A high-efficiency baking apparatus for processing electronic components

Abstract

This utility model provides a high-efficiency baking device for electronic component processing, relating to the field of electronic component processing technology. It includes a base with a housing fixedly connected to the top, and several baking trays inside the housing, each with drainage holes. This device dries electronic components using a three-stage continuous baking process: preheating with slow temperature increases to avoid temperature shocks, followed by high-temperature drying to remove moisture, and rapid cooling to room temperature for subsequent processing or packaging. This continuous processing step is suitable for assembly line operations, improving the drying efficiency of electronic components. Furthermore, a water vapor treatment mechanism treats the water vapor generated during drying, carrying it out under airflow and separating the water to allow the dry airflow to escape, preventing a damp working environment and slippery surfaces, thus improving the comfort and safety of the working environment.

Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, specifically a high-efficiency baking device for electronic component processing. Background Technology

[0002] In the manufacturing process of electronic components, such as integrated circuit packaging, LED chip curing, capacitor electrolyte drying, and PCB board moisture-proofing, high-temperature heating treatment is usually required to remove moisture. Therefore, baking equipment plays an important role in the electronics manufacturing industry as one of the key pieces of equipment.

[0003] Currently, traditional baking equipment mostly adopts a single-cavity structure, which means that the electronic components to be processed are placed into the oven at once, and the drying process is completed by heating the elements and maintaining the temperature for a certain period of time. Although this type of equipment has a simple structure and low cost, it has many shortcomings in practical applications.

[0004] Traditional ovens expose electronic components directly to high-temperature environments, which can easily lead to material cracking, deformation, or internal structural damage due to thermal stress. Furthermore, the ovens rely on natural cooling after baking, which is slow and prolongs the production cycle, hindering automated continuous operation. In addition, the drying process generates a large amount of moisture, which, when directly discharged, alters the working environment, making it humid and hot, and causing slippery surfaces that can easily lead to falls. Utility Model Content

[0005] The purpose of this application is to provide a high-efficiency baking apparatus for processing electronic components, so as to solve the technical problems of material cracking due to thermal stress, slow cooling and poor continuity of electronic components in the prior art.

[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a high-efficiency baking device for processing electronic components, comprising: a base, a box body fixedly connected to the top of the base, a plurality of baking trays provided inside the box body, and a drain hole provided on each baking tray;

[0007] A drying mechanism, located inside the housing, is used to dry electronic components. The drying mechanism includes: a partition cylinder, a partition plate, a loading and unloading area, a preheating area, a drying area, a cooling area, and a storage area.

[0008] A water vapor treatment mechanism is located inside the base and is used to treat the generated water vapor. The water vapor treatment mechanism includes: a cavity, a water receiving tank, a drain pipe, a water tank, a baffle, an exhaust pipe, a drain pipe, a demister, and an electric valve.

[0009] Furthermore, a partition cylinder is fixedly connected inside the box, and a cross-shaped partition plate is fixedly connected between several baking trays. Four equidistant partition plates are fixedly connected between the outside of the partition cylinder and the inner wall of the box. The partition plates can divide the inside of the box into a loading and unloading area, a preheating area, a drying area, and a cooling area. The partition plates can also divide the baking trays into four storage areas.

[0010] Furthermore, a cavity is provided at the bottom of the box, and a fan-shaped water receiving trough is fixedly connected to the top of the cavity. A drain pipe is connected to the bottom of the water receiving trough. A water tank is fixedly installed inside the base. The bottom of the drain pipe is connected to the inside of the water tank. A baffle is fixedly connected to the top of the water tank near the drain pipe. An exhaust pipe and a drain pipe are provided on one side of the water tank. A demister is provided inside the exhaust pipe, and an electric valve is provided on the drain pipe.

[0011] Furthermore, a hot air pipe is provided on one side of the inner wall of the preheating zone and the drying zone, an air suction pipe is provided on one side of the inner wall of the cooling zone, and an air inlet pipe is provided at the top of the cooling zone.

[0012] Furthermore, the inner wall of the separator cylinder is provided with windows a that communicate with the preheating zone, the drying zone and the cooling zone, and the outer side of the separator cylinder is provided with windows b at positions opposite to the loading and unloading zones.

[0013] Furthermore, a base is provided at the bottom of several baking trays, and a connecting rod is fixedly connected to the top of the base. The connecting rod is connected to several baking trays respectively. A geared motor is fixedly installed inside the base, and the top of the drive shaft of the geared motor is connected to the bottom of the base.

[0014] The beneficial effects of this utility model are:

[0015] The advantages of this utility model are that the electronic components are dried by the drying mechanism, and a three-stage continuous baking process is adopted. The electronic components are preheated and slowly heated to avoid temperature difference shock, then dried at high temperature to remove moisture, and then quickly cooled to room temperature, which facilitates subsequent processing or packaging. This forms a continuous processing step, which is suitable for assembly line operation and improves the drying efficiency of electronic components.

[0016] Secondly, the water vapor generated during drying is treated by a water vapor treatment device. The water vapor is carried out by the airflow, and the water is separated so that the dry airflow can be discharged, avoiding a damp working environment that could cause the ground to become slippery, thus improving the comfort and safety of the working environment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a cross-sectional view of the overall structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the baking tray structure of this utility model.

[0021] Figure 4 This is a schematic diagram of the separator cylinder structure of this utility model.

[0022] Figure 5 This is a top sectional view of the box structure of this utility model.

[0023] The following are the labeling elements in the figure:

[0024] 1. Base; 11. Box body; 12. Baking tray; 13. Drain hole; 2. Divider cylinder; 21. Divider plate; 22. Divider plate; 23. Loading and unloading area; 24. Preheating area; 25. Drying area; 26. Cooling area; 27. Storage area; 28. Hot air pipe; 29. ​​Suction pipe; 210. Air inlet pipe; 211. Window a; 212. Window b; 3. Cavity; 31. Water receiving tank; 32. Drain pipe; 33. Water tank; 34. Baffle; 35. Exhaust pipe; 36. Drain pipe; 37. Demister; 38. Electric valve; 4. Chassis; 41. Connecting rod; 42. Gear motor. Detailed Implementation

[0025] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0030] Example 1

[0031] As attached Figures 1 to 5 The high-efficiency baking device for processing electronic components shown includes: a base 1, a box 11 fixedly connected to the top of the base 1, a plurality of baking trays 12 inside the box 11, and a drain hole 13 on each baking tray 12; a drying mechanism inside the box 11 for drying electronic components; and a water vapor treatment mechanism inside the base 1 for treating the generated water vapor.

[0032] Specifically, when drying electronic components, the electronic components are placed on the baking tray 12 and dried by the drying mechanism. The drying process is carried out in three stages: the electronic components are preheated, then dried, and then cooled to facilitate unloading. Water stains can be discharged downward through the drain hole 13 to prevent water stains from accumulating in the baking tray 12. The water vapor generated during drying is driven by the airflow into the water vapor treatment mechanism, which processes the water vapor, separates the water, and discharges it through the airflow.

[0033] In a preferred embodiment, a base plate 4 is provided at the bottom of several baking trays 12, and a connecting rod 41 is fixedly connected to the top of the base plate 4. The connecting rod 41 is connected to several baking trays 12 respectively. A geared motor 42 is fixedly installed inside the base 1, and the top of the drive shaft of the geared motor 42 is connected to the bottom of the base plate 4.

[0034] Furthermore, when drying electronic components, the base 4 is rotated by starting the geared motor 42. The base 4 is also provided with several through holes to facilitate the discharge of accumulated water and the passage of airflow. The rotation of the base 4 drives several baking trays 12 to rotate through the connecting rod 41. The baking trays 12 are rotated and transported on the side where the electronic components are placed, so as to cooperate with the drying mechanism to dry the electronic components.

[0035] Example 2

[0036] Based on Embodiment 1, the solution in Embodiment 1 will be further described in detail below with reference to the specific working method, such as... Figures 1 to 5 As shown below, see details:

[0037] The drying mechanism includes: a partition cylinder 2, a partition plate 21, a partition plate 22, a loading and unloading area 23, a preheating area 24, a drying area 25, a cooling area 26, and a storage area 27. The partition cylinder 2 is fixedly connected inside the box body 11. A cross-shaped partition plate 21 is fixedly connected between several baking trays 12. Four partition plates 22 are fixedly connected between the outside of the partition cylinder 2 and the inner wall of the box body 11. The partition plates 22 can divide the inside of the box body 11 into the loading and unloading area 23, the preheating area 24, the drying area 25, and the cooling area 26. The partition plates 21 can divide the baking trays 12 into four storage areas 27.

[0038] The storage area 27 can be divided into four storage areas. In use, electronic components are placed in the first storage area opposite the loading / unloading area 23. Then, the geared motor 42 starts and rotates, transporting the storage area 27 containing the electronic components to the preheating area 24 before stopping. At this time, the cross-shaped separating plate 21 is opposite to the four separating plates 22 on the outside of the separating cylinder 2. The separating plate 21 and the separating plates 22 separate the loading / unloading area 23, the preheating area 24, the drying area 25, and the cooling area 26. The electronic components enter the preheating area 24 for preheating. Simultaneously, the second storage area moves to the loading / unloading area 23 for loading. After preheating, the geared motor 42 starts and transports the first storage area to the drying area 25 for drying. The second storage area enters the preheating area 24 for preheating. The third storage area moves to the loading / unloading area 23 for loading. Then, the geared motor 42 stops, and the electronic components in the first storage area... After the components are dried, the geared motor 42 starts again, transporting the first storage area to the cooling area 26 for cooling. The second storage area moves to the drying area 25 for drying, the third storage area moves to the preheating area 24 for preheating, and the fourth storage area moves to the loading and unloading area 23 for loading. After the electronic components in the first storage area have cooled down, the geared motor 42 starts again, transporting the first storage area to the loading and unloading area 23 for unloading. After unloading, loading continues. The second storage area moves to the cooling area 26 for cooling, the third storage area moves to the drying area 25 for drying, and the fourth storage area moves to the preheating area 24 for preheating. A three-stage continuous baking process is adopted, which preheats the electronic components slowly to avoid temperature shock, dries them at high temperature to remove moisture, and then quickly cools them to room temperature, facilitating subsequent processing or packaging. This forms a continuous processing step, suitable for assembly line operation, and improves the drying efficiency of electronic components.

[0039] In a preferred embodiment, a hot air pipe 28 is provided on one side of the inner wall of the preheating zone 24 and the drying zone 25, an air suction pipe 29 is provided on one side of the inner wall of the cooling zone 26, and an air inlet pipe 210 is provided at the top of the cooling zone 26.

[0040] Furthermore, the hot air entering the preheating zone 24 is in the range of 50°C to 150°C, and the hot air entering the drying zone 25 is in the range of 100°C to 250°C, through two hot air pipes 28 connected to the air supply pipes of two external hot air blowers. The actual temperatures of the preheating zone 24 and the drying zone 25 are adjusted according to the specific type of electronic components being processed and their material properties. One end of the suction pipe 29 is connected to the input pipe of the external suction blower. After the external suction blower is started, fresh air enters from the air inlet pipe 210 and is discharged from the suction pipe 29, so that the fresh air flows in the cooling zone 26 to remove the heat from the electronic components.

[0041] In a preferred embodiment, the inner wall of the separator cylinder 2 is provided with windows a211 that communicate with the preheating zone 24, the drying zone 25 and the cooling zone 26, and the outer side of the separator cylinder 2 is provided with windows b212 at the position opposite to the loading and unloading zone 23.

[0042] Furthermore, windows a211 and b212 are respectively connected to the loading / unloading area 23, the preheating area 24, the drying area 25, and the cooling area 26, and the storage area 27 inside the partition cylinder 2, facilitating the drying of electronic components. A position sensor is fixedly installed on the inner wall of the partition cylinder 2 near window b212. Four equally spaced sensors are fixedly installed around the chassis 4, and the four sensors are respectively opposite to the loading / unloading area 23, the preheating area 24, the drying area 25, and the cooling area 26. When the chassis 4 rotates, when the external sensors are opposite to the position sensor, the position sensor detects the sensor and controls the reduction motor 42 to stop working.

[0043] Example 3

[0044] Based on Embodiment 1, the solution in Embodiment 1 will be further described in detail below with reference to the specific working method, such as... Figures 1 to 5 As shown below, see details:

[0045] The water vapor treatment mechanism includes: cavity 3, water receiving trough 31, drain pipe 32, water tank 33, baffle 34, exhaust pipe 35, drain pipe 36, demister 37, and electric valve 38. Cavity 3 is provided at the bottom of the housing 11. A fan-shaped water receiving trough 31 is fixedly connected to the top of cavity 3. The bottom end of water receiving trough 31 is connected to drain pipe 32. Water tank 33 is fixedly installed inside base 1. The bottom end of drain pipe 32 is connected to the inside of water tank 33. Baffle 34 is fixedly connected to the top of water tank 33 near drain pipe 32. Exhaust pipe 35 and drain pipe 36 are provided on one side of water tank 33. Demister 37 is provided inside exhaust pipe 35. Electric valve 38 is provided on drain pipe 36.

[0046] Furthermore, during preheating and drying, the hot airflow enters the preheating zone 24 and the drying zone 25, then enters the water receiving tank 31 through the through hole on the chassis 4, and then enters the water tank 33 through the drain pipe 32. The airflow contacts the baffle 34 to mitigate the airflow impact, and then passes through the demister 37 and is discharged from the exhaust pipe 35. When the hot airflow flows out, it will carry away the water vapor generated during preheating and drying. The demister 37 intercepts the moisture in the hot airflow and stores the moisture in the water tank 33. After the electric valve 38 is opened, the water in the water tank 33 is discharged, thereby treating the generated water vapor.

[0047] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high-efficiency baking apparatus for processing electronic components, characterized in that, include: The base (1) has a box (11) fixedly connected to the top of the base (1). The box (11) has several baking trays (12) inside, and each baking tray (12) has a drain hole (13). The drying mechanism is located inside the housing (11) and is used to dry electronic components. The drying mechanism includes: a separator cylinder (2), a separator plate (21), a separator plate (22), a loading and unloading area (23), a preheating area (24), a drying area (25), a cooling area (26), and a storage area (27). A water vapor treatment mechanism is located inside the base (1) and is used to treat the generated water vapor. The water vapor treatment mechanism includes: a cavity (3), a water receiving tank (31), a drain pipe (32), a water tank (33), a baffle (34), an exhaust pipe (35), a drain pipe (36), a demister (37), and an electric valve (38).

2. The efficient baking apparatus for electronic components according to claim 1, wherein The box (11) is fixedly connected to a partition cylinder (2), and a cross-shaped partition plate (21) is fixedly connected between several baking trays (12). Four partition plates (22) are fixedly connected between the outside of the partition cylinder (2) and the inner wall of the box (11). The partition plates (22) can divide the inside of the box (11) into a loading and unloading area (23), a preheating area (24), a drying area (25), and a cooling area (26). The partition plates (21) can divide the baking trays (12) into four storage areas (27).

3. The efficient baking apparatus for electronic components according to claim 1, wherein The bottom of the box (11) is provided with a cavity (3). A fan-shaped water receiving trough (31) is fixedly connected to the top of the cavity (3). A drain pipe (32) is connected to the bottom of the water receiving trough (31). A water tank (33) is fixedly installed inside the base (1). The bottom of the drain pipe (32) is connected to the inside of the water tank (33). A baffle (34) is fixedly connected to the top of the water tank (33) near the drain pipe (32). An exhaust pipe (35) and a drain pipe (36) are provided on one side of the water tank (33). A demister (37) is provided inside the exhaust pipe (35). An electric valve (38) is provided on the drain pipe (36).

4. The efficient baking apparatus for electronic components according to claim 2, wherein Hot air pipes (28) are provided on one side of the inner wall of the preheating zone (24) and the drying zone (25), and suction pipes (29) are provided on one side of the inner wall of the cooling zone (26). An air inlet pipe (210) is provided at the top of the cooling zone (26).

5. The efficient baking apparatus for electronic components according to claim 2, wherein The inner wall of the separator (2) is provided with windows a (211) that communicate with the preheating zone (24), the drying zone (25) and the cooling zone (26), respectively. The outer side of the separator (2) is provided with windows b (212) at a position opposite to the loading and unloading zone (23).

6. The high-efficiency baking apparatus for processing electronic components according to claim 1, characterized in that, A base plate (4) is provided at the bottom of several baking trays (12). A connecting rod (41) is fixedly connected to the top of the base plate (4). The connecting rod (41) is connected to several baking trays (12) respectively. A geared motor (42) is fixedly installed inside the base (1). The top of the drive shaft of the geared motor (42) is connected to the bottom of the base plate (4).

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