A packaged chip testing device

Abstract

This utility model discloses a packaged chip testing device, including a fixed platform. A support column is fixedly connected to the bottom surface of the fixed platform, and a fixed disk is rotatably connected to the inner wall of the fixed platform. A limit ring is fixedly connected to the surface of the fixed disk. Activating the adsorption and fixing mechanism adsorbs and fixes the packaged chip. Activating the testing mechanism allows for image acquisition and testing of the chip surface. Activating the rotation component drives the packaged chip to rotate through the fixed disk, fixed frame, and adsorption and fixing mechanism, thereby adjusting the testing direction of the chip body. Activating the drive component drives the testing mechanism to flip upward through the transmission shaft, thereby automatically adjusting the image acquisition position of the testing mechanism. This achieves the goal of facilitating automatic adjustment of the image acquisition and testing position of the packaged chip, avoiding the problem of significantly reduced testing accuracy caused by the relatively fixed testing position of existing testing equipment.

Description

Technical Field

[0001] This utility model relates to the field of packaged chip testing technology, and in particular to a packaged chip testing device. Background Technology

[0002] Chip packaging is the process of forming individual devices from the diced dies of a wafer using packaging technology. It primarily provides mechanical protection, electrical connectivity, and heat dissipation. Modern packaging technology has evolved from traditional DIP to 2.5D / 3D stacked packaging, employing advanced processes such as through-silicon vias (TSVs) and fan-out designs, and is widely used in processors, memory chips, and 5G communications.

[0003] After the packaged chip is manufactured, testing equipment is needed to inspect the integrity of the packaged chip surface in order to improve production quality. However, the existing testing equipment has a relatively fixed image acquisition and inspection position on the chip surface, making it difficult to acquire and inspect the side image of the chip, which greatly reduces the accuracy of chip inspection. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a packaged chip testing device to solve the aforementioned problems.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A packaged chip testing device includes a fixed platform, a support column fixedly connected to the bottom surface of the fixed platform, a fixed disk rotatably connected to the inner wall of the fixed platform, a limit ring fixedly connected to the surface of the fixed disk and rotatably connected to the inner wall of the fixed platform, a fixed frame fixedly connected to the top surface of the fixed disk, a support plate fixedly connected to the top surface of the fixed platform, a drive shaft rotatably connected to the inner wall of the support plate, a testing mechanism provided on the surface of the drive shaft, a driving assembly provided on the bottom surface of the fixed platform, an adsorption and fixing mechanism provided inside the fixed frame, and a rotating assembly provided on the bottom surface of the fixed platform.

[0006] Preferably, the detection mechanism consists of a fixed frame and a detection camera, wherein the fixed frame is fixedly connected to the surface of the transmission shaft, and the detection camera is fixedly connected to the inner wall of the fixed frame.

[0007] Preferably, the drive assembly consists of a first servo motor, a drive wheel, a transmission belt, and a driven wheel. The first servo motor is fixedly connected to the bottom surface of the fixed platform. The inner wall of the drive wheel is fixedly connected to the output end of the first servo motor. The transmission belt meshes with the inner wall of the drive wheel. The inner wall of the driven wheel is fixedly connected to the surface of the transmission shaft, and the inner wall of the driven wheel meshes with the transmission belt.

[0008] Preferably, the adsorption and fixing mechanism consists of a vacuum suction cup, a silicone ring, a suction tube, and a vacuum pump. The vacuum suction cup is fixedly connected to the inner wall of the fixing frame, the silicone ring is fixedly connected to the top surface of the vacuum suction cup, the air inlet end of the suction tube is fixedly connected to the inner wall of the vacuum suction cup, the vacuum pump is fixedly connected to the inner wall of the suction tube, and the vacuum pump is fixedly connected to the top surface of the fixing plate.

[0009] Preferably, the rotating assembly consists of a second servo motor, a worm gear, a fixed shaft, and a worm wheel. The second servo motor is fixedly connected to the bottom surface of the fixed platform, the worm gear is fixedly connected to the output end of the second servo motor, the fixed shaft is fixedly connected to the bottom surface of the fixed disk, and the inner wall of the worm wheel is fixedly connected to the surface of the fixed shaft, with the worm wheel meshing with the worm gear.

[0010] Preferably, the fixing plate is circular in shape and is made of metal.

[0011] Preferably, there are multiple support plates, and the multiple support plates are symmetrically arranged with the vertical center line on the left side of the fixed platform as the axis of symmetry.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This packaged chip inspection device, when activated, uses an adsorption and fixing mechanism to adsorb and fix the packaged chip; when activated, the inspection mechanism can perform image acquisition and inspection on the chip surface; when activated, the rotating component drives the packaged chip to rotate through the fixing disk, fixing frame, and adsorption and fixing mechanism, thereby adjusting the inspection direction of the chip body; when activated, the driving component drives the inspection mechanism to flip upward through the transmission shaft, thereby automatically adjusting the image acquisition position of the inspection mechanism. This achieves the goal of facilitating the automatic adjustment of the image acquisition and inspection position of the packaged chip, avoiding the problem that the inspection accuracy of existing inspection equipment is greatly reduced due to the relatively fixed inspection position. Attached Figure Description

[0013] Figure 1 This is an isometric drawing of the structure of this utility model; Figure 2 This is a cross-sectional view of the structure of this utility model; Figure 3 This is an enlarged view of the structure at point A of this utility model; Figure 4 This is a left sectional view of the structure of this utility model; Figure 5 This is an enlarged view of structure B of this utility model.

[0014] In the diagram: 1. Fixed platform; 2. Support column; 3. Fixed plate; 4. Limiting ring; 5. Fixed frame; 6. Support plate; 7. Drive shaft; 8. Fixing frame; 9. Detection camera; 10. First servo motor; 11. Drive wheel; 12. Drive belt; 13. Driven wheel; 14. Vacuum suction cup; 15. Silicone ring; 16. Suction tube; 17. Vacuum pump; 18. Second servo motor; 19. Worm gear; 20. Fixed shaft; 21. Worm wheel. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Example: Refer to Figure 1-5 A packaged chip testing device includes a fixed platform 1, a support column 2 fixedly connected to the bottom surface of the fixed platform 1, and a fixed disk 3 rotatably connected to the inner wall of the fixed platform 1. The fixed disk 3 is circular and made of metal, which provides higher strength, makes it less prone to deformation and damage under stress, and is more durable. A limit ring 4 is fixedly connected to the surface of the fixed disk 3 and rotatably connected to the inner wall of the fixed platform 1. A fixed frame 5 is fixedly connected to the top surface of the fixed disk 3, and a support plate 6 is fixedly connected to the top surface of the fixed platform 1. Multiple support plates 6 are symmetrically arranged about the left vertical center line of the fixed platform 1, and are used to connect multiple drive shafts 7, improving the stability of the testing mechanism's tilting and adjustment. A drive shaft 7 is rotatably connected to the inner wall of the support plate 6, and a testing mechanism is provided on the surface of the drive shaft 7. The testing mechanism consists of a fixed frame. The fixed platform 8 and the detection camera 9 are used to collect image information of the chip surface, which facilitates the integrity detection of the packaged chip surface. The fixed platform 1 is equipped with a drive assembly, which consists of a first servo motor 10, a drive wheel 11, a transmission belt 12 and a driven wheel 13. The first servo motor 10 is fixedly connected to the bottom of the fixed platform 1. The inner wall of the drive wheel 11 is fixedly connected to the output end of the first servo motor 10. The transmission belt 12 meshes with the inner wall of the drive wheel 11. The inner wall of the driven wheel 13 is fixedly connected to the surface of the transmission shaft 7 and meshes with the transmission belt 12. This is used to drive the detection mechanism to flip upward, which facilitates the adjustment of the detection position. The fixed frame 5 is equipped with an adsorption fixing mechanism. The fixed platform 1 is equipped with a rotating assembly.

[0017] Specifically, the adsorption and fixation mechanism consists of a vacuum suction cup 14, a silicone ring 15, a suction tube 16, and a vacuum pump 17. The vacuum suction cup 14 is fixedly connected to the inner wall of the fixing frame 5, the silicone ring 15 is fixedly connected to the top surface of the vacuum suction cup 14, the air inlet end of the suction tube 16 is fixedly connected to the inner wall of the vacuum suction cup 14, and the vacuum pump 17 is fixedly connected to the inner wall of the suction tube 16 and the top surface of the fixing plate 3. This mechanism is used to adsorb and fix the packaged chip, thereby improving the detection stability.

[0018] Specifically, the rotating assembly consists of a second servo motor 18, a worm gear 19, a fixed shaft 20, and a worm wheel 21. The second servo motor 18 is fixedly connected to the bottom surface of the fixed platform 1, the worm gear 19 is fixedly connected to the output end of the second servo motor 18, the fixed shaft 20 is fixedly connected to the bottom surface of the fixed disk 3, and the inner wall of the worm wheel 21 is fixedly connected to the surface of the fixed shaft 20. The worm wheel 21 meshes with the worm gear 19 to drive the packaged chip to rotate, which facilitates automatic adjustment of the detection direction.

[0019] In use: First, the bottom of the packaged chip to be inspected is overlapped with the top surface of the silicone ring 15. The vacuum pump 17 is started to suck the air between the vacuum suction cup 14 and the chip through the suction pipe 16, which can adsorb and fix the packaged chip. The detection camera 9 is started to collect and inspect the image of the chip surface. The second servo motor 18 is started to drive the worm gear 19 to rotate. Through the meshing of the worm gear 19 and the worm wheel 21, the fixed shaft 20 and the fixed disk 3 are driven to rotate along the inner wall of the fixed platform 1. The rotation of the fixed disk 3 drives the fixed frame 5, the vacuum suction cup 14 and the packaged chip to rotate, which can adjust the detection direction of the chip body. The first servo motor 10 is started to drive the drive wheel 11 and the transmission belt 12 to rotate. Through the meshing of the transmission belt 12 and the driven wheel 13, the transmission shaft 7 is driven to rotate along the inner wall of the support plate 6. The rotation of the transmission shaft 7 drives the fixed frame 8 and the detection camera 9 to flip upward, which can automatically adjust the image acquisition position of the detection camera 9.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaged chip testing device, comprising a fixed platform (1), characterized in that, The fixed platform (1) is fixedly connected to a support column (2) on its bottom surface. The fixed platform (1) is rotatably connected to a fixed disk (3) on its inner wall. The fixed disk (3) is fixedly connected to a limiting ring (4) on its surface, and the limiting ring (4) is rotatably connected to the inner wall of the fixed platform (1). The fixed disk (3) is fixedly connected to a fixed frame (5) on its top surface. The fixed platform (1) is fixedly connected to a support plate (6) on its top surface. The support plate (6) is rotatably connected to a transmission shaft (7) on its inner wall. The transmission shaft (7) is provided with a detection mechanism on its surface. The fixed platform (1) is provided with a drive assembly on its bottom surface. The fixed frame (5) is provided with an adsorption and fixing mechanism inside its interior. The fixed platform (1) is provided with a rotating assembly on its bottom surface.

2. The packaged chip testing equipment according to claim 1, characterized in that, The detection mechanism consists of a fixed frame (8) and a detection camera (9). The fixed frame (8) is fixedly connected to the surface of the transmission shaft (7), and the detection camera (9) is fixedly connected to the inner wall of the fixed frame (8).

3. The packaged chip testing equipment according to claim 1, characterized in that, The drive assembly consists of a first servo motor (10), a drive wheel (11), a transmission belt (12), and a driven wheel (13). The first servo motor (10) is fixedly connected to the bottom surface of the fixed platform (1). The inner wall of the drive wheel (11) is fixedly connected to the output end of the first servo motor (10). The transmission belt (12) meshes with the inner wall of the drive wheel (11). The inner wall of the driven wheel (13) is fixedly connected to the surface of the transmission shaft (7), and the inner wall of the driven wheel (13) meshes with the transmission belt (12).

4. The packaged chip testing equipment according to claim 1, characterized in that, The adsorption and fixing mechanism consists of a vacuum suction cup (14), a silicone ring (15), a suction tube (16), and a vacuum pump (17). The vacuum suction cup (14) is fixedly connected to the inner wall of the fixing frame (5), the silicone ring (15) is fixedly connected to the top surface of the vacuum suction cup (14), the air inlet end of the suction tube (16) is fixedly connected to the inner wall of the vacuum suction cup (14), the vacuum pump (17) is fixedly connected to the inner wall of the suction tube (16), and the vacuum pump (17) is fixedly connected to the top surface of the fixing plate (3).

5. The packaged chip testing equipment according to claim 1, characterized in that, The rotating assembly consists of a second servo motor (18), a worm (19), a fixed shaft (20), and a worm wheel (21). The second servo motor (18) is fixedly connected to the bottom surface of the fixed platform (1). The worm (19) is fixedly connected to the output end of the second servo motor (18). The fixed shaft (20) is fixedly connected to the bottom surface of the fixed disk (3). The inner wall of the worm wheel (21) is fixedly connected to the surface of the fixed shaft (20), and the worm wheel (21) meshes with the worm (19).

6. The packaged chip testing equipment according to claim 1, characterized in that, The fixing plate (3) is round and made of metal.

7. The packaged chip testing equipment according to claim 1, characterized in that, The number of support plates (6) is multiple, and the multiple support plates (6) are symmetrically arranged with the vertical center line on the left side of the fixed platform (1) as the axis of symmetry.

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