A semiconductor component surface roughness detection structure

Abstract

This utility model discloses a surface roughness detection structure for semiconductor parts, relating to the field of semiconductor testing technology. The utility model includes a base, a semiconductor clamping assembly slidably fitted on the base, a support plate mounted on the base, a detection body disposed on one side of the support plate, a rotating part disposed between the outer side of the detection body and an adjustment part, and a T-shaped groove on one side of the detection body, with a probe tip disposed inside the T-shaped groove. This utility model achieves easy installation and removal of the probe tip through T-shaped groove positioning, L-shaped locking rod pre-tightening, locking block locking, and ring frame linkage. During installation, simply inserting the probe into the T-shaped groove triggers the reset rotating part to drive the locking block for automatic clamping, eliminating the need for additional locking. During removal, simply pushing the lever of the ring frame releases the locking block lock, allowing direct removal of the probe. The entire process requires no screwdrivers, wrenches, or other specialized tools, and can be completed by ordinary operators with simple training, thereby achieving and improving testing efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing, specifically, it relates to a structure for detecting the surface roughness of semiconductor parts. Background Technology

[0002] In the semiconductor industry, the surface roughness of components is one of the core indicators that determines the performance, reliability and lifespan of devices. With the iteration of advanced processes, the requirements for the surface micro-morphology of key components such as chips, wafer carriers, photomasks, and precision connectors have reached the nanometer or even sub-nanometer level. Even micrometer-level surface defects (such as scratches, protrusions, and depressions) may lead to short circuits, signal transmission distortion, reduced photolithography accuracy or insufficient bonding between the wafer and the carrier, ultimately causing a sharp drop in product yield.

[0003] Traditional probe tips (usually made of diamond with radii ranging from several micrometers to tens of nanometers) wear down from repeated contact with the surface of the part, causing changes in the tip morphology and gradually distorting the test data. This wear is especially pronounced when testing semiconductor materials with low hardness (such as aluminum thin films and photoresist coatings), where the wear rate is even faster, requiring frequent calibration or replacement of the probe and increasing maintenance costs.

[0004] In view of this, this utility model is hereby proposed. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a surface roughness detection structure for semiconductor parts.

[0006] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows: A surface roughness detection structure for semiconductor components includes a base, a semiconductor clamping assembly slidably fitted on the base, a support plate mounted on the base, an adjustment part on one side of the support plate, a detection body on one side of the support plate, a rotating part between the outer side of the detection body and the adjustment part, a T-shaped circular groove on one side of the detection body, a probe tip disposed inside the T-shaped circular groove, a placement groove inside the detection body, and a limiting slide groove connected to the T-shaped circular groove, arranged in a circular array on the top of the inner wall of the placement groove. The device is equipped with an L-shaped locking rod, one side of which engages with the probe tip. A first spring is installed between the L-shaped locking rod and the top of the inner wall of the limiting slide groove. A guide groove is formed on one side of the inner wall of the placement groove, which is connected to the T-shaped circular groove. A locking block that engages with the L-shaped locking rod is slidably fitted inside the guide groove. The locking block is in contact with the probe tip and has a reset part. A ring frame is rotatably fitted inside the placement groove. An inclined top block that abuts against the locking block is arranged on one side of the inner wall of the ring frame. A reset rotation part is provided on the lower side of the ring frame.

[0007] Optionally, the reset part includes a fixing plate installed on the upper side of the card block, a second spring installed between the fixing plate and one side of the inner wall of the placement groove, an arc-shaped groove that abuts against the inclined top block on one side of the card block, and an arc-shaped clamping plate that fits against the detection body on the other side of the card block.

[0008] Optionally, the reset rotating part includes a circular plate installed at the bottom of the inner wall of the placement groove, an annular frame rotatably fitted on the circular plate, a torsion spring installed between one side of the annular frame and the bottom of the inner wall of the placement groove, and the torsion spring sleeved on the circular plate, an arc-shaped through groove opened on one side of the inner wall of the placement groove, and a lever installed on the outer side of the annular frame, the lever slidingly fitted in the arc-shaped through groove.

[0009] Optionally, the adjustment unit includes a guide groove opened on one side of the support plate, a first motor is installed inside the guide groove, a first threaded rod is installed at the output end of the first motor, a moving block that is threadedly engaged with the first threaded rod is slidably fitted inside the guide groove, a fixed rod is installed on one side of the moving block, and a fixed cylinder is installed on the outside of the detection body.

[0010] Optionally, the fixing rod is rotatably fitted inside the fixing cylinder. A first slot is formed in a circumferential array on one side of the inner wall of the fixing cylinder, and a first circular groove is formed in a circumferential array on the outer side of the fixing rod. A first ball is slidably fitted inside the first circular groove and engages with the first slot. A third spring is installed between the first ball and the first circular groove.

[0011] Optionally, the semiconductor clamping assembly includes a movable groove on one side of the base, a sliding block that is slidably fitted inside the movable groove, a placement stage that is rotatably fitted on the sliding block, a U-shaped groove that is rotatably fitted inside the placement stage, a second threaded rod that is rotatably fitted inside the U-shaped groove, and a second motor that is mounted on the outside of the placement stage. The output end of the second motor passes through the placement stage and is connected to the second threaded rod.

[0012] Optionally, the U-shaped groove has two U-shaped blocks that are threadedly engaged with the second threaded rod inside, and a clamping plate connected to the U-shaped blocks is slidably engaged on the placement platform. Multiple second slots are provided on both sides of the inner wall of the moving groove, and second circular grooves are provided on both sides of the sliding block.

[0013] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all of the following advantages at the same time: The installation and removal of the probe tip are achieved through T-shaped circular groove positioning, L-shaped clamping rod pre-tightening, clamping block locking, and ring frame linkage. During installation, simply inserting the probe into the T-shaped circular groove triggers the reset rotating part to drive the clamping block to automatically hold it in place, without the need for additional locking. During disassembly, simply pushing the lever of the ring frame releases the clamping block locking, allowing the probe to be removed directly. The entire process requires no professional tools such as screwdrivers or wrenches, and can be completed by ordinary operators after simple training, significantly reducing the maintenance and operation threshold and thus achieving and improving testing efficiency.

[0014] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0015] The accompanying drawings described below are merely some embodiments. Those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 A schematic diagram of the semiconductor component surface roughness detection structure provided in this application; Figure 2 A schematic diagram of the adjustment section of the semiconductor component surface roughness detection structure provided in this application; Figure 3 A schematic cross-sectional view of the detection body structure of the semiconductor component surface roughness detection structure provided in this application; Figure 4 A schematic diagram of the internal structure of the detection body of the semiconductor component surface roughness detection structure provided in this application; Figure 5 A schematic diagram of the semiconductor clamping assembly structure for the semiconductor component surface roughness detection structure provided in this application; The attached diagram lists the components represented by each number as follows: 1. Base; 2. Support plate; 3. Moving block; 4. Detection body; 5. First motor; 6. First threaded rod; 7. Guide groove; 8. Fixing rod; 9. First circular groove; 10. First spring; 11. First ball; 12. Fixing cylinder; 13. First slot; 14. Probe tip; 15. T-shaped circular groove; 16. Placement groove; 17. Limiting slide groove; 18. Circular plate; 19. Torsion spring; 20. Ring frame; 21. Slanted top block; 2. Locking block; 23. Arc-shaped groove; 24. Fixing plate; 25. Second spring; 26. Sliding block; 27. L-shaped locking rod; 28. Third spring; 29. ​​Arc-shaped clamping plate; 30. Moving groove; 31. Placement platform; 32. Second locking groove; 33. U-shaped groove; 34. Second motor; 35. Second threaded rod; 36. U-shaped block; 37. Clamping plate; 38. Guide groove; 39. Second circular groove; 40. Second ball; 41. Fourth spring.

[0016] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings.

[0018] Please see Figure 1-5 As shown, this embodiment provides a semiconductor component surface roughness detection structure, including a base 1, a semiconductor clamping assembly slidably fitted on the base 1, a support plate 2 mounted on the base 1, an adjustment part on one side of the support plate 2, a detection body 4 disposed on one side of the support plate 2, a rotating part disposed between the outer side of the detection body 4 and the adjustment part, a T-shaped circular groove 15 disposed on one side of the detection body 4, a probe tip 14 disposed inside the T-shaped circular groove 15, a placement groove 16 disposed inside the detection body 4, and a limiting slide groove 17 connected to the T-shaped circular groove 15 being arranged in a circumferential array on the top of the inner wall of the placement groove 16, the limiting slide groove 17 being slidably fitted inside the limiting slide groove 17. The device includes an L-shaped locking rod 27, one side of which engages with the probe tip 14. A first spring 10 is installed between the L-shaped locking rod 27 and the top of the inner wall of the limiting slide groove 17. A guide groove 38, which communicates with the T-shaped circular groove 15, is circumferentially arranged on one side of the inner wall of the placement groove 16. A locking block 22, which engages with the L-shaped locking rod 27, is slidably fitted inside the guide groove 38. The locking block 22 is in contact with the probe tip 14. A reset part is provided on the locking block 22. A ring frame 20 is rotatably fitted inside the placement groove 16. An inclined top block 21, which abuts against the locking block 22, is circumferentially arranged on one side of the inner wall of the ring frame 20. A reset rotation part is provided on the lower side of the ring frame 20.

[0019] One application of this embodiment is as follows: the adjustment part on one side of the support plate 2 can drive the detection body 4 to move up, down, left, and right along the support plate 2, adjusting the vertical distance between the probe and the surface of the part. The rotating part can make the detection body 4 rotate around the rotating part, changing the contact angle between the probe tip 14 and the surface of the part, adapting to the roughness detection requirements of different curved or inclined surfaces. When the probe tip 14 is inserted along the T-shaped circular groove 15, the tip of the probe will press the L-shaped locking rod 27 in the limiting slide groove 17. Under the action of the pressing force, the L-shaped locking rod 27 slides away from the T-shaped circular groove 15 along the limiting slide groove 17, while compressing the first spring 10, putting it in an energy storage state. During this process, the original locking relationship between the L-shaped locking rod 27 and the locking block 22 is released, and the locking block 22... Once the limit is released and the limit of the locking block 22 is released, the reset rotating part inside the detection body 4 causes the annular frame 20 in the placement slot 16 to rotate through its stored torsional force. The inclined top blocks 21 of the circumferential array on the inner wall of the annular frame 20 rotate synchronously with the annular frame 20. Their inclined surfaces gradually contact the end of the locking block 22 and generate a squeezing force. Under the action of the inclined surface thrust, the locking block 22 slides along the guide groove 38 into the T-shaped circular groove 15, while stretching the reset part to store energy. Finally, the end of the locking block 22 fits against the outer wall of the probe tip 14. The multiple locking blocks 22 in the circumferential array form a ring-shaped clamp, which firmly fixes the probe tip 14 in the T-shaped circular groove 15, completing the automatic installation and thus realizing and improving the detection efficiency.

[0020] The reset part of this embodiment includes a fixing plate 24 installed on the upper side of the card block 22. A second spring 25 is installed between the fixing plate 24 and one side of the inner wall of the placement groove 16. An arc-shaped groove 23 that abuts against the inclined top block 21 is opened on one side of the card block 22. An arc-shaped clamping plate 29 that fits against the detection body 4 is installed on the other side of the card block 22.

[0021] As the locking block 22 slides along the guide groove 38 toward the T-shaped circular groove 15, the upper fixing plate 24 moves synchronously, stretching the second spring 25 to store energy. At the same time, the arc-shaped clamping plate 29 on the other side of the locking block 22 gradually adheres to the outer wall of the probe tip 14 until the arc-shaped clamping plate 29 completely wraps around the probe, forming a stable clamp.

[0022] The reset rotating part of this embodiment includes a circular plate 18 installed at the bottom of the inner wall of the placement groove 16, an annular frame 20 rotatably fitted on the circular plate 18, a torsion spring 19 installed between one side of the annular frame 20 and the bottom of the inner wall of the placement groove 16, and the torsion spring 19 sleeved on the circular plate 18, an arc-shaped through groove is opened on one side of the inner wall of the placement groove 16, and a lever is installed on the outer side of the annular frame 20, the lever slidingly fitted in the arc-shaped through groove.

[0023] When the probe tip 14 needs to be replaced, the operator pushes the lever along the arc-shaped through groove. The lever causes the ring frame 20 to rotate in the opposite direction around the circular plate 18. The torsion spring 19 on the inner side of the ring frame 20 is further twisted, storing torsional potential energy. When the ring frame 20 rotates in the opposite direction, the inclined top block 21 on the inner wall gradually disengages from the arc-shaped groove 23 of the locking block 22, and the squeezing force on the locking block 22 disappears. The second spring 25 releases elastic potential energy and pulls the locking block 22 back to its original position along the guide groove 38 through the fixing plate 24. The arc-shaped clamp 29 completely disengages from the probe tip 14, the probe is unlocked, and the probe is taken out from the T-shaped circular groove 15. The first spring 10 releases potential energy to push the L-shaped locking rod 27 back to its original position and re-engages with the locking block 22. After the lever is released, the potential energy of the torsion spring 19 is temporarily offset by the limiting of the L-shaped locking rod 27 and the locking block 22. The ring frame 20 remains in the unlocked position, waiting for the next probe installation.

[0024] The adjustment unit of this embodiment includes a guide groove 7 opened on one side of the support plate 2. A first motor 5 is installed inside the guide groove 7. A first threaded rod 6 is installed at the output end of the first motor 5. A moving block 3 that is threadedly engaged with the first threaded rod 6 is slidably fitted inside the guide groove 7. A fixing rod 8 is installed on one side of the moving block 3. A fixing cylinder 12 is installed on the outer side of the detection body 4. The fixing rod 8 is rotatably fitted inside the fixing cylinder 12. A first slot 13 is circumferentially arranged on one side of the inner wall of the fixing cylinder 12. A first circular groove 9 is circumferentially arranged on the outer side of the fixing rod 8. A first ball 11 that engages with the first slot 13 is slidably fitted inside the first circular groove 9. A third spring 28 is installed between the first ball 11 and the first circular groove 9.

[0025] According to the testing requirements, the first motor 5 is controlled to rotate forward or backward. The motor output shaft drives the first threaded rod 6 to rotate synchronously. When the first threaded rod 6 rotates, the moving block 3, which is threadedly engaged with it, moves linearly along the length of the guide groove 7 due to the limitation of the guide groove 7. This causes the moving block 3 to drive the testing body 4 to move up and down synchronously through the fixed rod 8 until the vertical distance between the probe and the surface of the part reaches the preset value. After reaching the target position, the first motor 5 stops working. Due to the self-locking property of the threaded transmission, the moving block 3 and the testing body 4 can be stably stopped at the current position, ensuring the distance during the testing process. With the distance remaining constant, the operator manually rotates the detection body 4, causing the fixed cylinder 12 to rotate around the fixed rod 8. At this time, the edge of the first slot 13 on the inner wall of the fixed cylinder 12 presses against the first ball 11, forcing the first ball 11 to retract into the first circular groove 9. Simultaneously, the third spring 28 is compressed to store energy. When the fixed cylinder 12 rotates to the target angle, the first ball 11, under the pushing force of the third spring 28, re-embeds into the corresponding position of the first slot 13. The mechanical engagement between the first ball 11 and the first slot 13 restricts the fixed cylinder 12 from continuing to rotate, thus achieving stable locking of the detection angle.

[0026] The semiconductor clamping assembly of this embodiment includes a movable groove 30 formed on one side of the base 1. A sliding block 26 is slidably fitted inside the movable groove 30. A placement platform 31 is rotatably fitted on the sliding block 26. A U-shaped groove 33 is formed inside the placement platform 31. A second threaded rod 35 is rotatably fitted inside the U-shaped groove 33. A second motor 34 is mounted on the outside of the placement platform 31. The output end of the second motor 34 passes through the placement platform 31 and is connected to the second threaded rod 35. Two U-shaped blocks 36 are slidably fitted inside the U-shaped groove 33 and threadedly fitted to the second threaded rod 35. A clamping plate 37 connected to the U-shaped blocks 36 is slidably fitted on the placement platform 31. Multiple second slots 32 are formed on both sides of the inner wall of the movable groove 30. Second circular grooves 39 are formed on both sides of the sliding block 26.

[0027] When the sliding block 26 needs to be moved, an external force pushes the sliding block 26, causing the second ball 40 to overcome the elastic force of the fourth spring 41 and disengage from the second slot 32. The sliding block 26 can then slide to the desired position within the moving groove 30. Then, under the action of the fourth spring 41, the second ball 40 re-enters the corresponding second slot 32, completing the positioning. The placement stage 31 rotates and engages with the sliding block 26. The placement stage 31 can be rotated according to actual needs to adjust the semiconductor placement angle to adapt to different processing or testing requirements. After the second motor 34 starts, its output drives the second threaded rod 35 to rotate. Since the two U-shaped blocks 36 are threadedly engaged with the second threaded rod 35, and the U-shaped blocks 36 slide within the U-shaped groove 33, the rotation of the second threaded rod 35 causes the two U-shaped blocks 36 to move relative to or away from each other within the U-shaped groove 33. The U-shaped blocks 36 are connected to the clamping plate 37, thereby driving the clamping plate 37 to move, realizing the clamping or releasing operation of the semiconductor.

[0028] During operation, the traditional probe tip 14 (usually made of diamond, with a radius of several micrometers to tens of nanometers) repeatedly contacts the surface of the part, causing wear and tear, resulting in changes in the tip morphology and gradually distorting the detection data. This is especially true when detecting semiconductor materials with low hardness (such as aluminum metal thin films and photoresist coatings), where the wear rate is even faster, requiring frequent calibration or probe replacement and increasing maintenance costs. In this solution, the probe tip 14 is inserted along the T-shaped groove 15. The tip of the probe presses against the L-shaped locking rod 27 in the limiting slide groove 17. Under the pressure, the L-shaped locking rod 27 slides away from the T-shaped groove 15 along the limiting slide groove 17, while simultaneously compressing the first spring 10, putting it in an energy storage state. During this process, the original locking relationship between the L-shaped locking rod 27 and the locking block 22 is maintained. Once released, the limiting position of the locking block 22 is released. After the limiting position of the locking block 22 is released, the reset rotating part inside the detection body 4 drives the annular frame 20 in the placement slot 16 to rotate through its stored torsional force. The inclined top blocks 21 of the circumferential array on the inner wall of the annular frame 20 rotate synchronously with the annular frame 20. Their inclined surfaces gradually contact the end of the locking block 22 and generate a squeezing force. Under the action of the inclined surface thrust, the locking block 22 slides along the guide groove 38 into the T-shaped circular groove 15, while stretching the reset part to store energy. Finally, the end of the locking block 22 fits against the outer wall of the probe tip 14. The multiple locking blocks 22 in the circumferential array form a ring-shaped clamp, which firmly fixes the probe tip 14 in the T-shaped circular groove 15, completing the automatic installation and thus realizing and improving the replacement efficiency.

[0029] This utility model is not limited to the above-described embodiments. Anyone should know that structural changes made under the guidance of this utility model, and any technical solutions that are the same as or similar to this utility model, fall within the protection scope of this utility model. Technical aspects, shapes, and structures not described in detail in this utility model are all publicly known technologies.

Claims

1. A semiconductor component surface roughness detection structure, characterized by, include: A base (1) is slidably fitted with a semiconductor clamping assembly. A support plate (2) is mounted on the base (1). An adjustment part is provided on one side of the support plate (2). A detection body (4) is provided on one side of the support plate (2). A rotating part is provided between the outer side of the detection body (4) and the adjustment part. A T-shaped circular groove (15) is provided on one side of the detection body (4). A probe tip (14) is provided inside the T-shaped circular groove (15). A placement groove (16) is provided inside the detection body (4). A limiting slide groove (17) communicating with the T-shaped circular groove (15) is arranged in a circular array on the top of the inner wall of the placement groove (16). An L-shaped locking rod (27) is slidably fitted inside the limiting slide groove (17). One side of the L-shaped locking rod (27) is fitted with the probe tip (14). A first spring (10) is installed between the L-shaped locking rod (27) and the top of the inner wall of the limiting slide groove (17). A guide groove (38) connected to the T-shaped circular groove (15) is arranged in a circumferential array on one side of the inner wall of the placement groove (16). A locking block (22) that is engaged with the L-shaped locking rod (27) is slidably fitted inside the guide groove (38). The locking block (22) is in contact with the probe tip (14). A reset part is provided on the locking block (22). A ring frame (20) is rotatably fitted inside the placement groove (16). An inclined top block (21) that abuts against the locking block (22) is arranged in a circumferential array on one side of the inner wall of the ring frame (20). A reset rotation part is provided on the lower side of the ring frame (20).

2. The semiconductor component surface roughness detection structure according to claim 1, characterized by The reset part includes a fixing plate (24) installed on the upper side of the card block (22), a second spring (25) is installed between the fixing plate (24) and one side of the inner wall of the placement groove (16), an arc groove (23) is opened on one side of the card block (22) to abut against the inclined top block (21), and an arc clamping plate (29) is installed on the other side of the card block (22) to fit against the detection body (4).

3. The semiconductor component surface roughness detection structure according to claim 1, wherein The reset rotating part includes a circular plate (18) installed at the bottom of the inner wall of the placement groove (16), an annular frame (20) rotatably fitted on the circular plate (18), a torsion spring (19) is installed between one side of the annular frame (20) and the bottom of the inner wall of the placement groove (16), and the torsion spring (19) is sleeved on the circular plate (18). An arc-shaped through groove is opened on one side of the inner wall of the placement groove (16), and a lever is installed on the outer side of the annular frame (20), and the lever slides in the arc-shaped through groove.

4. The semiconductor component surface roughness detection structure according to claim 1, wherein The adjustment unit includes a guide groove (7) opened on one side of the support plate (2), a first motor (5) is installed inside the guide groove (7), a first threaded rod (6) is installed at the output end of the first motor (5), a moving block (3) that is threadedly engaged with the first threaded rod (6) is slidably fitted inside the guide groove (7), a fixed rod (8) is installed on one side of the moving block (3), and a fixed cylinder (12) is installed on the outside of the detection body (4).

5. The semiconductor component surface roughness detection structure according to claim 4, wherein The fixing rod (8) is rotatably fitted inside the fixing cylinder (12). The inner wall of the fixing cylinder (12) is provided with a first slot (13) in a circumferential array on one side, and the outer side of the fixing rod (8) is provided with a first circular groove (9). The first circular groove (9) is slidably fitted with a first ball (11) that engages with the first slot (13). A third spring (28) is installed between the first ball (11) and the first circular groove (9).

6. The semiconductor component surface roughness detection structure according to claim 1, wherein The semiconductor clamping assembly includes a movable groove (30) on one side of the base (1), a sliding block (26) is slidably fitted inside the movable groove (30), a placement stage (31) is rotatably fitted on the sliding block (26), a U-shaped groove (33) is provided inside the placement stage (31), a second threaded rod (35) is rotatably fitted inside the U-shaped groove (33), and a second motor (34) is mounted on the outside of the placement stage (31). The output end of the second motor (34) passes through the placement stage (31) and is connected to the second threaded rod (35).

7. The semiconductor component surface roughness detection structure according to claim 6, wherein The U-shaped groove (33) has two U-shaped blocks (36) that are threaded to the second threaded rod (35) inside. The placement platform (31) has a clamping plate (37) that is connected to the U-shaped blocks (36) in a sliding fit. Multiple second slots (32) are opened on both sides of the inner wall of the moving groove (30). Second circular grooves (39) are opened on both sides of the sliding block (26).

8. The semiconductor component surface roughness detection structure according to claim 7, wherein The second circular groove (39) has a sliding fit with the second ball (40), and a fourth spring (41) is installed between the second ball (40) and the second circular groove (39).

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