A device for detecting the thermal conductivity of a thermal conductive adhesive

Abstract

This utility model discloses a thermal conductivity testing device for thermally conductive adhesive, including a housing and a base. The housing has a cover and a connecting ring inside. Several baffles are arranged between the connecting ring and the wall of the housing. An adhesive placement box is arranged between every two adjacent baffles. The bottom of the adhesive placement boxes is provided with the same annular plate. Several semiconductor heating elements are arranged on the annular plate, and the semiconductor heating elements are positioned corresponding to the adhesive placement boxes. An electric telescopic rod is provided at the bottom of the housing. The output end of the electric telescopic rod passes through the housing and connects to the annular plate. In this utility model, by detachably placing the adhesive placement boxes inside the housing and raising and lowering the adhesive placement boxes through the electric telescopic rod, the purpose of removing the adhesive placement boxes from the housing is achieved, which facilitates the cleaning of residual adhesive in the adhesive placement boxes during the testing process.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductivity testing technology, and in particular to a thermal conductivity testing device for thermally conductive adhesive. Background Technology

[0002] Thermally conductive adhesive, also known as thermally conductive silicone, is a type of silicone compound made primarily of organic silicone with added fillers, thermally conductive materials, and other polymeric materials. It possesses good thermal conductivity and electrical insulation properties and is widely used in electronic components. During the production process, the thermal conductivity of thermally conductive adhesive needs to be tested to ensure its quality meets standards before it can be sold.

[0003] Utility model CN212321491U discloses a thermal conductivity testing device for thermally conductive adhesives, comprising a testing box, an adhesive placement box, and a temperature sensor. The testing box includes a thermally conductive groove, a placement groove, a heating chamber, and an installation chamber. Heat insulation plates are welded into both the thermally conductive groove and the placement groove, and multiple heat insulation plates evenly divide the thermally conductive groove and the placement groove into multiple small sections. A temperature sensor is installed on the inner wall of each small section of the thermally conductive groove. A thermally conductive column penetrates the partition between the thermally conductive groove and the placement groove. A mixing mechanism to uniformly distribute the air temperature is provided in the heating chamber and the installation chamber. This utility model can test the thermal conductivity of different types of thermally conductive adhesives simultaneously without manual recording of test results, saving time and effort, increasing work efficiency, ensuring that the thermally conductive adhesive in each placement box is exposed to the same temperature, and ensuring that the temperature transfer between each small section is independent, minimizing testing errors.

[0004] In the device disclosed in the above utility model, the glue box is placed inside the heat conduction groove, making it difficult to clean the residual glue in the glue box after the test is completed. Utility Model Content

[0005] The purpose of this invention is to provide a device for testing the thermal conductivity of thermally conductive adhesive, so as to solve the problem mentioned in the background art of difficulty in cleaning residual adhesive in the adhesive box.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a thermal conductivity testing device for thermally conductive adhesive, comprising a housing and a base. The housing has a cover, and a connecting ring is provided inside the housing. Several baffles are provided between the connecting ring and the wall of the housing. An adhesive placement box is provided between every two adjacent baffles. The bottom of the adhesive placement boxes is provided with the same annular plate. Several semiconductor heating elements are provided on the annular plate, and the semiconductor heating elements are positioned corresponding to the adhesive placement boxes. An electric telescopic rod is provided at the bottom of the housing, and the output end of the electric telescopic rod passes through the housing and connects to the annular plate.

[0007] Preferably, a plurality of temperature sensors are provided on the bottom wall of the cover, and the plurality of temperature sensors correspond to a plurality of adhesive boxes.

[0008] Preferably, a semiconductor cooling chip is disposed inside the annular plate, and the semiconductor cooling chip is arranged in a ring.

[0009] Preferably, the semiconductor cooling chip is provided with a heat sink, and a fan is provided on the heat sink.

[0010] Preferably, the annular plate has a plurality of connecting grooves on its wall surface, the connecting grooves penetrating the annular plate.

[0011] Preferably, several of the baffles are suspended and connected to the upper part of the housing.

[0012] Preferably, a high-temperature resistant silicone sealing ring is provided at the edge of the cover.

[0013] The beneficial effects of this utility model are:

[0014] In this invention, the glue container is detachably installed inside the housing, and the glue container is raised and lowered by an electric telescopic rod, thereby achieving the purpose of removing the glue container from the housing and facilitating the cleaning of residual glue in the glue container during the testing process.

[0015] This invention enables rapid heating of the colloid by incorporating a semiconductor heating element in the device, effectively improving the speed of thermal conductivity testing. Furthermore, the inclusion of a semiconductor cooling element allows for rapid cooling of the interior of the casing, reducing the device's cooling time and facilitating the next round of colloid testing. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a thermal conductivity testing device for thermally conductive adhesive proposed in this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the housing of a thermal conductivity testing device for thermally conductive adhesive proposed in this utility model;

[0018] Figure 3 This is a front cross-sectional view of the thermal conductivity testing device for thermally conductive adhesive proposed in this utility model.

[0019] Figure 4 This is a bottom view of the cover structure of the thermal conductivity testing device for thermally conductive adhesive proposed in this utility model.

[0020] In the diagram: 1. Housing; 2. Base; 3. Cover; 4. Connecting ring; 5. Baffle; 6. Adhesive box; 7. Ring plate; 8. Electric telescopic rod; 9. Semiconductor heating element; 10. Temperature sensor; 11. Semiconductor cooling element; 12. Heat sink; 13. Fan; 14. Connecting groove; 15. High-temperature resistant silicone sealing ring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-4 A thermal conductivity testing device for thermally conductive adhesive includes a housing 1 and a base 2. The housing 1 has a cover 3 and a connecting ring 4 inside the housing 1. Several baffles 5 are arranged between the connecting ring 4 and the wall of the housing 1. An adhesive placement box 6 is arranged between every two adjacent baffles 5. The bottom of the adhesive placement boxes 6 is provided with the same annular plate 7. Several semiconductor heating elements 9 are arranged on the annular plate 7. The semiconductor heating elements 9 are positioned corresponding to the adhesive placement boxes 6. An electric telescopic rod 8 is provided at the bottom of the housing 1. The output end of the electric telescopic rod 8 passes through the housing 1 and is connected to the annular plate 7.

[0023] When using the device, the colloid is placed into the colloid box 6, and then the cover 3 is closed to seal the internal space of the housing 1. Then, the semiconductor heating element 9 is connected to the power supply to heat the colloid box 6. After the colloid is tested, the cover 3 is opened, and the output axis of the electric telescopic rod 8 is moved upward, thereby driving several colloid boxes 6 to move synchronously to the top of the housing 1 through the annular plate 7. This makes it easy for the staff to remove the colloid boxes 6 and clean the residual colloid inside the colloid boxes 6.

[0024] Specifically, in this embodiment, a plurality of temperature sensors 10 are provided on the bottom wall of the cover 3. The plurality of temperature sensors 10 correspond to a plurality of glue-holding boxes 6. By setting the temperature sensors 10, it is convenient to detect the heating temperature in the plurality of glue-holding boxes 6, thereby achieving the purpose of detecting the state of the glue at different temperatures.

[0025] Specifically, in this embodiment, a semiconductor cooling chip 11 is provided inside the annular plate 7. The semiconductor cooling chip 11 is arranged in a ring. When the colloidal test is completed and the next round of test is required, the semiconductor cooling chip 11 can generate a low temperature, thereby achieving the purpose of rapidly cooling the inside of the shell 1, so as to facilitate the next round of colloidal test.

[0026] Specifically, in this embodiment, a heat sink 12 is provided on the semiconductor cooling chip 11, and a fan 13 is provided on the heat sink 12, so that the low temperature generated by the semiconductor cooling chip 11 can be dissipated through the heat sink 12, and the cold airflow on the heat sink 12 is controlled by the fan 13 to flow in the housing 1, so that the temperature in the housing 1 can be reduced uniformly.

[0027] Specifically, in this embodiment, a plurality of connecting grooves 14 are provided on the wall surface of the annular plate 7. The connecting grooves 14 penetrate the annular plate 7, so that the low temperature inside the annular plate 7 can extend towards the glue box 6 through the connecting grooves 14, thereby realizing the movement of the low temperature airflow.

[0028] Specifically, in this embodiment, several baffles 5 are suspended and connected to the upper part of the housing 1, so that the lower part of several glue boxes 6 can form an air flow space and be connected to the space inside the annular plate 7, thereby achieving the purpose of rapid cooling.

[0029] Specifically, in this embodiment, a high-temperature resistant silicone sealing ring 15 is provided at the edge of the cover 3. The high-temperature resistant silicone sealing ring 15 facilitates the sealing between the opening of the shell 1 and the cover 3, thereby preventing the loss of internal temperature of the shell 1.

[0030] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A device for detecting the thermal conductivity of a heat-conducting glue, comprising a housing (1) and a base (2), characterized in that: The housing (1) has a cover (3), and a connecting ring (4) is provided inside the housing (1). Several baffles (5) are provided between the connecting ring (4) and the wall of the housing (1). A glue box (6) is provided between every two adjacent baffles (5). The bottom of several glue boxes (6) is provided with the same annular plate (7). Several semiconductor heating elements (9) are provided on the annular plate (7). The semiconductor heating elements (9) are positioned corresponding to the glue boxes (6). An electric telescopic rod (8) is provided at the bottom of the housing (1). The output end of the electric telescopic rod (8) passes through the housing (1) and is connected to the annular plate (7).

2. The device of claim 1, wherein: Several temperature sensors (10) are provided on the bottom wall of the cover (3), and the several temperature sensors (10) correspond to several adhesive boxes (6).

3. The device of claim 1, wherein: The annular plate (7) is provided with a semiconductor cooling chip (11) inside, and the semiconductor cooling chip (11) is arranged in a ring.

4. The device of claim 3, wherein: The semiconductor cooling chip (11) is provided with a heat sink (12), and a fan (13) is provided on the heat sink (12).

5. The device of claim 4, wherein: The annular plate (7) has several connecting grooves (14) on its wall surface, and the connecting grooves (14) penetrate the annular plate (7).

6. The device of claim 5, wherein: Several of the baffles (5) are suspended and connected to the upper part of the housing (1).

7. The heat conductive glue heat conductivity detection device according to claim 1, wherein: A high-temperature resistant silicone sealing ring (15) is provided at the edge of the cover (3).

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