glue removal machine

Abstract

This invention provides a degumming machine, wherein a first switch door is provided between the loading interlock chamber and the transfer chamber to open during wafer transfer; inert gas is introduced into the input end of the first section of the main gas supply line, the output end of the first section is connected to the input end of the flow limiting section, the output end of the flow limiting section is connected to the input end of the second section, and the output end of the second section introduces inert gas into the transfer chamber, with the gas flow rate of the second section being less than that of the first section; the input end of the gas supply bypass is connected to the first section, and the output end of the gas supply bypass is located between the loading vacuum chamber and the transfer chamber, blowing inert gas towards the transfer chamber, which can form an air curtain between the loading interlock chamber and the transfer chamber, with the gas flow rate of the gas supply bypass being the same as that of the first section; a vacuum pump is connected to the transfer chamber through a first exhaust valve. Thus, the degumming machine of this invention improves the particle abnormality phenomenon in the loading interlock chamber.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment processing technology, and in particular to a glue removal machine. Background Technology

[0002] In semiconductor manufacturing, photolithography is a commonly used process. The photolithography process typically involves using photoresist to form the desired pattern. After photolithography, any remaining photoresist needs to be removed, which requires a photoresist stripping machine. The principle of photoresist stripping is to cause a chemical reaction and volatilize the photoresist.

[0003] For existing desizing machines, when the wafer is transferred between the transfer cavity and the loading interlock chamber, the switches in the transfer cavity and the loading interlock chamber are open. At this time, the desizing machine continuously purges the transfer cavity with nitrogen, and the pressure in the transfer cavity is maintained between 50MT and 150MT. The pressure in the loading interlock chamber is at atmospheric pressure and there is no nitrogen supply in the loading interlock chamber. At this time, there is a positive pressure difference between the transfer cavity and the loading interlock chamber, which causes the volatile gases remaining on the wafer to flow into the loading interlock chamber, resulting in abnormal particle composition in the loading interlock chamber.

[0004] Therefore, how to improve the particle abnormality phenomenon in the loading interlock chamber has become a technical problem that urgently needs to be solved by existing technologies. Utility Model Content

[0005] This invention provides a degumming machine that improves the particle abnormality phenomenon in the loading interlock chamber.

[0006] According to a first aspect of the present invention, the technical solution of the present invention provides a degumming machine, comprising: Transmission cavity; A loading interlock chamber, wherein the loading interlock chamber and the transmission cavity have a first switch door that opens during wafer transfer; The main gas supply line includes a first section, a second section, and a flow restrictor. Inert gas is introduced into the input end of the first section, and the output end of the first section is connected to the input end of the flow restrictor. The output end of the flow restrictor is connected to the input end of the second section, and the output end of the second section introduces inert gas into the transmission cavity. The gas flow rate of the second section is less than that of the first section. A gas supply bypass is provided, wherein the input end of the gas supply bypass is connected to the first section, the output end of the gas supply bypass is located between the loading vacuum chamber and the transmission cavity, and the output end of the gas supply bypass blows inert gas toward the transmission cavity to form an air curtain between the loading interlock chamber and the transmission cavity. The gas flow rate of the gas supply bypass is the same as the gas flow rate of the first section. A vacuum pump is connected to the transmission chamber via a first exhaust valve to extract inert gas from the transmission chamber.

[0007] Optionally, the main gas supply line further includes a three-way valve, the three ends of which are respectively connected to the output end of the first section, the input end of the flow limiting section, and the input end of the gas supply bypass.

[0008] Optionally, the output end of the gas supply bypass includes a plurality of air holes facing the transmission cavity.

[0009] Optionally, the degumming machine further includes an air supply unit, which is connected to the input end of the first section via a first air inlet valve to provide inert gas.

[0010] Optionally, the loading interlock chamber includes a first locking chamber and a second locking chamber; the gas supply unit is connected to the first locking chamber via a second inlet valve, and the gas supply unit is connected to the second locking chamber via a third inlet valve, so as to supply inert gas to the first locking chamber and the second locking chamber respectively.

[0011] Optionally, the vacuum pump is connected to the first locked chamber via a second exhaust valve, and the vacuum pump is connected to the second locked chamber via a third exhaust valve, so as to extract the inert gas from the first locked chamber and the second locked chamber respectively.

[0012] Optionally, the flow-limiting part is a flow-limiting orifice.

[0013] Optionally, it also includes: a wafer carrier stage, wherein the wafer carrier stage and the loading interlock chamber have a second opening and closing door.

[0014] Optionally, it may also include: a plurality of desizing chambers, the desizing chambers being located around the transfer cavity and communicating with the transfer cavity.

[0015] Optionally, it also includes a robotic arm located within the transfer cavity, the robotic arm being used to transfer the wafer between the loading interlock chamber and the wafer carrier when the second switch door is opened, and / or to transfer the wafer between the transfer cavity and the wafer carrier when the first switch door is opened.

[0016] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects: In the adhesive removal machine of this utility model, in the main gas supply line, inert gas is introduced into the input end of the first section, the output end of the first section is connected to the input end of the flow limiting unit, the output end of the flow limiting unit is connected to the input end of the second section, and the output end of the second section introduces inert gas into the transmission chamber. Therefore, on the one hand, by combining a vacuum pump connected to the transmission chamber through the first exhaust valve, the inert gas in the transmission chamber can be extracted to maintain the gas pressure in the transmission chamber at a fixed vacuum level. On the other hand, the gas flow rate of the second section is limited by the flow limiting unit and is less than the gas flow rate of the first section. That is to say, the gas flow rate of the inert gas introduced into the transmission chamber through the main gas supply line is less than the gas flow rate of the inert gas introduced into the first section. Based on this, since the input end of the gas supply bypass is connected to the first section, and the output end of the gas supply bypass is located between the loading vacuum chamber and the transmission cavity, and blows inert gas towards the transmission cavity to form an air curtain between the loading interlock chamber and the transmission cavity, the gas flow rate of the gas supply bypass can be the same as that of the first section. That is, the gas flow rate of the inert gas entering the transmission cavity through the main gas supply line is less than that of the gas supply bypass. As a result, the air curtain has a positive pressure difference relative to the transmission cavity, thereby avoiding the contamination of the loading interlock chamber by the waste gas remaining on the wafer and improving the particle abnormality phenomenon in the loading interlock chamber. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the first type of glue-removing machine provided in this embodiment of the utility model; Figure 2 This is a schematic diagram of the structure of the second type of glue-removing machine provided in this embodiment of the utility model; Figure 3 This is a structural schematic diagram of the third type of glue-removing machine provided in this embodiment of the utility model; Figure 4 This is a structural schematic diagram of the fourth type of glue-removing machine provided in this embodiment of the utility model; Figure 5 This is a structural schematic diagram of the fifth type of glue-removing machine provided in this embodiment of the utility model; Figure 6 This is a structural schematic diagram of the sixth type of glue removal machine provided in this embodiment of the utility model; Figure 7 This is a structural schematic diagram of the seventh type of glue removal machine provided in this embodiment of the utility model. Detailed Implementation

[0019] As described in the background section, how to improve the abnormal particle phenomenon in the loading interlock chamber has become a technical problem that urgently needs to be solved in the existing technology.

[0020] In view of this, an embodiment of the present invention provides a degumming machine, comprising: a transmission chamber; a loading interlock chamber, with a first switch door between the loading interlock chamber and the transmission chamber; a main gas supply line, including a first section, a second section, and a flow restrictor, wherein inert gas is introduced into the input end of the first section, the output end of the first section is connected to the input end of the flow restrictor, the output end of the flow restrictor is connected to the input end of the second section, and the output end of the second section introduces inert gas into the transmission chamber, with the gas flow rate of the second section being less than that of the first section; a gas supply bypass, with the input end of the gas supply bypass connected to the first section, and the output end of the gas supply bypass located between the loading vacuum chamber and the transmission chamber, blowing inert gas toward the transmission chamber to form an air curtain between the loading interlock chamber and the transmission chamber, the gas flow rate of the gas supply bypass being the same as that of the first section; and a vacuum pump, connected to the transmission chamber via a first exhaust valve to extract inert gas from the transmission chamber. Thus, the degumming machine of this invention avoids the contamination of the loading interlock chamber by residual exhaust gas on the wafer, and improves the abnormal particle phenomenon in the loading interlock chamber.

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0023] The technical solution of this utility model will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0024] To solve the above problems, please refer to Figure 1 An embodiment of this utility model provides a glue removal machine, including: a transmission cavity 100, a loading interlock chamber 200, a main air supply line 400, an air supply bypass line 500, and a vacuum pump 600.

[0025] The loading interlock chamber 200 and the transmission cavity 100 are connected by a first switch door 300 that opens when transferring wafers. When there is a wafer to be transferred between the loading interlock chamber 200 and the transmission cavity 100, the first switch door 300 opens; otherwise, the first switch door 300 closes.

[0026] In this embodiment, the main gas supply line 400 may include a first section 410, a second section 430, and a flow restrictor 420. Inert gas is introduced into the input end of the first section 410, and the output end of the first section 410 is connected to the input end of the flow restrictor 420. The output end of the flow restrictor 420 is connected to the input end of the second section 430, and the output end of the second section 430 introduces inert gas into the transmission cavity 100. The gas flow rate of the second section 430 is less than the gas flow rate of the first section 410.

[0027] For example, nitrogen can be an inert gas, which has the advantage of being inexpensive.

[0028] As an example, the flow limiting part 420 can be a flow limiting orifice. Of course, this utility model is not limited to this, and the flow limiting part 420 can include at least one of a valve or a flow restrictor.

[0029] In this embodiment, the input end of the gas supply bypass 500 is connected to the first section 410, and the output end of the gas supply bypass 500 is located between the loading vacuum chamber and the transmission cavity 100. The output end of the gas supply bypass 500 blows inert gas toward the transmission cavity 100 to form an air curtain between the loading interlock chamber 200 and the transmission cavity 100. The gas flow rate of the gas supply bypass 500 is the same as the gas flow rate of the first section 410.

[0030] In this embodiment, the vacuum pump 600 is connected to the transmission chamber 100 via the first exhaust valve 610 to extract the inert gas from the transmission chamber 100.

[0031] Specifically, the transmission cavity 100 is maintained in a fixed vacuum environment.

[0032] For example, the pressure range inside the transmission cavity 100 is 50mT-150mT. This pressure range represents a relatively easy-to-achieve vacuum level. Of course, this invention is not limited to this; the pressure inside the transmission cavity 100 can be set to the pressure under a vacuum environment.

[0033] In this embodiment, the pressure in the transmission cavity 100 is maintained by the combined action of the main gas supply line 400 supplying gas to the transmission cavity 100 and the vacuum pump 600 extracting gas from the transmission cavity 100.

[0034] In this embodiment, the output end of the air supply bypass 500 can be multiple air holes facing the transmission cavity 100.

[0035] As can be seen from the above-mentioned degumming machine, since inert gas is introduced into the input end of the first section 410 in the main gas supply line 400, the output end of the first section 410 is connected to the input end of the flow limiting part 420, the output end of the flow limiting part 420 is connected to the input end of the second section 430, and the output end of the second section 430 introduces inert gas into the transmission chamber 100, on the one hand, by connecting the vacuum pump 600 to the transmission chamber 100 through the first exhaust valve 610, the inert gas in the transmission chamber 100 can be extracted so that the gas pressure in the transmission chamber 100 is maintained at a fixed vacuum level. On the other hand, the gas flow rate of the second section 430 is limited by the flow limiting part 420 and is less than the gas flow rate of the first section 410. That is to say, the gas flow rate of the inert gas introduced into the transmission chamber 100 through the main gas supply line 400 is less than the gas flow rate of the inert gas introduced into the first section 410. Based on this, since the input end of the gas supply bypass 500 is connected to the first section 410, and the output end of the gas supply bypass 500 is located between the loading vacuum chamber and the transmission cavity 100, and blows inert gas towards the transmission cavity 100 to form an air curtain between the loading interlock chamber 200 and the transmission cavity 100, the gas flow rate of the gas supply bypass 500 can be the same as the gas flow rate of the first section 410. That is, the gas flow rate of the inert gas introduced into the transmission cavity 100 through the main gas supply line 400 is less than the gas flow rate of the gas supply bypass 500. As a result, the air curtain has a positive pressure difference relative to the transmission cavity 100. This avoids the contamination of the loading interlock chamber 200 by the waste gas remaining on the wafer and improves the particle abnormality phenomenon in the loading interlock chamber 200.

[0036] As one specific embodiment, please refer to Figure 2 The main gas supply line 400 may also include a three-way valve 700, the three ends of which are respectively connected to the output end of the first section 410, the input end of the flow limiting part 420 and the input end of the gas supply bypass 500.

[0037] In this embodiment, the air flow rate of the first section 410 is equal to the air flow rate of the second section 430 by means of the three-way valve 700.

[0038] For specific implementation details, please refer to [link / reference]. Figure 3 The degumming machine may also include an air supply unit 800, which is connected to the input end of the first section 410 via a first air inlet valve 810, for supplying inert gas.

[0039] In this embodiment, the gas supply unit 800 can be an inert gas source.

[0040] For one specific implementation method, please refer to Figure 4 The loading interlock chamber 200 may include a first locking chamber 210 and a second locking chamber 220; the gas supply unit 800 is connected to the first locking chamber 210 through a second air inlet valve 820 and to the second locking chamber 220 through a third air inlet valve 830, so as to supply inert gas to the first locking chamber 210 and the second locking chamber 220.

[0041] In this embodiment, the gas supply unit 800 can supply nitrogen to the first locking chamber 210 and the second locking chamber 220 respectively when the second intake valve 820 is opened and the third intake valve 830 is opened, so that the first locking chamber 210 and the second locking chamber 220 can realize the conversion from vacuum state to atmospheric state.

[0042] For one specific implementation method, please refer to Figure 5 Vacuum pump 600 is connected to first lock chamber 210 through second exhaust valve 620, and vacuum pump 600 is connected to second lock chamber 220 through third exhaust valve 630, so as to extract inert gas from first lock chamber 210 and second lock chamber 220 respectively.

[0043] In this embodiment, during the operation of the glue removal machine, when the second exhaust valve 620 is opened, the vacuum pump 600 can extract the gas from the first locking chamber 210, and when the third exhaust valve 630 is opened, the vacuum pump 600 can extract the gas from the second locking chamber 220. Thus, the first locking chamber 210 and the second locking chamber 220 can achieve the conversion from an atmospheric environment to a vacuum environment under the combined action of the gas supply unit 800 and the vacuum pump 600.

[0044] For one specific implementation method, please refer to Figure 6 The degumming machine may also include: a wafer carrier stage 900, and a second opening and closing door 1000 between the wafer carrier stage 900 and the loading interlock chamber 200.

[0045] As an example, the number of wafer carriers in a desizing machine can be several.

[0046] Specifically, during the operation of the glue removal machine, the second switch door 1000 opens when the air pressure in the loading interlock chamber 200 is the same as the atmospheric pressure.

[0047] As one specific embodiment, refer to Figure 7 The glue removal machine may also include several glue removal process chambers 1100, which are located around the transmission cavity 100 and are connected to the transmission cavity 100.

[0048] Specifically, the desizing chamber 1100 is the chamber in the desizing machine that processes wafers.

[0049] Specifically, the desizing machine may also include a robotic arm (not shown), which is used to transfer the wafer between the loading interlock chamber 200 and the wafer carrier stage 900 when the second opening door 1000 is opened, and also to transfer the wafer between the transfer cavity 100 and the wafer carrier stage 900 when the first opening door 300 is opened.

[0050] In summary, in the adhesive removal machine of this utility model, since inert gas is introduced into the input end of the first section 410 in the main gas supply line 400, the output end of the first section 410 is connected to the input end of the flow limiting part 420, the output end of the flow limiting part 420 is connected to the input end of the second section 430, and the output end of the second section 430 introduces inert gas into the transmission chamber 100, on the one hand, by connecting the vacuum pump 600 to the transmission chamber 100 through the first exhaust valve 610, the inert gas in the transmission chamber 100 can be extracted so that the gas pressure in the transmission chamber 100 is maintained at a fixed vacuum level. On the other hand, the gas flow rate of the second section 430 is limited by the flow limiting part 420 and is less than the gas flow rate of the first section 410. That is to say, the gas flow rate of the inert gas introduced into the transmission chamber 100 through the main gas supply line 400 is less than the gas flow rate of the inert gas introduced into the first section 410. Based on this, since the input end of the gas supply bypass 500 is connected to the first section 410, and the output end of the gas supply bypass 500 is located between the loading vacuum chamber and the transmission cavity 100, and blows inert gas towards the transmission cavity 100 to form an air curtain between the loading interlock chamber 200 and the transmission cavity 100, the gas flow rate of the gas supply bypass 500 can be the same as the gas flow rate of the first section 410. That is, the gas flow rate of the inert gas introduced into the transmission cavity 100 through the main gas supply line 400 is less than the gas flow rate of the gas supply bypass 500. As a result, the air curtain structure has a positive pressure difference relative to the transmission cavity 100. This avoids the contamination of the loading interlock chamber 200 by the waste gas remaining on the wafer and improves the particle abnormality phenomenon in the loading interlock chamber 200.

[0051] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A debonding machine table, characterized by, include: Transmission cavity; A loading interlock chamber, wherein the loading interlock chamber and the transmission cavity have a first switch door that opens during wafer transfer; The main gas supply line includes a first section, a second section, and a flow restrictor. Inert gas is introduced into the input end of the first section, and the output end of the first section is connected to the input end of the flow restrictor. The output end of the flow restrictor is connected to the input end of the second section, and the output end of the second section introduces inert gas into the transmission cavity. The gas flow rate of the second section is less than that of the first section. A gas supply bypass is provided, wherein the input end of the gas supply bypass is connected to the first section, the output end of the gas supply bypass is located between the loading interlock chamber and the transmission cavity, and the output end of the gas supply bypass blows inert gas toward the transmission cavity to form an air curtain between the loading interlock chamber and the transmission cavity. The gas flow rate of the gas supply bypass is the same as the gas flow rate of the first section. A vacuum pump is connected to the transmission chamber via a first exhaust valve to extract inert gas from the transmission chamber.

2. The debonder table of claim 1, wherein, The main gas supply line also includes a three-way valve, the three ends of which are respectively connected to the output end of the first section, the input end of the flow limiting section, and the input end of the gas supply bypass.

3. The debonder table of claim 1, wherein, The output end of the gas supply bypass includes multiple air holes facing the transmission cavity.

4. The glue-removing machine as described in claim 1, characterized in that, The degumming machine also includes an air supply unit, which is connected to the input end of the first section via a first air inlet valve to provide inert gas.

5. The degumming machine as described in claim 4, characterized in that, The loading interlock chamber includes a first locking chamber and a second locking chamber; the gas supply unit is connected to the first locking chamber through a second inlet valve, and the gas supply unit is connected to the second locking chamber through a third inlet valve, so as to supply inert gas to the first locking chamber and the second locking chamber respectively.

6. The glue-removing machine as described in claim 5, characterized in that, The vacuum pump is connected to the first locked chamber via a second exhaust valve, and the vacuum pump is connected to the second locked chamber via a third exhaust valve, so as to extract the inert gas from the first locked chamber and the second locked chamber respectively.

7. The degumming machine as described in claim 1, characterized in that, The flow-limiting part is a flow-limiting orifice.

8. The degumming machine as described in claim 1, characterized in that, Also includes: A wafer carrier stage, wherein a second switch door is provided between the wafer carrier stage and the loading interlock chamber.

9. The degumming machine as described in claim 8, characterized in that, Also includes: Several adhesive removal process chambers are located around the transfer cavity and are in communication with the transfer cavity.

10. The degumming machine as described in claim 9, characterized in that, It also includes a robotic arm located within the transfer cavity, the robotic arm being used to transfer the wafer between the loading interlock chamber and the wafer carrier when the second switch door is opened, and / or to transfer the wafer between the transfer cavity and the wafer carrier when the first switch door is opened.

Images