Probe for electron transport test
By combining a dual-chamber design with a snap-fit connector, the problem of unstable connection between the probe and the chip pin is solved, achieving a stable connection in electron migration testing and enhancing tensile strength and thermal expansion suppression.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NAN JING WEI FU BAN DAO TI JI SHU YOU XIAN GONG SI
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-31
AI Technical Summary
Existing probes have poor connection strength with chip pins during electron migration testing, and are prone to disconnection due to unexpected factors, affecting test stability.
The probe employs a dual-chamber design, utilizing the separated first and second chambers to isolate the high-temperature heat conduction of the chip pins. Combined with a snap-fit connector, it directly snaps onto the chip pins, enhancing pull-out resistance and preventing the probe from detaching.
This improves the connection stability between the probe and the chip pins, preventing detachment due to high-temperature thermal expansion and accidental pulling, and ensuring the continuity of the test circuit.
Smart Images
Figure CN224581598U_ABST
Abstract
Description
Technical Field
[0001] This application relates to semiconductor testing equipment technology, and more particularly to a probe for electron migration testing. Background Technology
[0002] Electromigration testing is a critical test in semiconductor manufacturing and reliability engineering, primarily used to evaluate the resistance of metal interconnects (such as copper or aluminum wires in integrated circuits) to electromigration under prolonged high current density.
[0003] In electron migration testing, the test circuit and chip pins are usually connected by probes. However, the current probes do not provide a strong connection between the test circuit and the chip pins, and the connection can easily be broken due to unexpected factors. Utility Model Content
[0004] This application provides a probe for electron migration testing to solve the technical problem in related technologies where the probe connection to the test circuit and chip pins is unstable, which easily leads to the test circuit and chip pins becoming disconnected.
[0005] This application provides an electron migration testing probe for connecting a test circuit and a chip pin, the electron migration testing probe comprising:
[0006] The tube body has a first and a second compartment inside.
[0007] The contact assembly includes an elastic element disposed within the first cavity and a probe tip abutting against the elastic element. At least a portion of the probe tip extends out of the first cavity and can elastically reciprocate along the axial direction of the tube body. The probe tip is used to connect to the test circuit.
[0008] A snap-fit element is disposed in the second cavity, the snap-fit element being configured to snap into the chip pin extending into the second cavity to prevent the chip pin from detaching from the tube body.
[0009] In some possible implementations, the snap-fit component includes a base and a plurality of elastic claws spaced apart circumferentially on the base. The base is used to engage with the tube body. The plurality of elastic claws are located on the side of the base facing the first cavity, and the plurality of elastic claws engage the chip pins together.
[0010] In some possible implementations, the plurality of elastic claws are gradually retracted along the direction of the base toward the first cavity.
[0011] In some possible implementations, the probe head includes a retainer for engaging with the elastic element, and a connecting portion connected to the retainer and extending out of the first cavity, the connecting portion being used to connect with the test circuit;
[0012] There is a step between the card holder and the connecting part, and the step is used to limit and constrain the card holder within the first cavity.
[0013] In some possible implementations, the end of the connector used for connection to the test circuit has a chamfered edge.
[0014] In some possible implementations, the tube body is provided with a retaining platform for separating the first cavity and the second cavity, and one end of the elastic member abuts against the retaining platform.
[0015] In some possible implementations, at least one of the tube body, the snap-fit member, the elastic member, and the probe head is a metal component.
[0016] In some possible implementations, the snap-fit element is an integral beryllium copper component, and the elastic element is a stainless steel component.
[0017] In some possible implementations, at least one of the snap-fit member and the elastic member is provided with a nickel protective layer and a gold protective layer in sequence.
[0018] In some possible implementations, the elastic element spring has a length of 4.2-4.6 mm, a diameter of 0.93-0.97 mm, a wire diameter of 0.12-0.16 mm, and 10-12 coils.
[0019] The electron migration test probe provided in this application divides the tube body into a first cavity and a second cavity. The high temperature on the chip pin side and the test circuit side are separated and isolated by the dual-cavity design to prevent the high temperature heat on the chip pin side from being conducted to the elastic element and causing the elastic element to lose elasticity. This helps to maintain stable contact between the probe tip and the test circuit.
[0020] In addition, the snap-fit connector directly snaps into and limits the chip pin, enhancing the overall tensile strength of the probe and the chip pin, preventing the probe from detaching from the chip pin due to accidental cable pulling, and also suppressing pin offset caused by thermal expansion of the chip pin to a certain extent, ensuring a stable connection between the probe and the chip pin. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the overall structure of the probe for electron migration testing provided in an embodiment of this application. Detailed Implementation
[0023] This application provides a probe for electron migration testing to solve the technical problem in related technologies where the probe connection to the test circuit and chip pins is unstable, which easily leads to the test circuit and chip pins becoming disconnected.
[0024] In related technologies, during electron migration testing, the test circuit and chip pins are usually connected via probes. However, current probes do not provide a strong connection between the test circuit and chip pins, and the connection can easily be broken due to unexpected factors.
[0025] Existing probes are generally cantilever probes. Cantilever probes are prone to slipping when subjected to lateral forces. When testing multiple probes in parallel, the inconsistent height of the probe tips can also lead to poor contact between the test circuit and the chip pins, affecting normal electron migration testing.
[0026] Based on this, one or more embodiments of this application provide a probe for electron migration testing. By dividing the tube body to form a first cavity and a second cavity, the high temperature on the chip pin side and the test circuit side are separated and isolated by the dual-chamber design, preventing the high temperature heat on the chip pin side from being conducted to the elastic element and causing the elastic element to lose elasticity. This helps to maintain stable contact between the probe tip and the test circuit.
[0027] In addition, in this embodiment, by directly snapping the connector to the chip pin, the overall pull-out strength of the probe and the chip pin is enhanced, avoiding accidental pulling of the cable that could cause the probe to detach from the chip pin. At the same time, it can also suppress the pin offset caused by thermal expansion of the chip pin to a certain extent, ensuring the stable connection between the probe and the chip pin.
[0028] The following description, in conjunction with the accompanying drawings, illustrates the solutions of the embodiments of this application.
[0029] like Figure 1As shown, the electron migration test probe of this application embodiment includes a tube body 100, a contact assembly, and a snap-fit member 300. The tube body 100 has a first cavity 110 and a second cavity 120 separated inside. The contact assembly includes an elastic member 200 disposed in the first cavity 110 and a probe head 210 abutting against the elastic member 200. At least a portion of the probe head 210 extends out of the first cavity 110 and can elastically reciprocate along the axial direction of the tube body 100. The probe head 210 is used to connect to the test circuit. The snap-fit member 300 is disposed in the second cavity 120. The snap-fit member 300 is configured to snap-fit with the chip pin extending into the second cavity 120 to prevent the chip pin from detaching from the tube body 100.
[0030] As can be seen from the above description, the electron migration test probe of this application embodiment, by utilizing two separate cavities, can alleviate and reduce the high-temperature heat conduction from the chip pins to the elastic element 200, thereby preventing the high temperature on the chip pin side from affecting the elastic element 200 and causing the elastic element 200 to lose its elasticity. In addition, the snap-fit member 300 provided in the second cavity 120 can enhance the overall pull-out strength of the probe and the chip pin, preventing the probe from detaching from the chip pin due to accidental cable pulling, and can also suppress the pin offset caused by the thermal expansion of the chip pin to a certain extent, ensuring the stable connection between the probe and the chip pin.
[0031] It should be noted that in the embodiments of this application, the chip pins and test circuits used in the electron migration test can all adopt test components in related technologies. This application mainly improves the connection transfer component of the chip pins and test circuits—the probe. Therefore, the probe for electron migration testing can be applied to the embodiments of this application as long as it can be adapted to the chip pins and test circuits. This application does not make any absolute limitation on this aspect.
[0032] like Figure 1 As shown, in some embodiments of this application, the snap-fit component 300 includes a base 310 and a plurality of elastic snap-fit claws 320 spaced apart in the circumferential direction of the base 310. The base 310 is used to engage with the tube body 100. The plurality of elastic snap-fit claws 320 are located on the side of the base 310 facing the first cavity 110, and the plurality of elastic snap-fit claws 320 together snap-fit the chip pin.
[0033] The aforementioned base 310 is a circular seat. Multiple elastic claws 320 are fixed at intervals on the circumference of the circular ring of the base 310. The size of the base 310 is adapted to the opening size of the second cavity 120 of the tube 100. The base 310 can be directly welded and fixed in the second cavity 120 of the tube 100. After the chip pins pass through the through hole in the middle of the base 310, they are clamped by multiple elastic claws 320 to prevent accidental displacement or being pulled out of the tube 100.
[0034] Furthermore, along the direction of the base 310 toward the first cavity 110, the plurality of elastic claws 320 are gradually retracted.
[0035] Specifically, the aforementioned multiple elastic claws 320 can be directly welded and fixed to the base 310. The elastic claws 320 can be made of metal materials with a certain elastic deformation capability, such as copper or aluminum, and the number can be three or more.
[0036] Multiple elastic claws 320 are constructed as gradually tapering pointed cones. When the chip pin is inserted into the second cavity 120 of the tube body 100, the multiple elastic claws 320 are elastically deformed outward under radial force, thereby compensating for the diameter tolerance of the chip pin and facilitating the adaptation of chip pins of different diameters. In addition, the multiple elastic claws 320 together clamp the chip pin, which can avoid the contact failure problem of single-point contact fixing of chip pins in traditional technologies, further enhancing the fixing effect of the probe on the chip pin.
[0037] like Figure 1 As shown, in some embodiments of this application, the probe head 210 includes a retainer 211 for engaging with the elastic member 200, and a connecting portion 212 connected to the retainer 211 and extending out of the first cavity 110. The connecting portion 212 is used to connect with the test circuit. A step 213 is provided between the retainer 211 and the connecting portion 212. The step 213 is used to limit and constrain the retainer 211 within the first cavity 110.
[0038] In the above embodiments, the card holder 211 and the connecting part 212 can be integrally formed metal parts. The card holder 211 has a groove for fitting the elastic member 200. After the elastic member 200 is fitted into the card holder 211, the card holder 211 is pushed out of the first cavity 110 by the elastic force of the elastic member 200, thereby causing the connecting part 212 to extend out of the first cavity 110 and connect to the test circuit. The step 213 can form a clearance fit with the inner wall of the first cavity 110 of the tube body 100, avoiding the lateral swing of the probe tip 210, thereby reducing the wear of the probe tip 210.
[0039] Furthermore, the end of the connecting part 212 that connects to the test circuit has a chamfered edge. The chamfer facilitates the insertion of the probe tip 210 into the test circuit and prevents the test circuit from being scratched by the sharp right-angled edge.
[0040] like Figure 1 As shown, in some embodiments of this application, a retaining platform 130 is constructed inside the tube body 100. The retaining platform 130 is used to separate the first cavity 110 and the second cavity 120, and one end of the elastic member 200 abuts against the retaining platform 130.
[0041] The aforementioned mounting plate 130 is used to separate the first cavity 110 and the second cavity 120, thereby facilitating the installation of the elastic element 200. The mounting plate 130 may have an opening in the middle connecting the first cavity 110 and the second cavity 120, or it may be closed.
[0042] In some embodiments of this application, at least one of the tube body 100, the snap-fit member 300, the elastic member 200, and the probe head 210 is a metal part.
[0043] Specifically, the snap-fit component 300 is an integral beryllium copper component, and the elastic component 200 is a stainless steel component. At least one of the snap-fit component 300 and the elastic component 200 is sequentially provided with a nickel protective layer and a gold protective layer.
[0044] For example, the elastic element 200 is a spring made of 17-7PH precipitation hardening stainless steel material, with a length of 4.2-4.6 mm, a diameter of 0.93-0.97 mm, a wire diameter of 0.12-0.16 mm, and 10-12 turns.
[0045] After the elastic component 200 is manufactured, it is first plated with a nickel protective layer with a thickness of 20um, and then plated with a gold protective layer with a thickness of 1um.
[0046] For example, the latch 300 is made of beryllium copper, with a thickness of 0.12 mm and a diameter of 1.12 mm. The elastic claw 320 has a claw length of 1.65 mm. After manufacturing, a nickel protective layer with a thickness of 50 μm is first plated, followed by a gold protective layer with a thickness of 3 μm.
[0047] By providing a nickel protective layer and a gold protective layer on the elastic element 200 and the snap-fit element 300, the wear resistance of the elastic element 200 and the snap-fit element 300 can be enhanced.
[0048] It should be understood that although quantifiers such as "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are used merely to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit.
[0049] The directional terms such as "outer," "middle," and "inner" mentioned or potentially used in this specification are defined relative to the structures shown in the accompanying drawings. They are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive.
[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application in any form or substance. It should be noted that those skilled in the art can make various improvements and additions without departing from the method of this application, and these improvements and additions should also be considered within the protection scope of this utility model. Any modifications, alterations, and equivalent changes made by those skilled in the art without departing from the spirit and scope of this application, based on the disclosed technical content, are equivalent embodiments of this application. Furthermore, any modifications, alterations, and evolutions made to the above embodiments based on the essential technology of this application still fall within the scope of the technical solution of this application.
Claims
1. A probe for electron migration testing, used to connect a test circuit and a chip pin, characterized in that, The probes used for electron mobility testing include: The tube body has a first and a second compartment inside. The contact assembly includes an elastic element disposed within the first cavity and a probe tip abutting against the elastic element. At least a portion of the probe tip extends out of the first cavity and can elastically reciprocate along the axial direction of the tube body. The probe tip is used to connect to the test circuit. A snap-fit element is disposed in the second cavity, the snap-fit element being configured to snap into the chip pin extending into the second cavity to prevent the chip pin from detaching from the tube body.
2. The probe for electromigration test according to claim 1, wherein The snap-fit component includes a base and a plurality of elastic claws spaced apart in the circumferential direction of the base. The base is used to engage with the tube body. The plurality of elastic claws are located on the side of the base facing the first cavity, and the plurality of elastic claws engage the chip pins together.
3. The probe for electromigration testing according to claim 2, wherein Along the direction of the base toward the first cavity, the plurality of elastic claws gradually retract.
4. The probe for electromigration testing according to claim 1, wherein The probe head includes a retainer for engaging with the elastic element, and a connecting portion connected to the retainer and extending out of the first cavity, the connecting portion being used to connect with the test circuit; There is a step between the card holder and the connecting part, and the step is used to limit and constrain the card holder within the first cavity.
5. The probe for electromigration testing according to claim 4, wherein The end of the connecting part that is used to connect to the test circuit has a chamfered edge.
6. The probe for electromigration testing according to claim 1, wherein The tube body is equipped with a retaining platform, which is used to separate the first cavity and the second cavity. One end of the elastic member abuts against the retaining platform.
7. The probe for electron migration testing according to claim 1, characterized in that, At least one of the tube body, the snap-fit component, the elastic component, and the probe head is a metal component.
8. The probe for electromigration testing according to claim 7, wherein The snap-fit component is an integral beryllium copper component, and the elastic component is a stainless steel component.
9. The probe for electromigration testing according to claim 8, wherein At least one of the snap-fit member and the elastic member is provided with a nickel protective layer and a gold protective layer in sequence.
10. The probe for electromigration testing according to claim 1, wherein The elastic spring has a length of 4.2–4.6 mm, a diameter of 0.93–0.97 mm, a wire diameter of 0.12–0.16 mm, and 10–12 coils.