A novel ultra-thin backlight structure

Abstract

This utility model relates to the field of semiconductor display technology, specifically to a novel ultra-thin backlight structure, comprising: an L-shaped carbon fiber backplate fixed by a U-fold bonding method, with the short end of the L-shape tucked into the U-fold; a one-film film covering the surface of a light guide plate; a light guide plate with a thickness of 0.25-0.5mm; a reflective sheet disposed below the light guide plate; and an LED strip disposed along the side of the light guide plate. This utility model significantly improves the ultra-thin and ultra-lightweight performance of the backlight through innovative design. The L-shaped U-fold bonding method combined with the short-end tuck design of the carbon fiber backplate greatly reduces weight and enhances structural strength and durability. The ultra-thin light guide plate, with a thickness controlled at 0.25-0.5mm, integrates optical layers with the one-film film, simplifying multi-layer stacking, ensuring optical uniformity and high brightness, and reducing module thickness. The reflective sheet uses white or silver material to optimize reflection efficiency and reduce light loss. This achieves low-power, high-brightness lighting effects.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor display technology, specifically to a novel ultra-thin backlight structure. Background Technology

[0002] While existing backlight structure design technology is relatively mature, the current industry trend clearly focuses on ultra-thinness and ultra-lightweight design. To effectively address this important trend, we propose this solution to seek a breakthrough.

[0003] The existing backlight structure design must integrate a variety of key components, including backplates, frames, LED strips, light guide plates, reflectors, multi-layer optical films, and various tapes. This complex structure inevitably leads to higher requirements for product structural strength, overall weight, module thickness, and material costs.

[0004] Traditional backlight structures, limited by inherent design concepts and material applications, struggle to find effective and reliable solutions for fundamental structural strength optimization or critical dimension thickness reduction while maintaining basic performance. This limitation has become a major technological bottleneck restricting the continued evolution of backlights towards lighter and thinner designs, making it difficult to meet the market's growing demand for ultra-thin and lightweight designs. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model discloses a novel ultra-thin backlight structure to solve the aforementioned problems.

[0006] This utility model is achieved through the following technical solution:

[0007] This utility model provides a novel ultra-thin backlight structure, including:

[0008] The carbon fiber backplate is an L-shaped carbon fiber backplate, which is fixed by a U-fold bonding method, with its short L-shaped end tucked into the U-fold.

[0009] One film is used to cover the surface of the light guide plate;

[0010] Ultra-thin light guide plate, with a thickness of 0.25-0.5mm;

[0011] The reflective sheet is located below the light guide plate;

[0012] LED light strips are installed along the side of the light guide plate.

[0013] Furthermore, the carbon fiber backing plate is either a full backing plate structure or a large perforated backing plate structure.

[0014] Furthermore, it may or may not include a plastic frame.

[0015] Furthermore, the carbon fiber backing plate is bonded and fixed with adhesive, and its U-shaped corners enhance the structural strength.

[0016] Furthermore, the LED light strip uses 3004 / 2604 / 2605 / 3006 model LED chips.

[0017] Furthermore, the reflective sheet is a white reflective sheet or a silver reflective sheet.

[0018] Furthermore, the One film integrates multiple optical film layers.

[0019] The beneficial effects of this utility model are as follows:

[0020] This invention significantly improves the ultra-thin and ultra-lightweight performance of the backlight through innovative structural design. Specifically, the carbon fiber backplate adopts an L-shaped U-fold bonding method, combined with its short-end insertion design, which not only greatly reduces the overall weight but also enhances structural strength through the U-fold corners, effectively resisting external impacts and improving product durability. The thickness of the ultra-thin light guide plate is controlled within the range of 0.25-0.5mm, and it integrates multiple optical film layers (such as brightness enhancement film, diffusion film, etc.) with a one-film film, simplifying the traditional multi-layer film stacking. While ensuring optical uniformity and high brightness, it further reduces the module thickness.

[0021] This utility model uses a white or silver reflector to optimize light reflection efficiency and reduce light loss. The LED strips employ high-efficiency chips such as 3004 / 2604 / 2605 / 3006 to achieve low power consumption and high brightness illumination. Furthermore, the optional frame design provides configuration flexibility; a frameless mode further reduces weight and cost, while the full backplate or large-perforated backplate structure adapts to different application scenarios. The overall solution significantly reduces material costs and assembly complexity, improves production yield, and meets the market's urgent demand for thinner and lighter display devices. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a structural diagram of a new type of ultra-thin backlight;

[0024] Figure 2 yes Figure 1 Internal structure diagram at point A in the middle;

[0025] The labels in the diagram represent:

[0026] 1. U-fold; 2. Carbon fiber backplate; 3. Light guide plate; 4. One film membrane. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] In one embodiment, reference is made to Figure 1 and Figure 2 As shown, a novel ultra-thin backlight structure is provided, comprising:

[0029] The carbon fiber backplate is an L-shaped carbon fiber backplate, which is fixed by a U-fold bonding method, with its L-shaped short plate tucked into the U-fold.

[0030] One film is used to cover the surface of the light guide plate;

[0031] Ultra-thin light guide plate, with a thickness of 0.25-0.5mm;

[0032] The reflective sheet is located below the light guide plate;

[0033] LED light strips are installed along the side of the light guide plate;

[0034] Furthermore, the carbon fiber backplate is either a full backplate structure or a large perforated backplate structure; the carbon fiber backplate is fixed by adhesive bonding, and its U-folded corners enhance the structural strength.

[0035] In one embodiment, the novel ultra-thin backlight structure may or may not include a frame.

[0036] In this embodiment, the LED light strip uses LED chips of model 3004 / 2604 / 2605 / 3006.

[0037] In this embodiment, the reflective sheet is a white or silver reflective sheet.

[0038] In this embodiment, the One film integrates multiple optical film layers.

[0039] Example 1: Full back panel structure + frame assembly

[0040] 1. Preparation of carbon fiber backing plate

[0041] Lightweight carbon fiber board process (density 0.65–0.7 g / cm³) 3 ):

[0042] Raw materials: T700 carbon fiber prepreg (FAW 15g / m) 2 (and fast-curing epoxy resin (HY103, curing conditions 150℃ / 3–5min))

[0043] Process: The prepregs are stacked in the order of `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]` and molded into one piece by a 200T-500T hot press. The back plate thickness is 0.05-0.5mm, and the U-folded corners are reinforced by a reverse deformation process.

[0044] 2. Assembly structure

[0045] The back panel is a full back panel without any perforations, and the height of the U-folded corners is 0.5-3.0mm.

[0046] The frame and back panel are bonded together with adhesive tape; if the process is further optimized, the frame can be integrated with the back panel through in-mold injection molding.

[0047] The layers are stacked sequentially as follows: reflective sheet (0.05-0.2mm white / silver reflective sheet) → ultra-thin light guide plate (0.25-0.5mm) → Onefilm film (integrated brightness enhancement + diffusion layer). In this embodiment, it is integrated with the ultra-thin light guide plate LED light strip (3004 / 2604 / 2605 / 3006 model LED chip side-mounted).

[0048] Example 2: Full back panel structure + glue-free frame assembly

[0049] 1. Preparation of carbon fiber backing plate

[0050] Lightweight carbon fiber board process (density 0.65–0.7 g / cm³) 3 ):

[0051] Raw materials: T700 carbon fiber prepreg (FAW 15g / m) 2 (and fast-curing epoxy resin (HY103, curing conditions 150℃ / 3–5min))

[0052] Process: The prepregs are stacked in the order of `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]` and molded into one piece by a 200T-500T hot press. The back plate thickness is 0.05-0.5mm, and the U-folded corners are reinforced by a reverse deformation process.

[0053] 2. Assembly process

[0054] The back panel is a full back panel without any perforations, and the height of the U-folded corners is 0.5-3.0mm.

[0055] The following layers are stacked sequentially on the back plate: reflective sheet (0.05-0.2mm white / silver reflective sheet) → ultra-thin light guide plate (0.25-0.5mm) → One film (integrated brightness enhancement + diffusion layer), which in this embodiment is integrated with the ultra-thin light guide plate LED light strip (3004 / 2604 / 2605 / 3006 model LED chip side-mounted).

[0056] Example 3: Large hollow back panel + plastic frame assembly

[0057] 1. Hollowed-out back panel design

[0058] Lightweight carbon fiber board process (density 0.65–0.7 g / cm³) 3 ):

[0059] Raw materials: T700 carbon fiber prepreg (FAW 15g / m) 2 (and fast-curing epoxy resin (HY103, curing conditions 150℃ / 3–5min))

[0060] Process: Prepregs are stacked in the order of `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]` and molded as a single piece using a 200T-500T hot press. The back plate thickness is 0.05-0.5mm. Hollowing-out processing is performed using 3D complex structure integrated hot pressing or laser cutting technology. When optimizing the process, a local convex structure (height 0.05-0.08mm) can be set to improve rigidity; the U-fold corners are reinforced by a reverse deformation process.

[0061] The central area of ​​the back panel has a hollow ratio of 30-95%. The frame reinforcement ribs (2mm wide) can be retained or not retained, depending on the customer's actual needs.

[0062] 2. Frame integration

[0063] The back panel is a large, openwork full back panel with a U-fold corner height of 0.5-3.0mm;

[0064] The frame and back panel are bonded together with adhesive tape; if the process is further optimized, the frame can be integrated with the back panel through in-mold injection molding.

[0065] The layers are stacked sequentially as follows: reflective sheet (0.05-0.2mm white / silver reflective sheet) → ultra-thin light guide plate (0.25-0.5mm) → Onefilm film (integrated brightness enhancement + diffusion layer). In this embodiment, it is integrated with the ultra-thin light guide plate LED light strip (3004 / 2604 / 2605 / 3006 model LED chip side-mounted).

[0066] Example 4: Large hollow back panel + glue-free frame assembly

[0067] 1. Hollowed-out back panel design

[0068] Lightweight carbon fiber board process (density 0.65–0.7 g / cm³) 3 ):

[0069] Raw materials: T700 carbon fiber prepreg (FAW 15g / m) 2 (and fast-curing epoxy resin (HY103, curing conditions 150℃ / 3–5min))

[0070] Process: Prepregs are stacked in the order of `[0℃F / 90℃F / PMI core material / 90℃F / 0℃F]` and molded as a single piece using a 200T-500T hot press. The back plate thickness is 0.05-0.5mm. Hollowing-out processing is performed using 3D complex structure integrated hot pressing or laser cutting technology. When optimizing the process, a local convex structure (height 0.05-0.08mm) can be set to improve rigidity; the U-fold corners are reinforced by a reverse deformation process.

[0071] The central area of ​​the back panel has a cutout rate of 30-95%. The reinforcing ribs (2mm wide) can be retained or not retained, depending on the customer's actual needs.

[0072] 2. Assembly process

[0073] The back panel is a large, openwork full back panel with a U-fold corner height of 0.5-3.0mm;

[0074] The following layers are stacked sequentially on the back plate: reflective sheet (0.05-0.2mm white / silver reflective sheet) → ultra-thin light guide plate (0.25-0.5mm) → One film (integrated brightness enhancement + diffusion layer), which in this embodiment is integrated with the ultra-thin light guide plate LED light strip (3004 / 2604 / 2605 / 3006 model LED chip side-mounted).

[0075] Key Explanation of Carbon Fiber Backplate Manufacturing Process

[0076] 1. Material Selection: Recycled carbon fiber + plant fiber composite board (density 0.7g / cm³) is preferred. 3 This aligns with the concept of sustainable development.

[0077] 2. Molding process:

[0078] Integrated hot pressing: Complex U-shaped structures are formed in one step through in-mold hot pressing, avoiding secondary CNC machining;

[0079] Resin system: HY103 halogen-free epoxy resin for consumer electronics, with fast curing speed (3-5 min) and flame retardancy meeting standards.

[0080] 3. Increased strength:

[0081] The U-shaped corner adopts an "in-mold secondary molding and sealing structure", injecting toughening resin at the corner to improve impact resistance;

[0082] The hollowed-out back panel uses a "continuous fiber unequal thickness design," with the border area thickened to 0.05-0.8mm and the central area thinned to 0.05-0.3mm.

[0083] Technical effect

[0084] Comparison Table of Weight Reduction Effects and Characteristics in Examples

[0085] Example 1 36% lower than aluminum back panel Total thickness 0.6-1.5mm The full backplate provides strong support and is suitable for automated machine assembly. Example 2 ↓37％ 0.6-1.5mm Achieving ultra-narrow bezels (≤1.5mm) without a glue frame Example 3 ↓68％ 0.6-1.5mm Hollowed-out design + plastic frame, balancing lightweight and strength Example 4 ↓70％ 0.6-1.5mm Achieving ultra-narrow bezels (≤1.5mm) without a glue frame

[0086] Stress comparison test scheme

[0087] 1. Test Object

[0088] Comparison table of structures between experimental and control groups

[0089] experimental group L-shaped carbon fiber back panel + U-fold edging Three-dimensional edge wrapping, mechanical anchoring control group Ordinary flat carbon fiber back plate planar unreinforced structure

[0090] 2. Test Items and Indicators

[0091] Structural Testing Items and Mechanism Analysis Table

[0092]

[0093]

[0094] 3. Key Verification Points

[0095] Stress dispersion effect

[0096] The U-fold structure transforms the planar stress of the traditional back panel into the stress of a three-dimensional frame:

[0097] I U =I flat +2Ad 2

[0098] in:

[0099] I U The total moment of inertia (or section moment of inertia) of a U-shaped cross-section, usually measured in mm. 4 or m 4 ).

[0100] I falt The moment of inertia of the flat plate portion (U-shaped bottom web) about its own neutral axis (unit: I) U (consistent).

[0101] (A): Area of ​​each side of the U-shape (usually in mm²) 2 or m 2 ).

[0102] (d): The distance from the overall neutral axis to the neutral axis of the side itself (usually in mm or m).

[0103] Coefficient (2): indicates that the U-shaped cross section has two symmetrical sides (flanges), thus the contribution term is doubled.

[0104] Comparison of strain gauge data shows that the edge stress concentration factor of the experimental group is expected to decrease by 40%.

[0105] Improved bending stiffness

[0106] The "I-beam effect" formed by the U-bend increases the moment of inertia of the cross section:

[0107]

[0108] in:

[0109] I total The total moment of inertia of the U-shaped cross section about its neutral axis (strong axis).

[0110] I web : The moment of inertia of the web (i.e., the "flat plate" in the user's formula) about its own centroidal axis (due to symmetry, the centroidal axis of the web coincides with the global neutral axis).

[0111] A f : The cross-sectional area of ​​one flange (i.e., (A) in the user's formula). (d) c ): The vertical distance from the neutral axis of the cross section to the center of a flange (i.e., (d) in the user formula).

[0112] Edge failure suppression

[0113] Ordinary backplates are prone to microcracks due to edge stress during assembly (observed by SEM electron microscopy), while the U-fold mechanical covering provides continuous support boundaries and eliminates free deformation at the edges.

[0114] Expected comparison of test data

[0115] Comparison table of carbon fiber backplate performance parameters

[0116] Bending ultimate strength (MPa) 320 368 +15％ Torsional stiffness N·m / ° 15.2 18.6 +22％ <![CDATA[Delaminated area after impact (mm 2 )]]> 120 62 -48％

[0117] Conclusion and Argumentation

[0118] The U-fold structure achieves stress advantages through triple mechanical optimization:

[0119] 1. Load path reconstruction transforms planar stress into load-bearing capacity of a three-dimensional frame.

[0120] 2. Edge constraint reinforcement inhibits microcrack initiation

[0121] 3. The failure mode escalates from brittle fracture to progressive delamination.

[0122] In summary, this invention significantly improves the ultra-thin and ultra-lightweight performance of the backlight through innovative structural design. Specifically, the carbon fiber backplate adopts an L-shaped U-fold bonding method, combined with its short-end insertion design, which not only greatly reduces the overall weight but also enhances structural strength through the U-fold corners, effectively resisting external impacts and improving product durability. The thickness of the ultra-thin light guide plate is controlled within the range of 0.25-0.5mm, and it integrates multiple optical film layers (such as brightness enhancement film, diffusion film, etc.) with a one-film film, simplifying the traditional multi-layer film stacking. While ensuring optical uniformity and high brightness, it further reduces the module thickness.

[0123] This utility model uses a white or silver reflector to optimize light reflection efficiency and reduce light loss. The LED strips employ high-efficiency chips such as 3004 / 2604 / 2605 / 3006 to achieve low power consumption and high brightness illumination. Furthermore, the optional frame design provides configuration flexibility; a frameless mode further reduces weight and cost, while the full backplate or large-perforated backplate structure adapts to different application scenarios. The overall solution significantly reduces material costs and assembly complexity, improves production yield, and meets the market's urgent demand for thinner and lighter display devices.

[0124] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A novel ultra-thin backlight structure, characterized in that, include: The carbon fiber backplate is an L-shaped carbon fiber backplate, which is fixed by a U-fold bonding method, with its short L-shaped end tucked into the U-fold. One film is used to cover the surface of the light guide plate; Light guide plate, thickness 0.25-0.5mm; The reflective sheet is located below the light guide plate; LED light strips are installed along the side of the light guide plate.

2. The novel ultra-thin backlight structure of claim 1, wherein: The carbon fiber backplate can be a full backplate structure or a large hollow backplate structure.

3. The novel ultra-thin backlight structure of claim 1, wherein: With or without a plastic frame.

4. The novel ultra-thin backlight structure of claim 1, wherein: The carbon fiber backing plate is fixed by adhesive bonding, and its U-shaped corners enhance the structural strength.

5. The novel ultra-thin backlight structure according to claim 1, wherein: The LED light strip uses LED chips of model 3004 / 2604 / 2605 / 3006.

6. The novel ultra-thin backlight structure according to claim 1, wherein: The reflective sheet is a white or silver reflective sheet.

7. The novel ultra-thin backlight structure according to claim 1, wherein: The One film integrates multiple optical film layers.

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