A silicon photonic chip and silicon photonic engine compatible with multiple coupling mechanisms
By designing an input waveguide compatible with multiple couplers on a silicon photonic chip, the problem of incompatibility of clamps in silicon photonic engines is solved, achieving production flexibility and efficiency, and meeting the requirements of agile production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉钧恒科技有限公司
- Filing Date
- 2025-09-12
- Publication Date
- 2026-07-31
AI Technical Summary
In traditional silicon photonics engines, the chuck design of the silicon photonics chip and the coupler is incompatible, which leads to frequent switching of coupling chucks and debugging during production, violating the principles of agile production.
A first input waveguide with a tilt angle of 0° and a second input waveguide with a tilt angle of 8° are designed on the silicon photonics chip to enable compatibility with various couplers, flexible selection of laser chip patch ratio, and no need to switch coupling clamps or adjust when applied in silicon photonics engine.
This achieves flexible compatibility of silicon photonics chips between different couplers, conforms to the principles of agile manufacturing, and improves production efficiency and flexibility.
Smart Images
Figure CN224581737U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical engine technology, specifically to a silicon photonic chip and silicon photonic engine compatible with multiple couplers. Background Technology
[0002] A traditional silicon photonics engine structure includes a silicon photonics chip, an optical transmitter, and an optical fiber array. The silicon photonics chip has one input waveguide and multiple output waveguides coupled to it. The optical transmitter is coupled to the input waveguide of the silicon photonics chip, and the optical fiber array is coupled to the multiple output waveguides of the silicon photonics chip. The optical transmitter includes a laser chip, a collimating lens, an optical isolator, a converging lens, and a ceramic heat sink. The laser chip, collimating lens, optical isolator, and converging lens are coupled sequentially along the light propagation direction. The laser chip is mounted on the ceramic heat sink. The emitted light from the laser chip passes sequentially through the collimating lens, optical isolator, and converging lens before being coupled into the input waveguide of the silicon photonics chip. The input waveguide in the silicon photonics chip has two distribution configurations: either the input waveguide tilt angle is 0°, or the input waveguide tilt angle is 8°. Figure 1 , Figure 2 As shown, the optical emitter can be distributed at 0° or 8°. In actual production, there are two types of couplers: one with a 0° clamp and the other with an 8° clamp. They are incompatible with each other, which means that if the silicon photonics chip is not compatible with the coupler, it will take a long time to switch the coupling clamp and debug the coupler, which does not conform to the principle of agile production. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a silicon photonics chip and silicon photonics engine that are compatible with multiple couplers, so as to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A silicon photonics chip compatible with multiple couplers has a first input waveguide, a second input waveguide, and multiple output waveguides. The first input waveguide has a tilt angle of 0°, the second input waveguide has a tilt angle of 8°, the first input waveguide is coupled to multiple output waveguides, and the second input waveguide is coupled to multiple output waveguides.
[0005] The beneficial effects of this utility model are as follows: In this scheme, a first input waveguide with a tilt angle of 0° and a second input waveguide with a tilt angle of 8° are designed on the silicon photonic chip, and the first input waveguide and the second input waveguide are coupled to multiple output waveguides respectively. Therefore, the silicon photonic chip can be compatible with a variety of couplers. When it is applied in the silicon photonic engine, the laser chip mounting ratio can be flexibly selected according to the production capacity of the 0° and 8° couplers on the production line: that is, the ratio of 0° and 8° mounting is selected and then allocated to the coupling process. The coupler does not need to switch coupling clamps and make adjustments, so that the production is very flexible and conforms to the principle of agile production.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, the first input waveguide, the second input waveguide, and the output waveguide are located on the same side.
[0008] Furthermore, the number of optical waveguides is four.
[0009] Furthermore, the first input waveguide is coupled to the input of the first 1×2 coupler, the second input waveguide is coupled to the input of the second 1×2 coupler, one of the two outputs of the first 1×2 coupler is coupled to the first MPD, one of the two outputs of the second 1×2 coupler is coupled to the second MPD, the other output of the first 1×2 coupler and the other output of the second 1×2 coupler are coupled to the two inputs of the 2×2 coupler respectively, the two outputs of the 2×2 coupler are each coupled to the input of a third 1×2 coupler, and the two outputs of each third 1×2 coupler are each coupled to an output waveguide via an MZ modulator.
[0010] Furthermore, the splitting ratio of the first 1×2 coupler is 2:98, and the first 1×2 coupler splits 2% of the light to the first MPD; the splitting ratio of the second 1×2 coupler is 2:98, and the second 1×2 coupler splits 2% of the light to the second MPD; the splitting ratio of the 2×2 coupler is 50:50, and the splitting ratio of the third 1×2 coupler is 50:50.
[0011] Furthermore, the tilt angle of the output waveguide is 8°.
[0012] Based on the above technical solution, this utility model also provides a silicon photonics engine, including: an optical transmitter and a silicon photonics chip, the optical transmitters are distributed at 0°, the optical transmitters are coupled to the first input waveguide of the silicon photonics chip, and the multiple output waveguides of the silicon photonics chip are coupled to an optical fiber array.
[0013] The above-mentioned further beneficial effects include: making production highly flexible and in line with agile production principles.
[0014] Furthermore, the optical emitting end includes a laser chip, a collimating lens, an optical isolator, and a converging lens, which are sequentially coupled along the light propagation direction. The laser chip is mounted on a ceramic heat sink, and the laser chip, collimating lens, optical isolator, converging lens, and ceramic heat sink are all distributed at 0°.
[0015] Based on the above technical solution, this utility model also provides a silicon photonics engine, including: an optical transmitter and a silicon photonics chip, the optical transmitters are distributed at an 8° angle, the optical transmitters are coupled to the second input waveguide of the silicon photonics chip, and the multiple output waveguides of the silicon photonics chip are coupled to an optical fiber array.
[0016] The above-mentioned further beneficial effects include: making production highly flexible and in line with agile production principles.
[0017] Furthermore, the optical emitting end includes a laser chip, a collimating lens, an optical isolator, and a converging lens, which are sequentially coupled along the light propagation direction. The laser chip is mounted on a ceramic heat sink, and the laser chip, collimating lens, optical isolator, converging lens, and ceramic heat sink are all distributed at an 8° angle. Attached Figure Description
[0018] Figure 1 This is a structural diagram of the first silicon photonics engine in the prior art; Figure 2 This is a structural diagram of the second type of silicon photonic engine in the prior art; Figure 3 This is a structural diagram of the silicon photonics chip compatible with multiple couplers in this utility model; Figure 4 This is a structural diagram of the first silicon photonic engine in this utility model; Figure 5 This is a structural diagram of the second type of silicon photonic engine in this utility model.
[0019] The attached diagram lists the components represented by each number as follows: 1. Silicon photonics chip; 101. First input waveguide; 102. Second input waveguide; 103. Output waveguide; 104. First 1×2 coupler; 105. Second 1×2 coupler; 106. First MPD; 107. Second MPD; 108. 2×2 coupler; 109. Third 1×2 coupler; 110. MZ modulator; 2. Optical transmitter; 201. Laser chip; 202. Collimating lens; 203. Optical isolator; 204. Converging lens; 205. Ceramic heat sink; 3. Fiber optic array. Detailed Implementation
[0020] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0021] Example 1 like Figure 3 As shown, a silicon photonics chip compatible with multiple couplers has a first input waveguide 101, a second input waveguide 102, and multiple output waveguides 103. The first input waveguide 101 has a tilt angle of 0°, the second input waveguide 102 has a tilt angle of 8°, the first input waveguide 101 is coupled to multiple output waveguides 103, and the second input waveguide 102 is coupled to multiple output waveguides 103.
[0022] In this scheme, a first input waveguide 101 with a tilt angle of 0° and a second input waveguide 102 with a tilt angle of 8° are designed on the silicon photonic chip 1. The first input waveguide 101 and the second input waveguide 102 are coupled to multiple output waveguides 103 respectively. Therefore, the silicon photonic chip 1 can be compatible with a variety of couplers. When it is applied in the silicon photonic engine, the laser chip 201 mounting ratio can be flexibly selected according to the production capacity of the 0° and 8° couplers on the production line: that is, the ratio of 0° and 8° mounting is selected and then allocated to the coupling process. The coupler does not need to switch coupling clamps and make adjustments, so that the production is very flexible and conforms to the principle of agile production.
[0023] Example 2 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The first input waveguide 101, the second input waveguide 102, and the output waveguide 103 are on the same side. When coupling the optical transmitter 2 and the fiber array 3, the optical transmitter 2 and the fiber array 3 can be on the same side.
[0024] Example 3 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The number of optical waveguides 103 is four, so the silicon photonics chip 1 can be a 400G silicon photonics chip.
[0025] The first input waveguide 101 is coupled to the input of the first 1×2 coupler 104, and the second input waveguide 102 is coupled to the input of the second 1×2 coupler 105. One of the two outputs of the first 1×2 coupler 104 is coupled to the first MPD 106, and one of the two outputs of the second 1×2 coupler 105 is coupled to the second MPD 107. The two inputs of the 2×2 coupler 108 are coupled to the other output of the first 1×2 coupler 104 and the other output of the second 1×2 coupler 105, respectively. The two outputs of the 2×2 coupler 108 are each coupled to the input of a third 1×2 coupler 109, i.e., there are two third 1×2 couplers 109. The two outputs of each third 1×2 coupler 109 are each coupled to an output waveguide 103 via an MZ modulator 110, i.e., there are four MZ modulators 110.
[0026] As a further preferred embodiment, the splitting ratio of the first 1×2 coupler 104 is 2%:98%, with 2% of the light split by the first 1×2 coupler 104 to the first MPD 106. Of course, this is just an exemplary expression, and in actual operation, the ratio can fluctuate slightly above and below this value. The splitting ratio of the second 1×2 coupler 105 is 2%:98%, with 2% of the light split by the second 1×2 coupler 105 to the second MPD 107. Of course, this is just an exemplary expression, and in actual operation, the ratio can fluctuate slightly above and below this value.
[0027] The splitting ratio of the 2×2 coupler 108 is 50%:50%, and the splitting ratio of the third 1×2 coupler 109 is 50%:50%. For the light coupled into the first input waveguide 101, 2% is split to the first MPD 106, while the remaining 98% is split equally to the four output waveguides 103. Similarly, for the light coupled into the second input waveguide 102, 2% is split to the second MPD 107, while the remaining 98% is split equally to the four output waveguides 103.
[0028] Example 4 like Figure 3 As shown, this embodiment is a further improvement on embodiment 1, 2, or 3, as detailed below: The tilt angle of the light-emitting waveguide 103 is 8°, which is consistent with the existing technology. The 8° tilt of the light-emitting waveguide 103 can reduce light reflection. When the silicon photonic chip 1 is coupled with the fiber array 3, the end face of the fiber array 3 will also be an 8° face.
[0029] Example 5 like Figure 4As shown, a silicon photonics engine includes: an optical transmitter 2 and a silicon photonics chip 1 as described in any of embodiments 1 to 4. The optical transmitters 2 are distributed at 0° and are coupled to the first input waveguide 101 of the silicon photonics chip 1. The plurality of output waveguides 103 of the silicon photonics chip 1 are coupled to an optical fiber array 3. The emitted light from the optical transmitter 2 is coupled into the first input waveguide 101 of the silicon photonics chip 1 and then coupled into the optical fiber array 3 by the output waveguides 103.
[0030] Furthermore, the optical transmitter 2 includes a laser chip 201, a collimating lens 202, an optical isolator 203, a converging lens 204, and a ceramic heat sink 205. The laser chip 201, collimating lens 202, optical isolator 203, converging lens 204, and ceramic heat sink 205 are all distributed at 0°. The laser chip 201, collimating lens 202, optical isolator 203, and converging lens 204 are coupled sequentially along the light propagation direction. The laser chip 201 is disposed on the ceramic heat sink 205. The emitted light from the laser chip 201 is coupled into the first input waveguide 101 of the silicon photonic chip 1 after passing sequentially through the collimating lens 202, optical isolator 203, and converging lens 204.
[0031] Example 6 like Figure 5 As shown, a silicon photonics engine includes: an optical transmitter 2 and a silicon photonics chip 1 as described in any of embodiments 1 to 4. The optical transmitter 2 is distributed at an angle of 8° and is coupled to the second input waveguide 102 of the silicon photonics chip 1. A plurality of output waveguides 103 of the silicon photonics chip 1 are coupled to an optical fiber array 3. The emitted light from the optical transmitter 2 is coupled into the second input waveguide 102 of the silicon photonics chip 1 and then coupled into the optical fiber array 3 by the output waveguides 103.
[0032] The optical transmitter 2 includes a laser chip 201, a collimating lens 202, an optical isolator 203, a converging lens 204, and a ceramic heat sink 205. The laser chip 201, collimating lens 202, optical isolator 203, converging lens 204, and ceramic heat sink 205 are all distributed at an 8° angle. The laser chip 201, collimating lens 202, optical isolator 203, and converging lens 204 are coupled sequentially along the light propagation direction. The laser chip 201 is disposed on the ceramic heat sink 205. The emitted light from the laser chip 201 is coupled into the second input waveguide 102 of the silicon photonic chip 1 after passing sequentially through the collimating lens 202, optical isolator 203, and converging lens 204.
[0033] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A silicon photonics chip compatible with multiple couplers, characterized in that, It has a first input waveguide (101), a second input waveguide (102) and multiple output waveguides (103). The first input waveguide (101) has a tilt angle of 0° and the second input waveguide (102) has a tilt angle of 8°. The first input waveguide (101) is coupled to multiple output waveguides (103) respectively, and the second input waveguide (102) is coupled to multiple output waveguides (103) respectively.
2. The silicon photonic chip compatible with multiple coupling machines of claim 1, wherein, The first input waveguide (101), the second input waveguide (102), and the output waveguide (103) are on the same side.
3. The silicon photonic chip compatible with multiple coupling machines of claim 1, wherein, The number of the optical waveguides (103) is four.
4. The silicon photonic chip compatible with multiple coupling machines of claim 3, wherein, The first input waveguide (101) is coupled to the input of the first 1×2 coupler (104), the second input waveguide (102) is coupled to the input of the second 1×2 coupler (105), one of the two outputs of the first 1×2 coupler (104) is coupled to the first MPD (106), one of the two outputs of the second 1×2 coupler (105) is coupled to the second MPD (107), the other output of the first 1×2 coupler (104) and the other output of the second 1×2 coupler (105) are coupled to the two inputs of the 2×2 coupler (108), the two outputs of the 2×2 coupler (108) are each coupled to the input of a third 1×2 coupler (109), and the two outputs of each third 1×2 coupler (109) are each coupled to an output waveguide (103) via an MZ modulator (110).
5. The silicon photonic chip compatible with multiple coupling machines of claim 4, wherein, The first 1×2 coupler (104) has a splitting ratio of 2:98, and the first 1×2 coupler (104) splits 2% of the light to the first MPD (106); the second 1×2 coupler (105) has a splitting ratio of 2:98, and the second 1×2 coupler (105) splits 2% of the light to the second MPD (107); the 2×2 coupler (108) has a splitting ratio of 50:50, and the third 1×2 coupler (109) has a splitting ratio of 50:
50.
6. The silicon photonic chip compatible with multiple coupling machines according to any one of claims 1-5, wherein, The tilt angle of the output waveguide (103) is 8°.
7. A silicon light engine characterized by, include: The optical transmitter (2) and the silicon photonic chip (1) as described in any one of claims 1 to 6, wherein the optical transmitter (2) is distributed at 0°, the optical transmitter (2) is coupled to the first input waveguide (101) of the silicon photonic chip (1), and the plurality of output waveguides (103) of the silicon photonic chip (1) are coupled to an optical fiber array (3).
8. The silicon light engine of claim 7, wherein, The light emitting end (2) includes a laser chip (201), a collimating lens (202), an optical isolator (203), and a converging lens (204) coupled sequentially along the light propagation direction. The laser chip (201) is disposed on a ceramic heat sink (205). The laser chip (201), collimating lens (202), optical isolator (203), converging lens (204), and ceramic heat sink (205) are all distributed at 0°.
9. A silicon light engine characterized by, include: The optical transmitter (2) and the silicon photonic chip (1) as described in any one of claims 1 to 6, wherein the optical transmitter (2) is distributed at an angle of 8°, the optical transmitter (2) is coupled to the second input waveguide (102) of the silicon photonic chip (1), and the plurality of output waveguides (103) of the silicon photonic chip (1) are coupled to an optical fiber array (3).
10. The silicon light engine of claim 9, wherein, The light emitting end (2) includes a laser chip (201), a collimating lens (202), an optical isolator (203), and a converging lens (204) coupled sequentially along the light propagation direction. The laser chip (201) is disposed on a ceramic heat sink (205). The laser chip (201), collimating lens (202), optical isolator (203), converging lens (204), and ceramic heat sink (205) are all distributed at an 8° angle.