A positioning device for semiconductor testing

Abstract

This utility model discloses a positioning device for semiconductor testing, belonging to the field of semiconductor testing technology. It includes a base assembly, an adjustment component fixedly mounted on top of the base assembly, a mounting groove above the adjustment component, and clamping components mounted at both ends of the mounting groove. The adjustment component and the mounting groove are connected by a lifting and closing device. A tilting and moving device is located below the base assembly. This utility model, by incorporating a lifting and closing device, allows operators to adjust the height of the semiconductor within the mounting groove as needed using a screw and lifting plate, thus better meeting work requirements in different situations. Furthermore, when work is paused, operators can close the mounting groove using a screw and L-shaped plate to prevent the entry of external dust and other contaminants, thereby improving the device's operational efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing technology, and specifically relates to a positioning device for semiconductor testing. Background Technology

[0002] Semiconductors are materials whose electrical conductivity at room temperature falls between that of conductors and insulators. Semiconductors have wide applications in radios, televisions, and temperature measurement.

[0003] Chinese Patent Application No. 202320276417.5 discloses an adjustable positioning device for semiconductor testing, belonging to the field of semiconductor testing technology, to solve the problem of difficulty in moving a positioned semiconductor. The device includes a base and an adjustment box. A lead screw is fixedly connected to one side of the drive shaft, and a moving block is threaded onto the outer wall of the lead screw. A limit rod is installed below the lead screw, and a limit block is installed on the outer wall of the limit rod. A first hydraulic rod is fixedly connected below the limit block, and a connecting block is fixedly connected below the first hydraulic rod. This application utilizes a lead screw designed so that when the user needs to adjust the position of the semiconductor to be tested, the user can turn on the drive motor. Under the action of the drive motor, the drive shaft drives the lead screw to rotate. Under the action of the limit rod and the limit block, the rotation of the lead screw can drive the moving block to move, causing the moving block to move the mounting slot, facilitating the user's adjustment of the semiconductor's position.

[0004] 1. The aforementioned patent has the problem that it is inconvenient to adjust the height of the semiconductor and cannot close the mounting slot when the work is paused, thereby reducing the working capacity of the device; 2. The aforementioned patent has the problem that it is inconvenient to adjust the tilt of the semiconductor and that it is inconvenient to move it, thereby reducing the practicality of the device. Utility Model Content

[0005] To address the problems mentioned in the background section, this invention provides a positioning device for semiconductor detection, characterized by high operational capability and strong practicality.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a positioning device for semiconductor testing, comprising a base assembly, an adjustment component fixedly installed on the top of the base assembly, an installation groove provided on the top of the adjustment component, clamping components installed at both ends of the installation groove, the adjustment component and the installation groove being connected by a lifting and closing device, and a tilting and moving device provided below the base assembly.

[0007] Preferably, the lifting and sealing device includes a support frame, a lead screw, a lifting plate, and a sealing assembly. The support frame is fixedly installed on the side of the adjusting assembly near the mounting groove and outside the mounting groove. The lead screw is installed on the inner side of the support frame and on the side of the mounting groove via a bearing. The lifting plate is installed on the outer side of the lead screw and below the mounting groove via a thread. The mounting groove and the lifting plate are connected by the sealing assembly.

[0008] Preferably, the enclosure assembly includes a screw, an L-shaped plate, and a connecting frame. The connecting frame is fixedly installed between the mounting groove and the lifting plate. The screw is threadedly installed at the central position of the connecting frame, and the L-shaped plate is installed on the outer side of the screw and at the outer side of the mounting groove via a bearing.

[0009] Preferably, the enclosure assembly further includes a guide rod, which is fixedly installed on the bottom of the L-shaped plate near the connecting frame and below the screw.

[0010] Preferably, the tilting and moving device includes a base frame, a rotating block, a rotating shaft, screws, threaded holes, and moving components. The base frame is provided below the base assembly, and the rotating shaft is installed on the inner side of the base frame through a bearing. The base assembly and the rotating shaft are connected by a rotating block. Multiple threaded holes are provided at both ends of the rotating block. Two screws are installed on the top of the base frame through threads, and multiple moving components are installed on the bottom of the base frame.

[0011] Preferably, the moving component includes threaded blocks and a brake wheel. Multiple threaded blocks are threadedly mounted on the bottom of the base frame, and a brake wheel is fixedly mounted below the threaded blocks.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model, by setting up a lifting and sealing device, allows the operator to adjust the height of the semiconductor in the mounting slot when needed by using the cooperation of the screw and lifting plate, thereby better meeting the work needs in different situations. In addition, when work is paused, the operator can seal the mounting slot by using the cooperation of the screw and L-shaped plate to prevent the entry of external dust and other objects, thereby improving the working capacity of the device.

[0014] 2. By setting up a tilting and moving device, this utility model allows the operator to adjust the tilt of the semiconductor in the mounting slot when needed by using the cooperation of structures such as rotating blocks and rotating shafts, thereby better meeting the work needs in different situations. Furthermore, the operator can move the position of the device by using the various brake wheels when needed, thus improving the practicality of the device. Attached Figure Description

[0015] Figure 1This is a perspective view of the present utility model;

[0016] Figure 2 This is a three-dimensional sectional view of the present invention;

[0017] Figure 3 This is a three-dimensional sectional view of the lifting and sealing device of this utility model;

[0018] Figure 4 This is a three-dimensional sectional view of the tilting moving device of this utility model.

[0019] In the diagram: 1. Base assembly; 2. Lifting and sealing device; 21. Support frame; 22. Lead screw; 23. Lifting plate; 24. Sealing assembly; 241. Guide rod; 242. Screw; 243. L-shaped plate; 244. Connecting frame; 3. Mounting slot; 4. Clamping assembly; 5. Adjustment assembly; 6. Tilting and moving device; 61. Base frame; 62. Rotating block; 63. Rotating shaft; 64. Screw; 65. Threaded hole; 66. Moving assembly; 661. Threaded block; 662. Brake wheel. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] Please see Figure 1-4 The present invention provides the following technical solution: a positioning device for semiconductor testing, including a base assembly 1, an adjustment assembly 5 fixedly installed on the top of the base assembly 1, an installation groove 3 provided on the top of the adjustment assembly 5, clamping assemblies 4 installed at both ends of the installation groove 3, the adjustment assembly 5 and the installation groove 3 being connected by a lifting and closing device 2, and an inclined moving device 6 provided below the base assembly 1.

[0023] Specifically, the lifting and sealing device 2 includes a support frame 21, a lead screw 22, a lifting plate 23, and a sealing assembly 24. The support frame 21 is fixedly installed on the side of the adjusting assembly 5 near the mounting groove 3 and on the outside of the mounting groove 3. The lead screw 22 is installed on the inside of the support frame 21 and on the side of the mounting groove 3 via a bearing. The lifting plate 23 is installed on the outside of the lead screw 22 and below the mounting groove 3 via a thread. The mounting groove 3 and the lifting plate 23 are connected by the sealing assembly 24.

[0024] By adopting the above technical solution, the staff can adjust the height of the semiconductor in the mounting slot 3 by means of the cooperation of the lead screw 22 and the lifting plate 23 when needed, so as to better meet the work needs in different situations.

[0025] Specifically, the enclosed assembly 24 includes a screw 242, an L-shaped plate 243, and a connecting frame 244. The connecting frame 244 is fixedly installed between the mounting groove 3 and the lifting plate 23. The screw 242 is threadedly installed at the central position of the connecting frame 244. The L-shaped plate 243 is installed on the outer side of the screw 242 and at the outer side of the mounting groove 3 via a bearing.

[0026] By adopting the above technical solution, workers can close the mounting groove 3 by using the screw 242 and L-shaped plate 243 when work is paused, thereby preventing the entry of external dust and other objects, and better meeting the needs of the work.

[0027] Specifically, the enclosure assembly 24 also includes a guide rod 241, which is fixedly installed on the bottom of the L-shaped plate 243 near the connecting frame 244 and below the screw 242.

[0028] By adopting the above technical solution, the device can guide the movement of the L-shaped plate 243 through the guide rod 241, thereby preventing the L-shaped plate 243 from deviating and ensuring the normal operation of the work.

[0029] In this embodiment, when positioning is required during semiconductor testing, the operator rotates the lead screw 22 in the lifting and sealing device 2. The lead screw 22 is threadedly connected to the lifting plate 23, and one side of the lifting plate 23 is in contact with the inner side of the support frame 21. Therefore, the lead screw 22 drives the lifting plate 23 and other structures to move, thereby adjusting the height of the mounting slot 3 and other structures. Then, the operator rotates the screw 242 in the sealing assembly 24. The screw 242 is threadedly connected to the connecting frame 244, and the screw 242 is bearing-connected to the L-shaped plate 243. The guide rod 241 on the L-shaped plate 243 is slidably connected to the connecting frame 244. Therefore, the screw 242 drives the L-shaped plate 243 to move, so that the L-shaped plate 243 no longer seals the mounting slot 3. Then, the operator places the semiconductor into the mounting slot 3 and clamps and fixes the semiconductor using the two clamping assemblies 4. Then, the position of the semiconductor is adjusted by the cooperation of the adjusting assembly 5 and the base assembly 1, and the positioning work is completed.

[0030] Example 2

[0031] The difference between this embodiment and embodiment 1 is that the tilting moving device 6 includes a base frame 61, a rotating block 62, a rotating shaft 63, screws 64, threaded holes 65, and moving components 66. The base frame 61 is provided below the base assembly 1. The rotating shaft 63 is installed on the inner side of the base frame 61 through a bearing. The base assembly 1 and the rotating shaft 63 are connected by the rotating block 62. Multiple threaded holes 65 are provided at both ends of the rotating block 62. Two screws 64 are installed on the top of the base frame 61 through threads. Multiple moving components 66 are installed on the bottom of the base frame 61.

[0032] By adopting the above technical solution, the staff can adjust the tilt of the semiconductor in the mounting slot 3 by means of the cooperation of the rotating block 62 and the rotating shaft 63 when needed, so as to better meet the work needs in different situations.

[0033] Specifically, the moving component 66 includes a threaded block 661 and a brake wheel 662. Multiple threaded blocks 661 are threadedly installed on the bottom of the base frame 61, and a brake wheel 662 is fixedly installed below the threaded blocks 661.

[0034] By adopting the above technical solution, the staff can move the device to a certain extent by using each brake wheel 662 when needed, thereby reducing the difficulty of moving the device and alleviating the workload of the staff.

[0035] In this embodiment, when it is necessary to adjust the tilt of the semiconductor in the mounting slot 3, the operator rotates the two screws 64 on the base 61 of the tilting moving device 6 to disengage them from the threaded holes 65 on the rotating block 62. Then, the mounting slot 3 and other structures are pulled to rotate the semiconductor, rotating block 62, rotating shaft 63 and other structures to the required tilt. The two screws 64 are then rotated in the opposite direction to connect them with the corresponding threaded holes 65. After adjustment, the operator can push the device when needed, and move the device position through the brake wheels 662 in each moving component 66. The threaded block 661 serves as a connection and installation device.

[0036] The structure and principle of this utility model, comprising a base assembly 1 (consisting of a base, an electric guide rail slider, a pressing plate, a second hydraulic rod, an inclined plate, a transmission block, a moving plate, a fixed rod, a push rod, and a fixed plate), a mounting groove 3, a clamping assembly 4 (consisting of a pull ring, a trapezoidal block, a pull rod, and a spring), and an adjustment assembly 5 (consisting of an adjustment box, a power box, a limit rod, a lead screw, a drive motor, a transmission shaft, a moving block, a connecting block, a first hydraulic rod, and a limit block), are disclosed in Chinese Patent Application No. 202320276417.5, which discloses an adjustable semiconductor testing positioning device. Its working principle is as follows: when the user needs to inspect the semiconductor, the user inserts the semiconductor into the mounting groove. Under the pressure of the semiconductor, the trapezoidal block moves to the left and right, pressing the spring. Under the rebound force of the spring, the spring drives the trapezoidal block to fix the semiconductor, facilitating the user's semiconductor inspection. After inspection, the user can pull the pull ring. The ring and pull rod release the trapezoidal block from the semiconductor, making it easy for the user to remove the semiconductor. When the user needs to adjust the position of the semiconductor to be tested, the user can turn on the drive motor. Under the action of the drive motor, the transmission shaft drives the lead screw to rotate. Under the action of the limit rod and limit block, the rotation of the lead screw can drive the moving block to move, which in turn moves the mounting slot, making it easy for the user to adjust the position of the semiconductor to be tested. After the adjustment is completed, the user can drive the fixed plate to move through the electric guide rail slider, so that the fixed plate moves below the moving block. Then, the user can control the first hydraulic rod to move downward. Under the action of the first hydraulic rod, the connecting block contacts the fixed plate. Then, the user can control the second hydraulic rod to retract, so that the second hydraulic rod drives the push rod to push the transmission block to move. The transmission block pushes the inclined plate and the moving plate to move, so that the moving plate drives the pressing plate to fix the connecting block, making it easy for the user to position the semiconductor to be tested.

[0037] The working principle and usage process of this utility model are as follows: When positioning is required during semiconductor testing, the operator rotates the lead screw 22 in the lifting and sealing device 2. The lead screw 22 is threadedly connected to the lifting plate 23, and one side of the lifting plate 23 is in contact with the inner side of the support frame 21. Therefore, the lead screw 22 drives the lifting plate 23 and other structures to move, thereby adjusting the height of the mounting slot 3 and other structures. Then, the operator rotates the screw 242 in the sealing assembly 24. The screw 242 is threadedly connected to the connecting frame 244, and the screw 242 is bearing-connected to the L-shaped plate 243. The guide rod 241 on the L-shaped plate 243 is slidably connected to the connecting frame 244. Therefore, the screw 242 drives the L-shaped plate 243 to move, so that the L-shaped plate 243 no longer seals the mounting slot 3. Then, the operator moves the semiconductor... The semiconductor is placed in the mounting slot 3 and clamped and fixed by two clamping components 4. Then, the position of the semiconductor is adjusted by the cooperation of the adjusting component 5 and the base component 1, and the positioning work is completed. When it is necessary to adjust the tilt of the semiconductor in the mounting slot 3, the operator rotates the two screws 64 on the base frame 61 of the tilting moving device 6 to disengage them from the threaded holes 65 on the rotating block 62. Then, the mounting slot 3 and other structures are pulled to rotate the semiconductor, rotating block 62, rotating shaft 63 and other structures to the required tilt. The two screws 64 are rotated in the opposite direction to connect with the corresponding threaded holes 65. The adjustment is completed. When needed, the operator can push the device and move the position of the device by the brake wheels 662 in each moving component 66. The threaded block 661 plays the role of connection and installation.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for semiconductor testing, comprising a base assembly (1), wherein an adjustment assembly (5) is fixedly mounted on the upper part of the base assembly (1), a mounting groove (3) is provided on the upper part of the adjustment assembly (5), and clamping assemblies (4) are mounted on both ends of the mounting groove (3), characterized in that: The adjustment component (5) is connected to the mounting slot (3) via a lifting and closing device (2), and a tilting and moving device (6) is provided below the base component (1).

2. The positioning device for semiconductor detection according to claim 1, characterized in that: The lifting and sealing device (2) includes a support frame (21), a lead screw (22), a lifting plate (23), and a sealing assembly (24). The support frame (21) is fixedly installed on the side of the mounting groove (3) and outside the mounting groove (3). The lead screw (22) is installed on the inner side of the support frame (21) and on the side of the mounting groove (3) via a bearing. The lifting plate (23) is installed on the outer side of the lead screw (22) and below the mounting groove (3) via a thread. The mounting groove (3) and the lifting plate (23) are connected by the sealing assembly (24).

3. The positioning device for semiconductor detection according to claim 2, characterized in that: The enclosed assembly (24) includes a screw (242), an L-shaped plate (243), and a connecting frame (244). The connecting frame (244) is fixedly installed between the mounting groove (3) and the lifting plate (23). The screw (242) is threadedly installed at the center of the connecting frame (244), and the L-shaped plate (243) is installed on the outside of the screw (242) and at the outside of the mounting groove (3) via a bearing.

4. The positioning device for semiconductor detection according to claim 3, characterized in that: The enclosure assembly (24) also includes a guide rod (241), which is fixedly installed on the bottom of the L-shaped plate (243) near the connecting frame (244) and below the screw (242).

5. A positioning device for semiconductor detection according to claim 1, characterized in that: The tilting and moving device (6) includes a base frame (61), a rotating block (62), a rotating shaft (63), screws (64), threaded holes (65), and moving components (66). The base frame (61) is provided below the base assembly (1). The rotating shaft (63) is installed on the inner side of the base frame (61) through a bearing. The base assembly (1) and the rotating shaft (63) are connected by the rotating block (62). Multiple threaded holes (65) are provided at both ends of the rotating block (62). Two screws (64) are installed on the top of the base frame (61) through threads. Multiple moving components (66) are installed on the bottom of the base frame (61).

6. A positioning device for semiconductor detection according to claim 5, characterized in that: The moving component (66) includes a threaded block (661) and a brake wheel (662). Multiple threaded blocks (661) are threadedly installed on the bottom of the base frame (61), and a brake wheel (662) is fixedly installed below the threaded blocks (661).

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