LED backlight source facilitating heat dissipation

Abstract

This utility model relates to the field of backlight technology, and more particularly to an LED backlight with convenient heat dissipation. Its technical solution includes: a frame, a base plate, a light core layer, and a heat dissipation module. The light core layer is disposed within the frame, and the frame is fixedly disposed on the base plate. The light core layer consists of a diffuser plate, a light guide plate, a lamp holder, an LED array, and a PCB board, arranged sequentially from top to bottom. The heat dissipation module is fixedly disposed on the base plate and consists of a cavity, heat dissipation fins, and a thermal bridge. The thermal bridge is fixedly disposed on the base plate, and its upper surface contacts the PCB board. The cavity is formed within the thermal bridge and filled with liquid metal. The heat dissipation fins are equidistantly disposed on the thermal bridge. This utility model, by combining the thermal bridge and the liquid metal cavity with the heat dissipation fins to form a highly efficient integrated heat conduction and convection structure, significantly improves the heat dissipation efficiency and stability of the LED backlight.

Description

Technical Field

[0001] This utility model relates to the field of backlight technology, and in particular to an LED backlight that facilitates heat dissipation. Background Technology

[0002] LED backlights are surface light source structures widely used in LCD displays, advertising light boxes, and lighting panels. They mainly consist of light-emitting devices, light guide components, and a backplate. As display devices develop towards higher brightness, higher resolution, and longer operating times, the heat generated by LED devices is gradually increasing. If heat dissipation is not timely, it will lead to accelerated LED light decay, reduced luminous efficiency, shortened lifespan, and even safety hazards.

[0003] Traditional LED backlights often use metal base plates or aluminum substrates for heat dissipation, or assist in heat dissipation by increasing the back plate area or setting natural convection holes. However, these methods have long heat conduction paths and limited efficiency, and the heat dissipation problem is more prominent, especially in compact or enclosed environments.

[0004] Therefore, we propose an LED backlight that facilitates heat dissipation to solve the existing problems. Utility Model Content

[0005] The purpose of this invention is to address the problems existing in the background technology by proposing an LED backlight that facilitates heat dissipation.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an LED backlight that facilitates heat dissipation, comprising a frame, a base plate, an optical core layer, and a heat dissipation module, wherein the optical core layer is disposed within the frame, and the frame is fixedly disposed on the base plate;

[0007] The optical core layer consists of a diffuser plate, a light guide plate, a lamp holder, an array of LED beads, and a PCB board, with the optical core layer structure distributed from top to bottom.

[0008] The heat dissipation module is fixedly mounted on the base plate. The heat dissipation module consists of a cavity, heat dissipation fins and a thermal bridge. The thermal bridge is fixedly mounted on the base plate. The upper surface of the thermal bridge contacts the PCB board. The cavity is opened in the thermal bridge and filled with liquid metal. The heat dissipation fins are equidistantly arranged on the thermal bridge.

[0009] Preferably, a flexible thermally conductive silicone pad made of thermally conductive material is provided between the thermal bridge and the PCB board to ensure close contact and buffer stress.

[0010] Preferably, the liquid metal is a Ga-In alloy, which has high thermal conductivity and fast self-convection characteristics.

[0011] Preferably, the diffuser plate is glued to the upper surface of the light guide plate, the light guide plate is fixedly mounted on the lamp holder, the PCB board is fixedly mounted at the bottom of the lamp holder, and the LED array is fixedly mounted on the PCB board.

[0012] Preferably, the inner wall of the lamp holder and the PCB board, except for the position of the lamp bead array, are provided with reflective film.

[0013] Preferably, a sealing adhesive is provided at the contact position between the optical core layer and the frame.

[0014] Preferably, the base plate has four mounting holes, and the four mounting holes are arranged in a rectangular array on the base plate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model features a thermal bridge + liquid metal cavity structure, wherein the thermal bridge is in direct contact with the PCB board, which quickly conducts the heat generated by the LED chip during operation to the internal liquid metal. Through the high thermal conductivity and self-convection characteristics of the liquid metal Ga-In alloy, the heat diffusion is accelerated, significantly improving the heat dissipation efficiency.

[0017] The liquid metal and the equidistant heat dissipation fins below form an integrated structure for heat conduction and convection. After the heat is transferred through the liquid metal and the heat-conducting bridge, it is exchanged with the surrounding air through natural convection through the fins, forming a rapid heat dissipation channel, which is suitable for use in fanless or enclosed environments.

[0018] Flexible thermally conductive material is placed between the thermal bridge and the PCB board, and thermally conductive silicone pads effectively fill the gaps, increasing the contact area. At the same time, it has the function of buffering thermal expansion and contraction stress, ensuring continuous and stable heat transfer, and avoiding the decline in heat dissipation performance due to poor contact. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 3 This is a schematic diagram of the optical core layer structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the positional distribution structure of the heat dissipation module of this utility model;

[0023] Figure 5 This is a cross-sectional view of the heat dissipation module of this utility model.

[0024] Figure label:

[0025] 1. Frame; 2. Mounting holes; 3. Base plate; 4. Core layer; 401. Diffuser plate; 402. Light guide plate; 403. Lamp holder; 404. Lamp array; 405. PCB board; 5. Heat dissipation module; 501. Cavity; 502. Heat dissipation fins; 503. Thermal bridge. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0027] like Figures 1-5 As shown, the present invention proposes an LED backlight that facilitates heat dissipation, including a frame 1, a base plate 3, an optical core layer 4, and a heat dissipation module 5. The optical core layer 4 is disposed inside the frame 1, and the frame 1 is fixedly installed on the base plate 3.

[0028] The light core layer 4 includes, from top to bottom, a diffuser plate 401, a light guide plate 402, a lamp holder 403, an LED array 404, and a PCB board 405. The diffuser plate 401 is fixed to the upper surface of the light guide plate 402 by adhesive bonding. The light guide plate 402 is installed at the upper end of the lamp holder 403. The PCB board 405 is located at the bottom end of the lamp holder 403. The LED array 404 is installed on the PCB board 405.

[0029] The inner wall of the lamp holder 403 and the PCB board 405, except for the position of the lamp bead array 404, are covered with reflective film to improve light utilization and brightness uniformity. The contact position between the light core layer 4 and the frame 1 is coated with sealing adhesive to prevent dust and moisture from entering and to ensure the sealing and service life of the light source. Example

[0030] like Figures 1-5 As shown, the present invention proposes an LED backlight that facilitates heat dissipation. Compared with Embodiment 1, this embodiment further includes: a heat dissipation module 5 installed on the base plate 3, which is composed of a thermal bridge 503, a cavity 501 and heat dissipation fins 502.

[0031] The upper surface of the thermal bridge 503 is in contact with the PCB board 405, and a flexible thermally conductive silicone pad is filled between them to fill tiny gaps, improve heat conduction efficiency, and buffer mechanical stress caused by thermal expansion and contraction, ensuring contact stability.

[0032] The thermal bridge 503 is hollow, forming a cavity 501. The cavity 501 is filled with Ga-In alloy liquid metal, which has excellent thermal conductivity and self-convection characteristics. The thermal bridge 503 itself and the liquid metal can quickly absorb and diffuse the heat conducted from the PCB board 405. Multiple sets of evenly distributed heat dissipation fins 502 are set on the lower surface of the thermal bridge 503, forming a heat exchange structure between the liquid metal, the thermal bridge 503 and the air. Heat is transferred to the fins 502 through the liquid metal and the thermal bridge 503, and then dissipated through natural convection, thereby improving the overall heat dissipation efficiency. It is particularly suitable for LED applications in fanless or sealed cavities.

[0033] Four mounting holes 2 are provided on the base plate 3, arranged in a rectangular array, which facilitates the installation and fixation of the whole machine and enhances the structural stability.

[0034] This implementation method, through the combination of thermal bridge 503, liquid metal and heat dissipation fins, achieves rapid heat conduction and diffusion, avoids local overheating, and ensures stable operation of the LED light source for a long time.

[0035] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An LED backlight source facilitating heat dissipation, comprising a surrounding frame (1), a bottom plate (3), a light core layer piece (4) and a heat dissipation module (5), characterized in that: The optical core layer (4) is disposed inside the frame (1), and the frame (1) is fixedly disposed on the base plate (3); The light core layer (4) is composed of a diffuser plate (401), a light guide plate (402), a lamp holder (403), an array of lamp beads (404), and a PCB board (405). The structure of the light core layer (4) is distributed from top to bottom. The heat dissipation module (5) is fixedly mounted on the base plate (3). The heat dissipation module (5) is composed of a cavity (501), heat dissipation fins (502) and a thermal bridge (503). The thermal bridge (503) is fixedly mounted on the base plate (3). The upper surface of the thermal bridge (503) contacts the PCB board (405). The cavity (501) is opened in the thermal bridge (503). The cavity (501) is filled with liquid metal. The heat dissipation fins (502) are equidistantly mounted on the thermal bridge (503).

2. The LED backlight according to claim 1, wherein: A flexible thermally conductive silicone pad is provided between the thermal bridge (503) and the PCB board (405) to ensure close contact and buffer stress.

3. The LED backlight of claim 1, wherein: The liquid metal is a Ga-In alloy, which has high thermal conductivity and fast self-convection.

4. The LED backlight of claim 1, wherein: The diffuser plate (401) is glued to the upper surface of the light guide plate (402), the light guide plate (402) is fixedly mounted on the lamp holder (403), the PCB board (405) is fixedly mounted at the bottom of the lamp holder (403), and the lamp bead array (404) is fixedly mounted on the PCB board (405).

5. The LED backlight with easy heat dissipation according to claim 4, characterized in that: The inner wall of the lamp holder (403) and the PCB board (405) are provided with reflective film except for the position of the lamp bead array (404).

6. The LED backlight with easy heat dissipation according to claim 1, characterized in that: A sealing adhesive is provided at the contact position between the optical core layer (4) and the frame (1).

7. The LED backlight of claim 1, wherein: The base plate (3) has four mounting holes (2), and the four mounting holes (2) are arranged in a rectangular array on the base plate (3).

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