A circuit board flying probe testing device

Abstract

This utility model belongs to the field of circuit board testing technology and discloses a circuit board flying probe testing device, including a working platform with at least one set of symmetrically arranged clamping units. Each clamping unit includes: a base, fixedly mounted on the working platform, with a hinge seat mounted on the base; a support arm, hingedly mounted on the hinge seat and driven by a driving component; and an adaptive clamping structure, including an adjusting screw, a linearly movable top rod mounted at the bottom of the adjusting screw, springs sleeved on the outer surfaces of both the adjusting screw and the top rod, and a pressure head mounted at the end of the top rod. This utility model, through a combination of adaptive pressure control, flexible contact, and precise drive design, can completely eliminate the risks of circuit board deformation, micro-cracks, or surface damage caused by traditional rigid clamping, especially ensuring the integrity of thin boards, multilayer boards, and boards with irregular edges, thereby reducing production scrap rates.

Description

Technical Field

[0001] This utility model relates to the field of circuit board testing technology, and in particular to a circuit board flying probe testing device. Background Technology

[0002] Flying probe testing is a widely used technique in electrical testing of printed circuit boards (PCBs). It controls multiple independent probes to move to specific test points on the circuit board to perform power-on tests and check whether the electrical performance of the circuit board, such as open circuits and short circuits, is up to standard.

[0003] During testing, the circuit board under test must be firmly and precisely fixed on the work platform to prevent deviations in test point positioning caused by movement. Existing clamping methods mostly use mechanical rigid clamping, such as screw locking, cylinder-driven hard pressure blocks, or claws that apply clamping force directly from above or to the side of the circuit board edge. This method mainly has the following problems: 1) It can easily cause the circuit board to deform or be damaged: If the clamping force is too large or unevenly applied, it can easily cause the thin or multi-layer circuit board (especially the large area board) to bend, warp or internal micro-cracks. This stress deformation may directly lead to the scrapping of the circuit board or cause potential failures when soldering components later.

[0004] 2) Poor adaptability: For circuit boards of different thicknesses, sizes or edge shapes (such as those with irregular components or notches), it is necessary to frequently adjust the clamping force or change the fixture, which is cumbersome and affects the testing efficiency. Therefore, we propose a flying probe testing device for circuit boards. Utility Model Content

[0005] In view of the problems of existing circuit board flying probe testing equipment, such as easy deformation or damage to circuit boards and poor adaptability, this utility model is proposed.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: A circuit board flying probe testing device includes a working platform, wherein the working platform is provided with at least one set of symmetrically arranged clamping units; The clamping unit includes: a base, which is fixedly installed on the working platform, and a hinge seat is installed on the base; A support arm, which is hingedly mounted on the hinge seat and is driven by a drive component; An adaptive clamping structure includes an adjusting screw mounted on the support arm, a linearly movable top rod mounted on the bottom of the adjusting screw, and springs sleeved on the outer surfaces of both the adjusting screw and the top rod. One end of the spring is mounted on the bottom of the support arm, and the other end is mounted on a baffle of the top rod. A pressure head is mounted on the end of the top rod.

[0007] As a technical solution of the circuit board flying probe testing device of this utility model, the working platform is provided with positioning pins for initial positioning of the circuit board to be tested.

[0008] As a technical solution of the circuit board flying probe testing device of this utility model, the driving component includes a driving rod that is vertically arranged and rotatably mounted on the hinge base. A servo motor is mounted on the hinge base. The output shaft of the servo motor is connected to one end of the driving rod. The servo motor drives the driving rod to drive the support arm to rotate around the driving rod as an axis.

[0009] As a technical solution of the circuit board flying probe testing device of this utility model, the support arm is provided with a threaded groove that is threadedly connected to the adjusting screw, and the compression of the spring can be changed by turning the adjusting screw.

[0010] As a technical solution of the circuit board flying probe testing device of this utility model, the end of the push rod is connected to the pressure head by a ball hinge.

[0011] As a technical solution of the circuit board flying probe testing device of this utility model, the bottom of the pressure head is adhered with a flexible friction pad, which is made of rubber or polyurethane material.

[0012] Compared with the prior art, the present invention has at least the following beneficial effects: 1. This utility model, by adopting a combination design of adaptive pressure control, flexible contact and precise drive, can completely eliminate the risk of circuit board deformation, micro-cracks or surface damage caused by traditional rigid clamping, especially ensuring the integrity of thin boards, multilayer boards and boards with irregular edges, so as to reduce the production scrap rate.

[0013] 2. This utility model, through the synergistic effect of positioning pin pre-alignment and tool-free spring pre-compression mechanism, can quickly adapt to different specifications of circuit boards without changing the fixture, while greatly reducing the changeover and debugging time, thereby improving the overall efficiency of flying probe testing equipment. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them: Figure 1 This is a schematic diagram of the main structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the clamping unit structure of this utility model.

[0016] Figure 3 This is a cross-sectional structural diagram of the present invention.

[0017] Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle.

[0018] Explanation of reference numerals in the attached figures: In the diagram: 1. Working platform; 101. Positioning pin; 2. Base; 201. Hinge seat; 3. Servo motor; 4. Drive rod; 5. Support arm; 601. Top rod; 602. Spring; 603. Adjusting screw; 7. Pressure head; 8. Flexible friction pad. Detailed Implementation

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] Reference Figures 1-4 A circuit board flying probe testing device is provided. The circuit board flying probe testing device includes a working platform 1, and the working platform 1 is provided with at least one set of symmetrically arranged clamping units. The clamping unit includes: a base 2, which is fixedly installed on the work platform 1, and a hinge seat 201 is installed on the base 2; Support arm 5 is hingedly mounted on hinge seat 201 and is driven by a drive component. The adaptive clamping structure includes an adjusting screw 603 mounted on the support arm 5. A linearly movable top rod 601 is mounted on the bottom of the adjusting screw 603. Springs 602 are fitted on the outer surfaces of both the adjusting screw 603 and the top rod 601. One end of the spring 602 is mounted on the bottom of the support arm 5, and the other end is mounted on the baffle of the top rod 601. A pressure head 7 is mounted on the end of the top rod 601. In application, the clamping force can be automatically adjusted according to the thickness / flatness of the circuit board through the cooperation of the spring 602 and the adjusting screw 603, avoiding deformation or damage caused by rigid impact. Combined with the buffering mechanism of the spring 602, local stress is dispersed to prevent micro-cracks caused by stress concentration points (especially for multilayer thin boards). At the same time, the symmetrical clamping unit can adapt to circuit boards of different sizes, eliminating the need for frequent clamp replacement.

[0021] Reference Figure 1 The working platform 1 is equipped with a positioning pin 101 for initial positioning of the circuit board under test. In application, the positioning pin 101 realizes the pre-alignment of the circuit board under test, reduces the subsequent clamping and adjustment time, and improves the testing efficiency.

[0022] Reference Figure 3 and Figure 4 The driving component includes a drive rod 4 that is vertically set and rotatably mounted on a hinge base 201. A servo motor 3 (rotation angle of 0-90°, pressing speed of 10-30mm / s) is mounted on the hinge base 201. The output shaft of the servo motor 3 is connected to one end of the drive rod 4. The servo motor 3 drives the drive rod 4 to drive the support arm 5 to rotate around the drive rod 4. One end of the support arm 5 is fixedly mounted on the outer surface of the drive rod 4. In application, the servo motor 3 drives the support arm 5 to rotate around the drive rod 4 to ensure the vertical pressing trajectory of the pressure head 7 and avoid lateral force causing the circuit board to shift.

[0023] Reference Figure 3 and Figure 4 The support arm 5 has a threaded groove that is threadedly connected to the adjusting screw 603. By turning the adjusting screw 603, the compression of the spring 602 can be changed. Depending on the thickness of the circuit board (e.g., 0.8-3.2mm), turning the adjusting screw 603 compresses the spring 602, so that the initial pressure range is 5-20N (lower value for thinner boards, higher value for thicker boards). In application, the compression of the spring 602 can be changed by turning the adjusting screw 603 to flexibly adapt to the requirements of circuit boards with different hardness / thickness.

[0024] Reference Figure 3 and Figure 4 The end of the push rod 601 is connected to the pressure head 7 via a ball joint. The ball joint allows the pressure head 7 to deflect ±5° to accommodate irregular edges or protruding components. In application, the pressure head 7 and the push rod 601 are connected via a ball joint, which allows the pressure head 7 to automatically fine-tune its angle when contacting the circuit board to ensure uniform contact of the pressing surface.

[0025] Reference Figure 3 and Figure 4 The bottom of the pressure head 7 is adhered with a flexible friction pad 8, which is made of rubber or polyurethane material. In application, the rubber / polyurethane flexible friction pad 8 increases the friction of the contact surface, prevents the circuit board from shifting during testing, and avoids the pressure head 7 from scratching the board surface or components.

[0026] The working principle of this utility model is as follows: Preparation before testing: After powering on, the servo motor 3 is reset to the initial position (the support arm 5 is raised), and then the board to be tested is placed on the working platform 1 and pushed to the positioning pin 101 to complete the initial positioning; Clamping adjustment: The servo motor 3 drives the drive rod 4 to rotate and press down the support arm 5 until the pressure head 7 contacts the edge of the plate. Then, the spring 602 is compressed and automatically adjusts the clamping force. The flexible friction pad 8 is in contact with the plate surface. During this period, if testing special materials (such as ultra-thin plates), manually turn the adjusting screw 603 to reduce the compression of the spring 602. Test execution: The flying probe tester moves the probe according to the preset program to test the electrical performance of the circuit board. After the test is completed, the servo motor 3 reverses the drive rod 4 and rotates to lift the support arm 5, and the circuit board can be removed.

[0027] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A line card flying probe test apparatus, characterized by: Includes a work platform (1), on which at least one set of symmetrically arranged clamping units are provided; The clamping unit includes: a base (2), which is fixedly installed on the working platform (1), and a hinge seat (201) is installed on the base (2). Support arm (5), which is hingedly mounted on the hinge seat (201) and is driven by a drive member; An adaptive clamping structure is provided, comprising an adjusting screw (603) mounted on the support arm (5), a linearly movable top rod (601) mounted on the bottom of the adjusting screw (603), and springs (602) sleeved on the outer surfaces of the adjusting screw (603) and the top rod (601). One end of the spring (602) is mounted on the bottom of the support arm (5), and the other end is mounted on the baffle of the top rod (601). A pressure head (7) is mounted on the end of the top rod (601).

2. The line card flying probe test apparatus of claim 1, wherein: The working platform (1) is provided with a positioning pin (101) for initial positioning of the circuit board under test.

3. The line card flying probe test apparatus of claim 1, wherein: The driving component includes a driving rod (4) that is vertically arranged and rotatably mounted on the hinge base (201). A servo motor (3) is mounted on the hinge base (201). The output shaft of the servo motor (3) is connected to one end of the driving rod (4) for transmission. The servo motor (3) drives the driving rod (4) to drive the support arm (5) to rotate around the driving rod (4) as an axis.

4. The line card flying probe test apparatus of claim 1, wherein: The support arm (5) has a threaded groove that is threadedly connected to the adjusting screw (603), and the compression of the spring (602) can be changed by turning the adjusting screw (603).

5. The circuit board flying probe testing equipment according to claim 1, characterized in that: The end of the push rod (601) is connected to the pressure head (7) via a ball joint.

6. The circuit board flying probe testing equipment according to claim 1, characterized in that: The bottom of the pressure head (7) is adhered with a flexible friction pad (8), which is made of rubber or polyurethane material.

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