Rapid testing device for thermal conductivity of potting compound

By designing a rapid testing device, which combines a heating plate and an ejector assembly, the problems of complex existing equipment and demanding sample requirements are solved, enabling rapid and convenient testing of the thermal conductivity of potting compounds.

CN224581460UActive Publication Date: 2026-07-31GUANGDONG ZHUOYICHENG NEW MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG ZHUOYICHENG NEW MATERIALS CO LTD
Filing Date
2025-08-22
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing equipment for testing the thermal conductivity of potting compounds is bulky and complex to operate, making it difficult to achieve rapid and convenient evaluation on the production site, and it also has stringent requirements for samples.

Method used

A rapid testing device was designed, comprising a base, a testing container, a heating plate, a temperature detector, and an ejection assembly. The heating plate heats the potting compound and records the temperature change over time. Combined with the ejection assembly, the sample can be easily removed, enabling rapid testing.

Benefits of technology

It enables efficient and rapid testing of the thermal conductivity of potting mixes, simplifies the operation process, reduces sample requirements, and is suitable for rapid evaluation on the production site.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a rapid testing device for the thermal conductivity of potting refractories, relating to the technical field of testing devices. The rapid testing device for the thermal conductivity of potting refractories includes a base and a testing container fixedly connected to the top of the base. The top of the testing container has a receiving groove, and the bottom of the receiving groove is fixedly connected to a heating plate. A heating wire is fixedly installed inside the heating plate, and an ejection assembly is provided inside the heating plate. A cover plate is rotatably mounted on the upper end of the testing container. A temperature detector is fixedly installed on the top of the cover plate, and a testing head facing the upper surface of the heating plate is fixedly installed on the lower end of the cover plate. This utility model can efficiently and quickly complete the testing of the thermal conductivity of potting refractories and can efficiently eject the solidified potting refractories from the receiving groove, facilitating the removal of the tested potting refractories by testing personnel.
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Description

Technical Field

[0001] This utility model belongs to the technical field of testing devices, specifically, it relates to a rapid testing device for the thermal conductivity of potting and casting materials. Background Technology

[0002] Encapsulating refractories are engineering materials used for sealing and protecting electronic, electrical, or mechanical components. They are filled into the interior or outer shell of devices through casting or potting processes, and after curing, form a protective encapsulation layer. Their core functions are insulation, moisture protection, heat dissipation, and shock resistance, and they are widely used in new energy batteries, transformers, sensors, circuit boards, and other fields.

[0003] Existing technologies present significant inconveniences in testing the thermal conductivity of potting compounds: traditional testing equipment (such as hot plate and hot wire methods) requires samples to be completely cured and precisely machined to standard dimensions, and the testing process necessitates complex thermal equilibrium control and long periods of steady-state waiting; while laser flash methods are faster, they have stringent requirements on sample thickness and surface finish. These devices are bulky and require highly specialized operation, making it difficult to achieve rapid and convenient thermal conductivity assessments on the production site, severely impacting the efficiency of material development and process optimization. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a rapid testing device for the thermal conductivity of potting mixes that can overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:

[0006] A rapid testing device for the thermal conductivity of potting compound includes a base and a testing container fixedly connected to the top of the base. The top of the testing container has a receiving groove, and a heating plate is fixedly connected to the bottom of the receiving groove. An electric heating wire is fixedly installed inside the heating plate, and an ejection assembly is provided inside the heating plate. A cover plate is rotatably installed on the upper end of the testing container. A temperature detector is fixedly installed on the top of the cover plate, and a testing head facing the upper surface of the heating plate is fixedly installed on the lower end of the cover plate.

[0007] Preferably, the ejector assembly includes a vertical hole on the heating plate, a ejector rod is slidably mounted longitudinally in the vertical hole, the base has a device cavity, and the device cavity of the base has a lifting component for driving the ejector rod to move up and down.

[0008] Furthermore, the lifting component includes a rotating shaft rotatably connected to the cavity of the base device, a top block connected to the top rod is provided at the bottom of the heating plate, a main spring is installed between the top block and the bottom of the heating plate, and a pressing part for pressing the top block is provided on the rotating shaft.

[0009] Furthermore, the top pressing part includes a turntable fixedly mounted on the rotating shaft, with rollers rotatably mounted on the top of the turntable, and a drive motor for driving the rotating shaft to rotate is fixedly mounted inside the device cavity of the base.

[0010] Furthermore, the lower end of the push rod is provided with a sliding hole, a push rod is slidably installed in the sliding hole, the top block is fixedly connected to the bottom of the push rod, and a secondary spring is installed between the top of the push rod and the inner top of the sliding hole.

[0011] Furthermore, the top block is disc-shaped, and the lower edge of the top block is chamfered.

[0012] Preferably, the cross-sectional shape of the receiving groove is conical, and the inner wall of the receiving groove and the top surface of the heating plate are coated with a non-stick layer.

[0013] Preferably, the number of detection heads is set to multiple sets, and they are distributed in a star-shaped pattern at the bottom of the cover plate.

[0014] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:

[0015] 1. This utility model involves injecting potting compound into a receiving tank, then heating and solidifying the potting compound with a heating plate, and then increasing the heating power of the heating wire. At this time, the time required for the surface temperature of the potting compound to reach close to the temperature of the heating wire is recorded. If the time is long, it is judged that the thermal conductivity of the potting compound is poor; otherwise, it is judged that the thermal conductivity of the potting compound is good. This allows for efficient and rapid testing of the thermal conductivity of potting compound.

[0016] 2. By starting the drive motor, the continuously rotating turntable causes the rollers to indirectly push the top block upwards, thereby causing multiple top rods to rise and fall intermittently. This efficiently pushes out the solidified potting compound in the receiving tank, making it easy for testing personnel to remove the potting compound after testing.

[0017] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0018] In the attached diagram:

[0019] Figure 1 This is a three-dimensional structural diagram of the rapid testing device for the thermal conductivity of potting and casting refractories proposed in this utility model;

[0020] Figure 2 This is a partial cross-sectional schematic diagram of the rapid testing device for the thermal conductivity of potting refrigerants proposed in this utility model;

[0021] Figure 3This is a schematic diagram of the cover plate structure of the rapid testing device for the thermal conductivity of potting refrigerants proposed in this utility model;

[0022] Figure 4 This is a schematic diagram of the turntable structure of the rapid testing device for the thermal conductivity of potting compound proposed in this utility model;

[0023] Figure 5 This is a schematic diagram of the heating plate structure of the rapid testing device for the thermal conductivity of potting refrigerants proposed in this utility model.

[0024] In the diagram: 1. Base; 2. Detection container; 3. Receiving groove; 4. Heating plate; 5. Heating wire; 6. Cover plate; 7. Temperature detector; 8. Detection head; 9. Push rod; 10. Sliding hole; 11. Secondary spring; 12. Push rod; 13. Top block; 14. Main spring; 15. Turntable; 16. Rotating shaft; 17. Drive motor; 18. Roller; 19. Vertical hole. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0026] Example: Refer to Figures 1-5 A rapid testing device for the thermal conductivity of potting compound includes a base 1 for supporting the entire device, and a testing container 2 fixedly connected to the top of the base 1. The top of the testing container 2 is provided with a receiving groove 3 for storing the potting compound. A heating plate 4 is fixedly connected to the bottom of the receiving groove 3. An electric heating wire 5 for heating the potting compound is fixedly installed inside the heating plate 4. The electric heating wire 5 has at least two heating levels: a low level for heating and solidifying the potting compound, and a high level for testing the thermal conductivity of the potting compound. An ejector assembly is provided inside the heating plate 4. A cover plate 6 is rotatably installed on the upper end of the testing container 2. A temperature detector 7 is fixedly installed on the top of the cover plate 6, and a testing head 8 facing the upper surface of the heating plate 4 is fixedly installed on the lower end of the cover plate 6. The testing head 8 is used to detect the temperature.

[0027] Specifically, during use, the potting compound is injected into the receiving tank 3, and then the heating wire 5 is energized. The heating plate 4 heats and solidifies the potting compound. After the potting compound solidifies, the heating power of the heating wire 5 is increased. At this time, the temperature of the solidified potting compound surface is detected by the detection head 8 and displayed by the temperature detector 7. Then, the time required for the surface temperature of the potting compound to reach close to the temperature of the heating wire 5 is recorded. If the time is long, it is judged that the thermal conductivity of the potting compound is poor; otherwise, it is judged that the thermal conductivity of the potting compound is good. The thermal conductivity test of the potting compound can be completed efficiently and quickly. After the test, the solidified potting compound in the receiving tank 3 can be efficiently ejected by the ejection component, making it easy for the test personnel to take out the tested potting compound.

[0028] The aforementioned ejector assembly includes a vertical hole 19 on the heating plate 4, a push rod 9 that is longitudinally slidably installed in the vertical hole 19, a device cavity in the base 1, and a lifting component that drives the push rod 9 to move up and down in the device cavity of the base 1. The lifting component includes a rotating shaft 16 that is rotatably connected in the device cavity of the base 1. A top block 13 connected to the push rod 9 is provided at the bottom of the heating plate 4. The top block 13 is disc-shaped and has a chamfered lower edge. A main spring 14 is installed between the top block 13 and the bottom of the heating plate 4. A pressing part that presses against the top block 13 is provided on the rotating shaft 16. The pressing part includes a turntable 15 that is fixedly installed on the rotating shaft 16. A roller 18 is rotatably installed on the top of the turntable 15. A drive motor 17 that drives the rotating shaft 16 to rotate is fixedly installed in the device cavity of the base 1.

[0029] Specifically, after the test is completed, the drive motor 17 is started. The drive motor 17 drives the turntable 15 to rotate through the rotating shaft 16. The turntable 15 drives the roller 18 to revolve around the rotating shaft 16. The roller 18 will press multiple top blocks 13 upward in sequence. When the top block 13 is pressed upward, it will push the top rod 9 upward. When the roller 18 passes the top block 13, the main spring 14 will drive the top block 13 to move downward and reset. Then the top rod 9 will also move downward and reset. The continuously rotating turntable 15 will cause the roller 18 to press the top block 13 upward indirectly. This will cause the multiple top rods 9 to move up and down indirectly, which can efficiently push out the solidified potting material in the receiving tank 3, making it easy for the test personnel to take out the potting material after the test.

[0030] The lower end of the aforementioned push rod 9 is provided with a sliding hole 10, and a push rod 12 is slidably installed in the sliding hole 10. The top block 13 is fixedly connected to the bottom of the push rod 12, and a secondary spring 11 is installed between the top of the push rod 12 and the inner top of the sliding hole 10.

[0031] Specifically, when the top block 13 moves upward, the top block 13 will press the secondary spring 11 upward through the push rod 12. The secondary spring 11 will push the top rod 9 upward. The secondary spring 11 can transmit the force more gently to the bottom of the potting refractory, preventing excessive force from damaging the top rod 9 and the receiving groove 3.

[0032] The aforementioned receiving tank 3 has a conical cross-sectional shape, and the inner wall of the receiving tank 3 and the top surface of the heating plate 4 are coated with a non-stick layer. The non-stick layer design makes it easier for the potting compound to fall off, thereby improving the efficiency of removing the potting compound.

[0033] The aforementioned detection heads 8 are set in multiple sets and distributed in a star shape at the bottom of the cover plate 6. Multiple detection heads 8 can more comprehensively detect the temperature of the potting refractory, thus significantly improving the detection accuracy.

[0034] This rapid testing device for the thermal conductivity of potting refills involves injecting the potting refill into the receiving tank 3, then energizing the heating wire 5. The heating plate 4 then heats and solidifies the potting refill. After solidification, the heating power of the heating wire 5 is increased. The temperature of the solidified surface of the potting refill is detected by the detection head 8 and displayed by the temperature detector 7. The time required for the surface temperature of the potting refill to reach a temperature close to that of the heating wire 5 is recorded. If the time is long, the thermal conductivity of the potting refill is considered poor; conversely, if the time is short, the thermal conductivity is considered good. This device efficiently and quickly completes the testing of the thermal conductivity of potting refills.

[0035] After the test is completed, the drive motor 17 is started. The drive motor 17 drives the turntable 15 to rotate through the rotating shaft 16. The turntable 15 drives the roller 18 to revolve around the rotating shaft 16. The roller 18 will push multiple top blocks 13 upward in sequence. When the top block 13 is pushed upward, it will push the push rod 12 upward. The push rod 12 will push the top rod 9 upward elastically through the auxiliary spring 11. When the roller 18 passes the top block 13, the main spring 14 will drive the top block 13 to move downward and reset. Then the top rod 9 will also move downward and reset. The continuously rotating turntable 15 will cause the roller 18 to indirectly push the top block 13 upward, so that the multiple top rods 9 will move up and down intermittently. This can efficiently push out the solidified potting material in the receiving tank 3, making it easy for the test personnel to take out the potting material after the test.

[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A rapid testing device for the thermal conductivity of potting refractories, comprising a base (1), characterized in that, Also includes: The testing container (2) is fixedly connected to the top of the base (1). The top of the detection container (2) is provided with a receiving groove (3), and a heating plate (4) is fixedly connected to the bottom of the receiving groove (3). A heating wire (5) is fixedly installed in the heating plate (4), and an ejection assembly is provided in the heating plate (4). Rotate the cover plate (6) installed on the upper end of the detection container (2). A temperature detector (7) is fixedly installed on the top of the cover plate (6), and a detection head (8) facing the upper surface of the heating plate (4) is fixedly installed on the lower end of the cover plate (6).

2. The rapid testing device for the thermal conductivity of potting compound according to claim 1, characterized in that, The ejector assembly includes a vertical hole (19) on the heating plate (4), a push rod (9) is longitudinally slidably installed in the vertical hole (19), a device cavity is provided in the base (1), and a lifting component for driving the push rod (9) to move up and down is provided in the device cavity of the base (1).

3. The rapid testing device for the thermal conductivity of potting compound according to claim 2, characterized in that, The lifting component includes a rotating shaft (16) rotatably connected in the cavity of the base (1), a top block (13) connected to the top rod (9) is provided at the bottom of the heating plate (4), a main spring (14) is installed between the top block (13) and the bottom of the heating plate (4), and a pressing part of the pressing top block (13) is provided on the rotating shaft (16).

4. The rapid testing device for the thermal conductivity of potting compound according to claim 3, characterized in that, The top pressing part includes a turntable (15) fixedly installed on the rotating shaft (16), and a roller (18) is rotatably installed on the top of the turntable (15). A drive motor (17) for driving the rotating shaft (16) to rotate is fixedly installed in the device cavity of the base (1).

5. The rapid testing device for the thermal conductivity of potting compound according to claim 3, characterized in that, The lower end of the top rod (9) is provided with a sliding hole (10), and a push rod (12) is slidably installed in the sliding hole (10). The top block (13) is fixedly connected to the bottom of the push rod (12), and a secondary spring (11) is installed between the top of the push rod (12) and the inner top of the sliding hole (10).

6. The rapid testing device for the thermal conductivity of potting compound according to claim 3, characterized in that, The top block (13) is disc-shaped, and the lower edge of the top block (13) is chamfered.

7. The rapid testing device for the thermal conductivity of potting compound according to claim 1, characterized in that, The cross-sectional shape of the receiving groove (3) is conical, and the inner wall of the receiving groove (3) and the top surface of the heating plate (4) are coated with a non-stick layer.

8. The rapid testing device for the thermal conductivity of potting compound according to claim 1, characterized in that, The number of detection heads (8) is set in multiple sets, and they are distributed in a star shape at the bottom of the cover plate (6).