Electron transport test chip mounting device
By using a split test socket and sensor mounting device made of ceramic material, the problem of poor contact caused by chip test socket deformation at high temperatures is solved, achieving stable connection and precise temperature control in high-temperature environments, and improving the reliability and accuracy of electron migration testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NAN JING WEI FU BAN DAO TI JI SHU YOU XIAN GONG SI
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-31
AI Technical Summary
In existing technologies, chip test sockets soften and deform under high temperature conditions, leading to poor contact between the pins of the chip under test and the test circuit, which affects the reliability and accuracy of electron migration testing.
The first and second test sockets are made of ceramic material. The first test socket has multiple rows of pin holes and a sensor mounting station, while the second test socket has aligned pin holes for probe mounting. They are fixed by locking components to ensure reliable connection between the chip pins and probes at high temperatures, and are equipped with a temperature sensor for real-time temperature monitoring.
Maintaining structural stability at 500℃ ensures good contact between chip pins and test circuits, enabling precise temperature control and reliable electron migration testing.
Smart Images
Figure CN224581582U_ABST
Abstract
Description
Technical Field
[0001] This application relates to semiconductor testing equipment technology, and more particularly to an electron migration test chip mounting device. Background Technology
[0002] Electromigration refers to the migration of metal atoms along the direction of electron flow under the influence of electric current and temperature. This migration can cause voids within a conductor, leading to open circuits, or whisker buildup, causing short circuits. This phenomenon is particularly pronounced in high-current-density regions such as power lines and clock lines. Electromigration has a significant impact on the reliability and performance of chips, making its testing crucial.
[0003] The basic principle of electron migration testing is to apply an electric field and current at a high temperature of around 350°C and observe the change in the resistance of the device. This testing method is widely used in the semiconductor industry, especially in routine mass production, for screening high-quality semiconductor wafers.
[0004] In existing electron migration testing technologies, chip test sockets are generally made of metal springs and plastic, which cannot withstand high-temperature environments. Under high temperatures, the test socket will soften and deform, making it impossible to guarantee good contact between the pins of the chip under test and the test circuit at high temperatures. Utility Model Content
[0005] This application provides an electron migration test chip mounting device to solve the technical problem in the related art where the chip test socket used in electron migration testing softens and deforms under high temperature, resulting in poor contact between the pins of the chip under test and the test circuit.
[0006] To address the aforementioned technical problems, this application provides an electron migration test chip mounting apparatus for mounting a chip to be subjected to electron migration testing, comprising:
[0007] The first test stand has a first pin hole, which is arranged in multiple rows in parallel, and the first test stand has a sensor installation station.
[0008] The second test seat is arranged parallel to the first test seat. The second test seat is provided with a second pin hole, which is axially aligned with the first pin hole.
[0009] Both the first test socket and the second test socket are made of ceramic.
[0010] In some possible implementations, the sensor mounting station is located between two adjacent rows of the first pin holes.
[0011] In some possible implementations, the sensor mounting station is arranged along a direction that extends parallel to the first pin hole.
[0012] In some possible implementations, the sensor mounting station is a mounting slot that extends through the first test base along its thickness direction.
[0013] In some possible implementations, a mating groove is provided on the side of the first test socket facing the second test socket. The mating groove is arranged in a direction that extends parallel to the first pin holes, and the mating groove completely covers all the first pin holes.
[0014] In some possible implementations, a support protrusion is provided on the side of the second test socket facing away from the first test socket, and the support protrusion is arranged corresponding to the second pin hole.
[0015] In some possible implementations, both the first test socket and the second test socket are provided with locking parts, and locking members cooperate with the locking parts to lock and fix the first test socket and the second test socket.
[0016] In some possible implementations, the locking part is a through hole, the locking element is a locking bolt, the locking bolt is provided to pass through the through holes on the first test seat and the second test seat in sequence, the locking bolt is threaded into the through hole and or the locking bolt is engaged with the locking nut after passing through the through hole to lock.
[0017] In some possible implementations, a sensor slot is provided on the side of the first test base facing the second test base, and the sensor slot is connected to the sensor installation station.
[0018] In some possible implementations, the second test stand is provided with a sensor positioning part, which is configured corresponding to the sensor installation station.
[0019] In the electron migration test chip mounting device provided in this application embodiment, the first test socket and the second test socket are made of ceramic material, which can withstand high temperatures of 500°C for extended periods. A sensor mounting position is reserved on the first test socket for mounting a temperature sensor, which can monitor the temperature of the chip under test, thereby accurately measuring the chip's average temperature. During chip mounting, the pins of the chip under test are aligned with the first pin holes, confining the pins within the first pin holes of the first test socket. Simultaneously, a test probe is inserted into the second pin hole to test the chip. This significantly improves the stability of the chip and probe mounting in high-temperature environments, ensuring good contact between the chip pins and the measured circuit. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the overall structure of an electron migration test chip mounting device provided in an embodiment of this application.
[0022] Figure 2 This is a schematic diagram of the structure of a first test fixture provided in an embodiment of this application.
[0023] Figure 3 This is a structural schematic diagram of the first test fixture provided in one embodiment of this application from another angle.
[0024] Figure 4 This is a schematic diagram of the structure of the second test fixture provided in an embodiment of this application.
[0025] Figure 5 This is a structural schematic diagram of the second test fixture provided in one embodiment of this application from another angle. Detailed Implementation
[0026] This application provides an electron migration test chip mounting device to solve the technical problem in the related art where the chip test socket used in electron migration testing softens and deforms under high temperature, resulting in poor contact between the pins of the chip under test and the test circuit.
[0027] In related technologies, during electron migration testing, the test circuit and chip pins are usually connected via probes. However, current probes do not provide a strong connection between the test circuit and chip pins, and the connection can easily be broken due to unexpected factors.
[0028] Currently, existing chip test sockets for electron migration testing are generally made of metal springs and plastic, which cannot withstand high-temperature environments. Under high temperatures, the test socket will melt, which will result in the chip pins not being able to make good contact with the test circuit at high temperatures, affecting normal electron migration testing.
[0029] Based on this, one or more embodiments of this application provide an electron migration test chip mounting device. In electron migration testing, the electron migration test chip mounting device is used to fix the chip under test. The electron migration test chip mounting device is installed on the heating plate of the electron migration test module (DUT). The chip under test is clipped onto the electron migration test chip mounting device. The chip pins are connected to the measurement circuit through probes installed on the mounting base to complete the electron migration test.
[0030] The following combination Figures 1 to 5 The solutions of the embodiments of this application will be described.
[0031] This application provides an electron migration test chip mounting apparatus for mounting chips to be tested for electron migration, comprising a first test socket 100 and a second test socket 200 stacked together. The first test socket 100 has first pin holes 110 arranged in multiple parallel rows, and a sensor mounting station 120 is provided on the first test socket 100. The second test socket 200 is arranged parallel to the first test socket 100, and has second pin holes 210 axially aligned with the first pin holes 110. Both the first test socket 100 and the second test socket 200 are made of ceramic.
[0032] The electron migration test chip mounting device utilizes a split, parallel first test socket 100 and a second test socket 200 working together. The first test socket 100 has multiple rows of first pin holes 110 for inserting chip pins and securing the chip. Simultaneously, the sensor mounting station 120 on the first test socket 100 provides mounting space for temperature sensors. The second pin holes 210 of the second test socket 200 are axially aligned with the first pin holes 110, forming a continuous pin channel. The second pin holes 210 are suitable for mounting test probes, ensuring precise mating between chip pins and test probes. Both the first test socket 100 and the second test socket 200 are made of ceramic, maintaining structural stability in high-temperature testing environments and providing a rigid support platform for the chip.
[0033] The first test socket 100 and the second test socket 200, made of ceramic material, can withstand temperatures above 500℃, fundamentally solving the problem of heat resistance failure of the test socket in electron migration testing; the multiple rows of first pin holes 110 can adapt to the installation requirements of chips of different sizes, improving the versatility of the device; the axially aligned first pin holes 110 and second pin holes 210 ensure the reliability of contact between the chip pins and the probes at high temperatures; the sensor mounting station 120 provides a mounting position for the temperature sensor, enabling real-time monitoring of the chip temperature and supporting the precise temperature control of the electron migration testing module.
[0034] It should be noted that, in the embodiments of this application, the chip pins and temperature sensors used in the electron migration test can all be test components from related technologies. This application mainly improves the mounting device for the chip pins and temperature sensors. Therefore, the electron migration test chip mounting device can be used in the embodiments of this application as long as it can be adapted to the chip pins and temperature sensors. This application does not impose absolute limitations on the embodiments of this application.
[0035] In one embodiment of this application, the first pin holes 110 are arranged in four rows, with 20 first pin holes 110 in each row, respectively used for testing standard chips with different package widths. When the number of chip pins is no more than 20, the test can be completed on this test socket. The second pin holes 210 are arranged in a one-to-one correspondence with the first pin holes 110.
[0036] In this embodiment, the sensor mounting station 120 is located between two adjacent rows of first pin holes 110. Specifically, the sensor mounting station 120 is located between the middle two rows of first pin holes 110, allowing the temperature sensor to be directly mounted at the center of the chip pin area, avoiding interference with the probe mounting and chip fixation of the first pin holes 110. Simultaneously, it can monitor the temperature at the center of the electron migration test chip mounting device in real time, thereby accurately representing the average temperature of the chip under test and ensuring the temperature control accuracy of the electron migration test module.
[0037] Furthermore, the sensor mounting station 120 is arranged in a direction that extends parallel to the first pin hole 110, forming a straight channel that is consistent with the arrangement of the first pin hole 110. This facilitates the temperature sensor to cover multiple measurement points along the length of the chip, providing uniform temperature distribution data in electron migration testing and avoiding test deviations caused by local hot spots.
[0038] In one embodiment of this application, the sensor mounting station 120 is a mounting slot 121, which is provided through the first test base 100 along the thickness direction, thereby allowing the temperature sensor to be adjusted from the top of the first test base 100.
[0039] In one embodiment of this application, a mating groove 140 is provided on the side of the first test socket 100 facing the second test socket 200. The mating groove 140 is arranged in a direction extending parallel to the first pin holes 110, and the mating groove 140 completely covers all the first pin holes 110. A continuous groove is formed to accommodate and limit the mating connection point of the pins of the chip under test and the test probes, which facilitates the observation of whether the connection between the pins and the test probes is stable.
[0040] Furthermore, a sensor slot 122 is provided on the side of the first test base 100 facing the second test base 200, and the sensor slot 122 is connected to the sensor mounting station 120. This forms a dedicated channel to fix the temperature sensor. During testing, the head of the temperature sensor is installed in the sensor slot 122, and the tail detection area of the temperature sensor extends towards the sensor mounting station 120, thereby confining the temperature sensor to a predetermined position, reducing displacement of the temperature sensor caused by high-temperature vibration, and improving the accuracy and consistency of temperature data acquisition.
[0041] In addition, a positioning groove, serving as a sensor positioning part 230, is provided on the second test fixture. The sensor positioning part 230 is correspondingly positioned with respect to the sensor mounting station 120. During assembly, the sensor positioning part 230 is used to calibrate the mounting position of the temperature sensor, ensuring that the temperature sensor is aligned with the pre-mounted position on the chip surface, eliminating measurement errors caused by installation errors, and optimizing the temperature control effect of the electron migration test.
[0042] In one embodiment of this application, a support bump 220 is provided on the side of the second test socket 200 facing away from the first test socket 100, and the support bump 220 is arranged correspondingly to the second pin hole 210. In this embodiment, two support bumps 220 are provided on the second test socket 200, respectively located on both sides of the sensor mounting station 120. In some other embodiments, multiple support bumps 220 can also be provided, and the shape and position of the support bumps 220 can be arbitrarily arranged, as long as the support bumps 220 cover the second pin hole 210 accordingly. The support bumps 220 are located directly below the second pin hole 210. During testing, the support bumps 220 can extend the length of the second pin hole 210, thereby providing stable support for the installation of the chip pin, preventing chip deformation or displacement under high temperature, and ensuring the reliability of the connection between the chip pin and the probe.
[0043] In one embodiment of this application, a locking part 130 is provided on both the first test seat 100 and the second test seat 200. The locking member cooperates with the locking part 130 to lock and fix the first test seat 100 and the second test seat 200, forming a stable overall structure to resist thermal deformation during high-temperature testing and maintain the overall stability of the installation device at high temperatures.
[0044] Specifically, the locking part 130 is a through hole, and the locking element is a locking bolt. The locking bolt is set to pass through the through holes on the first test seat 100 and the second test seat 200 in sequence. The locking bolt is threaded with the through hole and or the locking bolt is locked with the locking nut after passing through the through hole.
[0045] In some other embodiments, the locking part 130 may also be a slot, and the locking element may be a corresponding claw. The claw engages with the slot to lock and fix the first test seat 100 and the second test seat 200.
[0046] In the electron migration test chip mounting device provided in this application, both the first test socket 100 and the second test socket 200 are made of ceramic material, which can withstand high temperature of 500℃ for a long time.
[0047] To facilitate probe installation, the electron migration test chip mounting device is divided into two separate parts: a first test socket 100 and a second test socket 200. The second pin hole 210 on the second test socket 200 also serves as a probe mounting hole. After the probe is installed, the first test socket 100 is closed, and the temperature sensing element is installed in the sensor mounting station 120. A locking bolt is then passed through the threaded holes (locking parts 130) on both the first and second test sockets 100 and tightened to form the entire electron migration test chip mounting device. Additional fixing screws are then passed through the auxiliary mounting holes on both the first and second test sockets 100 and 200 to secure the entire device to the electron migration test module. During testing, the chip pins are inserted into the first pin hole 110 to secure the chip. There are two rows of first pin holes 110 on each of the upper and lower sides of the sensor mounting station 120, with 20 holes in each row, used to test standard chips of different package widths. When the number of chip pins is no more than 20, testing can be completed on this test socket. The first test socket 100 and the second test socket 200 are made of ceramic material, and a mounting position for the temperature sensor is reserved. The second test socket 200 is designed to facilitate probe installation. It can work for a long time in a temperature range of 350℃ to 500℃, and can ensure good contact between the chip pins and the test circuit under high temperature conditions. It can also measure the temperature of the chip under test during the test, so as to achieve precise temperature control of the electron migration test module.
[0048] It should be understood that although quantifiers such as "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are used merely to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit.
[0049] The directional terms such as "outer," "middle," and "inner" mentioned or potentially used in this specification are defined relative to the structures shown in the accompanying drawings. They are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive.
[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application in any form or substance. It should be noted that those skilled in the art can make various improvements and additions without departing from the method of this application, and these improvements and additions should also be considered within the protection scope of this utility model. Any modifications, alterations, and equivalent changes made by those skilled in the art without departing from the spirit and scope of this application, based on the disclosed technical content, are equivalent embodiments of this application. Furthermore, any modifications, alterations, and evolutions made to the above embodiments based on the essential technology of this application still fall within the scope of the technical solution of this application.
Claims
1. An electromigration test chip mounting apparatus characterized by comprising: include: The first test stand is provided with a first pin hole, and multiple rows of the first pin holes are arranged in parallel. The first test stand is also provided with a sensor installation station. The second test seat is arranged parallel to the first test seat. The second test seat is provided with a second pin hole, which is axially aligned with the first pin hole. Both the first test socket and the second test socket are made of ceramic.
2. The electromigration test chip mounting apparatus according to claim 1, wherein The sensor installation station is located between the first pin holes of two adjacent rows.
3. The electromigration test chip mounting apparatus according to claim 2, wherein The sensor mounting station is arranged along the direction of parallel extension of the first pin hole.
4. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, characterized by The sensor mounting station is a mounting slot, which is set through the first test base along the thickness direction of the first test base.
5. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, wherein The first test socket has a mating groove on the side facing the second test socket. The mating groove is arranged in a direction that extends parallel to the first pin hole, and the mating groove completely covers all the first pin holes.
6. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, wherein The second test seat has a support protrusion on the side facing away from the first test seat, and the support protrusion is arranged corresponding to the second pin hole.
7. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, wherein Both the first test socket and the second test socket are provided with locking parts, and the locking member cooperates with the locking parts to lock and fix the first test socket and the second test socket.
8. The electromigration test chip mounting apparatus according to claim 7, wherein The locking part is a through hole, and the locking element is a locking bolt. The locking bolt is arranged to pass through the through holes on the first test seat and the second test seat in sequence. The locking bolt is threaded with the through hole and or the locking bolt is locked with the locking nut after passing through the through hole.
9. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, wherein A sensor slot is provided on the side of the first test stand facing the second test stand, and the sensor slot is connected to the sensor installation station.
10. The electromigration test chip mounting apparatus according to any one of claims 1 to 3, wherein The second test stand is provided with a sensor positioning part, which is set in correspondence with the sensor installation station.