A test circuit for a power device

Abstract

This utility model embodiment provides a test circuit for power devices. The circuit includes: a driver board, which includes a driver chip, a sub-emitter connection circuit and a gate connection circuit connected to the driver chip; and a power board, which includes a power module and a collector connection circuit and an emitter connection circuit connected to the power module. When the power device under test is a three-pin power device, the gate is connected to the gate connection circuit, the collector to the collector connection circuit, and the emitter to the emitter connection circuit. When the power device is a four-pin power device, the sub-emitter is connected to the sub-emitter connection circuit, the gate to the gate connection circuit, the collector to the collector connection circuit, and the emitter to the emitter connection circuit. Through the cooperative structure of the driver board and the power board, it is possible to test power devices with different pin counts.

Description

Technical Field

[0001] This utility model relates to the field of power device technology, and in particular to a test circuit for power devices. Background Technology

[0002] In the field of power electronics, the Insulated Gate Bipolar Transistor (IGBT) is a core power device widely used in inverters, motor drives, power conversion systems, and other applications. Currently, common IGBT packages include three-pin and four-pin types. However, due to differences in pin count and definition, existing IGBT test boards are typically designed for a specific package type, making it difficult to be compatible with devices with different pin counts. Utility Model Content

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a test circuit for a power device that overcomes or at least partially solves the above problems.

[0004] To address the aforementioned problems, this utility model discloses a test circuit for power devices, the circuit comprising: A driver board, the driver board including a driver chip, a sub-emitter connection circuit and a gate connection circuit connected to the driver chip; A power board, the power board including a power module and a collector connection circuit and an emitter connection circuit connected to the power module; When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit; the driver chip outputs a drive signal to the power device through the gate connection circuit; the power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter connection circuit, the gate is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit; the driver chip supplies power to the power device through the sub-emitter connection circuit; the driver chip outputs a drive signal to the power device through the gate connection circuit; and the power module supplies power to the power device through the collector connection circuit and the emitter connection circuit.

[0005] Optionally, the power device to be tested includes an upper-bridge power device and a lower-bridge power device; the gate connection circuit includes a first gate connection circuit and a second gate connection circuit; the collector connection circuit includes a first collector connection circuit and a second collector connection circuit; and the emitter connection circuit includes a first emitter connection circuit and a second emitter connection circuit. When the power device under test is a three-pin power device, the gate of the upper bridge power device is connected to the first gate connection circuit, the collector is connected to the first collector connection circuit, and the emitter is connected to the first emitter connection circuit; the gate of the lower bridge power device is connected to the second gate connection circuit, the collector is connected to the second collector connection circuit, and the emitter is connected to the second emitter connection circuit.

[0006] Optionally, the sub-emitter connection circuit includes a first sub-emitter connection circuit and a second sub-emitter connection circuit; When the power device under test is a four-pin power device, the sub-emitter of the upper bridge power device is connected to the first sub-emitter connection circuit, the gate is connected to the first gate connection circuit, the collector is connected to the first collector connection circuit, and the emitter is connected to the first emitter connection circuit; the sub-emitter of the lower bridge power device is connected to the second sub-emitter connection circuit, the gate is connected to the second gate connection circuit, the collector is connected to the second collector connection circuit, and the emitter is connected to the second emitter connection circuit.

[0007] Optionally, the driver board further includes an emitter control circuit connected to the driver chip, the emitter control circuit including emitter control circuit pads; When the power device under test is a three-pin power device, a pin header is soldered onto the emitter control circuit pad and a jumper cap is connected to the pin header to provide the drive circuit.

[0008] Optionally, the gate connection circuit includes a gate test socket, the collector connection circuit includes a collector test socket, and the emitter connection circuit includes an emitter test socket. When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

[0009] Optionally, the sub-emitter connection circuit includes a sub-emitter test socket; When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter test socket, the gate is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

[0010] Optionally, if the power device to be tested is a three-pin power device, the center distance between the gate test socket, the collector test socket, and the emitter test socket is a first preset distance.

[0011] Optionally, the sub-emitter connection circuit includes a sub-emitter test socket; When the power device under test is a four-pin power device, the center distance between the collector test socket and the emitter test socket is a second preset distance, and the center distance between the emitter test socket, the sub-emitter test socket and the gate test socket is a third preset distance.

[0012] Optionally, the gate connection circuit includes a gate test pad, and the gate test socket is formed by soldering on the gate test pad; the collector connection circuit includes a collector test pad, and the collector test socket is formed by soldering on the collector test pad; the emitter connection circuit includes an emitter test pad, and the emitter test socket is formed by soldering on the emitter test pad.

[0013] Optionally, the sub-emitter connection circuit includes a sub-emitter test pad, and the sub-emitter test socket is formed by soldering onto the sub-emitter test pad.

[0014] The embodiments of this utility model have the following advantages: This utility model discloses a test circuit for a power device. The circuit includes: a driver board, which includes a driver chip, a sub-emitter connection circuit and a gate connection circuit connected to the driver chip; and a power board, which includes a power module and a collector connection circuit and an emitter connection circuit connected to the power module. When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit. The driver chip outputs a drive signal to the power device through the gate connection circuit. The power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter connection circuit, the gate is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit. The driver chip supplies power to the power device through the sub-emitter connection circuit. The driver chip outputs a drive signal to the power device through the gate connection circuit. The power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. This invention, through the cooperative structure of the driver board and the power board, enables compatibility with device types with different pin counts when testing power devices, thereby improving the versatility and applicability of the test circuit. Attached Figure Description

[0015] Figure 1 This is a test circuit for a power device according to an embodiment of the present invention; Figure 2 This is another test circuit for a power device according to an embodiment of the present invention; Figure 3 This is another test circuit for a power device according to an embodiment of the present invention; Figure 4 This is another test circuit for a power device according to an embodiment of the present invention.

[0016] Reference numerals: Driver board 10, Driver chip 11, Sub-emitter connection circuit 12, First sub-emitter connection circuit 121, Second sub-emitter connection circuit 122, Gate connection circuit 13, First gate connection circuit 131, Second gate connection circuit 132, Emitter control loop 14, Power board 20, Power module 21, Collector connection circuit 22, First collector connection circuit 221, Second collector connection circuit 222, Emitter connection circuit 23, First emitter connection circuit 231, Second emitter connection circuit 232. Detailed Implementation

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] In the field of power electronics, the Insulated Gate Bipolar Transistor (IGBT) is a core power device widely used in inverters, motor drives, power conversion systems, and other applications. Currently, common IGBT packages include three-pin and four-pin types. However, due to differences in pin count and definition, existing IGBT test boards are typically designed for a specific package type, making it difficult to be compatible with devices with different pin counts.

[0019] Specifically, the pinout of a typical three-pin IGBT, from left to right, is usually gate (G), collector (C), and emitter (E); while the pinout of a four-pin IGBT is usually collector (C), emitter (E), Kelvin emitter (K), and gate (G). The Kelvin emitter introduced in the four-pin IGBT is primarily used to optimize the drive circuit, reduce the influence of lead inductance on the gate drive signal, and thus improve the switching performance and stability of the device.

[0020] When a four-pin IGBT is used on a test board that only accommodates three-pin IGBTs, the fourth pin is often left floating or incorrectly connected. This not only results in an incomplete circuit connection but may also cause short circuits or device damage due to incorrect pin connections. Furthermore, inconsistent pin positions can make device mounting on the test board difficult, and may even lead to poor contact, unstable test signals, and other problems, severely affecting the accuracy and repeatability of test results.

[0021] One of the core concepts of this utility model embodiment is that, through the cooperative structure of the driver board and the power board, it is possible to be compatible with device types with different pin counts when testing power devices, thereby improving the versatility and applicability of the test circuit.

[0022] Reference Figure 1 This illustration shows a test circuit for a power device according to an embodiment of the present invention, which may specifically include the following structure: A driver board 10, the driver board including a driver chip 11, a sub-emitter connection circuit 12 and a gate connection circuit 13 connected to the driver chip 11; Power board 20, the power board 20 includes a power module 21 and a collector connection circuit 22 and an emitter connection circuit 23 connected to the power module 21; When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate connection circuit 13, the collector is connected to the collector connection circuit 22, and the emitter is connected to the emitter connection circuit 23; the driver chip 11 outputs a drive signal to the power device through the gate connection circuit 13; the power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter connection circuit 12, the gate is connected to the gate connection circuit 13, the collector is connected to the collector connection circuit 22, and the emitter is connected to the emitter connection circuit 23; the driver chip 11 supplies power to the power device through the sub-emitter connection circuit 12; the driver chip 11 outputs a drive signal to the power device through the gate connection circuit 13; the power module 21 supplies power to the power device through the collector connection circuit 22 and the emitter connection circuit 23.

[0023] The power device under test can be an IGBT. A three-pin IGBT has three pins: Emitter (E), Collector (E), and Gate (G). This is the most common IGBT package type, with a simple structure suitable for most standard applications. Its simple structure with only three pins makes it easy to use and install. The gate drive signal is typically referenced to the emitter (a drive voltage is applied between G and E). There is no separate Kelvin emitter pin; therefore, in high-frequency or high-precision applications, it may be affected by lead inductance, leading to increased switching losses or unstable drive operation.

[0024] The pin definitions for a four-pin IGBT are: emitter (main current path), collector, gate, and Kelvin emitter. The Kelvin emitter is a separate, low-current pin dedicated to serving as a reference point for the drive circuit. Introducing the Kelvin emitter as a reference point for the gate drive circuit, separate from the main emitter, reduces voltage spikes caused by lead inductance in the main current path, improves switching performance, provides more precise gate drive voltage, and reduces oscillation and false triggering.

[0025] This utility model discloses a test circuit for a power device. The circuit includes: a driver board, which includes a driver chip, a sub-emitter connection circuit and a gate connection circuit connected to the driver chip; and a power board, which includes a power module and a collector connection circuit and an emitter connection circuit connected to the power module. When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit. The driver chip outputs a drive signal to the power device through the gate connection circuit. The power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter connection circuit, the gate is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit. The driver chip supplies power to the power device through the sub-emitter connection circuit. The driver chip outputs a drive signal to the power device through the gate connection circuit. The power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. This invention, through the cooperative structure of the driver board and the power board, enables compatibility with device types with different pin counts when testing power devices, thereby improving the versatility and applicability of the test circuit.

[0026] Reference Figure 2 This illustration shows another test circuit for a power device according to an embodiment of the present invention, which may specifically include the following structure: The power device to be tested includes an upper-bridge power device and a lower-bridge power device; the gate connection circuit 13 includes a first gate connection circuit 131 and a second gate connection circuit 132; the collector connection circuit 22 includes a first collector connection circuit 221 and a second collector connection circuit 222; the emitter connection circuit 23 includes a first emitter connection circuit 231 and a second emitter connection circuit 232. When the power device under test is a three-pin power device, the gate of the upper bridge power device is connected to the first gate connection circuit 131, the collector is connected to the first collector connection circuit 221, and the emitter is connected to the first emitter connection circuit 231; the gate of the lower bridge power device is connected to the second gate connection circuit 132, the collector is connected to the second collector connection circuit 222, and the emitter is connected to the second emitter connection circuit 232.

[0027] This utility model discloses a test circuit for a power device, namely a test board for testing power devices. The test board includes a driver board 10 and a power board 20. The circuit on the test board is a half-bridge structure. The power device to be tested is connected at the top and is called the upper bridge power device, while the power device to be tested is connected at the bottom and is called the lower bridge power device. The HO pin of the driver chip 11 is connected to the first gate connection circuit 131, which is the output terminal of the upper bridge circuit drive signal. The LO pin of the driver chip 11 is the output terminal of the lower bridge drive signal. The LO pin of the driver chip 11 is connected to the second gate connection circuit 132. The first collector connection circuit 221 is connected to the positive terminal of the power supply module 21, and the second emitter connection circuit 232 is connected to the negative terminal of the power supply module 21.

[0028] Reference Figure 3 This illustrates a test circuit for another power device according to an embodiment of the present invention. Figure 3 The driver board 10 and the power board 20 are combined to form a method that enables the testing of three-pin power devices. Figure 3 The upper box includes a first gate connection circuit 131 of the driver board 10, a first collector connection circuit 221 of the power board 20, and a first emitter connection circuit 231 of the power board 20, which are used to connect the gate G, collector C, and emitter E of the upper bridge IGBT, respectively; the lower box includes a second gate connection circuit 132 of the driver board 10, a second collector connection circuit 222 of the power board 20, and a second emitter connection circuit 232 of the power board 20, which are used to connect the gate G, collector C, and emitter E of the lower bridge IGBT, respectively.

[0029] When the power device under test is a three-pin power device, the gate of the upper-bridge IGBT is connected to the first gate connection circuit 131 of the driver board 10, the collector of the upper-bridge IGBT is connected to the first collector connection circuit 221 of the power board 20, and the emitter of the upper-bridge IGBT is connected to the first emitter connection circuit 231 of the power board 20; the gate of the lower-bridge IGBT is connected to the second gate connection circuit 132 of the driver board 10, the collector of the lower-bridge IGBT is connected to the second collector connection circuit 222 of the power board 20, and the emitter of the lower-bridge IGBT is connected to the second emitter connection circuit 232 of the power board 20. Through the cooperative structure of the driver board 10 and the power board 20, the three-pin upper-bridge IGBT and lower-bridge IGBT can be tested.

[0030] In this embodiment of the utility model, the sub-emitter connection circuit 12 includes a first sub-emitter connection circuit 121 and a second sub-emitter connection circuit 122; When the power device under test is a four-pin power device, the sub-emitter of the upper bridge power device is connected to the first sub-emitter connection circuit 121, the gate is connected to the first gate connection circuit 131, the collector is connected to the first collector connection circuit 221, and the emitter is connected to the first emitter connection circuit 231; the sub-emitter of the lower bridge power device is connected to the second sub-emitter connection circuit 122, the gate is connected to the second gate connection circuit 132, the collector is connected to the second collector connection circuit 222, and the emitter is connected to the second emitter connection circuit 232.

[0031] Reference Figure 4 This illustrates a test circuit for another power device according to an embodiment of the present invention. Figure 4 The driver board 10 and the power board 20 are combined to form a method that enables the testing of four-pin power devices. Figure 4 The upper box includes the first sub-emitter connection circuit 121 of the driver board 10, the first gate connection circuit 131 of the driver board 10, the first collector connection circuit 221 of the power board 20, and the first emitter connection circuit 231 of the power board 20, which are used to connect the sub-emitter K, gate G, collector C, and emitter E of the upper bridge IGBT, respectively; the lower box includes the second sub-emitter connection circuit 122 of the driver board 10, the second gate connection circuit 132 of the driver board 10, the second collector connection circuit 222 of the power board 20, and the second emitter connection circuit 232 of the power board 20, which are used to connect the sub-emitter K, gate G, collector C, and emitter E of the lower bridge IGBT, respectively.

[0032] The VB pin of the driver chip 11 is the power supply terminal for the upper bridge drive. The VB pin of the driver chip 11 is connected to the first sub-emitter connection circuit 121 through a capacitor. When the power device under test is a four-pin power device, the sub-emitter (Kelvin emitter) of the upper bridge IGBT is connected to the first sub-emitter connection circuit 121 of the driver board 10, the gate of the upper bridge IGBT is connected to the first gate connection circuit 131 of the driver board 10, the collector of the upper bridge IGBT is connected to the first collector connection circuit 221 of the power board 20, and the emitter of the upper bridge IGBT is connected to the first emitter connection circuit 231 of the power board 20. The sub-emitter of the lower bridge IGBT is connected to the second sub-emitter connection circuit 122 of the driver board 10, the gate of the lower bridge IGBT is connected to the second gate connection circuit 132 of the driver board 10, the collector of the lower bridge IGBT is connected to the second collector connection circuit 222 of the power board 20, and the emitter of the lower bridge IGBT is connected to the second emitter connection circuit 232 of the power board 20. The combination of the driver board 10 and the power board 20 enables testing of the four-pin upper-bridge IGBT and lower-bridge IGBT.

[0033] In this embodiment of the present invention, the driver board 10 further includes an emitter control circuit 14 connected to the driver chip 11, and the emitter control circuit 14 includes emitter control circuit pads; When the power device under test is a three-pin power device, a pin header is soldered onto the emitter control circuit pad and a jumper cap is connected to the pin header to provide the drive circuit.

[0034] When the power device under test is a three-pin IGBT, a pin header needs to be soldered onto the emitter control circuit pad and a jumper cap needs to be connected to form the drive circuit for testing the three-pin IGBT. When the power device under test is a four-pin IGBT, simply remove the jumper cap.

[0035] In this embodiment of the present invention, the gate connection circuit 13 includes a gate test socket, the collector connection circuit 22 includes a collector test socket, and the emitter connection circuit 23 includes an emitter test socket. When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

[0036] The test socket is a female connector used for testing. During testing, the gate pin of the three-pin IGBT is inserted into the gate test socket, the collector pin into the collector test socket, and the emitter pin into the emitter test socket. This connects the three pins of the three-pin IGBT to the driver board 10 and the power board 20 respectively, thus enabling testing of the three-pin IGBT. This method facilitates quick insertion and removal of IGBT devices, eliminating the need for soldering and desoldering for each test, saving time and manpower. It allows for rapid replacement of IGBTs of different models or batches for comparative testing; it avoids thermal damage to the IGBT caused by soldering; it improves testing efficiency and repeatability; it facilitates maintenance and troubleshooting; and it is suitable for multi-model compatibility testing, allowing IGBTs with different package types to be inserted into the socket.

[0037] In this embodiment of the invention, the sub-emitter connection circuit 12 includes a sub-emitter test socket; When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter test socket, the gate is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

[0038] During testing, the sub-emitter pin of the four-pin IGBT is inserted into the sub-emitter test socket, the gate pin into the gate test socket, the collector into the collector test socket, and the emitter into the emitter test socket. This connects the four pins of the four-pin IGBT to the driver board 10 and the power board 20 respectively, allowing for testing of the four-pin IGBT. This method facilitates quick insertion and removal of IGBT devices, eliminating the need for soldering and desoldering for each test, saving time and manpower. It allows for rapid replacement of IGBTs of different models or batches for comparative testing; it avoids thermal damage to the IGBT caused by soldering; it improves testing efficiency and repeatability; it facilitates maintenance and troubleshooting; and it is suitable for multi-model compatibility testing, allowing IGBTs with different package types to be inserted into the sockets.

[0039] In this embodiment of the invention, when the power device to be tested is a three-pin power device, the center distance between the gate test socket, the collector test socket, and the emitter test socket is a first preset distance.

[0040] Figure 2 The distance between the sub-emitter test socket of the first sub-emitter connection circuit 121 on the left-side driver board 10 and the gate test socket of the first gate connection circuit 131 is 2.54mm. The emitter control circuit 14 on the driver board 10, i.e. Figure 2 The position of the small circle pin E needs to be determined based on the position of the small circle E on the power board 20. When the driver board 10 and the power board are combined... Figure 3 When testing the three-pin IGBT circuit, the small circle E pin of the driver board 10 and the small circle E pin of the power board 20 will be in a straight line. Figure 2 The distance between the collector test socket of the first collector connection circuit 221 of the power board 20 on the right and the emitter test socket of the first emitter connection circuit 231 is 5.4mm. The distance between the upper collector test socket and emitter test socket and the lower collector test socket and emitter test socket needs to meet the 3mm electrical safety requirement and not interfere with each other when different combinations are made.

[0041] By Figure 2 The driver board 10 and the power board 20 are combined in different ways to obtain Figure 3 Three-pin test circuit and Figure 4 The four-pin test circuit can achieve three-pin and four-pin compatible testing, ensuring the reliability of test data and reducing interference from external factors.

[0042] For example, the pinout of the TO-247 packaged three-pin IGBT is defined as GCE, with a center-to-center distance of 5.4 mm. When testing the TO-247 packaged three-pin IGBT, the gate test socket of the driver board 10, and the collector test socket and emitter test socket of the power board 20, are combined to form the test connection positions for the gate, collector, and emitter of the three-pin IGBT. The first preset distance can be 5.4 mm, that is, the center-to-center distance between the gate test socket, collector test socket, and emitter test socket is 5.4 mm. This setting can adapt to the pinout of the three-pin IGBT and the distance between the pins, enabling testing of the three-pin IGBT. The E pin of the emitter control circuit 14 on the driver board 10 can be aligned with the small circle E on the power board 20, and pin headers can be soldered on to form the drive circuit for testing the three-pin IGBT. The K pin of the emitter connection circuit 12 is not used and has no effect on the test. During testing, simply insert the corresponding test sockets into the driver board 10 and power board 20 according to the pin definitions of the three-pin IGBT.

[0043] In this embodiment of the invention, the sub-emitter connection circuit includes a sub-emitter test socket; When the power device under test is a four-pin power device, the center distance between the collector test socket and the emitter test socket is a second preset distance, and the center distance between the emitter test socket, the sub-emitter test socket and the gate test socket is a third preset distance.

[0044] For example, the pinout of the four-pin IGBT in the TO-247 package is defined as CEKG; the center distance between the CE pins is 5.4mm, and the center distance between the EKG pins is 2.5mm. When testing the four-pin IGBT in the TO-247 package, the collector test socket and emitter test socket of the power board 20, and the sub-emitter test socket and gate test socket of the driver board 10 are combined to form the test connection positions of the collector, emitter, sub-emitter and gate of the four-pin IGBT. The second preset distance can be 5.4mm, and the third preset distance can be 2mm. The center distance between the collector test socket and the emitter test socket is 5.4 mm, and the center distance between the emitter test socket, the sub-emitter test socket, and the gate test socket is 2.5 mm. This setting can adapt to the pin definition of a four-pin IGBT and the distance between the pins, enabling testing of the four-pin IGBT. At the same time, the E pin of the emitter control circuit 14 of the driver board 10 will not interfere with the power board 20, and the 3 mm electrical safety distance is met. During testing, the test sockets of the driver board 10 and the power board 20 can be inserted according to the pin definition of the four-pin IGBT.

[0045] By using different combinations of the driver board 10 and the power board 20, a test circuit compatible with both three-pin IGBTs and four-pin IGBTs can be realized.

[0046] In this embodiment of the present invention, the gate connection circuit 13 includes a gate test pad, and the gate test socket is formed by soldering on the gate test pad; the collector connection circuit 22 includes a collector test pad, and the collector test socket is formed by soldering on the collector test pad; the emitter connection circuit 23 includes an emitter test pad, and the emitter test socket is formed by soldering on the emitter test pad.

[0047] Figure 3 and Figure 4 The circles in the box represent pads. The gate test socket, collector test socket, and emitter test socket are formed by soldering on the gate test pad, collector test socket, and emitter test socket, respectively. During the test, the gate, collector, and emitter of the three-pin IGBT are inserted into the corresponding gate test socket, collector test socket, and emitter test socket. There is no need to solder the IGBT pins, which facilitates the testing of different IGBT samples and ensures the stability and reliability of power device testing.

[0048] In this embodiment of the present invention, the sub-emitter connection circuit 12 includes a sub-emitter test pad, and the sub-emitter test socket is formed by soldering onto the sub-emitter test pad.

[0049] The sub-emitter test socket is formed by soldering on the emitter test pad. During the test, the collector, emitter, sub-emitter, and gate of the four-pin IGBT are inserted into the collector test socket, emitter test socket, sub-emitter test socket, and gate test socket respectively. There is no need to solder the IGBT pins, which facilitates the testing of IGBTs of different samples and can ensure the stability and reliability of power device testing.

[0050] The power board 20 in this embodiment remains unchanged. There are many different driver chips on the market. By designing a corresponding driver board according to different driver chips, compatibility testing can be achieved. This means that only one power board is needed to match various different driver boards for testing.

[0051] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0052] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0053] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0054] The above provides a detailed description of a test circuit for a power device provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A test circuit for a power device, characterized by, The circuit includes: A driver board, the driver board including a driver chip, a sub-emitter connection circuit and a gate connection circuit connected to the driver chip; A power board, the power board including a power module and a collector connection circuit and an emitter connection circuit connected to the power module; When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit; the driver chip outputs a drive signal to the power device through the gate connection circuit; the power module supplies power to the power device through the collector connection circuit and the emitter connection circuit. When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter connection circuit, the gate is connected to the gate connection circuit, the collector is connected to the collector connection circuit, and the emitter is connected to the emitter connection circuit; the driver chip supplies power to the power device through the sub-emitter connection circuit; the driver chip outputs a drive signal to the power device through the gate connection circuit; and the power module supplies power to the power device through the collector connection circuit and the emitter connection circuit.

2. The test circuit of claim 1, wherein, The power device under test includes an upper-bridge power device and a lower-bridge power device; the gate connection circuit includes a first gate connection circuit and a second gate connection circuit; the collector connection circuit includes a first collector connection circuit and a second collector connection circuit; the emitter connection circuit includes a first emitter connection circuit and a second emitter connection circuit. When the power device under test is a three-pin power device, the gate of the upper bridge power device is connected to the first gate connection circuit, the collector is connected to the first collector connection circuit, and the emitter is connected to the first emitter connection circuit; the gate of the lower bridge power device is connected to the second gate connection circuit, the collector is connected to the second collector connection circuit, and the emitter is connected to the second emitter connection circuit.

3. The test circuit of claim 2, wherein, The sub-emitter connection circuit includes a first sub-emitter connection circuit and a second sub-emitter connection circuit; When the power device under test is a four-pin power device, the sub-emitter of the upper bridge power device is connected to the first sub-emitter connection circuit, the gate is connected to the first gate connection circuit, the collector is connected to the first collector connection circuit, and the emitter is connected to the first emitter connection circuit; the sub-emitter of the lower bridge power device is connected to the second sub-emitter connection circuit, the gate is connected to the second gate connection circuit, the collector is connected to the second collector connection circuit, and the emitter is connected to the second emitter connection circuit.

4. The test circuit of claim 1, wherein, The driver board also includes an emitter control circuit connected to the driver chip, and the emitter control circuit includes emitter control circuit pads; When the power device under test is a three-pin power device, a pin header is soldered onto the emitter control circuit pad and a jumper cap is connected to the pin header to provide the drive circuit.

5. The test circuit of claim 1, wherein, The gate connection circuit includes a gate test socket, the collector connection circuit includes a collector test socket, and the emitter connection circuit includes an emitter test socket. When the power device under test is a three-pin power device, the gate of the power device under test is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

6. The test circuit of claim 5, wherein, The sub-emitter connection circuit includes a sub-emitter test socket; When the power device under test is a four-pin power device, the sub-emitter of the power device under test is connected to the sub-emitter test socket, the gate is connected to the gate test socket, the collector is connected to the collector test socket, and the emitter is connected to the emitter test socket.

7. The test circuit of claim 5, wherein, When the power device under test is a three-pin power device, the center distance between the gate test socket, the collector test socket, and the emitter test socket is a first preset distance.

8. The test circuit of claim 6, wherein, The sub-emitter connection circuit includes a sub-emitter test socket; When the power device under test is a four-pin power device, the center distance between the collector test socket and the emitter test socket is a second preset distance, and the center distance between the emitter test socket, the sub-emitter test socket and the gate test socket is a third preset distance.

9. The test circuit of claim 5, wherein, The gate connection circuit includes a gate test pad, and the gate test socket is formed by soldering on the gate test pad; the collector connection circuit includes a collector test pad, and the collector test socket is formed by soldering on the collector test pad; the emitter connection circuit includes an emitter test pad, and the emitter test socket is formed by soldering on the emitter test pad.

10. The test circuit of claim 6, wherein, The sub-emitter connection circuit includes a sub-emitter test pad, and the sub-emitter test socket is formed by soldering onto the sub-emitter test pad.

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