Infrared lamp bead evaluation device

Abstract

This application relates to an infrared LED bead testing device, which includes a frame assembly, a heat-conducting plate, a first temperature-measuring component, and a second temperature-measuring component. The frame assembly has a first wall and a second wall spaced apart along its height, with the first wall facing the second wall. The heat-conducting plate is fixedly connected to the first wall, and the side of the heat-conducting plate facing the second wall is used to mount the infrared LED bead. The first temperature-measuring component is mounted on the side of the heat-conducting plate facing the first wall, and the second temperature-measuring component is mounted on the second wall. The infrared LED bead testing device provided by this application can measure the radiation performance and heat generation of infrared LED beads.

Description

Technical Field

[0001] This application relates to the field of infrared lamp bead testing equipment technology, and in particular to an infrared lamp bead evaluation device. Background Technology

[0002] Infrared LED testing devices are used to evaluate the performance of infrared LEDs. Common infrared LED testing devices typically consist of a bracket and a temperature sensing component. The temperature sensing component is installed at a preset position and connects to a thermometer to measure the temperature at that position. The infrared LED is positioned above the temperature sensing component via the bracket. By comparing the temperature rise at the preset position over a certain period of time, the radiation performance of the infrared LED is evaluated. However, the above-mentioned infrared LED testing devices have limited functionality and cannot evaluate the heat generation or luminous efficiency of the infrared LED. Utility Model Content

[0003] Therefore, it is necessary to provide an infrared lamp bead evaluation device that can measure the radiation performance and heat generation of infrared lamp beads.

[0004] An infrared LED bead testing device includes a frame assembly, a heat-conducting plate, a first temperature measuring component, and a second temperature measuring component. The frame assembly has a first wall and a second wall spaced apart along its height direction, with the first wall facing the second wall. The heat-conducting plate is fixedly connected to the first wall, and the side of the heat-conducting plate facing the second wall is used to mount infrared LED beads. The first temperature measuring component is mounted on the side of the heat-conducting plate facing the first wall, and the second temperature measuring component is mounted on the second wall.

[0005] In one embodiment, the spacing between the first wall and the second wall along the height direction of the infrared LED testing device is adjustable.

[0006] In one embodiment, the number of second temperature measuring components is configured to be multiple, and the multiple second temperature measuring components are arranged at intervals around the projection of the heat-conducting plate on the second wall.

[0007] In one embodiment, the first temperature measuring component includes a first thermocouple and a first graphene sheet. The first thermocouple is used to connect to a temperature measuring instrument, and the first thermocouple is bonded and fixed to a heat-conducting plate via the first graphene sheet. And / or, the second temperature measuring component includes a second thermocouple, a second graphene sheet, and a heat insulation element. The heat insulation element is connected to a second wall, the second thermocouple is used to connect to a temperature measuring instrument, and the second thermocouple is bonded and fixed to the side of the heat insulation element away from the second wall via the second graphene sheet.

[0008] In one embodiment, the frame assembly includes a first plate, a second plate, and a bracket. The first plate and the second plate are respectively mounted on the bracket. Along the height direction of the infrared lamp bead testing device, the first plate and the second plate are spaced apart, and the first plate is located above the second plate. The wall surface of the first plate facing the second plate constitutes the first wall, and the end surface of the second plate facing the first plate constitutes the second wall.

[0009] In one embodiment, the support includes multiple pillars that are detachably spliced ​​along the height direction of the infrared LED testing device.

[0010] In one embodiment, each support has a first segment and a second segment connected together. The outer diameter of the first segment is smaller than the outer diameter of the second segment, so that a limiting step is formed at the connection between the outer diameter of the first segment and the second segment. The end of the second segment away from the first segment is provided with a plug hole. The second segment of each support can be sleeved on the first segment of another support through the plug hole and stopped by the limiting step.

[0011] In one embodiment, the first plate has a first hole and can be clamped between two adjacent pillars along the height direction of the infrared lamp bead testing device, and the first plate is sleeved on the outer side of the corresponding first segment through the first hole; the second plate has a second hole and can be clamped between two adjacent pillars along the height direction of the infrared lamp bead testing device, and the second plate is sleeved on the outer side of the corresponding first segment through the second hole.

[0012] In one embodiment, the second plate is configured to be a transparent acrylic plate or a glass plate.

[0013] In one embodiment, the heat-conducting plate is configured as an aluminum plate.

[0014] Compared with existing technologies, the infrared LED bead testing device provided in this application uses a heat-conducting plate facing the side of the second wall to mount the infrared LED bead, and a first temperature-sensing component is mounted on the side of the heat-conducting plate facing the first wall. The heat-conducting plate can transfer the heat generated by the infrared LED bead during operation to the first temperature-sensing component. Therefore, by comparing the temperature rise of the first temperature-sensing component after the infrared LED bead has been operating for a period of time, the heat generation or luminous efficiency of the infrared LED bead can be evaluated. Since the second temperature-sensing component is mounted on the second wall, by comparing the temperature rise of the first temperature-sensing component after the infrared LED bead has been operating for a period of time, the radiation performance of the infrared LED bead can be evaluated. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the infrared LED bead testing device provided in this application;

[0017] Figure 2 A schematic diagram of the support provided in this application.

[0018] Reference numerals: 100, Infrared LED testing device; 10, Frame assembly; 11, First wall; 12, Second wall; 13, First plate; 14, Second plate; 15, Support; 150, Support column; 151, First section; 152, Second section; 153, Limiting step; 154, Insertion hole; 20, Heat-conducting plate; 30, First temperature measuring component; 31, First thermocouple; 32, First graphene sheet; 40, Second temperature measuring component; 41, Second thermocouple; 42, Second graphene sheet; 43, Heat insulation component; 200, Infrared LED. Detailed Implementation

[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0020] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0024] Please see Figure 1 This application provides an infrared LED bead testing device 100, which includes a frame assembly 10, a heat-conducting plate 20, a first temperature measuring component 30, and a second temperature measuring component 40. The frame assembly 10 has a first wall 11 and a second wall 12 spaced apart along its height direction h, with the first wall 11 facing the second wall 12. The heat-conducting plate 20 is fixedly connected to the first wall 11, and the side of the heat-conducting plate 20 facing the second wall 12 is used to mount infrared LED beads 200. The first temperature measuring component 30 is mounted on the side of the heat-conducting plate 20 facing the first wall 11, and the second temperature measuring component 40 is mounted on the second wall 12.

[0025] Understandably, by setting the side of the heat-conducting plate 20 facing the second wall 12 for mounting the infrared lamp bead 200, and mounting the first temperature-sensing component 30 on the side of the heat-conducting plate 20 facing the first wall 11, the heat-conducting plate 20 can transfer the heat generated by the infrared lamp bead 200 during operation to the first temperature-sensing component 30. Therefore, by comparing the temperature rise of the first temperature-sensing component 30 after the infrared lamp bead 200 has been operating for a period of time, the heat generation or luminous efficiency of the infrared lamp bead 200 can be evaluated. Since the second temperature-sensing component 40 is mounted on the second wall 12, by comparing the temperature rise of the first temperature-sensing component 30 after the infrared lamp bead 200 has been operating for a period of time, the radiation performance of the infrared lamp bead 200 can be evaluated.

[0026] The heat-conducting plate 20 can be made of a metal plate with good thermal conductivity, such as an aluminum plate. The heat-conducting plate 20 can be attached to the first wall 11 by tape; alternatively, it can be connected to the first wall 11 by screws; or it can be connected to the first wall 11 by clips. Multiple infrared LEDs 200 can be configured, and these LEDs 200 are evenly spaced on the heat-conducting plate 20. Thus, the temperature measured by the first temperature-sensing component 30 on the back of the heat-conducting plate 20 is the temperature change caused by the combined heating of the multiple infrared LEDs 200, which avoids the influence of individual differences in the infrared LEDs 200 on the test and speeds up the overall testing process.

[0027] The first temperature measuring component 30 includes a first thermocouple 31 and a first graphene sheet 32. The first thermocouple 31 is used to connect to the temperature measuring instrument, and the first thermocouple 31 is bonded and fixed to the heat-conducting plate 20 through the first graphene sheet 32. The first graphene sheet 32 ​​has a high infrared absorption rate and an extremely high thermal conductivity, which minimizes temperature differences throughout its structure and avoids affecting test accuracy due to positional deviations caused by each movement or rearrangement of the first thermocouple 31. In practical use, different infrared LED beads 200 can be tested under the same test conditions, such as the same number of infrared LED beads 200 and the same electrical power. By comparing the temperature rise of the first thermocouple 31 within the same time period, the heat generation of different infrared LED beads 200 can be evaluated.

[0028] The second temperature measuring component 40 includes a second thermocouple 41, a second graphene sheet 42, and a heat insulation element 43. The heat insulation element 43 is connected to the second wall 12. The second thermocouple 41 is used to connect to the temperature measuring instrument, and the second thermocouple 41 is bonded and fixed to the side of the heat insulation element 43 away from the second wall 12 via the second graphene sheet 42. Similarly, the second graphene sheet 42 has a high infrared absorption rate and extremely high thermal conductivity, which minimizes temperature differences across its components and avoids affecting test accuracy due to positional deviations caused by each movement or rearrangement of the second thermocouple 41. The heat insulation element 43 separates the second graphene sheet 42 from the second wall 12 to reduce thermal conductivity between the second wall 12 and the second graphene sheet 42, thereby allowing the second thermocouple 41 to more accurately measure the temperature rise of the second graphene sheet 42 caused by irradiation by the infrared lamp bead 200. The heat insulation element 43 can be made of foam double-sided adhesive with low thermal conductivity.

[0029] Multiple second temperature sensing components 40 are configured, and these components are spaced apart around the projection of the heat-conducting plate 20 onto the second wall 12. In this way, multiple second temperature sensing components 40 can reflect the radiation performance of the infrared lamp beads 200 at different angles. In practical use, different infrared lamp beads 200 can be tested under the same test conditions, such as the same number of infrared lamp beads 200 and the same electrical power. The greater the difference in temperature rise values ​​among the multiple second temperature sensing components 40, the more concentrated the radiant energy of the infrared lamp beads 200. Furthermore, multiple second temperature sensing components 40 can also be used to compare and evaluate various parameters such as the heating rate and cooling rate of different infrared lamp beads 200.

[0030] The distance between the first wall 11 and the second wall 12 along the height direction h of the infrared lamp bead testing device 100 is adjustable. In this way, not only can an adjustable testing space be formed between the first wall 11 and the second wall 12, but the distance between the infrared lamp bead 200 and the second temperature measuring component 40 can also be changed, thereby creating different testing environments.

[0031] The frame assembly 10 includes a first plate 13, a second plate 14, and a bracket 15. The first plate 13 and the second plate 14 are respectively mounted on the bracket 15. Along the height direction h of the infrared LED bead testing device 100, the first plate 13 and the second plate 14 are spaced apart, with the first plate 13 positioned above the second plate 14. The wall surface of the first plate 13 facing the second plate 14 forms the first wall 11, and the end face of the second plate 14 facing the first plate 13 forms the second wall 12. Thus, by adjusting the distance between the first plate 13 and the second plate 14 along the height direction h of the infrared LED bead testing device 100, the distance between the first wall 11 and the second wall 12 along the height direction h of the infrared LED bead testing device 100 can be adjusted.

[0032] The brackets 15 are configured to be multiple, and the multiple brackets 15 are distributed along the circumference of the first plate 13, which helps to improve the structural strength of the frame assembly 10.

[0033] Optionally, in one embodiment, the first plate 13 and the second plate 14 are detachably mounted on the bracket 15, and the mounting height of the first plate 13 and the second plate 14 on the bracket 15 along the height direction h of the infrared lamp bead testing device 100 can be adjusted.

[0034] Specifically, such as Figure 1 and Figure 2 As shown, the bracket 15 includes multiple supports 150, which are detachably assembled along the height direction h of the infrared LED testing device 100. This allows the height of the bracket 15 to be freely adjusted by increasing or decreasing the number of supports 150. Furthermore, this results in a simple structure and low cost for the bracket 15.

[0035] Furthermore, each support column 150 has a first segment 151 and a second segment 152 connected to each other. The outer diameter of the first segment 151 is smaller than the outer diameter of the second segment 152, so that a limiting step 153 is formed at the connection between the outer diameter of the first segment 151 and the second segment 152. A insertion hole 154 is provided at the end of the second segment 152 away from the first segment 151. The second segment 152 of each support column 150 can be sleeved on the outside of the first segment 151 of another support column 150 through the insertion hole 154 and stopped at the limiting step 153.

[0036] Furthermore, the first plate 13 has a first hole, allowing it to be clamped between two adjacent support pillars 150 along the height direction h of the infrared lamp bead testing device 100, and the first plate 13 is fitted over the outer side of the corresponding first segment 151 through the first hole. The second plate 14 has a second hole, allowing it to be clamped between two adjacent support pillars 150 along the height direction h of the infrared lamp bead testing device 100, and the second plate 14 is fitted over the outer side of the corresponding first segment 151 through the second hole. Thus, the distance between the first plate 13 and the second plate 14 can be adjusted by increasing or decreasing the number of support pillars 150 between them.

[0037] Of course, in other embodiments, a screw can also be installed on the bracket 15 and a nut can be installed on the first plate 13. By cooperating with the screw and the nut, the position of the first plate 13 can be adjusted along the height direction h of the infrared lamp bead evaluation device 100, thereby adjusting the distance between the first wall 11 and the second wall 12.

[0038] Furthermore, the infrared LED bead testing device 100 also includes a drive motor, with a screw connected to the drive motor. The drive motor can be controlled by a voice module, which is equipped with a controller, a voice receiving module, and a voice parsing module. The voice receiving module receives user commands, and the voice parsing module parses the commands. Based on the parsed commands, the controller controls the drive motor to rotate, which in turn drives the screw to rotate, causing the nut to move the first plate 13 axially along the screw. This enables intelligent adjustment of the distance between the first plate 13 and the second plate 14, improving the user experience.

[0039] The second plate 14 is made of transparent acrylic or glass. Transparent acrylic or glass has a relatively low absorption rate of infrared light emitted by the infrared lamp beads 200, and its own thermal conductivity is low. This can effectively reduce the interference of heat conduction at various points on the second plate 14 on each of the second temperature measuring components 40, so that the heat source for the temperature rise measured by each of the second temperature measuring components 40 on the second plate 14 comes from the direct irradiation of the infrared lamp beads 200.

[0040] When the infrared lamp bead testing device 100 is placed on the ground, the second plate 14 is 10mm-20mm above the ground. This prevents the ground temperature from conducting heat to the second plate 14 and affecting the second temperature measuring component 40 on the second plate 14.

[0041] The infrared lamp bead testing device 100 provided in this application can also be used to simulate actual user working conditions and test the effects of different infrared lamp beads 200. For example, when a user needs to simulate infrared defrosting of food in a refrigerator drawer, the infrared lamp bead testing device 100 can be placed in an environment with the same temperature and humidity. By adjusting the first plate 13 to the same height as the top of the drawer and the second plate 14 to the same height as the top of the drawer, and using the second temperature measuring component 40 to simulate the food placement position, the heating conditions of the food during infrared defrosting can be simulated.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. An infrared lamp bead evaluation device, characterized in that, The infrared lamp bead testing device (100) includes a frame assembly (10), a heat-conducting plate (20), a first temperature measuring component (30), and a second temperature measuring component (40). The frame assembly (10) has a first wall (11) and a second wall (12) spaced apart along its height direction. The first wall (11) is positioned facing the second wall (12). The heat-conducting plate (20) is fixedly connected to the first wall (11), and the side of the heat-conducting plate (20) facing the second wall (12) is used to install infrared lamp beads (200). The first temperature measuring component (30) is installed on the side of the heat-conducting plate (20) facing the first wall (11), and the second temperature measuring component (40) is installed on the second wall (12).

2. The infrared lamp bead evaluation device according to claim 1, characterized in that, The spacing between the first wall (11) and the second wall (12) along the height direction of the infrared lamp bead testing device (100) is adjustable.

3. The infrared lamp bead evaluation device according to claim 1 or 2, characterized in that, The number of the second temperature measuring components (40) is configured to be multiple, and the multiple second temperature measuring components (40) are arranged at intervals around the projection of the heat-conducting plate (20) on the second wall (12).

4. The infrared lamp bead evaluation device according to claim 1, characterized in that, The first temperature measuring component (30) includes a first thermocouple (31) and a first graphene sheet (32). The first thermocouple (31) is used to connect to the temperature measuring instrument, and the first thermocouple (31) is bonded and fixed to the heat-conducting plate (20) through the first graphene sheet (32). And / or, the second temperature measuring component (40) includes a second thermocouple (41), a second graphene sheet (42) and a heat insulation element (43), the heat insulation element (43) being connected to the second wall (12), the second thermocouple (41) being used to connect to the temperature measuring instrument, and the second thermocouple (41) being bonded and fixed to the side of the heat insulation element (43) away from the second wall (12) via the second graphene sheet (42).

5. The infrared lamp bead evaluation device according to claim 1, wherein, The frame assembly (10) includes a first plate (13), a second plate (14), and a bracket (15). The first plate (13) and the second plate (14) are respectively mounted on the bracket (15). Along the height direction of the infrared lamp bead testing device (100), the first plate (13) and the second plate (14) are spaced apart, and the first plate (13) is located above the second plate (14). The wall surface of the first plate (13) facing the second plate (14) constitutes the first wall (11), and the end face of the second plate (14) facing the first plate (13) constitutes the second wall (12).

6. The infrared lamp bead evaluation device according to claim 5, characterized in that, The bracket (15) includes multiple pillars (150), which are detachably spliced ​​along the height direction of the infrared lamp bead testing device (100).

7. The infrared lamp bead evaluation device according to claim 6, characterized in that, Each of the support pillars (150) has a first segment (151) and a second segment (152) connected to each other. The outer diameter of the first segment (151) is smaller than the outer diameter of the second segment (152) so that a limiting step (153) is formed at the connection between the outer diameter of the first segment (151) and the second segment (152). A plug hole (154) is provided at the end of the second segment (152) away from the first segment (151). The second segment (152) of each support pillar (150) can be sleeved on the first segment (151) of another support pillar (150) through the plug hole (154) and stopped by the limiting step (153).

8. The infrared lamp bead evaluation device according to claim 7, characterized in that, The first plate (13) has a first hole, and the first plate (13) can be sandwiched between two adjacent pillars (150) along the height direction of the infrared lamp bead evaluation device (100), and the first plate (13) is sleeved on the outside of the corresponding first segment (151) through the first hole. The second plate (14) has a second hole, and the second plate (14) can be clamped between two adjacent pillars (150) along the height direction of the infrared lamp bead testing device (100), and the second plate (14) is sleeved on the outside of the corresponding first segment (151) through the second hole.

9. The infrared lamp bead evaluation device according to claim 5, characterized in that, The material of the second plate (14) is a transparent acrylic plate or a glass plate.

10. The infrared lamp bead evaluation device according to claim 1, characterized in that, The heat-conducting plate (20) is configured as an aluminum plate.

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