Data Center Integrated Inspection Drones

Abstract

This utility model discloses a data center integrated inspection drone, including a drone body and a central control circuit, a multi-sensor integrated circuit module, an image acquisition and processing circuit, and a data communication circuit integrated within it. The central control circuit includes a main control chip and a power management unit. The multi-sensor integrated circuit module integrates a hydrogen detection sensor, a particulate matter detection module, a smoke sensor, a temperature and humidity acquisition module, and a CO / CO2 gas detection module. The image acquisition and processing circuit includes an infrared high-definition camera interface, an image processing chip, a visible light module, and an infrared thermal imaging module. The data communication circuit includes a communication interface chip and a 4G / 5G dual-mode circuit. This drone can flexibly cover concealed areas of the data center, achieving multi-parameter integrated inspection, eliminating blind spots, reducing the risk of false alarms and missed alarms, and providing reliable protection for the safe operation of the data center.

Description

Technical Field

[0001] This utility model relates to the field of inspection drone technology, specifically to a data center integrated inspection drone. Background Technology

[0002] In recent years, with the continuous expansion of data center construction, their operational safety has become increasingly important as a prerequisite for normal production. Fire, water leakage, and the intrusion of unidentified organisms are the three major hazards threatening the operational and physical safety of data centers. Currently, the safe operation of data centers mainly relies on human inspections and fixed systems such as early detection detectors, smoke and temperature detectors, and temperature and humidity monitoring. The main fire extinguishing devices are gas extinguishing systems, high-pressure fine water mist systems, or sprinkler systems.

[0003] However, in existing technologies, manual inspections are limited by the range of movement and operational capabilities of inspectors, making it difficult to cover concealed and densely piped areas such as above corridors and ceilings, resulting in blind spots. While fixed systems like early warning detectors and smoke / temperature sensors are structurally fixed in specific locations with limited detection ranges, they may leave blind spots in vast and complex data centers, especially in high-altitude or remote areas. Furthermore, over time, these fixed systems may experience false alarms or missed alarms due to structural aging or malfunctions. False alarms increase the workload of maintenance personnel, while missed alarms can escalate or spiral out of control, potentially causing accidental triggering of fire suppression systems. Dust from gaseous fire suppression systems is difficult to clean, and high-pressure water mist or spray systems can easily cause water damage to equipment, affecting normal data center operations and causing significant economic losses. Therefore, it is necessary to propose a data center integrated inspection drone to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a data center integrated inspection drone. This addresses the problem that existing data center security inspections rely on fixed-installation early detection devices, smoke detectors, temperature and humidity sensors, etc. These devices have limited detection ranges due to their fixed structures, and cannot cover hidden and densely piped areas such as above corridors and room ceilings. At the same time, manual inspections are also limited by activity range and operational capabilities, making it difficult to effectively inspect the above areas, resulting in blind spots in inspections.

[0005] This utility model provides a data center integrated inspection drone, including a drone body and a central control circuit, a multi-sensor integrated circuit module, an image acquisition and processing circuit and a data communication circuit integrated inside the drone body;

[0006] The central control circuit includes a main control chip and a power management unit electrically connected to it. The main control chip achieves bidirectional data transmission with the multi-sensor integrated circuit module, the image acquisition and processing circuit, and the data communication circuit through the address bus and the data bus, respectively.

[0007] The multi-sensor integrated circuit module includes a sensor interface circuit and a hydrogen detection sensor, a particulate matter detection module, a smoke sensor, and a temperature and humidity acquisition module connected in parallel to the sensor interface circuit. The output of the sensor interface circuit is connected to the data bus of the central control circuit through an analog-to-digital conversion circuit.

[0008] The image acquisition and processing circuit includes an infrared high-definition camera interface and an image processing chip. The infrared high-definition camera interface is connected to the input terminal of the image processing chip through a differential signal transmission line, and the output terminal of the image processing chip is electrically connected to the main control chip of the central control circuit through an SPI interface.

[0009] The data communication circuit includes a communication interface chip and an antenna matching circuit connected in series with it. The input terminal of the communication interface chip is connected to the address bus of the central control circuit through a UART interface, and the output terminal of the antenna matching circuit is soldered to the antenna on the top of the UAV body.

[0010] Furthermore, the multi-sensor integrated circuit module also includes a CO / CO2 gas detection module, which uses I... 2 The C interface is connected in parallel to the sensor interface circuit.

[0011] Furthermore, the image acquisition and processing circuit also includes a visible light module and an infrared thermal imaging module. The visible light module and the infrared thermal imaging module are connected to the infrared high-definition camera interface through a multiplexer switch. The control terminal of the multiplexer switch is electrically connected to the GPIO pin of the main control chip of the central control circuit.

[0012] Furthermore, the multi-sensor integrated circuit module also includes a data comparison circuit. The input of the data comparison circuit is connected to the output of the hydrogen detection sensor, the particulate matter detection module, the smoke sensor, and the temperature and humidity acquisition module, respectively. Its output is electrically connected to the interrupt pin of the central control circuit through a comparator circuit.

[0013] Furthermore, the central control circuit also includes a positioning circuit, which includes a GPS module and a clock synchronization circuit. The output of the GPS module is connected to the real-time clock pin of the main control chip through an RTC interface, and the input of the clock synchronization circuit is soldered to the 3.3V output of the power management unit.

[0014] Furthermore, a precision resistor network is connected in series between the sensor interface circuit and the hydrogen detection sensor, particulate matter detection module, smoke sensor, and temperature and humidity acquisition module. The resistance value of the precision resistor network is matched with the output impedance of the existing hydrogen detector, early detection sensor, smoke sensor, and temperature and humidity sensor in the data center.

[0015] Furthermore, the data communication circuit also includes a 4G / 5G dual-mode circuit. The 4G / 5G dual-mode circuit is connected in parallel with the communication interface chip through an RF switch, and the control terminal of the RF switch is electrically connected to the control pin of the main control chip of the central control circuit.

[0016] Furthermore, a signal amplification circuit is connected in series between the multiplexer switch and the visible light module and the infrared thermal imaging module. The gain resistor of the signal amplification circuit is connected to the gain control pin of the image processing chip through a feedback circuit.

[0017] Furthermore, the power management unit includes a multi-channel DC-DC converter, the output terminals of which are soldered one-to-one with the 3.3V power supply terminal of the multi-sensor integrated circuit module, the 5V power supply terminal of the image acquisition and processing circuit, and the 2.8V power supply terminal of the data communication circuit.

[0018] Furthermore, the data comparison circuit also includes an EEPROM memory chip, which uses I... 2 The C bus is connected to the reference voltage input of the comparator circuit.

[0019] This utility model offers the following advantages: The data center integrated inspection drone provided by this utility model integrates a central control circuit, a multi-sensor integrated circuit module, an image acquisition and processing circuit, and a data communication circuit into the drone's main body. Utilizing the drone's flexible mobility, it overcomes the limitations of fixed detection equipment installation locations and the activity range constraints of manual inspections, effectively covering concealed and densely piped areas such as above corridors and room ceilings, eliminating blind spots. The multi-sensor integrated circuit module integrates a hydrogen detection sensor, a particulate matter detection module, a smoke sensor, a temperature and humidity acquisition module, and a CO / CO2 gas detection module. It can collect various environmental parameters in real time and compare them with preset thresholds through a data comparison circuit. Combined with a comparator circuit to trigger an interrupt, it achieves rapid response to abnormal situations. The image acquisition and processing circuit combines a visible light module and an infrared thermal imaging module. Through multi-channel selection switching and signal amplification circuit, it improves image quality, acquiring high-definition visible light images and detecting temperature anomalies through infrared thermal imaging. The data communication circuit adopts 4G / 5G dual-mode communication to ensure the stability and real-time performance of data transmission. Simultaneously, the position positioning circuit achieves precise positioning and clock synchronization, facilitating the spatiotemporal correlation of inspection data. The power management unit provides matching voltages to each module through multiple DC-DC converters, and the precision resistor network of the sensor interface circuit matches the impedance of existing sensors in the data center, improving system compatibility. The overall design enables comprehensive, mobile, and multi-parameter integrated inspection of the complex environment of the data center, reducing blind spots in fixed systems and the limitations of manual inspection, lowering the risk of false alarms and missed alarms, and providing more reliable protection for the safe operation of the data center. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the data center integrated inspection drone of this utility model.

[0022] Diagram Explanation: 1-UAV main body; 2-Central control circuit; 3-Multi-sensor integrated circuit module; 4-Image acquisition and processing circuit; 5-Data communication circuit; 6-Positioning circuit; 21-Main control chip; 22-Power management unit; 23-Address bus; 24-Data bus; 211-GPIO pin; 212-Interrupt pin; 213-Real-time clock pin; 214-Control pin; 31-Sensor interface circuit; 32-Hydrogen detection sensor; 33-Particulate matter detection module; 34-Smoke sensor; 35-Temperature and humidity acquisition module; 36-Analog-to-digital conversion circuit; 37-C O / CO2 gas detection module; 38-Data comparison circuit; 381-Comparator circuit; 382-EEPROM memory chip; 41-Infrared high-definition camera interface; 42-Image processing chip; 43-Differential signal transmission line; 44-SPI interface; 45-Visible light module; 46-Infrared thermal imaging module; 47-Multiple-channel selector switch; 51-Communication interface chip; 52-Antenna matching circuit; 53-UART interface; 54-Antenna; 55-4G / 5G dual-mode circuit; 56-RF switch; 61-GPS module; 62-Clock synchronization circuit; 63-RTC interface. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be pointed out that the following detailed description is illustrative and intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] Please see Figure 1 This utility model embodiment provides a data center integrated inspection drone, including a drone body 1 and a central control circuit 2, a multi-sensor integrated circuit module 3, an image acquisition and processing circuit 4, and a data communication circuit 5 integrated inside the drone body 1. The drone body 1 can be a quadcopter or a hexcopter structure, such as the DJI Matrice 350RTK airframe platform, which has long endurance, high load capacity and a stable flight control system, can carry various circuit modules and adapt to the flight requirements of the complex environment of the data center.

[0025] The central control circuit 2 includes a main control chip 21 and a power management unit 22 electrically connected to it. The main control chip 21 achieves bidirectional data transmission with the multi-sensor integrated circuit module 3, the image acquisition and processing circuit 4, and the data communication circuit 5 through the address bus 23 and the data bus 24, respectively. The main control chip 21 can be an STM32H743VIT6 model, based on the ARM Cortex-M7 core, which can meet the real-time and integration requirements of multi-module collaborative operation. The address bus 23 and the data bus 24 can adopt a 16-bit address bus and a 32-bit data bus design to ensure high efficiency in data transmission. The power management unit 22 includes a multi-channel DC-DC converter, such as the Texas Instruments TPS5430 DC-DC converter. The output terminals of the multi-channel DC-DC converter are respectively soldered to the 3.3V power supply terminal of the multi-sensor integrated circuit module 3, the 5V power supply terminal of the image acquisition and processing circuit 4, and the 2.8V power supply terminal of the data communication circuit 5, providing stable and matched operating voltages for different modules and ensuring reliable circuit operation.

[0026] The multi-sensor integrated circuit module 3 includes a sensor interface circuit 31 and a hydrogen detection sensor 32, a particulate matter detection module 33, a smoke sensor 34, and a temperature and humidity acquisition module 35 connected in parallel to the sensor interface circuit 31. The hydrogen detection sensor 32 can be the Alphasense H2-AF model, with a detection range of 0-1000ppm and a resolution of 0.1ppm, capable of accurately detecting hydrogen leaks; the particulate matter detection module 33 is the Sharp GP2Y1010AU0F model, capable of detecting particulate matter concentrations of 0.3-10μm; the smoke sensor 34 is an SGX model. Sensortech's MQ-2 model is highly sensitive to smoke and liquefied gas; the temperature and humidity acquisition module 35 uses Sensilink's SHT31 model, with a temperature measurement accuracy of ±0.3℃ and a humidity measurement accuracy of ±2%RH; the output of the sensor interface circuit 31 is connected to the data bus 24 of the central control circuit 2 through the analog-to-digital converter circuit 36, which can use an AD7606 16-bit ADC chip to achieve multi-channel synchronous sampling with a conversion rate of 200kSPS; a precision resistor network is connected in series between the sensor interface circuit 31 and each sensor, for example, using 0402 packaged 1% accuracy resistors, whose resistance values ​​match the output impedance of the original sensors in the data center, improving system compatibility; the multi-sensor integrated circuit module 3 also includes a CO / CO2 gas detection module 37, for example, the carbon dioxide detection can use the Senseair S8-0053 model module, which uses non-dispersive infrared (NDI) technology. Infrared (NDIR) technology, with a measurement range covering 0-10000ppm, supports UART / Modbus protocol. When connected to sensor interface circuit 31, it needs to be connected via UART-to-I... 2 C-to-C converter chips, such as the Texas Instruments TIPCA9600, convert their UART signals to I-to-C signals. 2 In C format, the UART_TX / RX pins of the converter chip are connected to the UART interface of the S8-0053. 2 The C_SDA / SCL pins are connected in parallel to the I pins of interface circuit 31. 2 C bus, and configure independent I / O via hardware address pins. 2 Device address (C); For carbon monoxide detection, the Alphasense CO-AF module can be used. This module operates on an electrochemical principle, has a detection range of 0-1000ppm, and outputs an analog signal. It requires an I / O connection for proper connection. 2 For ADC chips with a C-interface, such as the Texas Instruments ADS1115, which performs analog-to-digital conversion, the analog output pin of the CO-AF is connected to the analog input channel of the ADS1115. The ADS1115's I / O pin... 2 Pin C is also connected in parallel to I in interface circuit 31.2 The C bus, configured with independent device addresses, allows the main control chip of sensor interface circuit 31 to access via I... 2 The C-bus reads the conversion data from the two modules in a time-sharing manner to achieve parallel detection of CO2 and CO concentrations. It is important to ensure that the two modules are powered independently and to avoid I / O. 2 C address conflict. The multi-sensor integrated circuit module 3 also includes a data comparison circuit 38, which can be built using an LM324 operational amplifier. Its inputs are connected to the outputs of each sensor, and its outputs are electrically connected to the interrupt pin 212 of the central control circuit 2 via a comparator circuit 381. The comparator circuit 381 is an LM393 model, which triggers an interrupt when abnormal data is detected. The data comparison circuit 38 also includes an electrically erasable programmable read-only memory (EEPROM) chip 382, ​​such as an AT24C02 model, which is connected via I... 2 The C bus is connected to comparator circuit 381 and is used to store preset thresholds.

[0027] The image acquisition and processing circuit 4 includes an infrared high-definition camera interface 41 and an image processing chip 42. The infrared high-definition camera interface 41 can adopt the MIPI-CSI2 interface standard and is connected to the input terminal of the image processing chip 42 through a differential signal transmission line 43. The differential signal transmission line 43 uses shielded twisted-pair cable to reduce signal interference. The image processing chip 42 uses an NVIDIA Jetson Nano module with a 128-core Maxwell GPU, which can perform image noise reduction, edge detection, and other processing. The output terminal of the image processing chip 42 is electrically connected to the master control chip 21 of the central control circuit 2 through an SPI interface 44. The SPI interface 44 uses a serial clock (SCLK), master output slave input (MOSI), master input slave output (MISO), and chip select line. The image acquisition and processing circuit 4 uses a four-wire (Select, CS) system with a transmission rate of up to 50Mbps. It also includes a visible light module 45 and an infrared thermal imaging module 46. The visible light module 45 uses a Sony IMX385 camera with a resolution of 2 megapixels. The infrared thermal imaging module 46 uses a FLIR Lepton 3.5 with a resolution of 640×512 and a thermal sensitivity of 50mK. Both modules are connected to the infrared high-definition camera interface 41 via a multiplexer switch 47. The multiplexer switch 47 can be a Texas Instruments SN74LVC1G3157, and its control terminal is electrically connected to the GPIO pin 211 of the main control chip 21 of the central control circuit 2 to achieve module switching. A signal amplification circuit, such as an AD8055 operational amplifier, is connected in series between the multiplexer switch 47 and each image module. The gain resistor of the signal amplification circuit is connected to the gain control pin of the image processing chip 42 via a feedback circuit, allowing automatic gain adjustment based on image brightness.

[0028] The data communication circuit 5 includes a communication interface chip 51 and an antenna matching circuit 52 connected in series with it. The communication interface chip 51 can be a SIM800C GSM module, supporting GPRS data transmission. The antenna matching circuit 52 consists of an inductor and a capacitor forming a π-type matching network to ensure impedance matching between the antenna 54 and the communication interface chip 51, typically 50Ω. The input terminal of the communication interface chip 51 is connected to the address bus 23 of the central control circuit 2 via a UART interface 53. The UART interface 53 uses standard asynchronous serial communication with a baud rate set to 115200bps. The output terminal of the antenna matching circuit 52 is soldered to the antenna 54 on the top of the UAV body 1. The antenna 54 is a 2.4GHz / 5.8GHz dual-band omnidirectional antenna with a gain of 5dBi. The data communication circuit 5 also includes a 4G / 5G dual-mode circuit 55, such as the Quectel RM500Q module, which supports 5G NSA / SA and 4G. The LTE network is connected in parallel with the communication interface chip 51 via the RF switch 56. The RF switch 56 is the SKY13357 model from Skyworks. Its control terminal is electrically connected to the control pin 214 of the main control chip 21 of the central control circuit 2 to realize the switching of communication modes.

[0029] The central control circuit 2 also includes a position positioning circuit 6, which includes a GPS module 61 and a clock synchronization circuit 62. The GPS module 61 can be the NEO-M8N model from UBlox, which supports GPS, GLONASS, and BeiDou multi-system positioning with a positioning accuracy of 1m. Its output is connected to the real-time clock pin 213 of the main control chip 21 through the RTC interface 63 to achieve synchronization of position and time information. The clock synchronization circuit 62 uses the DS3231 real-time clock chip, and its input is soldered to the 3.3V output of the power management unit 22 to provide a high-precision clock signal.

[0030] The operation of the drone is as follows: The main body 1 of the drone flies autonomously within the data center according to a preset route. During the flight, the sensors in the multi-sensor integrated circuit module 3 collect environmental parameters in real time. The hydrogen detection sensor 32 detects the hydrogen concentration in the air, the particulate matter detection module 33 monitors the content of particulate matter such as PM2.5, the smoke sensor 34 senses smoke particles, the temperature and humidity acquisition module 35 records the ambient temperature and humidity, and the CO / CO2 gas detection module 37 simultaneously monitors the concentration of the two gases. The sensor interface circuit 31 summarizes these analog signals and converts them into digital signals through the analog-to-digital converter circuit 36, which then transmits them to the main control chip 21 via the data bus 24. At the same time, the data comparison circuit 38 compares the real-time data with the threshold stored in the EEPROM storage chip 382. If a parameter exceeds the threshold, the comparator circuit 381 immediately sends an interrupt signal to the interrupt pin 212 of the main control chip 21. After responding to the interrupt, the main control chip 21 controls the multiplexer switch 47 to switch to the visible light module 45 via the GPIO pin 211. Alternatively, an infrared thermal imaging module 46 can be used to acquire images of abnormal areas. After the image signal is amplified by a signal amplification circuit, it is transmitted to the image processing chip 42 via the infrared high-definition camera interface 41 and differential signal transmission line 43 for noise reduction, contrast enhancement, and other processing. The processed image data is returned to the main control chip 21 via the SPI interface 44. The main control chip 21 combines the latitude and longitude information provided by the GPS module 61 in the position positioning circuit 6 and the time data from the clock synchronization circuit 62 to fuse the sensor data, image data, and spatiotemporal information. The fused data is transmitted to the data communication circuit 5 via the address bus 23 and UART interface 53. According to the current network conditions, the main control chip 21 controls the RF switch 56 through the control pin 214 to select either the GPRS mode provided by the communication interface chip 51 or the 4G / 5G dual-mode circuit 55 to provide the 4G / 5G mode. The data is then sent to the ground monitoring platform in real time via the antenna matching circuit 52 and the antenna 54. The power management unit 22 provides stable power to each module throughout the process to ensure uninterrupted operation.

[0031] This invention integrates multiple sensors and image acquisition modules into a drone, leveraging the drone's flexible mobility to effectively cover traditional blind spots in data center corridors and ceilings. The collaborative operation of multiple sensor types enables comprehensive monitoring of environmental parameters such as hydrogen, CO / CO2, smoke, particulate matter, temperature, and humidity. Combined with real-time anomaly detection via data comparison circuitry, it improves the timeliness of fault warnings. Dual-mode image acquisition using visible light and infrared thermal imaging, coupled with a high-performance image processing chip, provides a clear visual representation of equipment appearance and temperature anomalies, offering reliable evidence for fault location. 4G / 5G dual-mode communication ensures stable and real-time data transmission, while GPS positioning and clock synchronization enable precise spatiotemporal marking of inspection data. The overall design reduces reliance on manual inspections and mitigates the coverage limitations of fixed detection equipment, providing a comprehensive and efficient inspection solution for the safe operation of data centers.

[0032] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A data center comprehensive inspection unmanned aerial vehicle, characterized in that, include: The main body of the UAV (1) and the central control circuit (2), multi-sensor integrated circuit module (3), image acquisition and processing circuit (4) and data communication circuit (5) integrated inside the main body of the UAV (1); The central control circuit (2) includes a main control chip (21) and a power management unit (22) electrically connected thereto. The main control chip (21) transmits data bidirectionally to the multi-sensor integrated circuit module (3), the image acquisition and processing circuit (4), and the data communication circuit (5) through the address bus (23) and the data bus (24), respectively. The multi-sensor integrated circuit module (3) includes a sensor interface circuit (31) and a hydrogen detection sensor (32), a particulate matter detection module (33), a smoke sensor (34) and a temperature and humidity acquisition module (35) connected in parallel to the sensor interface circuit (31). The output terminal of the sensor interface circuit (31) is connected to the data bus (24) of the central control circuit (2) through an analog-to-digital converter circuit (36). The image acquisition and processing circuit (4) includes an infrared high-definition camera interface (41) and an image processing chip (42). The infrared high-definition camera interface (41) is connected to the input terminal of the image processing chip (42) through a differential signal transmission line (43). The output terminal of the image processing chip (42) is electrically connected to the main control chip (21) of the central control circuit (2) through an SPI interface (44). The data communication circuit (5) includes a communication interface chip (51) and an antenna matching circuit (52) connected in series therewith. The input end of the communication interface chip (51) is connected to the address bus (23) of the central control circuit (2) through the UART interface (53). The output end of the antenna matching circuit (52) is welded to the antenna (54) on the top of the UAV body (1).

2. The data center comprehensive inspection unmanned aerial vehicle of claim 1, wherein, The multi-sensor integrated circuit module (3) further includes a CO / CO2 gas detection module (37), which is connected in parallel to the sensor interface circuit (31).

3. The data center integrated inspection drone of claim 1, wherein, The image acquisition and processing circuit (4) further includes a visible light module (45) and an infrared thermal imaging module (46). The visible light module (45) and the infrared thermal imaging module (46) are connected to the infrared high-definition camera interface (41) through a multiplexer (47). The control terminal of the multiplexer (47) is electrically connected to the GPIO pin (211) of the main control chip (21) of the central control circuit (2).

4. The data center integrated inspection drone of claim 1, wherein, The multi-sensor integrated circuit module (3) also includes a data comparison circuit (38). The input terminal of the data comparison circuit (38) is connected to the output terminals of the hydrogen detection sensor (32), the particulate matter detection module (33), the smoke sensor (34), and the temperature and humidity acquisition module (35), respectively. Its output terminal is electrically connected to the interrupt pin (212) of the central control circuit (2) through the comparator circuit (381).

5. The data center integrated inspection drone of claim 1, wherein, The central control circuit (2) further includes a positioning circuit (6), which includes a GPS module (61) and a clock synchronization circuit (62). The output of the GPS module (61) is connected to the real-time clock pin (213) of the main control chip (21) through the RTC interface (63), and the input of the clock synchronization circuit (62) is soldered to the 3.3V output of the power management unit (22).

6. The data center integrated inspection drone of claim 1, wherein, The sensor interface circuit (31) is connected in series with the hydrogen detection sensor (32), particulate matter detection module (33), smoke sensor (34), and temperature and humidity acquisition module (35) via a precision resistor network. The resistance value of the precision resistor network is matched with the output impedance of the original hydrogen detector, early detection sensor, smoke sensor, and temperature and humidity sensor in the data center.

7. The data center integrated inspection drone of claim 1, wherein, The data communication circuit (5) further includes a 4G / 5G dual-mode circuit (55), which is connected in parallel with the communication interface chip (51) through a radio frequency switch (56). The control terminal of the radio frequency switch (56) is electrically connected to the control pin (214) of the main control chip (21) of the central control circuit (2).

8. The data center integrated inspection drone of claim 3, wherein, The multiplexer (47) is connected in series with the visible light module (45) and the infrared thermal imaging module (46) via a signal amplification circuit. The gain resistor of the signal amplification circuit is connected to the gain control pin of the image processing chip (42) via a feedback circuit.

9. The data center integrated inspection drone of claim 1, wherein, The power management unit (22) includes a multi-channel DC-DC converter, the output terminals of which are respectively soldered to the 3.3V power supply terminal of the multi-sensor integrated circuit module (3), the 5V power supply terminal of the image acquisition and processing circuit (4), and the 2.8V power supply terminal of the data communication circuit (5).

10. The data center integrated inspection drone of claim 4, wherein, The data comparison circuit (38) further includes an EEPROM memory chip (382), which connects to the EEPROM memory chip (382) via I... 2 The C bus is connected to the reference voltage input of the comparator circuit (381).

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