A silicon photonics chip and silicon photonics engine
By designing two input waveguides on the silicon photonics chip, the limitation of the design of the gold wire electrical connection between the laser chip and the PCB board is solved, and the flexible design of the PCB board and lens coupler is realized, which conforms to the agile design principle.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉钧恒科技有限公司
- Filing Date
- 2025-09-12
- Publication Date
- 2026-07-31
AI Technical Summary
In traditional silicon photonics engines, the design of the electrical connection between the laser chip and the PCB board using gold wires has limitations, resulting in inflexible PCB board design and restrictions on the design of lens couplers and fiber array couplers.
Two input waveguides are designed on the silicon photonics chip, and all output waveguides are located between these two input waveguides. The position of the laser chip is flexibly selected according to the PCB layout, so that it is located on the upper or lower side of the fiber array.
This enables greater flexibility in PCB design, and also makes the design of lens couplers and fiber array couplers more flexible, in line with agile design principles.
Smart Images
Figure CN224581738U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical engine technology, specifically to a silicon photonic chip and a silicon photonic engine. Background Technology
[0002] Traditional silicon photonics engine structure, such as Figure 1 As shown, it includes: a silicon photonics chip, an optical transmitter, and an optical fiber array. The silicon photonics chip has an input waveguide and multiple output waveguides coupled to the input waveguide. The optical transmitter is coupled to the input waveguide of the silicon photonics chip, and the optical fiber array is coupled to the multiple output waveguides of the silicon photonics chip. The optical transmitter includes: a laser chip, a collimating lens, an optical isolator, a converging lens, and a ceramic heat sink. The laser chip, collimating lens, optical isolator, and converging lens are coupled sequentially along the light propagation direction. The laser chip is located on the ceramic heat sink. The emitted light from the laser chip is coupled into the input waveguide of the silicon photonics chip after passing through the collimating lens, optical isolator, and converging lens in sequence. In this scheme, since the input waveguide is located above the output waveguide, the laser chip is also located above the optical fiber array. Since the laser chip needs to be electrically connected to the gold wires of the PCB board, the laser driving circuit and its gold wire bonding pads can only be designed on the upper side of the optical fiber array, which limits the design of the PCB board. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a silicon photonics chip and a silicon photonics engine to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A silicon photonics chip has a first input waveguide, a second input waveguide, and multiple output waveguides on the same side. All output waveguides are located between the first input waveguide and the second input waveguide, and the first input waveguide and the second input waveguide are coupled to the multiple output waveguides respectively.
[0005] The beneficial effects of this invention are as follows: By designing a first input waveguide and a second input waveguide on the silicon photonic chip, and placing all output waveguides between the first and second input waveguides, when the optical transmitter and the fiber array are coupled to the silicon photonic chip, the laser chip in the optical transmitter can be flexibly positioned on the upper or lower side of the fiber array according to the PCB layout. This eliminates limitations on the PCB design and allows for more flexible design of the lens coupler and fiber array coupler, conforming to the principles of agile design.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, the tilt angle of the first input waveguide is 0°, the tilt angle of the second input waveguide is 0°, and the tilt angle of all output waveguides is 8°.
[0008] Furthermore, the number of optical waveguides is four.
[0009] Furthermore, the first input waveguide and the second input waveguide are coupled to the two inputs of the 2×2 coupler, respectively. The two outputs of the 2×2 coupler are each coupled to the input of a 1×2 coupler. The two outputs of each 1×2 coupler are each coupled to an output waveguide via an MZ modulator.
[0010] Based on the above technical solution, this utility model also provides a silicon photonics engine, including: an optical transmitter, an optical fiber array, and a silicon photonics chip, wherein the optical transmitter is coupled to the first input waveguide of the silicon photonics chip, and the optical fiber array is coupled to the output waveguide of the silicon photonics chip.
[0011] The further beneficial effects of adopting the above are: the laser chip in the optical transmitter can be flexibly placed on the upper side or the lower side of the fiber array according to the PCB layout, so that the PCB design is not limited, and the design of the lens coupler and fiber array coupler is also more flexible, which conforms to the agile design principle.
[0012] Furthermore, the optical emitting end includes: a laser chip, a collimating lens, an optical isolator, and a converging lens, which are sequentially coupled along the light propagation direction, with the laser chip mounted on a ceramic heat sink.
[0013] Based on the above technical solution, this utility model also provides a silicon photonics engine, including: an optical transmitter, an optical fiber array, and a silicon photonics chip, wherein the optical transmitter is coupled to the second input waveguide of the silicon photonics chip, and the optical fiber array is coupled to the output waveguide of the silicon photonics chip.
[0014] The further beneficial effects of adopting the above are: the laser chip in the optical transmitter can be flexibly placed on the upper side or the lower side of the fiber array according to the PCB layout, so that the PCB design is not limited, and the design of the lens coupler and fiber array coupler is also more flexible, which conforms to the agile design principle.
[0015] Furthermore, the optical emitting end includes: a laser chip, a collimating lens, an optical isolator, and a converging lens, which are sequentially coupled along the light propagation direction, with the laser chip mounted on a ceramic heat sink. Attached Figure Description
[0016] Figure 1 This is a structural diagram of a silicon photonics engine in the prior art; Figure 2 This is a structural diagram of the silicon photonic chip in this utility model; Figure 3 This is a structural diagram of the first silicon photonic engine in this utility model; Figure 4 This is a structural diagram of the second type of silicon photonic engine in this utility model.
[0017] The attached diagram lists the components represented by each number as follows: 1. Silicon photonics chip; 101. First input waveguide; 102. Second input waveguide; 103. Output waveguide; 104. 2×2 coupler; 105. 1×2 coupler; 106. MZ modulator; 2. Optical transmitter; 201. Laser chip; 202. Collimating lens; 203. Optical isolator; 204. Converging lens; 205. Ceramic heat sink; 3. Fiber optic array. Detailed Implementation
[0018] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0019] Example 1 like Figure 2 As shown, a silicon photonics chip has a first input waveguide 101, a second input waveguide 102, and multiple output waveguides 103 on the same side. All output waveguides 103 are located between the first input waveguide 101 and the second input waveguide 102. The spacing between the first input waveguide 101 and the output waveguide 103 is sufficient to couple the optical transmitter 2 and the fiber array 3. The spacing between the second input waveguide 102 and the output waveguide 103 is also sufficient to couple the optical transmitter 2 and the fiber array 3. The first input waveguide 101 is coupled to the multiple output waveguides 103, and the second input waveguide 102 is also coupled to the multiple output waveguides 103.
[0020] A first input waveguide 101 and a second input waveguide 102 are designed on the silicon photonic chip 1, and all output waveguides 103 are located between the first input waveguide 101 and the second input waveguide 102. When the optical transmitter 2 and the fiber array 3 are coupled to the silicon photonic chip 1, the laser chip 201 in the optical transmitter 2 can be flexibly placed on the upper side of the fiber array 3 or on the lower side of the fiber array 3 according to the PCB layout. This makes the PCB design unrestricted and the design of the lens coupler and the fiber array coupler more flexible, which conforms to the agile design principle.
[0021] Example 2 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The tilt angle of the first input waveguide 101 is 0°, or the tilt angle of the first input waveguide 101 is 8°; the tilt angle of the second input waveguide 102 is 0°, or the tilt angle of the second input waveguide 102 is 8°. At this point, the following combinations exist: 1) The tilt angle of the first input waveguide 101 is 0°, and the tilt angle of the second input waveguide 102 is 0°; 2) The tilt angle of the first input waveguide 101 is 8°, and the tilt angle of the second input waveguide 102 is 0°; 3) The tilt angle of the first input waveguide 101 is 0°, and the tilt angle of the second input waveguide 102 is 8°; 4) The tilt angle of the first input waveguide 101 is 8° and the tilt angle of the second input waveguide 102 is 8°.
[0022] All output waveguides 103 are tilted at an angle of 8°. When the first input waveguide 101 is tilted at an angle of 8°, then the first input waveguide 101 is parallel to the output waveguide 103. When the second input waveguide 102 is tilted at an angle of 8°, then the second input waveguide 102 is parallel to the output waveguide 103.
[0023] Example 3 like Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: The number of optical waveguides 103 is four, so the silicon photonics chip 1 can be a 400G silicon photonics chip.
[0024] Furthermore, the first input waveguide 101 and the second input waveguide 102 are coupled to the two inputs of the 2×2 coupler 104, respectively. Alternatively, the two inputs of the 2×2 coupler 104 are coupled to the first input waveguide 101 and the second input waveguide 102, respectively, while the two outputs of the 2×2 coupler 104 are each coupled to the input of a 1×2 coupler 105, i.e., there are two 1×2 couplers 105. The two outputs of each 1×2 coupler 105 are each coupled to an output waveguide 103 via an MZ modulator 106, i.e., there are four MZ modulators 106.
[0025] The splitting ratio of the 2×2 coupler 104 is 50%:50%, and the splitting ratio of the 1×2 coupler 105 is 50%:50%. That is, the light output from the first input waveguide 101 is distributed to the four output waveguides 103 in an equal ratio, and the light output from the second input waveguide 102 is also distributed to the four output waveguides 103 in an equal ratio.
[0026] Example 4 like Figure 3As shown, a silicon photonics engine includes: an optical transmitter 2, an optical fiber array 3, and a silicon photonics chip 1 as described in any of embodiments 1 to 3. The optical transmitter 2 is coupled to the first input waveguide 101 of the silicon photonics chip 1, and the optical fiber array 3 is coupled to the output waveguide 103 of the silicon photonics chip 1. That is, the emitted light from the optical transmitter 2 is coupled into the first input waveguide 101 of the silicon photonics chip 1, and the output light from the output waveguide 103 is coupled into the optical fiber array 3.
[0027] Depending on the PCB layout, the laser chip 201 in the light emitter 2 can be flexibly positioned on the upper side of the fiber array 3 or on the lower side of the fiber array 3, so that the PCB design is not limited and the design of the lens coupler and fiber array coupler is also more flexible, which conforms to the agile design principle.
[0028] Furthermore, the optical transmitter 2 includes a laser chip 201, a collimating lens 202, an optical isolator 203, a converging lens 204, and a ceramic heat sink 205. The laser chip 201, collimating lens 202, optical isolator 203, and converging lens 204 are coupled sequentially along the light propagation direction. The laser chip 201 is disposed on the ceramic heat sink 205. The emitted light from the laser chip 201 is coupled into the first input waveguide 101 of the silicon photonic chip 1 after passing through the collimating lens 202, optical isolator 203, and converging lens 204 in sequence. The tilt angle of the optical transmitter 2 is the same as the tilt angle of the first input waveguide 101.
[0029] Example 5 like Figure 4 As shown, a silicon photonics engine includes: an optical transmitter 2, an optical fiber array 3, and a silicon photonics chip 1 as described in any of embodiments 1 to 3. The optical transmitter 2 is coupled to the second input waveguide 102 of the silicon photonics chip 1, and the optical fiber array 3 is coupled to the output waveguide 103 of the silicon photonics chip 1. That is, the emitted light from the optical transmitter 2 is coupled into the second input waveguide 102 of the silicon photonics chip 1, and the output light from the output waveguide 103 is coupled into the optical fiber array 3.
[0030] Depending on the PCB layout, the laser chip 201 in the light emitter 2 can be flexibly positioned on the upper side of the fiber array 3 or on the lower side of the fiber array 3, so that the PCB design is not limited and the design of the lens coupler and fiber array coupler is also more flexible, which conforms to the agile design principle.
[0031] Furthermore, the optical emitter 2 includes a laser chip 201, a collimating lens 202, an optical isolator 203, a converging lens 204, and a ceramic heat sink 205. The laser chip 201, collimating lens 202, optical isolator 203, and converging lens 204 are coupled sequentially along the light propagation direction. The laser chip 201 is disposed on the ceramic heat sink 205. The emitted light from the laser chip 201 is coupled into the second input waveguide 102 of the silicon photonic chip 1 after passing through the collimating lens 202, optical isolator 203, and converging lens 204 in sequence. The tilt angle of the optical emitter 2 is the same as the tilt angle of the second input waveguide 102.
[0032] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A silicon photonic chip, characterized by, It has a first input waveguide (101), a second input waveguide (102) and multiple output waveguides (103) on the same side. All output waveguides (103) are located between the first input waveguide (101) and the second input waveguide (102). The first input waveguide (101) and the second input waveguide (102) are coupled to the multiple output waveguides (103) respectively.
2. The silicon photonic chip of claim 1, wherein, The tilt angle of the first input waveguide (101) is 0° or 8°.
3. The silicon photonic chip of claim 1, wherein, The tilt angle of the second input waveguide (102) is 0° or 8°.
4. The silicon photonic chip of claim 1, wherein, All outgoing waveguides (103) have a tilt angle of 8°.
5. The silicon photonic chip of any of claims 1-4, wherein, The number of the optical waveguides (103) is four.
6. The silicon photonic chip of claim 5, wherein, The first input waveguide (101) and the second input waveguide (102) are coupled to the two inputs of the 2×2 coupler (104), respectively. The two outputs of the 2×2 coupler (104) are each coupled to the input of a 1×2 coupler (105). The two outputs of each 1×2 coupler (105) are each coupled to an output waveguide (103) via an MZ modulator (106).
7. A silicon light engine characterized by, include: The optical transmitter (2), the fiber array (3), and the silicon photonic chip (1) as described in any one of claims 1 to 6, wherein the optical transmitter (2) is coupled to the first input waveguide (101) of the silicon photonic chip (1), and the fiber array (3) is coupled to the output waveguide (103) of the silicon photonic chip (1).
8. The silicon light engine of claim 7, wherein, The light emitting end (2) includes a laser chip (201), a collimating lens (202), an optical isolator (203) and a converging lens (204) coupled sequentially along the light propagation direction, wherein the laser chip (201) is disposed on a ceramic heat sink (205).
9. A silicon light engine characterized by, include: The optical transmitter (2), the fiber array (3), and the silicon photonic chip (1) as described in any one of claims 1 to 6, wherein the optical transmitter (2) is coupled to the second input waveguide (102) of the silicon photonic chip (1), and the fiber array (3) is coupled to the output waveguide (103) of the silicon photonic chip (1).
10. The silicon light engine of claim 9, wherein, The light emitting end (2) includes a laser chip (201), a collimating lens (202), an optical isolator (203) and a converging lens (204) coupled sequentially along the light propagation direction, wherein the laser chip (201) is disposed on a ceramic heat sink (205).