Electronic device

Abstract

This application provides an electronic device, belonging to the field of electronic product technology. It addresses the problem of poor heat dissipation performance in electronic devices due to high thermal resistance. The electronic device includes a housing, a heat-conducting component, a motherboard, a heat-generating element, and a first substrate. The heat-conducting component is disposed within the housing and includes a first heat-conducting section and a second heat-conducting section distributed along its length. The motherboard is disposed within the housing and is stacked with the heat-conducting component. The heat-generating element is disposed between the motherboard and the first heat-conducting section, fixed to the motherboard, and in contact with the first heat-conducting section. Two first substrates are provided, along the width direction of the heat-conducting component, with both first substrates disposed on opposite sides of the first heat-conducting section. Both first substrates are fixedly connected to the first heat-conducting section and to the motherboard.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] As users' performance demands for electronic devices (such as laptops) continue to increase, the need for better heat dissipation also rises. However, existing heat dissipation components in electronic devices suffer from high thermal resistance, resulting in poor heat dissipation and negatively impacting the user experience. Utility Model Content

[0003] This application provides an electronic device to solve the problem that the heat dissipation components inside existing electronic devices have high thermal resistance, resulting in poor heat dissipation and affecting the user experience.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] This application provides an electronic device, which includes a housing, a heat-conducting component, a motherboard, a heating element, and a first substrate. The heat-conducting component is disposed within the housing and includes a first heat-conducting segment and a second heat-conducting segment distributed along its length. The motherboard is disposed within the housing and is stacked with the heat-conducting component. The heating element is disposed between the motherboard and the first heat-conducting segment, and is fixed on the motherboard and in contact with the first heat-conducting segment. The first substrate has two first substrates, which are disposed on both sides of the first heat-conducting segment along the width direction of the heat-conducting component. Both first substrates are fixedly connected to the first heat-conducting segment and to the motherboard.

[0006] In the electronic device provided in this application, two first substrates are respectively disposed on both sides of a heat-conducting component along its width, such that the two first substrates are located on both sides of a first heat-conducting segment and are fixedly connected to the first heat-conducting segment. The two first substrates are also fixedly connected to a motherboard, so that the first heat-conducting segment is fixed relative to the motherboard. Since the heat-generating element is disposed between the motherboard and the first heat-conducting segment, the two first substrates allow the heat-generating element to abut against the motherboard and the first heat-conducting segment, and the heat-generating element to contact the first heat-conducting segment. This allows the heat generated by the heat-generating element to be directly transferred to the first heat-conducting segment, thereby improving the heat exchange efficiency between the heat-generating element and the first heat-conducting segment. This helps to reduce the thermal resistance during heat dissipation, improves the heat dissipation effect of the heat-generating element, and further improves the heat dissipation performance of the electronic device, thus enhancing the user experience.

[0007] In one possible implementation of this application, the first substrate includes a first main body and a folded edge. The folded edge is fixed to the edge of the first main body near the first heat-conducting segment. The first heat-conducting segment has two first sidewalls distributed along its width. The folded edge is fitted and fixedly connected to the first sidewalls. This allows the folded edge and the first sidewalls of the first heat-conducting segment to form a surface-to-surface contact and fixed connection, increasing the contact area between them and thus improving the connection strength and reliability of the fixed connection between the first substrate and the heat-conducting element. Furthermore, since the connection point between the first substrate and the first heat-conducting segment is on the side of the first heat-conducting segment, the first substrate does not need to be disposed between the first heat-conducting segment and the heating element, allowing the heating element to directly contact the first heat-conducting segment.

[0008] In one possible implementation of this application, the first substrate further includes a rolled edge portion, which is fixed to the edge of the folded edge portion away from the first main body portion and extends in a direction away from the first sidewall. The distance between the rolled edge portion and the main board is greater than the distance between the first heat-conducting section and the main board. In this way, for the heat source surface of the first heat-conducting section used to contact the heat-generating element, the feature that the distance between the bottom surface of the rolled edge portion and the main board is greater than the distance between the heat source surface and the main board allows the bottom surface of the rolled edge portion to form a branch path on the material flow path when materials such as solder used to achieve the connection overflow and flow along the first sidewall (i.e., flow towards the main board). That is, when the material flows to the bottom surface of the rolled edge portion, some solder will flow along the bottom surface of the rolled edge portion in a direction away from the first heat-conducting section, thereby reducing the material flowing towards the heat source surface and reducing the risk of material adhering to the heat source surface, leading to an increase in thermal resistance.

[0009] In one possible implementation of this application, the surface of the first heat-conducting section that contacts the heating element is the heat source surface, and the distance between the rolled edge and the plane containing the heat source surface is not less than 0.1 mm. This ensures a certain distance between the bottom surface of the rolled edge and the plane containing the heat source surface, i.e., a certain adhesion area on the first sidewall, allowing material that has not flowed to the rolled edge to adhere to the first sidewall, thereby further reducing the risk of material flowing to the heat source surface.

[0010] In one possible implementation of this application, the first substrate further includes a rolled edge portion, which is fixed to the edge of the folded edge portion away from the first main body portion and extends in a direction away from the first sidewall. The surface of the rolled edge portion facing the first sidewall is spaced apart from the first sidewall, so that there is a gap space between the rolled edge portion and the first sidewall, allowing some material to continue to flow along the first sidewall, that is, some material can adhere to the first sidewall, so that the bottom surface of the rolled edge portion can be flush with the plane where the heat source surface is located, or the bottom surface of the rolled edge portion can be closer to the main board than the heat source surface, providing more options for the position and structural design of the rolled edge portion.

[0011] In one possible implementation of this application, the surface of the rolled edge facing the first sidewall is an arc surface. This results in a larger surface area for the arc surface, allowing for the adhesion of more material and further reducing the risk of material flowing to the heat source surface.

[0012] In one possible implementation of this application, the width of the surface of the first heat-conducting segment furthest from the motherboard is smaller than the width of the surface of the first heat-conducting segment closest to the motherboard. This allows the cross-section of the first heat-conducting segment to form an approximately trapezoidal structure, with at least one first sidewall extending at an angle relative to the plane containing the heat source surface. For example, one first sidewall can be formed as a slope, forming an angle with the plane containing the heat source surface, i.e., they are not perpendicular. Correspondingly, since the folded edge portion fits into the first sidewall, the surface of the folded edge portion connected to the first sidewall is also a slope. After the first substrate is fixed to the motherboard, the action of the two slopes allows the first substrate to apply a force towards the motherboard to the first heat-conducting segment, thereby pressing the first heat-conducting segment firmly onto the heating element.

[0013] In one possible implementation of this application, the distance between the surface of the first substrate away from the motherboard and the motherboard is no greater than the distance between the surface of the first heat-conducting section away from the motherboard and the motherboard. In this way, with the motherboard of the electronic device as a reference, in the direction corresponding to the thickness of the electronic device, the distance between the surface of the first substrate away from the motherboard and the motherboard is no greater than the distance between the surface of the first heat-conducting section away from the motherboard and the motherboard, thus eliminating the possibility of further increasing the thickness of the electronic device with the first substrate.

[0014] In one possible implementation of this application, at least one first substrate includes a fixing portion, which is fixed to the edge of the first main body near the first heat-conducting section, and abuts against the surface of the heat-conducting element away from the motherboard. In this way, the fixing portion can apply a force to the heat-conducting element from the side away from the motherboard, and the direction of this force is directly towards the motherboard, thereby increasing the force exerted by the first heat-conducting section on the heat-generating element, and further improving the structural reliability of the heat-generating element abutting between the first heat-conducting section and the motherboard.

[0015] In one possible implementation of this application, the first substrate includes multiple fixing portions that are spaced apart. This allows the multiple fixing portions to apply force to the heat-conducting component at different positions, resulting in a more uniform stress distribution on the heat-conducting component and further improving the overall structural reliability.

[0016] In one possible implementation of this application, both first substrates include a fixing portion. This allows the fixing portion on both first substrates to apply a pressing force to the heat-conducting component from both sides in the width direction, ensuring uniform force distribution on both sides of the heat-conducting component in the width direction.

[0017] In one possible implementation of this application, along a direction perpendicular to the motherboard, the distance between the surface of the first heat-conducting section away from the motherboard and the motherboard is greater than the distance between the surface of the second heat-conducting section away from the motherboard and the motherboard, and the fixing part abuts against the surface of the second heat-conducting section away from the motherboard. In this way, the fixing part abuts against the thinner second heat-conducting section, avoiding the thicker first heat-conducting section, which helps to reduce the risk of the fixing part increasing the thickness of the electronic device.

[0018] In one possible implementation of this application, the electronic device further includes a second substrate. The second substrate includes a second main body and a connecting portion. A portion of the second main body is located on the side of one of the first substrates away from the heat-conducting element. The connecting portion is fixed to the edge of the second main body near the heat-conducting element, and a portion of the connecting portion is located between the heat-conducting element and the motherboard, and is in close contact with the heat-conducting element. In this way, the second substrate, independent of the first substrate, can use a lower density and lighter weight material while meeting the heat dissipation requirements of other components, thus enhancing the lightweight design of the electronic device.

[0019] In one possible implementation of this application, the heating element includes a heating body and a base. The heating body is disposed on the surface of the base facing the heat-conducting element. A portion of the connecting part is located between the base and the heat-conducting element, and is spaced apart from the base. In this way, the portion of the connecting part located between the base and the heat-conducting element only contacts the heat-conducting element and not the base, avoiding the impact of factors such as the flatness of this portion of the connecting part and thermal expansion on the tightness of the contact between the first heat-conducting section and the heating body.

[0020] In one possible implementation of this application, the connecting portion includes a first part and a second part. The first part is stacked with the first substrate, and the second part is located between the base and the heat-conducting component. In this way, the connecting portion can both connect to the first substrate to provide an assembly function and provide a heat transfer path with the heat-conducting component.

[0021] In one possible implementation of this application, the base surface facing the heat-conducting element includes a first region and a second region. The heating body is disposed in the first region, and the projection of the second part on the base surface facing the heat-conducting element is located within the second region, with the projected area accounting for more than 80% of the area of ​​the second region. In this way, based on the structural features of the heating element base, the area of ​​the second part of the connection can be maximized, improving the heat transfer effect between it and the heat-conducting element.

[0022] In one possible implementation of this application, the total connection area of ​​the two first substrates and the heat-conducting component is not less than 40 mm². 2 This way, the requirements for the pull-out force of the fixed connection can be met.

[0023] In one possible implementation of this application, the surface of the first heat-conducting section that contacts the heating element is a heat source surface, and the flatness value of the heat source surface is no greater than 0.05 mm. In this way, by ensuring the flatness range, the contact effect between the heat-conducting component and the heating element can be guaranteed, and the thermal resistance of heat transfer can be reduced.

[0024] In one possible implementation of this application, the heat-conducting element is a heat pipe with an outer diameter of not less than 8 mm and a wall thickness of not less than 0.2 mm. This allows the heat pipe of this specification to remain undeformed when subjected to a predetermined surface pressure, thereby enabling the heating element to be pressed firmly under the predetermined surface pressure.

[0025] In one possible implementation of this application, the heat-conducting component is a heat pipe, and the wall thickness of the first heat-conducting section is greater than that of the second heat-conducting section. In this way, the thicker wall of the first heat-conducting section can meet the requirements of surface flatness processing; while the thinner thickness of the second heat-conducting section can reduce the overall weight of the heat-conducting component and ensure the lightweight design of the electronic device.

[0026] In one possible implementation of this application, the heat-generating element includes a first element and a second element. The distance between the surface of the first element away from the motherboard and the motherboard is greater than the distance between the surface of the second element away from the motherboard and the motherboard. The first element is in contact with a first heat-conducting segment, and an intermediate component is disposed between the second element and the first heat-conducting segment. The intermediate component is fixedly connected to the motherboard, and the second element, the intermediate component, and the first heat-conducting segment are in sequential contact. In this way, for two elements with inherent thickness differences, the intermediate component compensates for the thickness difference between them, reducing or even eliminating the step difference in the heat-conducting components, while simultaneously meeting the heat dissipation requirements of both elements. Attached Figure Description

[0027] Figure 1 A structural diagram of the electronic device provided in the embodiments of this application;

[0028] Figure 2 for Figure 1 The diagram shows the structure of the keyboard unit in the electronic device shown.

[0029] Figure 3 for Figure 2 Cross-sectional view of section AA;

[0030] Figure 4 This is a structural diagram illustrating one assembly method of electronic components on a motherboard provided in an embodiment of this application.

[0031] Figure 5 An exploded view of a partial structure of the heat dissipation module of an electronic device provided in an embodiment of this application;

[0032] Figure 6This is a structural diagram illustrating one assembly method of the heating element and the heat-conducting component provided in an embodiment of this application.

[0033] Figure 7 for Figure 6 A partial structural diagram of section BB in the middle;

[0034] Figure 8 This is an exploded view of the assembly structure of the heat-conducting component and the heating element provided in the embodiments of this application;

[0035] Figure 9 for Figure 8 Top view of the structure in its assembled state;

[0036] Figure 10 for Figure 9 The diagram shown is a structural diagram after the structure is cut along the CC section.

[0037] Figure 11 for Figure 10 A magnified view of a portion of point a;

[0038] Figure 12 for Figure 11 A structural diagram of one type of rolled edge structure shown;

[0039] Figure 13 for Figure 11 A structural diagram of another structure of the rolled edge shown;

[0040] Figure 14 for Figure 13 The diagram shows the structure after the rolled edge has been repositioned.

[0041] Figure 15 In order to be in Figure 9 The structural diagram shown is obtained by cutting the first substrate of the structure along the DD section after the fixing part is provided on the structure shown.

[0042] Figure 16 Another structural diagram of the two first substrates provided in the embodiments of this application;

[0043] Figure 17 Another structural diagram of the two first substrates provided in the embodiments of this application;

[0044] Figure 18 Another structural diagram of the two first substrates provided in the embodiments of this application;

[0045] Figure 19 for Figure 18 A partial structural diagram of section JJ in the middle;

[0046] Figure 20 Another electronic device provided in the embodiments of this application is Figure 10 Cross-sectional view at the section shown;

[0047] Figure 21 Another electronic device provided in the embodiments of this application is Figure 10 Cross-sectional view at the section shown;

[0048] Figure 22 This is a structural diagram showing the assembly of two first substrates with corresponding connecting plates according to embodiments of this application;

[0049] Figure 23 for Figure 22 The diagram shown illustrates the structure in which the two first substrates are fixed to the motherboard via a connecting plate.

[0050] Figure 24 Figure 1 shows the flatness measurement results at different points on the heat source surface of the thermally conductive component sample provided in the embodiments of this application.

[0051] Figure 25 An assembly structure diagram of the intermediate substrate and the heat-conducting component provided in the embodiments of this application;

[0052] Figure 26 for Figure 25 A partial structural diagram of the EE section;

[0053] Figure 27 An exploded view of the assembly structure of the second substrate and the heating element of the electronic device provided in the embodiments of this application;

[0054] Figure 28 for Figure 27 Top view of the structure in its assembled state;

[0055] Figure 29 for Figure 28 The diagram shown is a structural diagram after the structure has been cut along the GG section.

[0056] Figure 30 for Figure 29 A magnified view of a section at point b in the middle;

[0057] Figure 31 A structural diagram of the second substrate provided in an embodiment of this application;

[0058] Figure 32 A structural diagram of one type of heating element provided in an embodiment of this application;

[0059] Figure 33 This is a schematic diagram illustrating the relationship between the heating element and the second substrate provided in an embodiment of this application.

[0060] Figure 34 This is an overall assembly structure diagram of the heat dissipation module, motherboard, and corresponding substrate in an electronic device provided in the embodiments of this application.

[0061] Figure label:

[0062] 100 - Electronic devices;

[0063] 1-Monitor, 11-Top cover, 12-Display screen;

[0064] 2-Keyboard host, 21-House, 21a-Inner cavity, 21b-Ventilation port, 211-Upper shell, 212-Lower shell, 22-Keyboard, 24-Main board, 241-Positioning support, 242-Positioning hole, 25-Electronic component, 26-Assembly board, 27-Intermediate board;

[0065] 3-Heat dissipation module, 31-Heat conduction component, 311-First heat conduction section, 311a-Heat source surface, 311b-First sidewall, 311c-Non-heat source surface, 312-Second heat conduction section, 32-Fin, 33-Fan, 34-Heat transfer component;

[0066] 4-Heating element, 41-Heating body, 42-Base, 421-Frame;

[0067] 5-First substrate, 51-First main body, 52-Folded edge, 53-Rolled edge, 53a-Bottom surface, 53b-Arc-shaped surface, 53c-Flat surface, 54-Fixing part;

[0068] 6-Connecting plate, 6a-Connecting hole, 61-Riveting point;

[0069] 7-Second substrate, 71-Second main body, 711-First assembly part, 7111-Padded block, 712-Second assembly part, 713-Third assembly part, 72-Connecting part, 721-First part, 722-Second part;

[0070] 8 - Flow path, 81 - First branch path, 82 - Second branch path;

[0071] 9-Interval space. Detailed Implementation

[0072] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0073] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0074] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0075] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0076] This application provides an electronic device 100, which includes a heat dissipation module 3. Specifically, the electronic device 100 can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), personal computer, notebook computer, in-vehicle device, wearable device, etc. For ease of explanation, the following description uses a notebook computer as an example of the electronic device 100.

[0077] Please see Figure 1 , Figure 1 This is a structural diagram of the electronic device 100 provided in this application embodiment. The electronic device 100 includes a display 1 and a keyboard host 2, which are rotatably connected, allowing the electronic device 100 to switch between an open state and a closed state. The display 1 is used to display images, videos, etc. The keyboard host 2 is used to input commands and data, and controls the display 1 to display images and videos according to the input commands and data. Simultaneously, the keyboard host 2 is also used to play voice or music.

[0078] Please continue reading. Figure 1 The display 1 includes a top cover 11 and a display screen 12. The display screen 12 is fixed to the top cover 11 and located on the side of the top cover 11 closer to the keyboard host 2. The display screen 12 can be fixed by snap-fit, adhesive, threaded fasteners, etc. The top cover 11 can be made of metal or non-metallic materials such as plastic or wood. This application does not impose any restrictions on this.

[0079] For example, the display screen 12 described above can be a flexible display screen or a rigid display screen. For instance, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0080] Please see Figure 2 and Figure 3 , Figure 2 This is a structural diagram of the keyboard host 2 in the electronic device 100 according to an embodiment of this application. Figure 3 for Figure 2 A cross-sectional view of section AA. The keyboard host 2 includes a housing 21 and a keyboard 22. It should be noted that... Figures 1 to 3 The electronic device 100 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figures 1 to 3 Restrictions.

[0081] The housing 21 can be a one-piece structure or an assembled structure composed of multiple parts. Please refer to [link / reference]. Figure 3 In this embodiment, the housing 21 includes an upper housing 211 and a lower housing 212. The upper housing 211 and the lower housing 212 can be fixed by snap-fit, adhesive, or by threaded fasteners (such as screws). Furthermore, the housing 21 can be made of metal, or non-metallic materials such as plastic or wood. The housing 21 has an inner cavity 21a, which in this embodiment is formed by the assembly of the upper housing 211 and the lower housing 212.

[0082] For ease of description below, an XYZ coordinate system is established. The thickness direction of the keyboard host 2 of the electronic device 100 is defined as the Z-axis, the width direction as the X-axis, and the direction perpendicular to both the Z-axis and X-axis as the Y-axis. The intersection of the XYZ axes is the origin O. It is understood that the coordinate system can be flexibly set according to actual needs. This application only provides an example and should not be considered a specific limitation of this application.

[0083] The aforementioned electronic device 100 also includes a motherboard 24, which can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The motherboard 24 is disposed within the inner cavity 21a of the aforementioned housing 21. The motherboard 24 is used to house the electronic components 25 inside the electronic device 100 and enables communication between the electronic components 25. For example, the electronic components 25 may include a central processing unit (CPU), a graphics processing unit (GPU), an application processor (AP), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS), etc.

[0084] For example, please refer to Figure 4 , Figure 4 This is a structural diagram illustrating one possible assembly method of the electronic component 25 on the motherboard 24 according to an embodiment of this application. When the electronic component 25 is a CPU, the CPU can be fixed to the motherboard 24 via a mounting substrate 26. Specifically, the CPU is positioned at a corresponding location on the motherboard 24, and the mounting substrate 26 covers the CPU. Furthermore, the coverage area of ​​the mounting substrate 26 is larger than the area of ​​the CPU, allowing a portion of the mounting substrate 26 to be fixedly connected to the motherboard 24 via fasteners, threaded fasteners, or other means, thereby pressing the CPU firmly onto the motherboard 24.

[0085] In addition, some electronic components 25 can generate a lot of heat when they are working, such as the CPU or GPU. The electronic components 25 that can generate heat will be referred to as heat-generating components 4 below. Therefore, in order to reduce the impact of heat on the performance of electronic components 25, the above-mentioned electronic device 100 may also include a heat dissipation module 3, which is disposed in the inner cavity 21a of the housing 21.

[0086] In some embodiments, please refer to Figure 5 , Figure 5This is an exploded view of a partial structure of the heat dissipation module 3 of the electronic device 100 provided in this application embodiment. The heat dissipation module 3 may include a heat-conducting element 31, fins 32, and a fan 33. The heat-generating element 4 is in contact with the heat-conducting element 31. For example, the heat-conducting element 31 may be a heat pipe with a circular cross-section. Pressure is applied to form a flat tube structure from the circular heat pipe to meet the assembly requirements of the electronic device 100.

[0087] To ensure a sufficiently low surface contact thermal resistance for the heating element 4, the contact pressure between the heat-conducting component 31 and the heating element 4 needs to reach a certain range. For example, when the electronic component 25 is a CPU, the surface pressure of the electronic component 25 is generally designed to be 4.5-6.0 kg, which places certain requirements on the structural strength of the heat pipe. According to actual measurement results, for heat pipes with an internal copper powder sintered capillary structure, a specification with an outer diameter of not less than 8 mm and a wall thickness of not less than 0.2 mm can be used. These heat pipes will not deform when subjected to a surface pressure of 4.5-6.0 kg, thus pressing the heating element 4 tightly under this surface pressure to ensure stable contact between the heating element 4 and the heat-conducting component 31.

[0088] Furthermore, the heat-conducting element 31 and the fins 32 are in close contact. As needed, the heat-conducting element 31 and the fins 32 can be fixedly connected by welding or bonding, so that the heat generated by the heating element 4 can be transferred to the fins 32 through the heat-conducting element 31. The fan 33 is fixed inside the housing 21, and the housing 21 is provided with a vent 21b opposite to the fan 33. The fins 32 are located between the fan 33 and the vent 21b, so that the fan 33 can blow air out of the vent 21b and diffuse the heat transferred to the fins 32 through the heat-conducting element 31 to the outside of the electronic device 100, thereby achieving heat dissipation for the heating element 4.

[0089] Depending on the heat dissipation requirements, the heat dissipation module 3 may include multiple fins 32 and multiple fans 33, with each fin 32 corresponding to a fan 33, thus forming a multi-cooling-end heat dissipation module 3. Furthermore, the heat dissipation module 3 can provide heat dissipation for one heat-generating element 4 or for multiple heat-generating elements 4 simultaneously.

[0090] For example, please refer to Figure 6 and Figure 7 , Figure 6 This is a structural diagram showing one assembly method of the heating element 4 and the heat-conducting component 31 provided in an embodiment of this application. Figure 7 for Figure 6 Partial structural diagram of the BB section. Taking the heat-generating element 4 as the CPU as an example, since the heat-generating element 4 is pressed onto the motherboard 24 by the mounting substrate 26, the heat-conducting component 31 of the heat dissipation module 3 can only be stacked on top of the mounting substrate 26 and attached to the mounting substrate 26.

[0091] In this way, along the Z-axis direction, the heat conductor 31, the mounting base plate 26, and the heating element 4 (below the heating element 4 is the main board 24) Figure 6 and Figure 7 (Not shown in the image) Stacked sequentially, Figure 6 The heating element 4 is represented by a dashed outline, indicating that it is obscured by the heat-conducting component 31. The heat generated by the heating element 4 is transferred to the heat-conducting component 31 via the mounting substrate 26, then to the fins 32 via the heat-conducting component 31, and finally carried out of the electronic device 100 by airflow through the fan 33. It should be noted that... Figure 6 The image shows two heat-generating components 4, which can be a CPU and a GPU, respectively. Both are assembled with the same heat dissipation module 3 in the same way via corresponding mounting substrates 26.

[0092] However, since heat is conducted between the heat-conducting component 31 and the heating element 4 via the mounting substrate 26, there are at least six thermal resistances along the entire heat dissipation path. These six thermal resistances include: the contact thermal resistance between the heating element 4 and the mounting substrate 26, the thermal resistance of the mounting substrate 26, the contact thermal resistance between the mounting substrate 26 and the heat-conducting component 31, the thermal resistance of the heat-conducting component 31, the contact thermal resistance between the heat-conducting component 31 and the fins 32, and the thermal resistance of the fins 32. This results in a relatively large thermal resistance along the entire heat transfer path, leading to poor heat dissipation efficiency of the heating element 4.

[0093] Thermal resistance represents the degree of obstruction to heat transfer between two objects and within the same object. It is related to the effective contact area between the two objects (which is affected by the tightness of the contact) and the thermal conductivity of the materials used in the objects. The larger the effective contact area and the higher the thermal conductivity of the materials, the lower the thermal resistance; conversely, the lower the thermal resistance, the higher the thermal resistance. Higher thermal resistance results in lower heat transfer efficiency, and vice versa.

[0094] To address the aforementioned problems, this application provides another electronic device 100, please refer to [link / reference needed]. Figure 8 and Figure 9 , Figure 8 This is an exploded view of the assembly structure of the heat-conducting component 31 and the heating element 4 provided in the embodiments of this application. Figure 9 for Figure 8 The diagram shows a top view of the assembled structure. The heat dissipation module 3's heat-conducting component 31 can be fixed to the motherboard 24 via two first substrates 5.

[0095] The heat-conducting component 31 includes a first heat-conducting section 311 and a second heat-conducting section 312. For example, the heat-conducting component 31 includes two second heat-conducting sections 312 and a first heat-conducting section 311 located between the two second heat-conducting sections 312. The first heat-conducting section 311 extends in a direction parallel to the X-axis, its width direction is parallel to the Y-axis, and its thickness direction is parallel to the Z-axis. The second heat-conducting section 312 extends in a plane perpendicular to the Z-axis, and its thickness direction is parallel to the Z-axis. The heating element 4 is disposed between the first heat-conducting section 311 and the main board 24. The two second heat-conducting sections 312 of the heat-conducting component 31 and the two fins 32 ( Figure 8 and Figure 9 (not shown) are in contact with each other to form a heat dissipation module 3 with a single heat source and dual cold ends.

[0096] It is understandable that the number of either the first heat-conducting section 311 or the second heat-conducting section 312 can be one or more, and the relative positional relationship between the first heat-conducting section 311 and the second heat-conducting section 312 is not limited to... Figure 8 and Figure 9 As shown. For example, an L-shaped heat-conducting element 31 can be used, consisting of a first heat-conducting section 311 and a second heat-conducting section 312. Therefore, the embodiments of this application do not impose special limitations on the number and positional relationship of the first heat-conducting section 311 and the second heat-conducting section 312.

[0097] Please continue reading. Figure 8 and Figure 9 Two first substrates 5 are distributed along the width direction of the heat-conducting component 31 (specifically, the width direction of the first heat-conducting segment 311, i.e., the Y-axis direction). The first heat-conducting segment 311 is located between the two first substrates 5, and both first substrates 5 are fixedly connected to the first heat-conducting segment 311, and both first substrates 5 are fixedly connected to the motherboard 24. In this way, the heat-conducting component 31 can be fixed to the motherboard 24 through the fixed connection between the first substrates 5 and the motherboard 24.

[0098] Please see Figure 10 and Figure 11 , Figure 10 for Figure 9 The diagram shown is a structural diagram after being cut along the CC section. Figure 11 for Figure 10 A partial enlarged view of point a. Since the heating element 4 is located between the motherboard 24 and the first heat-conducting section 311, after the heat-conducting component 31 is fixed to the motherboard 24 by the two first substrates 5, the heating element 4 abuts between the motherboard 24 and the first heat-conducting section 311, and the heating element 4 contacts the first heat-conducting section 311, so that the heat generated by the heating element 4 can be directly transferred to the first heat-conducting section 311.

[0099] Therefore, based on the embodiments of this application, an electronic device 100 is provided, in which the heating element 4 is in direct contact with the heat-conducting component 31. Compared to the heating element 4 transferring heat to the heat-conducting component 31 through the mounting substrate 26, from the perspective of local thermal resistance, the three thermal resistances—the contact thermal resistance between the heating element 4 and the mounting substrate 26, the thermal conductivity thermal resistance of the mounting substrate 26, and the contact thermal resistance between the mounting substrate 26 and the heat-conducting component 31—are reduced to the single thermal resistance between the heating element 4 and the heat-conducting component 31. This eliminates two thermal resistances in the entire heat dissipation path, shortens the heat transfer path, and effectively improves the heat exchange efficiency between the heating element 4 and the heat-conducting component 31, thereby improving the heat dissipation effect of the heating element 4. This, in turn, helps to improve the heat dissipation performance of the electronic device 100 and enhance the user experience.

[0100] Furthermore, a thermal interface filling material can be provided between the heating element 4 and the first thermally conductive section 311. For example, the thermal interface filling material can be thermally conductive silicone grease. Heat is transferred between the heating element 4 and the first thermally conductive section 311 through the thermal interface filling material. The thermal interface filling material can fill the gaps that may be caused by the surface flatness of the contact interface between the heating element 4 and the first thermally conductive section 311, which can further improve the heat exchange efficiency.

[0101] In some embodiments, please continue reading Figure 10 and Figure 11 The first substrate 5 and the first heat-conducting section 311 can be fixed by surface-to-surface contact. For example, the cross-section of the first heat-conducting section 311 perpendicular to the X-axis is rectangular, and the two sidewalls of the first heat-conducting section 311 distributed along the width direction (i.e., the Y-axis direction) are the first sidewalls 311b.

[0102] Furthermore, the first substrate 5 may include a first main body portion 51 and a folded edge portion 52. The folded edge portion 52 is fixed to the side edge of the first main body portion 51 near the first heat-conducting section 311. The two opposing surfaces of the folded edge portion 52 and the first side wall 311b are attached to each other and fixedly connected, that is, the two are in surface-to-surface contact and fixedly connected.

[0103] For example, the surface of the folded edge 52 facing the first sidewall 311b and the surface of the first sidewall 311b facing the folded edge 52 can both be flat, or the surface of the folded edge 52 facing the first sidewall 311b and the surface of the first sidewall 311b facing the folded edge 52 can both be curved, and the two are in close contact with each other, that is, the surface shape of the folded edge 52 and the first sidewall 311b are the same. Furthermore, the folded edge 52 and the first sidewall 311b can be fixedly connected by welding (e.g., soldering) or bonding.

[0104] In this way, by bonding and fixing the folded edge 52 and the first sidewall 311b together, the contact area of ​​the fixed connection can be increased to meet the pull-out force requirements of the fixed connection, thus improving the connection strength between the two. For example, the connection area between the heat-conducting component 31 and the first substrate 5 is not less than 40 mm². 2 According to actual measurements, the heat-conducting component 31 and the first substrate 5 can withstand a pull force of 2.6 kg without falling off under this connection area. Furthermore, the length of the folded edge 52 along the X-axis can be no less than 25 mm and the width along the Z-axis can be no less than 2.5 mm, which helps to increase the fixed connection area between the folded edge 52 and the first heat-conducting section 311.

[0105] For further information, please refer to [link / reference]. Figure 10 and Figure 11 The first substrate 5 also includes a rolled edge portion 53, which is fixed to the edge of the folded edge portion 52 away from the first main body portion 51. The rolled edge portion 53 extends in a direction away from the first sidewall 311b of the first heat-conducting section 311, so that the rolled edge portion 53 has a bottom surface facing the main board 24, and the distance between the rolled edge portion 53 and the main board 24 is greater than the distance between the first heat-conducting section 311 and the main board 24. The rolled edge portion 53 is mainly used to solve the problem of material overflow, such as solder overflow, used to achieve the fixed connection when the first substrate 5 and the first heat-conducting section 311 are fixedly connected.

[0106] Specifically, when the folded edge 52 is fixedly connected to the first heat-conducting section 311 by means of, for example, welding, the solder will flow along the first sidewall 311b downwards from the heat source surface 311a where the first heat-conducting section 311 contacts the heating element 4 under the action of compression and gravity, posing a significant risk of flowing onto the heat source surface 311a. Once the solder flows onto the heat source surface 311a, it will leave residue that needs to be removed. On the one hand, removing the residual solder from the heat source surface 311a is very inconvenient; on the other hand, removing the solder from the heat source surface 311a will affect the flatness and other properties of the heat source surface 311a, and the flatness of the heat source surface 311a affects the tightness of the contact between the first heat-conducting section 311 and the heating element 4, thereby affecting the thermal resistance between the first heat-conducting section 311 and the heating element 4.

[0107] Therefore, by setting the rolled edge portion 53, and utilizing the fact that the distance between the rolled edge portion 53 and the main board 24 is greater than the distance between the first heat-conducting section 311 and the main board 24, in the positive half-axis direction of the Z-axis, with the lowermost main board 24 as the reference, the height of the bottom surface 53a of the rolled edge portion 53 is higher than that of the heat source surface 311a. Based on this, when the solder flows along the first sidewall 311b, some material will flow along the bottom surface 53a of the rolled edge portion 53, forming a branch path of flow. Since the total amount of overflowing solder is fixed, after a portion of the solder flows to the bottom surface 53a of the rolled edge portion 53, the amount of remaining solder is reduced, thereby reducing the amount of solder that continues to flow along the first sidewall 311b to the heat source surface 311a, thus reducing the risk of increased thermal resistance due to solder adhering to the heat source surface 311a.

[0108] Furthermore, the bottom surface 53a of the rolled edge 53 does not serve as a heat transfer contact surface, so there are no special requirements for its surface flatness. The attached solder can be removed by surface treatment methods such as grinding or CNC machining, without affecting the heat dissipation performance.

[0109] In some examples, the distance H between the rolled edge 53 and the plane where the heat source surface 311a is located is not less than 0.1 mm, ensuring that there is a sufficient distance between the bottom surface 53a of the rolled edge 53 and the plane where the heat source surface 311a is located, so that the material that does not flow along the bottom surface 53a of the rolled edge 53 can continue to flow along the first sidewall 311b, thereby allowing the material to adhere to the first sidewall 311b, which helps to further reduce the risk of the material flowing to the heat source surface 311a.

[0110] For example, please refer to Figure 12 , Figure 12 for Figure 11 The diagram shows one structural configuration of the rolled edge portion 53. The rolled edge portion 53 and the folded edge portion 52 can transition at a right angle, so that the bottom surface 53a of the rolled edge portion 53 only includes a planar area facing the main board 24. Therefore, the reference points for the distance between the rolled edge portion 53 and the main board 24, and the distance between the rolled edge portion 53 and the plane containing the heat source surface 311a, both refer to the bottom surface 53a of the rolled edge portion 53.

[0111] The material flowing along the first sidewall 311b toward the main board 24 is diverted when it reaches the rolled edge portion 53. After the diversion, the material flow path 8 forms a first branch path 81 that flows along the bottom surface 53a of the rolled edge portion 53 and a second branch path 82 that continues to flow along the first sidewall 311b.

[0112] In other embodiments, please refer to Figure 13 , Figure 13 for Figure 11The diagram shows another structure of the rolled edge portion 53. The rolled edge portion 53 and the folded edge portion 52 can be transitioned by rounding the corners. The chamfered area can be regarded as part of the rolled edge portion 53. That is, the bottom surface 53a of the rolled edge portion 53 includes an arc-shaped surface 53b (corresponding to the chamfered area) and a plane 53c (corresponding to the plane area of ​​the rolled edge portion 53 facing the main board 24).

[0113] It should be noted that the reference points for the distance between the rolled edge portion 53 and the main board 24, and the distance between the rolled edge portion 53 and the plane where the heat source surface 311a is located, both refer to the point on the rolled edge portion 53 that is furthest from the main board 24 along the Z-axis, that is, the connection point where the arc surface 53b of the rolled edge portion 53 and the folded edge portion 52 meet.

[0114] In this case, please refer to Figure 14 , Figure 14 for Figure 13 The diagram shows the structure of the rolled edge portion 53 after its position has been adjusted. Because the arc-shaped surface 53b of the rolled edge portion 53 forms the first branch path 81 for material flow, and there is a gap 9 between the arc-shaped surface 53b and the first sidewall 311b, some material can continue to flow along the second branch path 82 on the first sidewall 311b, meaning some material can adhere to the first sidewall 311b. Therefore, the plane 53c of the rolled edge portion 53 can be flush with the plane of the heat source surface 311a, or the plane 53c of the rolled edge portion 53 can be closer to the main board 24 than the heat source surface 311a.

[0115] Based on the above, the electronic device 100 provided in this application embodiment sets the heat-conducting component 31 of the heat dissipation module 3 and the heat-generating element 4 on the motherboard 24 in direct contact. This direct contact reduces thermal resistance along the heat transfer path and improves heat dissipation performance. Furthermore, ensuring tight contact between the heat transfer contact surfaces and eliminating macroscopic gaps between them further guarantees heat transfer efficiency. To this end, the electronic device 100 provided in this application embodiment can also apply downward pressure to the heat-conducting component 31 to further press it against the heat-generating element 4, ensuring tight contact. This can be achieved in various ways in this application embodiment.

[0116] In some embodiments, please refer to Figure 15 , Figure 15 In order to be in Figure 9The diagram shows the structure of the first substrate 5 after being cut along a DD section with a fixing part 54. At least one first substrate 5 may include a fixing part 54, which is fixed to the edge of the first main body 51 near the heat-conducting element 31. The fixing part 54 abuts against the surface of the heat-conducting element 31 away from the main board 24. In this way, since the first main body 51 is fixedly connected to the main board 24, and the fixing part 54 abuts against the surface of the heat-conducting element 31 away from the main board 24, the fixing part 54 can apply downward pressure to the heat-conducting element 31. This downward pressure is directed towards the side where the main board 24 is located; that is, the downward pressure is applied to the heating element 4 through the heat-conducting element 31, ensuring close contact between the heating element 4 and the first heat-conducting section 311, thereby reducing thermal resistance.

[0117] Meanwhile, the fixing part 54 can also be fixedly connected to the surface of the heat-conducting component 31 by welding, bonding or other methods, thereby increasing the connection area between the first substrate 5 and the heat-conducting component 31 and further meeting the requirements of the pull-out force.

[0118] Furthermore, in addition to the function of the fixing part 54 in pressing down on the heat-conducting element 31, the number and distribution of the fixing parts 54 also affect the position of the downward pressure applied to the heat-conducting element 31, as well as the position of the combined force of the multiple downward pressures applied by the multiple fixing parts 54. Therefore, for the two first substrates 5, whether to provide fixing parts 54 on each of them, and the number and distribution of the fixing parts 54 on each first substrate 5, can be selectively set according to the product requirements of the electronic device 100.

[0119] For example, the fixing part 54 can have a variety of different distribution structures on the two first substrates 5. The first substrate 5 of this application provides four distribution structures of the fixing part 54 on the two first substrates 5, but the embodiments of this application are not limited to these four structures.

[0120] Please continue reading. Figure 15 , Figure 15 The diagram shows two fixing parts 54 on each of the two first substrates 5. The fixing parts 54 on the two first substrates 5 are positioned identically in the X-axis direction, and their lengths extending identically in the Y-axis direction. The two fixing parts 54 on the same first substrate 5 are located on opposite sides of the center of the first heat-conducting section 311 in the X-axis direction, and the distances from the center of the first heat-conducting section 311 to the two fixing parts 54 are the same in the X-axis direction. In this way, the two first substrates 5 apply downward pressure to the heat-conducting member 31 from both sides in the width direction through their respective fixing parts 54. The downward pressure applied to both sides of the first heat-conducting section 311 in the width direction is consistent in position and magnitude, and the resultant force of the downward pressure is applied at the center of the first heat-conducting section 311.

[0121] Alternatively, please see Figure 16 , Figure 16 Another structural diagram of the two first substrates 5 provided in the embodiments of this application. Figure 16 The fixing part 54 shown in the figure is distributed on the two first substrates 5 and has a structure. Figure 15 They are basically the same, except that the lengths of the fixing portions 54 on the two first substrates 5 extending along the Y-axis are not the same. As a result, although the two first substrates 5 apply downward pressure to the heat conductor 31 from both sides of the width direction of the heat conductor 31 through their respective fixing portions 54, the position of the resultant force of the downward pressure is more biased towards the side of the first substrate 5 where the fixing portion 54 extends longer along the Y-axis, relative to the center of the first heat conductor section 311.

[0122] Alternatively, please see Figure 17 , Figure 17 This is another structural diagram of the two first substrates 5 provided in the embodiments of this application. Figure 17 The fixing part 54 shown in the figure is distributed on the two first substrates 5 and has a structure. Figure 15 In comparison, the similarities lie in the fact that the fixing portions 54 on the two first substrates 5 extend to the same length along the Y-axis; the differences lie in the fact that each of the two first substrates 5 has only one fixing portion 54, and the fixing portions 54 of the two first substrates 5 are located on both sides of the center of the first heat-conducting section 311 in the X-axis direction. In this way, the two first substrates 5 apply downward pressure to the heat-conducting member 31 from both sides in the width direction through their respective fixing portions 54. The resultant force of the downward pressure is located at the center of the first heat-conducting section 311, but for any side of the first substrate 5, the position of the downward pressure on that side is biased towards the side where the fixing portion 54 is located in the X-axis direction.

[0123] Alternatively, please see Figure 18 , Figure 18 This is another structural diagram of the two first substrates 5 provided in the embodiments of this application. Figure 18 The fixing part 54 shown in the figure is distributed on the two first substrates 5 and has a structure. Figure 15 In comparison, the similarities are that each first substrate 5 has two fixing parts 54, and the two fixing parts 54 are located on opposite sides of the center of the first heat-conducting section 311 in the X-axis direction, and the two fixing parts 54 are equidistant from the center of the first heat-conducting section 311 in the X-axis direction; the differences are that only one of the two first substrates 5 has a fixing part 54. In this way, only one first substrate 5 can apply downward pressure to the heat-conducting member 31 from one side of the width direction of the heat-conducting member 31 through its fixing part 54, and the resultant force of the downward pressure is also more biased towards the side of the first substrate 5 with the fixing part 54 relative to the center of the first heat-conducting section 311.

[0124] In addition, please continue Figure 18 And further reading Figure 19 , Figure 19 for Figure 18 A partial structural diagram of the JJ cross section. Based on the aforementioned heat-conducting component 31 being flattened from a heat pipe, for the first heat-conducting section 311, since it needs to be fixedly connected to the first substrate 5, to ensure the connection effect and further consider the manufacturing difficulty, the first sidewall 311b of the first heat-conducting section 311 is set as a plane. This is generally achieved by performing a secondary pressing on the first heat-conducting section 311 in the width direction. In this way, in the thickness direction (i.e., the Z-axis direction), the distance between the surface of the first heat-conducting section 311 away from the motherboard 24 and the motherboard 24 is greater than the distance between the surface of the second heat-conducting section 312 away from the motherboard 24 and the motherboard 24. Figure 19 As can be seen, in the Z-axis direction, there is a height difference between the surface of the first heat-conducting section 311 away from the motherboard 24 and the surface of the second heat-conducting section 312 away from the motherboard 24, which makes the thickness of the first heat-conducting section 311 greater than that of the second heat-conducting section 312. Therefore, in this embodiment, the fixing part 54 abuts against the thinner second heat-conducting section 312, avoiding the thicker first heat-conducting section 311, which helps to reduce the risk of the fixing part 54 increasing the thickness of the electronic device 100.

[0125] In some embodiments, applying downward pressure to the heat-conducting element 31 can also be achieved in other ways. See also Figure 20 and Figure 21 , Figure 20 Another electronic device 100 provided in the embodiments of this application is in Figure 10 Cross-sectional view at the section shown. Figure 21 Another electronic device 100 provided in the embodiments of this application is in Figure 10 Cross-sectional view at the section shown.

[0126] according to Figure 20 and Figure 21 respectively with Figure 10 A comparison of the structures shown can be seen that... Figure 20 and Figure 21 The structure shown involves a change in the structure of the first heat-conducting section 311 and the first substrate 5. Its main purpose is to enable the first substrate 5 to apply downward pressure to the first heat-conducting section 311 without adding other structural components for applying downward pressure, such as without providing the aforementioned fixing part 54.

[0127] Specifically, in this embodiment, along the Y-axis direction, the width of the surface of the first heat-conducting segment 311 away from the motherboard 24 (i.e., the non-heat source surface 311c) is smaller than the width of the surface of the first heat-conducting segment 311 close to the motherboard 24 (i.e., the heat source surface 311a). That is, the structure of the first heat-conducting segment 311 is designed such that its cross-sectional shape perpendicular to the X-axis direction is approximately trapezoidal. In this way, at least one first sidewall 311b of the first heat-conducting segment 311 is an inclined surface, and the folded edge 52 of the first substrate 5 connected to this first sidewall 311b is also a correspondingly inclined structure, i.e., the surface of the folded edge 52 is also an inclined surface. (Refer to...) Figure 17 It can be seen that after the first substrate 5 is fixed to the motherboard 24, the force F applied by the folded edge 52 to the first sidewall 311b through the action of the inclined surface will generate a component force F1 perpendicular to the motherboard 24 and pointing towards the motherboard 24. This component force F1 is the downward pressure applied by the first substrate 5 to the first heat-conducting section 311, thereby pressing the first heat-conducting section 311 onto the heating element 4.

[0128] Furthermore, depending on the needs of the electronic device 100, the aforementioned trapezoid can specifically be a general trapezoid as well as special trapezoids such as right trapezoids and isosceles trapezoids. A general trapezoid is one where neither of its two base angles is 90 degrees and the angles are different. For example, Figure 17 The cross-sectional shape of the first heat-conducting section 311 is a right-angled trapezoid, allowing the first substrate 5, located on the side of the inclined waist of the trapezoid, to apply downward pressure to the first heat-conducting section 311 via the inclined surface. This causes the center of the resultant downward pressure on the first heat-conducting section 311 to be biased towards the side of the inclined waist. Therefore, the orientation of the center of the resultant downward pressure on the first heat-conducting section 311 can be adjusted as needed by changing the specific location of the inclined waist of the right-angled trapezoid on the first heat-conducting section 311 along the Y-axis. Figure 18 The cross-sectional shape of the first heat-conducting section 311 is an isosceles trapezoid, so that both sides of the first heat-conducting section 311 in the Y-axis direction are subjected to the same downward pressure. Thus, the center of the resultant downward pressure on the first heat-conducting section 311 is located at the center of the first heat-conducting section 311.

[0129] Meanwhile, by setting the cross-section of the first heat-conducting section 311 to a common trapezoid, the position of the resultant force center of the first heat-conducting section 311 can also be adjusted by changing the inclination angle of the two inclined sides of the trapezoid. For example, Figure 18The isosceles trapezoid shown is replaced with a regular trapezoid, making the inclination angles of the two sloping legs different, i.e., the two base angles of the trapezoid are different sizes. As a result, the first substrate 5 on the side with the smaller base angle exerts a greater downward pressure on the first heat-conducting section 311 through the inclined first sidewall 311b; conversely, the first substrate 5 on the side with the larger base angle exerts a smaller downward pressure on the first heat-conducting section 311 through the inclined first sidewall 311b. Therefore, the center of the resultant force of the downward pressure exerted by the two first substrates 5 on the first heat-conducting section 311 will be biased towards the side with the smaller base angle, achieving the effect of adjusting the position of the center of the resultant force of the first heat-conducting section 311.

[0130] For further information, please refer to [link / reference]. Figure 20 and Figure 21 Based on the downward pressure exerted by the first substrate 5 on the first heat-conducting section 311 through the inclined first sidewall 311b, there is no need to provide other components (such as the aforementioned fixing part 54) on the side of the non-heat source surface 311c of the first heat-conducting section 311 on the first substrate 5 to provide the downward pressure. Therefore, the first substrate 5 can be further configured such that the distance between its surface away from the motherboard 24 and the motherboard 24 is no greater than the distance between the non-heat source surface 311c of the first heat-conducting section 311 and the motherboard 24. This helps to reduce the risk of the first substrate 5 increasing the thickness of the electronic device 100, thus ensuring the thinness and lightness of the electronic device 100.

[0131] In some embodiments, the method of applying downward pressure to the heat conduction element 31 on the first substrate 5 can be achieved by simultaneously applying pressure through the fixing part 54 and through the inclined surface of the folded edge part 52 and the first sidewall 311b, that is, the fixing part 54 and the inclined surface structure of the folded edge part 52 and the first sidewall 311b coexist.

[0132] In some embodiments, the length of the first sidewall 311b of the first heat-conducting section 311 along the X-axis is greater than the length of the first substrate 5 along the X-axis. Thus, in the X-axis direction, the first sidewall 311b of at least one side of the first heat-conducting section 311 is connected to two or more first substrates 5 at the same time. Therefore, the heat-conducting component 31 can be fixed to the main board 24 by at least three first substrates 5, thereby improving the stability of the assembly.

[0133] In some embodiments, please refer to Figure 22 and Figure 23 , Figure 22 This is a structural diagram showing the assembly of two first substrates 5 with corresponding connecting plates 6 according to an embodiment of this application. Figure 23 for Figure 22The diagram shows two first substrates 5 fixed to a main board 24 by a connecting plate 6. The first main body 51 of the first substrate 5 is connected to the connecting plate 6, which is stacked on the side of the first main body 51 away from the main board 24. The connecting plate 6 and the first main body 51 can be fixedly connected by welding, riveting, threaded fasteners, or other methods. For example, multiple riveting holes are provided on the connecting plate 6 and the first main body 51 to connect them to each other by riveting, forming multiple riveting points 61. The connecting plate 6 is used to fix the first substrate 5 to the main board 24.

[0134] The main board 24 has multiple positioning supports 241 for supporting two connecting plates 6 corresponding to the two first substrates 5, and the connecting plates 6 are used to connect the positioning supports 241. Specifically, the connecting plates 6 are provided with connecting holes 6a at both ends along the X-axis. The connecting holes 6a are used to connect to the screw holes on the positioning supports 241 by threaded fasteners (e.g., screws), so that the connecting plates 6 can be fixed to the positioning supports 241 by threaded fasteners, thereby fixing the first substrates 5 to the main board 24.

[0135] In some embodiments, the first heat-conducting section 311 of the heat-conducting element 31 is in direct contact with the heating element 4. To reduce thermal resistance, the flatness of the heat source surface 311a on the first heat-conducting section 311 that contacts the heating element 4 should not be too large. In the embodiments of this application, the flatness of the heat source surface 311a of the first heat-conducting section 311 is no greater than 0.05 mm. CNC machining can be used to perform surface treatment on the heat source surface 311a to ensure that the flatness meets the requirements.

[0136] Please see Figure 24 , Figure 24 The following table shows the flatness measurement results (in mm) of the heat source surface 311a of the heat-conducting component 31 sample provided in the embodiments of this application.

[0137] It should be noted that, Figure 24 The measurement results shown do not correspond to the data in Table 1 below. Figure 24 The measurement results for the corresponding samples are not included in Table 1 below.

[0138] Table 1

[0139]

[0140]

[0141] As shown in Table 1, among the six samples, sample number 5 has the worst flatness at 0.089 mm, which can be improved to 0.05 mm through surface treatments such as grinding. Furthermore, the heat pipe with a wall thickness of not less than 0.2 mm (e.g., 0.25 mm-0.3 mm) is used for the heat-conducting component 31. This wall thickness provides sufficient allowance for surface treatment, preventing the heat-conducting component 31 from becoming too thin after surface treatment and failing to meet structural strength requirements.

[0142] Meanwhile, considering the lightweight design requirements of the electronic device 100, when the heat-conducting component 31 uses a heat pipe, the structural strength and surface flatness requirements mainly apply to the first heat-conducting section 311 that is in contact with the heating element 4. Therefore, a wall thickness of 0.2 mm or more is sufficient for the first heat-conducting section 311. The second heat-conducting section 312, however, has no structural strength or surface flatness requirements. Therefore, to reduce the overall weight of the heat-conducting component 31, the thickness of the second heat-conducting section 312 can be reduced to less than 0.2 mm. In other words, the heat-conducting component 31 can adopt a structure with unequal wall thicknesses.

[0143] In one example, the first heat-conducting section 311 can be a heat pipe with a wall thickness of 0.25mm-0.3mm, and the thickness of the second heat-conducting section 312 can be reduced to less than 0.25mm.

[0144] In some embodiments, the electronic device 100 may include only one main heat-generating element 4. For example, if the CPU of the electronic device 100 integrates the function of a graphics processor, that is, if the electronic device 100 adopts an integrated graphics solution, then the main heat-generating element 4 of the electronic device 100 is the CPU, and a heat dissipation method in which the CPU directly contacts the aforementioned heat-conducting component 31 can be adopted.

[0145] In other embodiments, the electronic device 100 may include multiple main heat-generating components 4. For example, if the CPU of the electronic device 100 does not have integrated graphics processing capabilities, and the electronic device 100 also includes a GPU, that is, if the electronic device 100 adopts a discrete graphics solution, then the main heat-generating components 4 of the electronic device 100 may include the CPU and the GPU.

[0146] In this scenario, due to the difference in thickness between the CPU and GPU (for example, the GPU may be thicker than the CPU), if both the CPU and GPU use a heat dissipation method that directly contacts the heatsink 31, the heatsink 31 needs a significant transition structure along its thickness direction (Z-axis) to accommodate both the CPU and GPU. Because the heatsink 31 has a limited length, the transition length along this direction is short, resulting in a large and uneven transition. This significantly and negatively impacts the heatsink 31's thermal conductivity and noise reduction performance. Therefore, while direct contact with the heatsink 31 can reduce thermal resistance, it actually hinders overall heat dissipation performance.

[0147] Therefore, for a discrete graphics card solution, considering that the CPU is thinner than the GPU (in this example, the GPU is the first component and the CPU is the second component), to reduce or even eliminate the step difference in the heat dissipation of the heat-conducting component 31 and ensure the overall heat dissipation effect of the electronic device 100, the GPU adopts a heat dissipation method that directly contacts the heat-conducting component 31, while the CPU adopts a heat dissipation method that indirectly contacts the heat-conducting component 31 through an intermediate component (such as the aforementioned mounting substrate 26). That is, the intermediate component is positioned between the CPU and the heat-conducting component 31. In this way, by using the intermediate component to compensate for the thickness difference between the CPU and the GPU, the step difference in the heat-conducting component 31 can be reduced or even eliminated, while simultaneously meeting the heat dissipation requirements of both the CPU and the GPU.

[0148] In some embodiments, please refer to Figure 25 and Figure 26 , Figure 25 This is an assembly structure diagram of the intermediate substrate 26 and the heat-conducting component 31 provided in an embodiment of this application. Figure 26 for Figure 25 A partial structural diagram of the EE section. Figure 6 Based on the illustrated electronic device 100, the electronic device 100 may further include an intermediate substrate 27, which is fixedly connected to an assembly substrate 26. For example, the intermediate substrate 27 can be used to mount power supply devices for the electronic device 100, such as power management chips or voltage converters. However, the power supply devices on the intermediate substrate 27 also generate heat, which needs to be transferred sequentially through the intermediate substrate 27 and the assembly substrate 26 to the heat conductor 31. During the heat transfer process, the thermal resistance is high, which is not conducive to heat dissipation.

[0149] In some examples, the assembly substrate 26 and the intermediate substrate 27 can be configured as an integral structure to reduce thermal resistance during heat transfer. However, the integral structure formed by the assembly substrate 26 and the intermediate substrate 27 has a large overall volume and requires high structural strength, necessitating the use of high-density materials (such as copper), resulting in a large overall weight and failing to meet the lightweight design requirements of the electronic device 100.

[0150] To address the above problems, this application provides an electronic device 100. Please refer to... Figure 27 and Figure 28 , Figure 27 This is an exploded view of the assembly structure of the second substrate 7 and the heating element 4 of the electronic device 100 provided in the embodiments of this application. Figure 28 for Figure 27 The diagram shows a top view of the structure in its assembled state. Figure 8 Based on the provided electronic device 100, the electronic device 100 provided in this embodiment also includes a second substrate 7. The function of the second substrate 7 is the same as that of the intermediate substrate 27 described above, which is used to mount the power supply device of the electronic device 100 to realize the power supply of the electronic device 100. That is, the second substrate 7 can be the power supply substrate of the electronic device 100, which can guide the heat of the power supply device to the heat conductor 31.

[0151] For details, please refer to further information. Figure 29 , Figure 30 as well as Figure 31 , Figure 29 for Figure 28 The diagram shown is a structural diagram after the structure has been cut along the GG section. Figure 30 for Figure 29 A magnified view of a portion at point b. Figure 31 This is a structural diagram of the second substrate 7 provided in an embodiment of this application. The second substrate 7 may include a second main body portion 71 and a connecting portion 72. A corresponding power supply device contacts the second main body portion 71. The main body portion 71 is located on the side of one of the first substrates 5 away from the heat-conducting element 31. The connecting portion 72 is disposed on the edge of the second main body portion 71 near the heat-conducting element 31. A portion of the connecting portion 72 extends from the side of the heat-conducting element 31 near the motherboard 24 to the space between the heat-conducting element 31 and the motherboard 24, and is in contact with the surface of the heat-conducting element 31 near the motherboard 24. In this way, based on the surface contact between the connecting portion 72 and the heat-conducting element 31, the heat transferred by the second substrate 7 can be directly transferred to the heat-conducting element 31 without passing through the first substrate 5, which can effectively improve the heat transfer efficiency of the second substrate 7 to the heat-conducting element 31.

[0152] The area on the connecting part 72 that is in contact with the surface of the heat-conducting element 31 can also be fixedly connected to the surface of the heat-conducting element 31, and the connection method includes welding, bonding, etc. In addition, the area of ​​the connecting part 72 that is in contact with the heat-conducting element 31 avoids the area where the heat-conducting element 31 contacts the main heating element 4.

[0153] Furthermore, since the second substrate 7 does not involve interaction with the main heat-generating components 4 (such as the CPU or GPU), its material and specifications can differ from those of the first substrate 5. For example, the second substrate 7 can be made of aluminum, which has a lower density and lighter weight, to enhance the lightweight design of the electronic device 100.

[0154] For further information, please refer to [link / reference]. Figure 29 , Figure 30 as well as Figure 31 The connecting portion 72 includes a first portion 721 and a second portion 722. The first portion 721 is stacked on the side of the first main body 51 near the main board 24 and is fixedly connected to the first main body 51. The connection method can be welding, riveting, bonding, etc. The first portion 721 is used to achieve a fixed connection between the second substrate 7 and the first substrate 5. The second portion 722 extends between the heat-conducting element 31 and the main board 24 and is used to achieve heat transfer between the second substrate 7 and the heat-conducting element 31.

[0155] Furthermore, the second part 722 and the fixing part 54 are positioned in the same direction along the X-axis, meaning that the second part 722 and the fixing part 54 are opposite each other in the thickness direction (i.e., the Z-axis direction) of the heat-conducting element 31. In this way, the fixing part 54 and the second part 722 are positioned in the same direction with the heat-conducting element 31, and the forces they exert on the heat-conducting element 31 act at the same location, thus avoiding any impact on the reliability of the heat-conducting element 31 structure.

[0156] Specifically, the forces exerted by the fixing part 54 and the second part 722 on the heat-conducting element 31 are respectively directed towards the negative half-axis and the positive half-axis of the Z-axis, so the two forces are in opposite directions. If the positions of the two forces on the heat-conducting element 31 are misaligned in the X-axis direction, the heat-conducting element 31 will be subjected to shear force, affecting the reliability of the structure of the heat-conducting element 31.

[0157] In some embodiments, please continue reading Figure 29 , Figure 30 as well as Figure 31The second main body 71 is provided with two first assembly parts 711. The two first assembly parts 711 are located below the connecting plate 6 of the first substrate 5 that is close to the second substrate 7, and the two first assembly parts 711 correspond to the two connecting holes 6a at both ends along the X-axis direction on the connecting plate 6. A pad 7111 is provided between the first assembly part 711 and the location of the connecting hole 6a on the connecting plate 6. The first assembly part 711 is used to fix together with the connecting plate 6 to the positioning support 241 on the main board 24 by threaded fasteners, so that the second substrate 7 and the main board 24 are fixedly connected.

[0158] Please continue to refer to Figure 29 , Figure 30 as well as Figure 31 The second main body 71 has a second mounting portion 712 and a third mounting portion 713 at its edge away from the connecting portion 72. The second mounting portion 712 has a hole for connection by threaded fasteners (e.g., screws). Figure 27 The positioning hole 242 is shown on the motherboard 24. Thus, the second assembly part 712, together with the two first assembly parts 711, forms three support points for the second substrate 7, providing stable support for the second substrate 7. The third assembly part 713 is used to contact other heat-conducting components in the heat dissipation module 3, improving the heat transfer efficiency of the second substrate 7.

[0159] In some embodiments, please refer to Figure 32 , Figure 32 This is a structural diagram of one embodiment of the heating element 4 provided in this application, exemplarily showing the CPU of an electronic device 100. The heating element 4 includes a heating body 41 (i.e., the core of the CPU) and a base 42 (i.e., the CPU's packaging base). For example, the heating body 41 may protrude relative to the surface of the base 42, so the first heat-conducting section 311 may contact the heating body 41 but not the base 42. Specifically, the second part 722 of the connecting portion 72 may be located between the base 42 and the heat-conducting element 31. The second part 722 contacts the heat-conducting element 31 but not the base 42 to avoid affecting the tightness of the contact between the first heat-conducting section 311 and the heating body 41.

[0160] Specifically, if the second part 722 contacts both the heat-conducting element 31 and the base 42, then the second part 722 will exert a force on the heat-conducting element 31 due to factors such as flatness deviation or thermal expansion, causing the heat-conducting element 31 to tend to move away from the motherboard 24. This reduces the tightness of the contact between the first heat-conducting section 311 and the heat-generating body 41, and may even cause the first heat-conducting section 311 to separate from the heat-generating body 41. However, if the second part 722 does not contact the base 42, the deformation of the second part 722 due to flatness deviation or thermal expansion can occur freely in the space between the second part 722 and the base 42, thereby effectively avoiding the problem of the second part 722 exerting a force on the heat-conducting element 31.

[0161] In addition, please continue to refer to Figure 32 And further reading Figure 33 , Figure 33 This is a schematic diagram illustrating the relationship between the heating element 4 and the second substrate 7 provided in an embodiment of this application. The surface of the base 42 includes a first region and a second region (the first region and the second region are located on...). Figure 32 and Figure 33 (Not marked in the text) The first region is occupied by the heating body 41, the second region surrounds the heating body 41, and the second part 722 is located in the second region. Specifically, the second part 722 can be located on both sides of the heating body 41 in the X-axis direction, that is, the connecting part 72 can include two second parts 722. The two second parts 722 can increase the contact area between the connecting part 72 and the heat-conducting element 31 and improve the heat transfer effect.

[0162] In addition, in order to further increase the contact area between the second part 722 and the heat-conducting element 31 and further improve the heat transfer effect between the second substrate 7 and the heat-conducting element 31, the projected area of ​​the two second parts 722 in the second region accounts for more than 80% of the area of ​​the second region.

[0163] It should be noted that, Figure 32 and Figure 33 An exemplary CPU structure is shown, which also has an annular border 421 on the base 42. The border 421 is located at the edge of the second region and protrudes from the surface of the base 42, but the height of the border 421 protruding from the surface of the base 42 is less than that of the heat-generating body 41. Therefore, due to the limitation of the border 421, the second portion 722 is disposed between the heat-generating body 41 and the border 421. However, the CPU itself has various packaging structures, and for CPUs without the border 421, the position of the second portion 722 is not affected by the border 421.

[0164] In some embodiments, please refer to Figure 34 , Figure 34This is an overall assembly diagram of the heat dissipation module 3, motherboard 24, and corresponding substrate in the electronic device 100 provided in this application embodiment. The heat dissipation module 3 further includes a heat transfer element 34, at least one end of which contacts the heat conductor 31, and the remaining portion extends to other areas of the motherboard 24. The heat transfer element 34 is mainly used to dissipate heat from other electronic components 25 within the housing 21 that are far from the heat conductor 31. That is, when other electronic components 25 far from the heat conductor 31 come into contact with the heat transfer element 34, their heat is conducted to the heat conductor 31 through the heat transfer element 34 for heat dissipation. For example, the CPU of the electronic device 100 is close to the heat conductor 31 and can be directly dissipated through the heat conductor 31; power supply devices are far from the heat conductor 31 and can indirectly dissipate heat by directing heat to the heat conductor 31 through the second substrate 7; other components are far from both the heat conductor 31 and the second substrate 7 and can indirectly dissipate heat by directing heat to the heat conductor 31 through the heat transfer element 34.

[0165] Furthermore, a portion of the heat transfer element 34 can also contact the aforementioned third assembly portion 713. Specifically, a portion of the heat transfer element 34 is stacked on the side of the third assembly portion 713 away from the motherboard and contacts the third assembly portion 713. On one hand, the third assembly portion 713 can support the heat transfer element 34; on the other hand, the third assembly portion 713 can guide a portion of the heat transferred from the second substrate 7 to the heat transfer element 34, thereby improving the heat dissipation effect of the second substrate 7.

[0166] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0167] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: include: case; A heat-conducting component is disposed within the housing, the heat-conducting component comprising a first heat-conducting section and a second heat-conducting section distributed along the length direction; The motherboard is disposed within the housing and is stacked with the heat-conducting component; A heating element is disposed between the motherboard and the first heat-conducting section. The heating element is fixed on the motherboard and is in contact with the first heat-conducting section. Two first substrates are provided, along the width direction of the heat-conducting component, and the two first substrates are provided on both sides of the first heat-conducting segment. The first substrates are fixedly connected to the first heat-conducting segment and the first substrates are fixedly connected to the motherboard.

2. The electronic device of claim 1, wherein, The first substrate includes a first main body and a folded edge. The folded edge is fixed to the edge of the first main body near the first heat-conducting section. The first heat-conducting section has two first sidewalls distributed along the width direction. The folded edge is attached to and fixedly connected to the corresponding first sidewall.

3. The electronic device of claim 2, wherein, The first substrate further includes a rolled edge portion, which is fixed to the edge of the folded edge portion away from the first main body portion and extends in a direction away from the first sidewall; the distance between the rolled edge portion and the main board is greater than the distance between the first heat-conducting section and the main board.

4. The electronic device of claim 3, wherein, The surface of the first heat-conducting section that contacts the heating element is the heat source surface, and the distance between the rolled edge and the plane containing the heat source surface is not less than 0.1 mm.

5. The electronic device of claim 2, wherein, The first substrate further includes a rolled edge portion, which is fixed to the edge of the folded edge portion away from the first main body portion and extends in a direction away from the first sidewall; the surface of the rolled edge portion facing the first sidewall is spaced apart from the first sidewall.

6. The electronic device of claim 5, wherein, The surface of the rolled edge facing the first sidewall is an arc surface.

7. The electronic device of claim 2, wherein, The width of the surface of the first heat-conducting segment away from the motherboard is smaller than the width of the surface of the first heat-conducting segment close to the motherboard.

8. The electronic device of claim 7, wherein, The distance between the surface of the first substrate away from the motherboard and the motherboard is not greater than the distance between the surface of the first heat-conducting section away from the motherboard and the motherboard.

9. The electronic device of claim 2, wherein, At least one of the first substrates includes a fixing portion, the fixing portion being fixed to the edge of the first main body near the first heat-conducting section, and the fixing portion abutting against the surface of the heat-conducting member away from the main board.

10. The electronic device of claim 9, wherein, The first substrate includes a plurality of fixing portions, which are spaced apart.

11. The electronic device of claim 9, wherein, Both of the first substrates include the fixing portion.

12. The electronic device of claim 9, wherein, Along a direction perpendicular to the motherboard, the distance between the surface of the first heat-conducting section away from the motherboard and the motherboard is greater than the distance between the surface of the second heat-conducting section away from the motherboard and the motherboard, and the fixing part abuts against the surface of the second heat-conducting section away from the motherboard.

13. The electronic device of any of claims 1-12, wherein, Also includes: The second substrate includes a second main body and a connecting portion. A portion of the second main body is located on one side of the first substrate away from the heat conductor. The connecting portion is fixed to the edge of the second main body near the heat conductor. A portion of the connecting portion is located between the heat conductor and the main board and is in contact with the heat conductor.

14. The electronic device of claim 13, wherein, The heating element includes a heating body and a base. The heating body is disposed on the surface of the base facing the heat-conducting element. A portion of the connecting part is located between the base and the heat-conducting element and is spaced apart from the base.

15. The electronic device of claim 14, wherein, The connecting portion includes a first part and a second part, the first part being stacked with the first substrate, and the second part being located between the base and the heat-conducting component.

16. The electronic device of claim 15, wherein, The base has a first region and a second region on its surface facing the heat-conducting component. The heating body is disposed in the first region. The projection of the second part on the surface of the base facing the heat-conducting component is located in the second region, and the area of ​​the projection accounts for more than 80% of the area of ​​the second region.

17. The electronic device of any of claims 1-12, 14-16, wherein, The total connecting area of the two first substrates and the heat conducting member is not less than 40mm 2 .

18. The electronic device of any of claims 1-12, 14-16, wherein, The surface of the first heat-conducting section that contacts the heating element is the heat source surface, and the flatness value of the heat source surface is not greater than 0.05 mm.

19. The electronic device of any of claims 1-12, 14-16, wherein, The heat-conducting component is a heat pipe, the outer diameter of which is not less than 8 mm and the wall thickness of which is not less than 0.2 mm.

20. The electronic device according to any one of claims 1-12, 14-16, characterized in that, The heat-conducting component is a heat pipe, and the wall thickness of the first heat-conducting section is greater than that of the second heat-conducting section.

21. The electronic device of any of claims 1-12, 14-16, wherein, The heating element includes a first element and a second element, wherein the distance between the surface of the first element away from the motherboard and the motherboard is greater than the distance between the surface of the second element away from the motherboard and the motherboard; The first element is in contact with the first heat-conducting section, and an intermediate component is provided between the second element and the first heat-conducting section. The intermediate component is fixedly connected to the motherboard, and the second element, the intermediate component, and the first heat-conducting section are in contact in sequence.

Images