A double-sided structure heat preservation device in high-precision reference application

Abstract

This invention relates to a double-sided insulation device for high-precision reference applications, comprising: a PCB board, and a reference source, key components, and multiple insulation sleeves mounted on the PCB board; each insulation sleeve houses one of the reference sources or one of the key components. This invention changes the traditional method of isolating the entire module by individually configuring an insulation sleeve for each reference source and key component on the PCB board. This reduces the external dimensions and internal cavity volume of the insulation structure, thereby shortening the internal temperature stabilization time, reducing the impact of airflow fluctuations on the devices, and improving the output stability of the precision reference and the accuracy and reliability of the entire instrument.

Description

Technical Field

[0001] This utility model belongs to the field of high-precision instruments and meters, and in particular relates to a double-sided thermal insulation device for high-precision reference applications. Background Technology

[0002] In high-precision instruments, such as 8.5-digit digital multimeters, the internal high-precision ultra-low temperature drift reference sources, such as the LTZ1000 or ADR1000, require a stable external environment to ensure that the precision reference output meets the high temperature drift coefficient requirement of 0.5 ppm / ℃. Therefore, to prevent changes in the external environment, a heat-insulating shell is needed. The quality of this insulation design directly determines the output stability of the precision reference, and thus directly determines the accuracy and reliability of the entire instrument.

[0003] The traditional approach is to isolate the entire baseline application module with an insulation sleeve, such as... Figure 2 As shown, this type of insulation jacket has a large external size and a large internal cavity, resulting in a longer internal temperature stabilization time and greater airflow fluctuations. In addition, only the top cover of this insulation jacket is connected to the PCB board, while the bottom is directly exposed to the external environment. In particular, the soldering points of precision and critical components are directly plug-in packaged structures, causing the bottom pins to be exposed to the external environment. When this structure is affected by external temperature changes, the temperature changes are easily transmitted to the components through the pins. Utility Model Content

[0004] To address the problems existing in the background technology, this utility model provides a double-sided structure heat preservation device for high-precision reference applications, comprising: a PCB board, and a reference source, key components, and multiple heat preservation sleeves mounted on the PCB board; each heat preservation sleeve contains one of the reference sources or one of the key components.

[0005] Preferably, the insulation sleeve includes a top cover body and a bottom cover body; the top cover body is fixedly installed on the top of the PCB board, and the bottom cover body is fixedly installed on the bottom of the PCB board.

[0006] Preferably, the insulation sleeve further includes: screws and nuts; the screws pass through the top cover body, PCB board and bottom cover body from top to bottom and are threadedly engaged with the nuts.

[0007] Preferably, gaskets are installed between the top cover body and the screw, and between the bottom cover body and the nut.

[0008] Preferably, the top cover body and the bottom cover body are made of PC material.

[0009] This invention changes the traditional method of isolating the entire module by individually configuring insulation sleeves for each reference source and key component on the PCB board. This reduces the external size and internal cavity volume of the insulation structure, thereby shortening the internal cavity temperature stabilization time and reducing the impact of airflow fluctuations on the device. At the same time, the individual wrapping design can more accurately isolate external ambient temperature changes and avoid temperature transfer caused by direct contact between pins and other parts and the outside environment. This effectively improves the working stability of high-precision reference sources and key components, thereby ensuring the accuracy and reliability of instruments. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a thermal insulation structure used in traditional high-precision reference applications. Figure 2 The schematic diagram shows the thermal insulation structure of this utility model. Detailed Implementation

[0011] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this utility model. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0012] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the present invention. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0013] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0014] Please see Figure 1This utility model provides a double-sided thermal insulation device for high-precision reference applications, including: a PCB board 1, and a reference source 2, a key component 3 and a plurality of thermal insulation sleeves 4 mounted on the PCB board 1; each thermal insulation sleeve 4 is equipped with one of the reference sources 2 or one of the key components 3.

[0015] In this embodiment, the key components typically refer to core components that are as important as high-precision reference sources and are sensitive to changes in external ambient temperature—a well-known fact in the field. The operational stability of these components directly affects the output accuracy of the high-precision reference (such as the temperature drift coefficient), requiring separate isolation and protection with insulation sleeves to prevent external temperature fluctuations from affecting their performance through pins and other components, thereby ensuring the accuracy and reliability of the entire instrument. By configuring individual insulation sleeves for each reference source and key component on the PCB board, the traditional method of uniformly isolating the entire module is changed. This reduces the external dimensions and internal cavity volume of the insulation structure, thereby shortening the internal cavity temperature stabilization time and reducing the impact of airflow fluctuations on the devices.

[0016] Preferably, the insulation sleeve 4 includes a top cover body 41 and a bottom cover body 42; the top cover body 41 is fixedly installed on the top of the PCB board, and the bottom cover body 42 is fixedly installed on the bottom of the PCB board.

[0017] In this embodiment, the main body of the reference or key component is installed inside the top cover body 41, and the pin portion of the reference or key component is installed inside the bottom cover body 42. By installing the top cover body and the bottom cover body on the upper and lower sides of the PCB board respectively, a double-sided sealed thermal insulation sleeve structure is formed, which completely solves the problem of the traditional thermal insulation sleeve bottom being exposed, causing the component pins to directly contact the external environment, and avoids temperature changes being transmitted to the device through the pins. The double-sided fixed design makes the thermal insulation sleeve more completely wrapping the component, effectively blocking the heat conduction path at the bottom, improving the overall thermal insulation performance of the thermal insulation sleeve, further ensuring that the reference source and key components work in a stable temperature environment, and significantly improving the stability of high-precision reference applications and the accuracy and reliability of instruments.

[0018] In this embodiment, the top cover body 41 and the bottom cover body 42 can be fixed to the PCB board by means of threaded connection or adhesive bonding, with threaded connection being preferred. The threaded connection method is as follows: Preferably, the insulation sleeve 4 further includes: screw 43 and nut 44; the screw 43 passes through the top cover body 41, PCB board 1 and bottom cover body 42 from top to bottom and is threadedly engaged with the nut 44.

[0019] In this embodiment, the top cover body 41, PCB board 1, and bottom cover body 42 are fixed as a whole by the threaded engagement of screws 43 and nuts 44, ensuring the stability and sealing of the insulation sleeve structure. This design avoids the structural loosening problem caused by the exposed bottom of traditional insulation sleeves. The mechanical fixing method strengthens the integrity of the double-sided insulation structure, effectively preventing the insulation sleeve from loosening during use, thereby preventing external ambient temperature from affecting components through the connection gaps, and further improving the heat insulation effect and reliability of the insulation sleeve.

[0020] Preferably, a gasket 45 is installed between the top cover body 41 and the screw 43, and between the bottom cover body 42 and the nut 44.

[0021] In this embodiment, by providing a gasket 45 between the top cover body 41 and the screw 43, and between the bottom cover body 42 and the nut 44, the gaps at the connection points can be filled, enhancing the sealing performance of the insulation jacket and preventing heat conduction through the contact points between the screw and the top cover, and the nut and the bottom cover. Simultaneously, the gasket can evenly distribute the pressure of the screw and nut, preventing deformation of the top or bottom cover caused by direct compression, improving the durability of the structure, ensuring the insulation jacket maintains a stable heat insulation effect over a long period, and further guaranteeing the stable operating temperature of the reference source and key components.

[0022] Preferably, the top cover body 41 and the bottom cover body 42 are made of PC material.

[0023] In this embodiment, the top cover body 41 and the bottom cover body 42 are made of PC material. Utilizing the excellent thermal insulation properties and mechanical strength of PC material, the heat conduction path is effectively blocked. Compared to traditional insulation sleeve structures, PC material insulation sleeves can reduce the impact of external temperature fluctuations on internal components while ensuring the structure's impact resistance and wear resistance, preventing a decline in insulation performance due to material aging or damage. Furthermore, the lightweight nature of PC material facilitates the installation and maintenance of the insulation sleeve, ultimately achieving efficient insulation of high-precision reference sources and key components, ensuring the accuracy and reliability of the instruments. In this embodiment, the PC material typically includes polycarbonate.

[0024] The working principle of this utility model: This invention replaces the traditional monolithic insulation sleeve by encasing each reference source and key component in an independent insulation sleeve. This significantly reduces the internal cavity volume of a single insulation sleeve, shortens the internal temperature stabilization time, reduces the impact of airflow fluctuations on the device, and achieves "precise thermal insulation." The insulation sleeve consists of a top cover fixed to the upper surface of the PCB board and a bottom cover fixed to the lower surface, forming a fully enclosed seal for the components. This design completely blocks the heat conduction path caused by bottom exposure in traditional solutions (such as direct contact between component pins and the external environment), preventing external temperature changes from being transmitted to the core of the device through the pins.

[0025] In summary, this utility model, through the combined design of "discrete double-sided insulation structure + mechanical fixing + high-performance materials", comprehensively surpasses traditional solutions in terms of structural compactness, thermal insulation efficiency, and environmental adaptability, providing a superior temperature stability solution for high-precision reference applications and ensuring the core performance of high-end instruments from a technical perspective.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of this technical solution, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A double-sided structure heat preservation device in high-precision reference applications, characterized in that, include: PCB board (1), and reference source (2), key components (3) and multiple insulation sleeves (4) mounted on PCB board (1); each insulation sleeve (4) contains one of the reference source (2) or one of the key components (3).

2. The double-sided structure heat preservation device in high-precision reference applications according to claim 1, characterized in that, The insulation sleeve (4) includes a top cover body (41) and a bottom cover body (42); the top cover body (41) is fixedly installed on the top of the PCB board, and the bottom cover body (42) is fixedly installed on the bottom of the PCB board.

3. The double-sided structure heat preservation device in high-precision reference applications according to claim 2, characterized in that, The insulation sleeve (4) also includes: screws (43) and nuts (44); the screws (43) pass through the top cover body (41), PCB board (1) and bottom cover body (42) from top to bottom and are threadedly engaged with the nuts (44).

4. The double-sided structure heat preservation device in high-precision reference applications according to claim 3, characterized in that, A gasket (45) is installed between the top cover body (41) and the screw (43), and between the bottom cover body (42) and the nut (44).

5. The double-sided structure heat preservation device in high-precision reference applications according to claim 2, 3 or 4, characterized in that, The top cover body (41) and the bottom cover body (42) are made of PC material.

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