Chip optical inspection device

Abstract

This utility model relates to the field of chip testing technology, specifically disclosing a chip optical testing device. The device includes an adsorption module and a testing module. The adsorption module includes a pick-up nozzle for selectively adsorbing chips and a nozzle drive assembly for driving the pick-up nozzle. The testing module includes a testing assembly, which includes a testing guide and a camera testing assembly for photographing the surface to be tested. The testing guide includes a first reflector and a second reflector forming a testing optical path. The exit port of the testing optical path faces the lens of the camera testing assembly, and the optical axis of the lens extends along a first direction. The entrance port faces the surface to be tested on the chip perpendicular to a second direction. Light rays entering from the entrance port enter the first reflector along the second direction, are reflected, enter the second reflector along a third direction, are reflected again, and exit from the exit port along the first direction. The first, second, and third directions are set at angles to each other. This device optimizes the testing optical path to ensure that the movements of each component do not interfere with each other.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip optical testing device. Background Technology

[0002] In chip manufacturing and packaging processes, visual inspection is a crucial step in ensuring product quality. With increasing chip integration and diversification of packaging methods, higher demands are placed on the accuracy, efficiency, and flexibility of inspection equipment.

[0003] Traditional chip optical inspection equipment typically employs a direct-view optical path design, where the camera and the surface of the chip under test are positioned directly opposite each other, with light propagating in a single direction into the camera lens. While this structure is simple and intuitive, it has significant limitations in practical applications. Firstly, the linear propagation characteristic of light restricts the camera's placement, making it difficult to avoid moving parts such as the pick-and-place nozzle. This can lead to light path obstruction during chip handling, affecting inspection stability and repeatability. Secondly, traditional equipment struggles to achieve simultaneous multi-angle and multi-directional inspection, limiting the spatial integration and automation levels of the inspection system. Furthermore, with increasing inspection cycle requirements, traditional inspection methods are no longer sufficient to meet the speed and efficiency demands of modern production lines for high-speed cyclic testing. Utility Model Content

[0004] The purpose of this invention is to provide a chip optical inspection device to accelerate the inspection cycle and meet the requirements for inspection speed and efficiency.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A chip optical inspection device is used to inspect chips, wherein the chip has at least one surface to be inspected. The chip optical inspection device includes an adsorption module and a detection module. The adsorption module includes a nozzle driving assembly and a pick-up nozzle. The pick-up nozzle selectively adsorbs the chip, and the nozzle driving assembly drives the pick-up nozzle to move the chip past the inspection position. The detection module is movably disposed on the adsorption module and includes a detection assembly. The detection assembly includes a detection guide and a camera detection assembly. The camera detection assembly is used to photograph the surface to be inspected. The detection guide includes a first reflector and a second reflector. The first and second reflectors form a detection optical path. The exit port of the detection optical path is directly opposite the lens of the camera detection assembly. The optical axis of the lens extends along a first direction. The entrance port of the detection optical path is directly opposite the test surface on the chip located at the detection position. The test surface is perpendicular to a second direction. Light rays entering from the entrance port enter the first reflector along the second direction, are reflected by the first reflector, enter the second reflector along a third direction, are reflected by the second reflector, and exit from the exit port along the first direction. The first direction, the second direction, and the third direction are set at angles to each other.

[0007] As an optional technical solution for chip optical inspection devices, the pick-up nozzle rotates about an axis parallel to the third direction.

[0008] As an optional technical solution for chip optical inspection devices, the adsorption module also includes a carrier plate, the output end of the suction nozzle drive component is fixed to the carrier plate, and the material suction nozzle is disposed on the carrier plate.

[0009] As an optional technical solution for chip optical inspection devices, the output end of the suction nozzle drive assembly is connected to the bottom end of the carrier plate, and the material suction nozzle is connected to the top end of the carrier plate.

[0010] As an optional technical solution for chip optical inspection devices, the axis of the carrier disk is parallel to the third direction, and the output end of the suction nozzle drive component is coaxial with the carrier disk.

[0011] As an optional technical solution for chip optical inspection devices, multiple pick-up nozzles are provided, and all of the pick-up nozzles are evenly distributed around the axis of the carrier disk.

[0012] As an optional technical solution for the chip optical inspection device, the inspection module further includes a camera driving component, the inspection component being fixed on the camera driving component, and the camera driving component being used to drive the inspection component to move in a plane perpendicular to the third direction.

[0013] As an optional technical solution for the chip optical inspection device, the adsorption module further includes a light source assembly, which is used to illuminate the chip located at the inspection position.

[0014] As an optional technical solution for chip optical inspection devices, the number of inspection components is the same as the number of test surfaces on the chip, and each test surface corresponds to one inspection component.

[0015] As an optional technical solution for chip optical inspection devices, the first direction, the second direction, and the third direction are all perpendicular to each other.

[0016] The beneficial effects of this utility model are:

[0017] This chip optical inspection device, by setting up a first and a second reflector, allows light rays, originally limited by the direction of the chip's test surface, to undergo multiple optical path direction conversions before entering the camera along the lens's optical axis. This achieves a turning point in the chip inspection optical path, ensuring flexible arrangement of the optical path in three-dimensional space. This enables non-direct-view inspection between the camera and the chip, and by spatially offsetting the camera inspection component and the pick-up nozzle, it avoids obstruction of the optical path during nozzle movement. This ensures that the movements of the camera inspection component and the pick-up nozzle in different directions do not interfere with each other, providing ample space for nozzle layout, enhancing layout flexibility, improving the space utilization and module integration of the chip optical inspection device, and facilitating a high-efficiency and high-precision automated inspection process. Furthermore, the nozzle drive component moves the chip past the inspection position, with the inspection module working synchronously, achieving automated improvements in the inspection process. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the chip optical detection device provided in this embodiment of the utility model;

[0019] Figure 2 This is a front view of the chip optical inspection device provided in this embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the detection guide provided in this embodiment of the utility model.

[0021] In the picture:

[0022] X, first direction; Y, second direction; Z, third direction;

[0023] 100. Camera detection component; 200. Detection guide; 220. First reflector; 230. Second reflector; 300. Pickup nozzle; 400. Nozzle drive component; 500. Camera drive component. Detailed Implementation

[0024] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0025] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] like Figures 1 to 3As shown, this embodiment provides a chip optical inspection device for inspecting chips. The chip has at least one surface to be inspected. The chip optical inspection device includes an adsorption module and a detection module. The adsorption module includes a nozzle driving assembly 400 and a pick-up nozzle 300. The pick-up nozzle 300 selectively adsorbs the chip. The nozzle driving assembly 400 drives the pick-up nozzle 300 to move the chip past the inspection position. The detection module is movably disposed on the adsorption module. The detection module includes a detection component, which includes a detection guide 200 and a camera detection component 100. The camera detection component 100 is used to capture images of the surface to be inspected. The detection guide 200 includes a first reflector 2. The first reflector 220 and the second reflector 230 form a detection optical path. The light outlet of the detection optical path is directly opposite the lens of the camera detection component 100. The optical axis of the lens extends along the first direction X. The light inlet of the detection optical path is directly opposite the test surface on the chip located at the detection position. The test surface is perpendicular to the second direction Y. The light rays entering from the light inlet enter the first reflector 220 along the second direction Y. After being reflected by the first reflector 220, they enter the second reflector 230 along the third direction Z. After being reflected by the second reflector 230, they exit from the light outlet along the first direction X. The first direction X, the second direction Y, and the third direction Z are set at angles to each other.

[0029] This chip optical inspection device, by setting up a first reflector 220 and a second reflector 230, allows light rays, originally limited by the direction of the chip's test surface, to undergo multiple optical path direction conversions before entering the camera along the lens's optical axis. This achieves a turning point in the chip inspection optical path, ensuring flexible arrangement of the optical path in three-dimensional space and enabling non-direct-view inspection between the camera and the chip. Furthermore, by spatially offsetting the camera inspection component 100 and the pick-up nozzle 300, it avoids the pick-up nozzle 300 obstructing the optical path during movement, ensuring that the movements of the camera inspection component 100 and the pick-up nozzle 300 in different directions do not interfere with each other. This provides ample space for the layout of the pick-up nozzle 300, enhancing layout flexibility and improving the space utilization and module integration of the chip optical inspection device, facilitating a high-efficiency and high-precision automated inspection process. Moreover, the nozzle drive component 400 drives the chip past the inspection position, with the inspection module working synchronously, achieving automated improvements in the inspection process.

[0030] The aforementioned chip optical inspection device has significant engineering value and market potential in practical applications, and is suitable for high-precision chip inspection scenarios.

[0031] In this embodiment, the material suction nozzle 300 rotates about an axis parallel to the third direction Z.

[0032] The 300mm pick-up nozzle rotates around a third direction (Z) to achieve chip adsorption and positioning in different directions, which is beneficial for the rational layout of the structural space, avoids interference problems caused by rotation, and also helps to improve the compactness of the structure. Moreover, the rotation function helps to realize the automatic flipping and alignment of chips, which helps to improve the automation level of the chip optical inspection device.

[0033] Furthermore, the adsorption module also includes a support plate, the axis of which is parallel to the third direction Z. The output end of the suction nozzle drive assembly 400 is fixed to the support plate, and the material suction nozzle 300 is disposed on the support plate.

[0034] The pick-up nozzle 300 is mounted on a carrier plate and connected to the nozzle drive assembly 400 via the carrier plate, forming a modular structure. This ensures the stability and reliability of the pick-up nozzle 300, facilitates future replacement and maintenance, improves the maintainability and efficiency of the chip optical inspection device, reduces maintenance costs, and prevents adsorption failure of a single pick-up nozzle 300 due to structural loosening. The fixed connection between the nozzle drive assembly 400 and the carrier plate increases the rigidity of the overall structure, facilitates the linkage control between the nozzle drive assembly 400 and multiple pick-up nozzles 300, ensures the stability and synchronization of the chip during movement, and reduces detection errors caused by vibration. Moreover, the carrier plate design provides a basic platform for the layout of multiple pick-up nozzles 300, facilitating parallel operation of multiple pick-up nozzles 300, improving chip handling efficiency, and reserving space for future expansion to include simultaneous multi-chip inspection capabilities.

[0035] Furthermore, the output end of the suction nozzle drive assembly 400 is connected to the bottom end of the carrier plate, and the material suction nozzle 300 is connected to the top end of the carrier plate.

[0036] The nozzle drive assembly 400 is connected to the bottom of the support plate, while the pick-up nozzle 300 is located at the top. This distribution lowers the center of gravity of the entire adsorption module, making it more stable during movement and reducing the impact of vibration on chip adsorption stability. This also helps maintain the balance of the robotic arm and improves stability during movement. Furthermore, the arrangement of the vertical nozzle drive assembly 400 at the bottom and the pick-up nozzle 300 at the top makes the structure more compact, facilitating the integration of more detection components within a limited space. Moreover, placing the drive assembly at the bottom facilitates daily maintenance and wiring, while preventing the pick-up nozzle 300 and chip area from being obstructed by mechanical parts, thus avoiding interference with the detection field of view.

[0037] In this embodiment, the axis of the carrier disk is parallel to the third direction Z, and the output end of the suction nozzle drive assembly 400 is coaxial with the carrier disk.

[0038] The coaxial arrangement of the carrier disk and the drive output ensures coaxiality during rotation, guaranteeing the accuracy and stability of the carrier disk during rotation, reducing rotational errors caused by eccentricity, and improving positioning accuracy during detection. Furthermore, the coaxial structure helps reduce energy loss during transmission, simplifies the drive control logic, improves system response speed and control accuracy, easily meets the requirements of high-precision image acquisition, enhances the efficiency of the rotation drive, and helps extend the service life of the chip optical inspection device.

[0039] Furthermore, there are multiple material suction nozzles 300, and all material suction nozzles 300 are evenly distributed around the axis of the support plate.

[0040] The multiple pick-up nozzles 300 allow for the simultaneous adsorption of multiple chips, enabling simultaneous chip pick-up, placement, and inspection. This shortens the inspection cycle, facilitates a rotating inspection process, and improves inspection efficiency and automation. Furthermore, the ring-shaped distribution structure facilitates integration with external automated conveying systems, enabling continuous production.

[0041] The material suction nozzle 300 is a conventional device in this technical field. Its specific structure and working principle are common knowledge in this field. Moreover, the material suction nozzle 300 is not the focus of this embodiment, so it will not be described in detail here.

[0042] For example, the detection module further includes a camera driving component 500, the detection component is fixed on the camera driving component 500, and the camera driving component 500 is used to drive the detection component to move in a plane perpendicular to the third direction Z.

[0043] The camera driver assembly 500 moves the detection assembly in a plane perpendicular to the third direction Z, enabling the camera to accurately focus and capture images of different areas of the chip. This improves detection alignment accuracy and avoids detection failures caused by chip placement errors. Simultaneously, the movement function reduces interference between the pick-up nozzle 300 and the camera in the third direction Z, optimizing the spatial layout of the detection module to accommodate the detection needs of chips of different sizes and enhancing the adaptability and flexibility of the chip optical inspection device.

[0044] In this embodiment, the adsorption module further includes a light source assembly for illuminating the chip located at the detection position.

[0045] The light source component provides stable illumination for the chip, avoiding interference from ambient light. Good light source illumination helps improve image contrast, facilitates the identification of minute defects on the chip surface, ensures the consistency of image acquisition under different ambient light conditions, and improves detection accuracy and stability.

[0046] For example, the number of detection components is the same as the number of test surfaces on the chip, and each test surface corresponds to one detection component.

[0047] Each surface under test is configured with an independent detection component, enabling synchronous detection of all surfaces on a single chip. This avoids time loss when switching between surfaces and improves detection efficiency. Furthermore, the independent detection components can be focused and calibrated separately, which helps improve detection accuracy and independence, facilitates fault location and replacement, and enhances equipment availability.

[0048] In this embodiment, the first direction X, the second direction Y, and the third direction Z are all perpendicular to each other.

[0049] The above constraints facilitate the establishment of a standard three-dimensional coordinate system, providing a unified benchmark for optical paths, motion control, and image processing. The vertical arrangement facilitates mechanical structure design and assembly, reducing error accumulation; and it is also beneficial for the development and optimization of subsequent image processing algorithms and motion control algorithms.

[0050] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A chip optical inspection apparatus for inspecting a chip, said chip having at least one surface to be inspected, characterized in that, The chip optical inspection device includes: The adsorption module includes a suction nozzle driving assembly (400) and a material picking nozzle (300). The material picking nozzle (300) selectively adsorbs the chip, and the suction nozzle driving assembly (400) drives the material picking nozzle (300) to make the chip pass through the detection position. A detection module is movably disposed within the adsorption module. The detection module includes a detection component, which includes a detection guide (200) and a camera detection component (100). The camera detection component (100) is used to photograph the surface to be tested. The detection guide (200) includes a first reflector (220) and a second reflector (230). The first reflector (220) and the second reflector (230) form a detection optical path. The light outlet of the detection optical path is directly opposite the lens of the camera detection component (100), and the optical axis of the lens is along a first direction (X). Extending further, the light inlet of the detection optical path is directly opposite the test surface on the chip located at the detection position. The test surface is perpendicular to the second direction (Y). The light rays entering from the light inlet enter the first reflector (220) along the second direction (Y), and after being reflected by the first reflector (220), enter the second reflector (230) along the third direction (Z). After being reflected by the second reflector (230), the light rays exit from the light outlet along the first direction (X). The first direction (X), the second direction (Y), and the third direction (Z) are set at angles to each other.

2. The chip optical inspection device according to claim 1, characterized in that, The material suction nozzle (300) rotates about an axis parallel to the third direction (Z).

3. The chip optical inspection device according to claim 2, characterized in that, The adsorption module also includes a support plate, the output end of the suction nozzle drive assembly (400) is fixed to the support plate, and the material suction nozzle (300) is disposed on the support plate.

4. The chip optical inspection device according to claim 3, characterized in that, The output end of the suction nozzle drive assembly (400) is connected to the bottom end of the carrier plate, and the material suction nozzle (300) is connected to the top end of the carrier plate.

5. The chip optical inspection device according to claim 3, characterized in that, The axis of the carrier plate is parallel to the third direction (Z), and the output end of the suction nozzle drive assembly (400) is coaxial with the carrier plate.

6. The chip optical inspection device according to claim 3, characterized in that, The material pick-up nozzle (300) is provided in multiple ways, and all the material pick-up nozzles (300) are evenly distributed around the axis of the carrier plate.

7. The chip optical inspection device according to claim 2, characterized in that, The detection module further includes a camera driving component (500), which is fixed on the camera driving component (500) and is used to drive the detection component to move in a plane perpendicular to the third direction (Z).

8. The chip optical inspection device according to claim 1, characterized in that, The adsorption module further includes a light source assembly for illuminating the chip located at the detection position.

9. The chip optical inspection device according to claim 1, characterized in that, The number of detection components is the same as the number of test surfaces on the chip, and each test surface corresponds to one detection component.

10. The chip optical inspection apparatus according to any one of claims 1-9, characterized in that, The first direction (X), the second direction (Y), and the third direction (Z) are all perpendicular to each other.

Images