An 800G DR8 silicon photonics module
By designing bumps on the base of the 800G DR8 silicon photonics module to achieve double-sided heat dissipation, the problem of poor heat dissipation in the traditional structure is solved, and the heat dissipation effect of the optical emitter and silicon photonics chip is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉钧恒科技有限公司
- Filing Date
- 2025-08-28
- Publication Date
- 2026-07-31
AI Technical Summary
The traditional 800G DR8 silicon photonics module's base structure leads to poor heat dissipation for the DFB chip and silicon photonics chip at the optical emitter, resulting in excessively high temperatures that affect device performance.
A protrusion is designed on the base to contact the outer shell, and the light emitting end is fixed on the protrusion to achieve double-sided heat dissipation of the base. Heat is dissipated through the bottom shell and the top cover respectively, which enhances the heat dissipation effect.
Effective heat dissipation of the light emitter and silicon photonics chip was achieved, avoiding the problem of excessively high DFB chip temperature and improving the overall heat dissipation effect.
Smart Images
Figure CN224581735U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module technology, specifically to an 800G DR8 silicon optical module. Background Technology
[0002] The structure of a traditional 800G DR8 silicon photonics module is as follows: Figure 1 , Figure 2 As shown, it includes: a shell, a PCB board, and a base. The shell encapsulates a PCB board, which rests on the base. The base is made of tungsten copper. A window smaller than the cross-sectional size of the base is opened on the PCB board in the area corresponding to the base. The lower surface of the base is in contact with the bottom shell of the shell. On the upper surface of the base, within the area enclosed by the window, a silicon photonic chip, an optical transmitter, and a multi-channel fiber array are fixed. The silicon photonic chip is electrically connected to the PCB board. The two beams of the optical transmitter are coupled into the two input waveguides of the silicon photonic chip, respectively. The eight output waveguides of the silicon photonic chip are coupled to the multi-channel fiber array. The input beam of each input waveguide of the silicon photonic chip is first split into two beams by a 1×2 optical splitter, and then each beam is split into two beams by a 1×2 optical splitter, that is, finally split into four beams and coupled into four output waveguides. Two multi-channel optical receivers are fixed on the PCB board. The multi-channel optical receivers are generally four-channel optical receivers. The optical emitting end includes: a first pad and a second pad bonded to the upper surface of the base. A dual optical isolator is bonded to the upper surface of the first pad. A converging lens is coupled between each input waveguide of the silicon photonic chip and the dual optical isolator. The converging lens is bonded to the upper surface of the first pad. The second pad is located on the input side of the dual optical isolator. Two heat sinks are bonded to the upper surface of the second pad. A DFB chip (laser chip) coupled to the dual optical isolator is provided on the upper surface of each heat sink. A collimating lens is coupled between each DFB chip and the dual optical isolator. The collimating lens is bonded to the upper surface of the second pad. The first pad, the second pad, and the heat sinks are all made of ceramic. The laser emitted by each DFB chip is coupled into one input waveguide of the silicon photonic chip after passing through the collimating lens, the dual optical isolator, and the converging lens in sequence. In this scheme, due to the limitations of the base structure, the upper surface of the base does not contact the upper cover in the outer shell. Therefore, the DFB chip at the light emitting end can only dissipate heat through the base and the bottom shell in the outer shell (located on the back of the PCB board). Since the upper cover in the outer shell is the main heat dissipation surface, while the bottom shell is not, the base temperature is high, which in turn causes the DFB chip temperature to be high. The silicon photonics chip also needs to dissipate heat through the base. If the base temperature is too high, it will also be detrimental to the heat dissipation of the silicon photonics chip. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an 800G DR8 silicon photonics module to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An 800G DR8 silicon photonics module includes: a housing and a base disposed within the housing. The lower surface of the base contacts the bottom shell of the housing. A silicon photonics chip is fixed on the upper surface of the base. A bump integrally formed with the silicon photonics chip is provided on the light-incident side of the silicon photonics chip on the upper surface of the base. The upper surface of the bump contacts the top cover of the housing. The bump has a cavity that penetrates the side of the bump adjacent to the silicon photonics chip. The light-emitting end coupled to the silicon photonics chip is fixed in an inverted manner on the top of the cavity of the bump.
[0005] Based on the above technical solution, the present invention can be further improved as follows.
[0006] Furthermore, both the base and the bumps are made of tungsten copper.
[0007] Furthermore, a hole communicating with the cavity is opened on the lower surface of the base in the area corresponding to the cavity.
[0008] Furthermore, the cavity extends through the bump away from the side of the silicon photonics chip.
[0009] Furthermore, the optical emitting end includes: a first pad and a second pad located within the cavity of the protrusion and fixed on the top of the cavity; a dual optical isolator fixed to the first pad is disposed below it; the silicon photonic chip has two incident waveguides; a converging lens is coupled between each incident waveguide of the silicon photonic chip and the dual optical isolator below the first pad; the converging lens is bonded to the first pad; the second pad is located on the incident side of the dual optical isolator; two heat sinks are disposed below the second pad and bonded to it; a DFB chip coupled to the dual optical isolator is disposed on the lower surface of each heat sink; a collimating lens is coupled between each DFB chip and the dual optical isolator below the second pad; the collimating lens is bonded to the second pad.
[0010] Furthermore, the first pad, the second pad, and the heat sink are all made of ceramic.
[0011] Furthermore, a multi-channel fiber array coupled to eight output waveguides of the silicon photonic chip is provided on the upper surface of the base.
[0012] Furthermore, a PCB board is encapsulated inside the casing and rests on the base. A window smaller than the cross-sectional size of the base is opened on the PCB board in the area corresponding to the base. The bump and the silicon photonic chip are located inside the window, and the silicon photonic chip is electrically connected to the PCB board.
[0013] Furthermore, two multi-channel optical receivers are fixed on the PCB board.
[0014] The beneficial effects of this utility model are as follows: An additional protrusion is designed on the base, and the lower surface of the base contacts the bottom shell in the outer casing, and the protrusion contacts the top cover in the outer casing. Then, the protrusion fixes the light emitting end coupled to the silicon photonic chip in an inverted manner on the top of the cavity, so that the base can dissipate heat through both the bottom shell and the top cover, that is, achieve double-sided heat dissipation, which is beneficial to heat dissipation of silicon photonic chip and light emitting end. In addition, the light emitting end can also dissipate heat directly to the top cover in the outer casing through the protrusion, so that the overall heat dissipation effect is better and the high temperature of the DFB chip in the light emitting end is avoided. Attached Figure Description
[0015] Figure 1 This is a front view of an existing 800G DR8 silicon photonics module; Figure 2 This is a top view of a portion of the structure of an 800G DR8 silicon photonics module in the prior art; Figure 3 This is a top view of the 800G DR8 silicon photonics module of this utility model; Figure 4 This is a bottom view of the 800G DR8 silicon photonics module in this utility model; Figure 5 for Figure 4 A magnified view of a portion of the image; Figure 6 This is a cross-sectional view of the 800G DR8 silicon photonics module structure in this utility model; Figure 7 This is a first-view view of the base in this utility model; Figure 8 This is a second-view view of the base in this utility model.
[0016] The attached diagram lists the components represented by each number as follows: 1. Base; 110. Bump; 111. Cavity; 120. Hole; 2. Silicon photonics chip; 3. Optical emitter; 310. First pad; 320. Second pad; 330. Dual optical isolator; 340. Converging lens; 350. Heat sink; 360. DFB chip; 370. Collimating lens; 4. Multi-channel fiber optic array; 5. PCB board; 510. Window; 6. Multi-channel optical receiver. Detailed Implementation
[0017] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0018] Example 1 like Figures 3-8 As shown, an 800G DR8 silicon photonics module includes: The outer shell and the base 1 arranged inside the outer shell, the lower surface of the base 1 is in contact with the bottom shell in the outer shell, a silicon photonic chip 2 is fixed on the upper surface of the base 1, and a protrusion 110 integrally formed thereon is on the light-incident side of the silicon photonic chip 2 on the upper surface of the base 1. The upper surface of the protrusion 110 is in contact with the top cover in the outer shell. The protrusion 110 has a cavity 111, and the cavity 111 penetrates the side of the protrusion 110 adjacent to the silicon photonic chip 2. The light emitting end 3 is fixed in an inverted manner on the top of the cavity 111 of the protrusion 110. The light emitting end 3 is coupled to the silicon photonic chip 2 on the upper surface of the base 1.
[0019] An additional bump 110 is designed on the base 1, and the lower surface of the base 1 contacts the bottom shell in the outer shell, and the bump 110 contacts the top cover in the outer shell. Then, the bump 110 is fixed in an inverted manner on the top of the cavity 111 to the light emitting end 3 coupled to the silicon photonic chip 2, so that the base 1 can dissipate heat through both the bottom shell and the top cover, that is, achieve double-sided heat dissipation, which is beneficial to the heat dissipation of the silicon photonic chip 2 and the light emitting end 3. In addition, the light emitting end 3 can also dissipate heat directly to the top cover in the outer shell through the bump 110, so that the overall heat dissipation effect is better and the high temperature of the DFB chip in the light emitting end 3 is avoided.
[0020] Example 2 like Figures 3-8 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The base 1 is made of tungsten copper, and the bump 110 is also made of tungsten copper. Of course, this is just an example of a commonly used material, and the appropriate material can be selected according to the requirements in actual application.
[0021] Example 3 like Figure 6 , Figure 7 , Figure 8 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: On the lower surface of the base 1, a hole 120 is opened in the area corresponding to the cavity 111 to communicate with the cavity 111, so as to facilitate the patch mounting of the light emitting end 3. Furthermore, the cavity 111 passes through the bump 110 and is away from the side of the silicon photonic chip 2.
[0022] Example 4 like Figure 4 , Figure 5 , Figure 6 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below: The optical emitting end 3 includes: a first pad 310 and a second pad 320. The first pad 310 is located inside the cavity 111 of the protrusion 110 and is bonded to the top of the cavity. The second pad 320 is located inside the cavity 111 of the protrusion 110 and is bonded to the top of the cavity. A dual optical isolator 330 is arranged below the first pad 310 and is bonded to the first pad 310. The silicon photonic chip 2 has two input waveguides, meaning the silicon photonic chip 2 remains consistent with existing technology. Below the first pad 310, a converging lens 340 is coupled between each input waveguide of the silicon photonic chip 2 and the dual optical isolator 330. Since the silicon photonic chip 2 has two input waveguides, there are two converging lenses 340. The converging lenses 340 are bonded to the first pad 310. The second pad 320... At position 0 on the light-incident side of the dual optical isolator 330, two heat sinks 350 are arranged below the second pad 320 and are bonded to the second pad 320. Each heat sink 350 has a DFB chip (laser chip) 360 coupled to the dual optical isolator 330 on its lower surface. Below the second pad 320, a collimating lens 370 is coupled between each DFB chip 360 and the dual optical isolator 330. Since there are two DFB chips 360, there are also two collimating lenses 370. The collimating lenses 370 are bonded to the second pad 320. The laser emitted by each DFB chip 360 passes through the collimating lens 370, the dual optical isolator 330, and the converging lens 340 in sequence before being coupled into one light-incident waveguide of the silicon photonic chip 2.
[0023] Furthermore, the first pad 310 is made of ceramic, the second pad 320 is made of ceramic, and the heat sink 350 is made of ceramic. Of course, this is just an example of a commonly used material, and the appropriate material can be selected according to the actual application.
[0024] Example 5 like Figure 3 As shown, this embodiment is a further improvement on embodiment 4, as detailed below: The upper surface of the base 1 is provided with a multi-channel fiber array 4 coupled to eight output waveguides of the silicon photonic chip 2. That is, the output light of the silicon photonic chip 2 is coupled into the multi-channel fiber array 4. The input light of each input waveguide of the silicon photonic chip 2 is first split into two paths by a 1×2 optical splitter, and then each path of light is split into two paths by a 1×2 optical splitter, that is, finally split into four paths and coupled into four output waveguides.
[0025] Example 6 like Figures 3-6 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below: A PCB board 5 is encapsulated inside the casing, and the PCB board 5 rests on the base 1. A window 510 smaller than the cross-sectional size of the base 1 is opened on the PCB board 5 in the area corresponding to the base 1. The bump 110 and the silicon photonic chip 2 are located in the window 510. The silicon photonic chip 2 is electrically connected to the PCB board 5. Normally, the silicon photonic chip 2 and the PCB board 5 are bonded with gold wire, that is, this part is consistent with the prior art.
[0026] Two multi-channel optical receivers 6 are fixed on the PCB board 5. The multi-channel optical receivers 6 are generally four-channel optical receivers 6, which means that this part is consistent with the existing technology.
[0027] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An 800G DR8 silicon photonic module, comprising: include: The outer shell and the base (1) arranged inside the outer shell, the lower surface of the base (1) is in contact with the bottom shell in the outer shell, a silicon photonic chip (2) is fixed on the upper surface of the base (1), and a protrusion (110) integrally formed with the silicon photonic chip (2) is on the light-incident side of the upper surface of the base (1). The upper surface of the protrusion (110) is in contact with the upper cover in the outer shell. The protrusion (110) has a cavity (111). The cavity (111) penetrates the protrusion (110) and is adjacent to the side of the silicon photonic chip (2). The protrusion (110) is fixed in an inverted manner on the top of the cavity (111) to the light-emitting end (3) coupled to the silicon photonic chip (2).
2. The 800G DR8 silicon optical module of claim 1, wherein, The base (1) and the protrusion (110) are both made of tungsten copper.
3. The 800G DR8 silicon optical module of claim 1, wherein, On the lower surface of the base (1), a hole (120) communicating with the cavity (111) is opened in the area corresponding to the cavity (111).
4. The 800G DR8 silicon optical module of claim 1, wherein, The cavity (111) passes through the bump (110) away from the side of the silicon photonic chip (2).
5. The 800G DR8 silicon optical module of any one of claims 1-4, wherein, The light emitting end (3) includes: a first pad (310) and a second pad (320) located inside the cavity (111) of the protrusion (110) and bonded to the top of the cavity. A dual optical isolator (330) is arranged below the first pad (310) and bonded thereto. The silicon photonic chip (2) has two input waveguides. A converging lens (340) is coupled between each input waveguide of the silicon photonic chip (2) and the dual optical isolator (330) below the first pad (310). The converging lens (340) is connected to the first pad (310). The second pad (320) is located on the light-incident side of the dual optical isolator (330). Two heat sinks (350) are arranged below the second pad (320) and bonded to it. Each heat sink (350) has a DFB chip (360) coupled to the dual optical isolator (330) on its lower surface. A collimating lens (370) is coupled between each DFB chip (360) and the dual optical isolator (330) below the second pad (320). The collimating lens (370) is bonded to the second pad (320).
6. The 800G DR8 silicon optical module of claim 5, wherein, The first pad (310), the second pad (320), and the heat sink (350) are all made of ceramic.
7. The 800G DR8 silicon optical module of claim 1, wherein, The upper surface of the base (1) is provided with a multi-channel fiber array (4) coupled to eight optical waveguides of the silicon photonic chip (2).
8. An 800G DR8 silicon photonics module according to claim 1, characterized in that, The outer casing encapsulates a PCB board (5), which rests on the base (1). A window (510) smaller than the cross-sectional size of the base (1) is opened on the PCB board (5) in the area corresponding to the base (1). The bump (110) and the silicon photonic chip (2) are located inside the window (510). The silicon photonic chip (2) is electrically connected to the PCB board (5).
9. An 800G DR8 silicon photonics module according to claim 8, characterized in that, Two multi-channel optical receivers (6) are fixed on the PCB board (5).