A water-cooled computer chassis with magnetofluid application

Abstract

This utility model discloses a water-cooled computer chassis incorporating magnetic fluid application, including a support assembly, a magnetic fluid assembly, and a heat dissipation assembly. The magnetic fluid assembly and the heat dissipation assembly are located on the inner sidewall of the support assembly. The magnetic fluid assembly includes an outer surface component, a support plate, a receiving cavity, a magnet, and a microphone transmission block. The outer surface component is located on the upper surface of the support plate, and the support plate is located on the inner sidewall of the support assembly. The receiving cavity is located on the inner sidewall of the outer surface component. The magnet is located on the upper surface of the receiving cavity, and the microphone transmission block is located on the inner sidewall of the receiving cavity. The magnetic field control of the magnet in the magnetic fluid assembly can actively change the viscosity, flow direction, and thermal conductivity of the magnetic fluid: when core components such as the CPU / GPU are under high load and generate heat, the magnetic field adjustment is triggered by the microphone transmission block, driving the magnetic fluid to flow rapidly and directionally to the high heat source area, forming a precise heat conduction path; under low load, the fluidity of the magnetic fluid is reduced to reduce energy loss.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, specifically a water-cooled computer chassis incorporating magnetic fluid applications. Background Technology

[0002] With the rapid development of electronic information technology, the performance of computer hardware is constantly improving, especially the power consumption and heat generation of core components such as the central processing unit (CPU) and graphics processing unit (GPU), which are increasing exponentially. High-temperature environments not only reduce the operating efficiency of electronic components but may also cause problems such as thermal failure, shortened lifespan, and even hardware damage. Therefore, efficient and reliable heat dissipation technology has become crucial to ensuring the stable operation of computers.

[0003] Magnetofluid is a colloidal solution formed by uniformly dispersing nanoscale magnetic particles in a carrier liquid, possessing both fluidity and magnetic response characteristics. Under the influence of an external magnetic field, the viscosity, thermal conductivity, and flow direction of a magnetofluid can be precisely controlled. In existing technologies, magnetofluids have been preliminarily applied in areas such as speaker sealing and damping devices, but their application in computer heat dissipation is still in the exploratory stage. Some studies have attempted to use magnetofluids as a heat transfer medium to replace traditional coolants, but their applications are mostly limited to static heat conduction scenarios, failing to fully utilize the dynamic control characteristics of magnetofluids to achieve active thermal management. Therefore, how to combine the magnetic control characteristics of magnetofluids with the efficient heat dissipation capabilities of water-cooling systems to overcome the limitations of traditional water-cooling technology is a key challenge. To address this issue, the inventors have proposed a water-cooled computer chassis incorporating magnetofluid applications. Utility Model Content

[0004] To address the shortcomings of the aforementioned technologies, this invention provides a water-cooled computer chassis incorporating magnetic fluid applications.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a water-cooled computer chassis with magnetic fluid application, comprising a support assembly, a magnetic fluid assembly, and a heat dissipation assembly. The magnetic fluid assembly is disposed on the inner sidewall of the support assembly, and the heat dissipation assembly is disposed on the inner sidewall of the support assembly. The magnetic fluid assembly includes an outer surface component, a support plate, a receiving cavity, a magnet, and a microphone transmission block. The outer surface component is disposed on the upper surface of the support plate, the support plate is disposed on the inner sidewall of the support assembly, the receiving cavity is opened in the inner sidewall of the outer surface component, the magnet is disposed on the upper surface of the receiving cavity, and the microphone transmission block is disposed on the inner sidewall of the receiving cavity.

[0006] As a further explanation, the upper surface of the exterior component is provided with a magnetic flux placement plate, the inner sidewall of the magnetic flux placement plate is provided with the interior of the magnetic flux, and the upper surface of the magnetic flux placement plate is provided with a magnetic flux cover for sealing.

[0007] As further explained, the heat dissipation assembly includes a fan housing, a support base, and a support frame. The fan housing is disposed on the inner side wall of the support assembly, the support frame is disposed on the inner side wall of the fan housing, and the support base is disposed on the inner side wall of the support frame, so as to facilitate the support of the fan.

[0008] As further explained, the support assembly includes a support foot, a base plate, and a side plate. The base plate is disposed on the upper surface of the support foot, the side plate is disposed on the upper surface of the base plate, and the fan housing is located on the inner side wall of the side plate.

[0009] As further explained, the upper surface of the side plate is provided with an upper cover plate, one end of the upper cover plate is provided with a front cover plate, one end of the upper cover plate is provided with a rear cover plate corresponding to the front cover plate, and the support plate is located on the inner side wall of the front cover plate.

[0010] As further explained, the inner wall of the rear cover is provided with a graphics card placement plate for placing the graphics card, and the inner wall of the rear cover is provided with a power supply mounting slot.

[0011] As further explained, the inner wall of the side plate is provided with a main board.

[0012] In summary, this utility model has the following beneficial effects: This utility model provides a water-cooled computer chassis with magnetic fluid application. The magnetic field control of the magnet in the magnetic fluid component can actively change the viscosity, flow direction, and thermal conductivity of the magnetic fluid. When core components such as CPU / GPU are under high load and generate heat, the magnetic field adjustment is triggered by the microphone transmission block (which may be used to receive temperature or load signals), driving the magnetic fluid to flow rapidly and directionally to the high heat source area, forming a precise heat conduction path. Under low load, the fluidity of the magnetic fluid is reduced, reducing energy loss. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a water-cooled computer chassis with magnetic fluid application according to this utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of a water-cooled computer chassis with magnetic fluid application according to this utility model;

[0015] Figure 3 This is a schematic diagram of the support component structure of a water-cooled computer chassis with magnetic fluid application according to the present invention;

[0016] Figure 4 This is a schematic diagram of the heat dissipation component structure of a water-cooled computer chassis with magnetic fluid application according to this utility model;

[0017] Figure 5 This is an exploded view of the magnetofluid component of a water-cooled computer chassis with magnetofluid application according to this utility model. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figure 1-5 As shown, this utility model discloses a water-cooled computer chassis incorporating a magnetic fluid 24. It includes a support assembly, a magnetic fluid assembly, and a heat dissipation assembly. The magnetic fluid assembly and the heat dissipation assembly are both located on the inner wall of the support assembly. The magnetic fluid assembly includes an outer surface component 210, a support plate 211, a receiving cavity 201, a magnet 22, and a microphone transmission block 23. The outer surface component 210 is located on the upper surface of the support plate 211, which is located on the inner wall of the support assembly. The receiving cavity 201 is formed on the inner wall of the outer surface component 210. The magnet 22 is located on the upper surface of the receiving cavity 201, and the microphone transmission block 23 is located on the inner wall of the receiving cavity 201. A magnetic fluid placement plate 21 is provided on the upper surface of the outer surface component 210. The inner wall of the magnetic fluid placement plate 21 contains the interior of the magnetic fluid 24, and a magnetic fluid cover 25 for sealing is provided on the upper surface of the magnetic fluid placement plate 21.

[0020] Specifically, the magnetofluid 24 within the magnetofluid placement plate 21 consists of nanoscale magnetic particles and a carrier liquid, maintaining a natural flow state in the absence of an external magnetic field. When the device detects a localized temperature increase (e.g., through feedback from a built-in temperature sensor or microphone transmission block 23), the magnet 22 (located on the upper surface of the receiving cavity 201) is triggered to generate a magnetic field in a specific direction. At this time, the magnetic particles in the magnetofluid 24 align under the influence of the magnetic field, causing dynamic changes in their viscosity, thermal conductivity, and flow direction.

[0021] When the magnetic field is concentrated in the high-temperature region, the viscosity of the magnetic fluid 24 increases and its thermal conductivity is enhanced, which can quickly absorb and transfer heat. The magnetic field guides the magnetic fluid 24 to flow towards the heat dissipation component, actively guiding heat from the heat source to the heat dissipation path.

[0022] The magnetic fluid 24 is confined to a specific area (such as the inside of the front cover 14) by the sealing structure (such as a rubber sealing ring) between the magnetic fluid cover 25 and the magnetic fluid placement plate 21, thus preventing leakage. At the same time, the side plate 15, bottom plate 12, top cover 13 and other structures in the support assembly provide a stable installation foundation for the magnetic fluid assembly and heat dissipation assembly, ensuring the stability of magnetic field control and fluid flow.

[0023] The heat dissipation assembly includes a fan housing 31, a support base 32, and a support frame 33. The fan housing 31 is located on the inner wall of the support assembly, the support frame 33 is located on the inner wall of the fan housing 31, and the support base 32 is located on the inner wall of the support frame 33, so as to facilitate the support of the fan.

[0024] Specifically, the fan (not shown) in the heat dissipation assembly (located inside the fan housing 31 and fixed by the support base 32 and the support frame 33) is activated to accelerate the airflow around the radiator and quickly expel heat from the chassis.

[0025] The support assembly includes support feet 11, a base plate 12, and a side plate 15. The base plate 12 is located on the upper surface of the support feet 11, and the side plate 15 is located on the upper surface of the base plate 12. The fan housing 31 is located on the inner side wall of the side plate 15. The upper surface of the side plate 15 has an upper cover plate 13. One end of the upper cover plate 13 has a front cover plate 14, and the other end of the upper cover plate 13 has a rear cover plate 18 corresponding to the front cover plate 14. A support plate 211 is located on the inner side wall of the front cover plate 14. The inner side wall of the rear cover plate 18 has a graphics card mounting plate 16 for placing the graphics card, and a power supply mounting slot 17 is formed in the inner side wall of the rear cover plate 18. The inner side wall of the side plate 15 has a motherboard 1.

[0026] Specifically, the support components serve as the basic framework, forming a closed heat dissipation space through structures such as the base plate 12, side plate 15, and top cover plate 13. The front cover plate 14 and rear cover plate 18 correspond to the air intake and exhaust channels, respectively, while the motherboard 1, graphics card placement plate 16, and other components provide mounting positions for the hardware.

[0027] The magnetic field control of magnet 22 in the magnetofluid assembly can actively change the viscosity, flow direction and thermal conductivity of magnetofluid 24: when core components such as CPU / GPU are under high load and generate heat, the magnetic field adjustment is triggered by microphone transmission block 23 (which may be used to receive temperature or load signals), driving magnetofluid 24 to flow rapidly and directionally to the high heat source area, forming a precise heat conduction path; when the load is low, the fluidity of magnetofluid 24 is reduced to reduce energy loss.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A water-cooled computer case with magnetic fluid applications, characterized by: Including support components; A magnetic flux assembly, wherein the magnetic flux assembly is disposed on the inner sidewall of the support assembly; A heat dissipation component is disposed on the inner sidewall of the support component; The magnetohydrodynamic assembly includes an outer surface component, a support plate, a receiving cavity, a magnet, and a microphone transmission block. The outer surface component is disposed on the upper surface of the support plate, the support plate is disposed on the inner sidewall of the support assembly, the receiving cavity is opened in the inner sidewall of the outer surface component, the magnet is disposed on the upper surface of the receiving cavity, and the microphone transmission block is disposed on the inner sidewall of the receiving cavity.

2. A water-cooled computer case with magnetic fluid application according to claim 1, characterized in that: The upper surface of the exterior component is provided with a magnetic flux placement plate, the inner sidewall of the magnetic flux placement plate is provided with the interior of the magnetic flux, and the upper surface of the magnetic flux placement plate is provided with a magnetic flux cover for sealing.

3. A water-cooled computer case with magnetic fluid application according to claim 1, characterized in that: The heat dissipation assembly includes a fan housing, a support base, and a support frame. The fan housing is located on the inner wall of the support assembly, the support frame is located on the inner wall of the fan housing, and the support base is located on the inner wall of the support frame, which facilitates the support of the fan.

4. A water-cooled computer case with magnetic fluid application according to claim 3, characterized in that: The support assembly includes a support foot, a base plate, and a side plate. The base plate is located on the upper surface of the support foot, the side plate is located on the upper surface of the base plate, and the fan housing is located on the inner side wall of the side plate.

5. A water-cooled computer chassis for magnetic fluid applications according to claim 4, characterized in that: The upper surface of the side plate is provided with an upper cover plate, one end of the upper cover plate is provided with a front cover plate, one end of the upper cover plate is provided with a rear cover plate corresponding to the front cover plate, and the support plate is located on the inner side wall of the front cover plate.

6. A water-cooled computer chassis for magnetic fluid applications according to claim 5, characterized in that: The inner wall of the rear cover is provided with a graphics card placement plate for placing the graphics card, and the inner wall of the rear cover is provided with a power supply mounting slot.

7. A water-cooled computer chassis for magnetic fluid applications according to claim 4, characterized in that: The inner wall of the side panel is provided with a main board.

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