A computer with dual or multi-path liquid cooling device

Abstract

This utility model belongs to, but is not limited to, the field of computer overall structure and heat dissipation technology, and discloses a computer with a dual- or multi-channel liquid cooling system, including a chassis, motherboard, heat-generating components, and a dual- or multi-channel liquid cooling system. The liquid cooling system includes a water circuit board, a water pump, an air-cooling assembly, and piping. The water circuit board has multiple independent water-cooling tanks, each connected to different heat-generating components. The first water-cooling tank forms a cooling loop through the air-cooling assembly, and the piping is L-shaped to fit the chassis layout. This utility model improves the targeted heat dissipation and space utilization through the integrated design of dual- or multi-channel liquid cooling with the overall system, ensuring efficient and stable operation of the entire machine.

Description

Technical Field

[0001] This utility model belongs to, but is not limited to, the field of computer structure and heat dissipation technology, and particularly relates to a computer with dual or multi-channel liquid cooling devices. Background Technology

[0002] With the improvement of computer performance, the heat generated by multiple components such as CPU, graphics card, and AI inference card inside the chassis increases dramatically when operating at high power. Traditional computer cooling devices have the following problems:

[0003] The integration of liquid cooling with the overall system is low, the water circuit board is poorly compatible with the layout of internal components, and the messy piping leads to low space utilization.

[0004] A single liquid cooling circuit cannot adequately handle multiple high-heat-generating components, and heat can easily interfere with each other, resulting in insufficient heat dissipation efficiency.

[0005] The liquid cooling system and air cooling components are set up independently and lack coordinated design. Under high load scenarios, they cannot cool down quickly, which affects the overall stability of the machine.

[0006] The State Intellectual Property Office (SIPO) document CN205566950U describes an integrated liquid-cooled heat dissipation chassis. This chassis employs a sealed enclosure, a bottom liquid reservoir, and a spraying mechanism to form a single-cycle liquid cooling system. The coolant is pumped into the pipeline and then atomized and sprayed directly onto the surface of heat-generating components through nozzles. After heat exchange by the cooling mechanism, the coolant returns to the reservoir, achieving a liquid-gas-liquid three-state cycle for heat dissipation. This solution emphasizes the portability of the integrated structure and the high heat transfer coefficient of the spray cooling, while also possessing the advantage of being airtight for operation in harsh environments.

[0007] However, practical evaluations revealed that the long spray recovery path, reliant on gas-liquid separation within the enclosure, resulted in insufficient droplet recombination efficiency and low refrigerant utilization. Simultaneously, the single-loop circulation caused significant pressure differential at the terminal pump, making it prone to localized overheating in hotspot scenarios such as those involving GPUs and AI accelerator cards, posing a risk of application incompatibility with the spray-film mechanism proposed in the literature. Furthermore, the liquid storage tank and pump are both located at the bottom of the enclosure, and the height difference restricts natural venting, requiring the entire tank to be tilted for drainage during maintenance, increasing the risk of leakage and operational complexity.

[0008] Therefore, there is an urgent need for a structure that can efficiently integrate dual or multi-channel liquid cooling devices with the computer system to optimize heat dissipation performance and space layout. Utility Model Content

[0009] To address the problems existing in the prior art, this utility model provides a computer with dual or multi-channel liquid cooling devices. By integrating the dual or multi-channel liquid cooling system with the overall assembly structure, targeted heat dissipation of multiple components is achieved, thereby improving the overall heat dissipation efficiency and space adaptability.

[0010] This utility model is implemented as follows: a computer with a dual-channel or multi-channel liquid cooling device includes a chassis, a motherboard disposed in the chassis, multiple heat-generating components (such as CPU, graphics card, AI inference card), and a dual-channel or multi-channel liquid cooling device; the dual-channel or multi-channel liquid cooling device includes a water circuit board body, a water pump, an air cooling component, and pipes;

[0011] The water cooling board is fixed inside the chassis and is formed by a cover plate and a bottom plate. It has at least two independent water cooling tanks (including a first water cooling tank and a second water cooling tank, which can be expanded to a third and a fourth water cooling tank). The cover plate has a water pump slot and multiple through holes. The water pump is snapped into the water pump slot and its output end is connected to the first water cooling tank through the through holes. The first water cooling tank is connected to the air cooling component through pipes to form an independent heat dissipation circuit.

[0012] The second water-cooling tank (and the extended third and fourth water-cooling tanks) are connected to different heat-generating components through pipes and through holes to form an independent liquid cooling circuit for each component; the pipes are L-shaped to fit the internal space layout of the chassis; the main body of the water circuit board is fixed to the inner wall of the chassis with screws, and the components and the liquid cooling device are assembled together to form the whole structure.

[0013] Furthermore, the number of independent water-cooling tanks is 2-4, each corresponding to at least two heat-generating components in the CPU, graphics card, and AI inference card.

[0014] Furthermore, the air-cooling assembly includes a fan and fins, the fins being connected to a pipe connecting to the first water-cooling tank, and the fan being positioned corresponding to the fins.

[0015] Furthermore, the cover plate and the base plate are made of acrylic material. The base plate is milled with an independent water-cooling groove, and the cover plate is milled with a sealing pattern that matches the water-cooling groove. The cover plate and the base plate are fixed together by screws passing through the edge screw holes.

[0016] Furthermore, a sealing gasket is provided at the connection between the water pump and the first water-cooling tank.

[0017] Based on the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solution to be protected by this utility model are as follows:

[0018] (1) High integration of the whole machine: The liquid cooling device is assembled with the chassis, motherboard and heat-generating components, the pipeline layout is simple, the chassis space utilization is improved, and the problem of messy pipeline in the traditional structure is solved;

[0019] (2) Dual or multi-channel targeted heat dissipation: Independent water cooling tanks correspond to components such as CPU and graphics card to avoid heat interference and meet the heat dissipation needs of high-heat components;

[0020] (3) High-efficiency collaborative heat dissipation: The integrated air-cooling components work together with the first water-cooling tank to enhance the liquid cooling circulation cooling effect and ensure the overall temperature stability under high load scenarios;

[0021] (4) Easy assembly and maintenance: The water circuit board is fixed to the chassis with screws, the water pump is installed by snap-fit, and the pipeline adopts an L-shaped adapter design, which is convenient for disassembly and subsequent maintenance;

[0022] (5) Reliable structure: The cover plate and the bottom plate are made of acrylic material and CNC machined, with excellent sealing performance, reducing the risk of liquid cooling leakage and ensuring the safety of the whole machine operation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a computer structure with a dual-channel or multi-channel liquid cooling device provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of a dual-channel or multi-channel liquid cooling device provided in an embodiment of this utility model;

[0025] Figure 3 This is a structural diagram of the water channel plate provided in an embodiment of this utility model;

[0026] Figure 4 This is a diagram of the internal structure of the water circuit board provided in this embodiment of the utility model;

[0027] Figure 5 This is a front view of the air-cooled component provided in this embodiment of the utility model;

[0028] Figure 6 This is a schematic diagram of the back of the air-cooled component provided in this embodiment of the utility model;

[0029] Figure 7 This is a schematic diagram of a water pump provided in an embodiment of the present invention;

[0030] In the diagram: 1. Chassis; 2. Motherboard; 3. Heat-generating components; 3-1. CPU; 3-2. Graphics card; 3-3. AI inference card; 4. Dual or multi-channel liquid cooling system; 5. Water cooling board body; 5-1. Cover plate; 5-2. Base plate; 6. Water cooling tank; 6-1. First water cooling tank; 6-2. Second water cooling tank; 6-3. Third water cooling tank; 6-4. Fourth water cooling tank; 7. Water pump tank; 8. Water pump; 9. Through hole; 10. Air cooling assembly; 11. Piping. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0032] As shown in Figure 1, the computer includes a chassis 1, a motherboard 2 is fixed inside the chassis 1, and heat-generating components 3 such as CPU 3-1, graphics card 3-2 or AI inference card 3-3 are installed on the motherboard 2; a dual-channel or multi-channel liquid cooling device 4 is fixed to the inner wall of the chassis 1 with screws and is adapted to the position of the heat-generating components 3.

[0033] The main body 5 of the water circuit board consists of an acrylic cover plate 5-1 and a base plate 5-2. The first water cooling tank 6-1, the second water cooling tank 6-2, the third water cooling tank 6-3 and the fourth water cooling tank 6-4 are milled on the base plate 5-2 by CNC machining. The cover plate 5-1 is milled with matching textures. After the cover is closed, it is fixed and sealed by edge screw holes and screws.

[0034] A water pump 8 is snapped into the water pump slot 7 on the cover plate 5-1. The output end of the water pump 8 is connected to the first water cooling tank 6-1 through the through hole 9. A sealing gasket is provided at the connection to prevent leakage. The other end of the first water cooling tank 6-1 is connected to the air cooling component 10 (including fan and fins) through the pipe 11. The fins absorb heat in contact with the pipe 11, and the fan accelerates heat dissipation.

[0035] The second water cooling tank 6-2 is connected to the CPU 3-1 via an L-shaped pipe 11. The third water cooling tank 6-3 is connected to the graphics card 3-2 and the AI ​​inference card 3-3 via an L-shaped pipe 11. The fourth water cooling tank 6-4 is connected to other heat-generating components inside the chassis via an L-shaped pipe 11. The pipes 11 are laid out along the inner wall of the chassis 1 to avoid interference with other components.

[0036] First liquid cooling cycle: Water pump 8 drives coolant into the first water cooling tank 6-1, absorbs heat from the environment inside the chassis, and then flows into the air cooling component 10 through pipe 11; fins transfer heat, the fan accelerates heat dissipation, and the cooled coolant flows back to water pump 8 to complete the cooling cycle.

[0037] Secondary or multi-channel liquid cooling circulation: The coolant in the second water-cooling tank 6-2 flows through the CPU 3-1 via pipe 22, absorbs its heat, and then flows back; the coolant in the third water-cooling tank 6-3 flows through the graphics card 3-2 and AI inference card 3-3 via pipe 11, absorbs its heat, and then flows back, achieving independent heat dissipation for multiple components; the coolant in the fourth water-cooling tank 6-4 flows through the other heat-generating components via pipe 11, absorbs its heat, and then circulates back.

[0038] System-wide coordinated heat dissipation: Dual or multiple liquid cooling circuits work in parallel, combined with air cooling components to enhance cooling, ensuring that the temperature of each component inside the chassis is within a reasonable range, and guaranteeing the stable operation of the entire computer.

[0039] Pump 8, acting as a power source, pushes coolant from the pump chamber into the first water-cooling tank 6-1 in the main body of the water circuit board 5. The first tank is equivalent to a main distribution chamber, and its internal flow channels are precision-milled using CNC machining to ensure low resistance and stable flow rate. The coolant in 6-1 is guided to three independent outlets, which converge into the second, third, and fourth water-cooling tanks (6-2, 6-3, and 6-4) via L-shaped pipes 11. This parallel structure with one pump and multiple outlets avoids the "terminal temperature rise" caused by series arrangement, ensuring that each heat-generating component receives a nearly isothermal and uniform primary coolant flow. The cover plate 5-1 and the base plate 5-2 are double-locked using threads and sealing gaskets, forming a three-dimensional closed flow channel that can withstand the internal pressure of a typical PC water-cooling loop of 0.1–0.3 MPa without leakage.

[0040] When the coolant enters the second water-cooling tank 6-2, it travels directly to the bottom of the CPU cold head via a short-distance L-shaped flexible hose. The bottom surface is typically made of nickel-plated copper or has a microfin structure, whose high thermal conductivity allows the heat from the silicon wafer-IHS to be quickly transferred to the coolant. The third tank 6-3 similarly serves the higher-power graphics cards 3-2 and AI inference cards 3-3; the water block covers the GPU die and memory, ensuring that the temperature difference between the core and memory is less than 5 °C. The fourth tank 6-4 can flexibly connect to secondary heat sources such as the motherboard VRM, NVMe SSD heatsinks, or 100W-level accelerator cards. The advantage of multi-channel parallel connection is that each branch can be equipped with different cross-sectional areas of pipes and cold head fin densities according to the power consumption of the components, keeping the local Reynolds number in the turbulent range of 200–400, improving the convective heat transfer coefficient, while avoiding a sudden drop in flow rate due to excessive load on a single pump.

[0041] The heat carried away by each branch converges after returning to the first tank 6-1 and is introduced into the air-cooled assembly 10 via pipe 11. The air-cooled assembly is actually a 240 mm or 360 mm surface cooler: a U-shaped flat tube is expanded and joined with aluminum fins, and the fan uses positive / negative pressure mode to force cold air from outside the chassis through the fins, reducing the liquid phase temperature from about 50 °C to about 35 °C. The cooled liquid then returns to the inlet of the water pump 8, realizing a closed-loop circulation. Due to the damping matching formed by the water pump-cold plate-radiator, the steady-state flow rate of the system can reach 150–200 L h⁻¹, and the longitudinal temperature difference is only 8–12 K; combined with the piping layout of the wiring on the inner wall of the chassis 1, it reduces heat accumulation in dead corners and maintains overall system compatibility. When the external heat load increases or the GPU Boost power consumption increases, the pump speed and fan PWM will increase in tandem according to the motherboard temperature control curve to achieve dynamic heat dissipation, ensuring that the CPU core temperature is kept below 85 °C and the GPU / AI card core temperature does not exceed 75 °C, thereby ensuring the long-term stable operation of the whole machine.

[0042] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.

Claims

1. A computer having a dual or multi-path liquid cooling device, characterized by comprising: The system includes a chassis, a motherboard housed within the chassis, multiple heat-generating components, and a dual- or multi-channel liquid cooling system. The dual- or multi-channel liquid cooling system includes a water cooling plate body, a water pump, an air-cooling assembly, and piping. The water cooling plate body is fixed inside the chassis and is formed by a cover plate and a base plate. It has at least two independent water-cooling tanks inside, including a first water-cooling tank and a second water-cooling tank. The cover plate has a water pump slot and multiple through holes. The water pump is engaged in the water pump slot, and its output end is connected to the first water-cooling tank through the through holes. The first water-cooling tank is connected to the air-cooling assembly through piping. The second water-cooling tank is connected to the heat-generating components through piping and through the through holes.

2. The computer of claim 1, wherein, The number of independent water-cooling tanks is 2-4, each corresponding to at least two heat-generating components in the CPU, graphics card, and AI inference card.

3. The computer of claim 1, wherein, The air-cooling assembly includes a fan and fins. The fins are connected to a pipe that connects to the first water-cooling tank, and the fan is positioned corresponding to the fins.

4. The computer of claim 1, wherein, The cover plate and the base plate are made of acrylic. The base plate has an independent water-cooling groove milled on it, and the cover plate has a sealing pattern milled to match the water-cooling groove. The cover plate and the base plate are fixed together by screws through the edge screw holes.

5. The computer of claim 1, wherein, The water circuit board is fixed to the inner wall of the chassis with screws, and the pipeline has an L-shaped structure to adapt to the internal space layout of the chassis.

6. The computer of claim 1, wherein, A sealing gasket is provided at the connection between the water pump and the first water-cooling tank.

Images