Liquid cooling heat dissipation device and server board

Abstract

This utility model relates to a liquid cooling heat dissipation device and a server board. The liquid cooling heat dissipation device includes a liquid cooling plate and a heat exchanger. The liquid cooling plate is used to abut against the chip packaging unit of the server board to form a first cooling cavity between the liquid cooling plate and the chip packaging unit. The first cooling cavity is used to accommodate part of the heat sink of the chip packaging unit, and the liquid cooling plate is provided with an inlet and an outlet communicating with the first cooling cavity. One end of the heat exchanger is connected to the inlet, and the other end of the heat exchanger is connected to the outlet. The heat exchanger is used to cool the cooling medium entering the first cooling cavity through the inlet. By forming a first cooling cavity between the liquid cooling plate and the chip packaging unit, the cooling medium can immerse part of the heat sink contained in the first cooling cavity to remove heat from the heat sink, thereby improving the heat dissipation effect. The heat exchanger further cools the cooling medium, thus achieving cyclic heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of server technology, and in particular to liquid cooling heat dissipation devices and server boards. Background Technology

[0002] As electronic devices such as servers continue to evolve towards higher integration, miniaturization, and higher frequencies, the heat dissipation requirements of these devices during engineering applications and production testing (power-on testing) are also increasing. Integrated chips and heat sinks, with their lower thermal resistance, are the preferred solution for meeting the higher heat flux density requirements of engineering applications. For boards with integrated heat sink chips, testing is indispensable, serving as the final barrier before delivery to the user. While traditional air cooling can provide some heat dissipation, it is often insufficient to meet the increasingly demanding cooling requirements. Although total immersion liquid cooling can achieve efficient heat dissipation, it requires immersing the entire device in the liquid cooling medium, which undoubtedly increases the cost of both the equipment and the cooling medium. Utility Model Content

[0003] Therefore, it is necessary to provide a liquid cooling device to address the technical problem that existing heat dissipation systems are either ineffective or costly and cannot meet the heat dissipation requirements during the chip power-on testing process.

[0004] A liquid cooling heat dissipation device for a server board, the liquid cooling heat dissipation device comprising:

[0005] A liquid cooling plate, wherein the liquid cooling plate is used to abut against a chip packaging unit of a server board, thereby enclosing a first cooling cavity between the liquid cooling plate and the chip packaging unit, the first cooling cavity being used to accommodate part of the heat sink of the chip packaging unit, and the liquid cooling plate having an inlet and an outlet communicating with the first cooling cavity; and,

[0006] A heat exchanger, one end of which is connected to the liquid inlet and the other end of which is connected to the liquid outlet, is used to cool the cooling medium that enters the first cooling chamber through the liquid inlet.

[0007] In one embodiment, the liquid cooling plate includes a first plate segment and two second plate segments connected to the first plate segment. The two second plate segments are respectively located on both sides of the first plate segment. The first plate segment is used to abut against the heat sink to form the first cooling cavity, and the second plate segments are used to abut against the target component on the motherboard of the server board.

[0008] In one embodiment, the second plate segment is provided with a first thermal interface material layer, and the second plate segment is used to abut against the target component on the motherboard through the first thermal interface material layer.

[0009] In one embodiment, the second plate segment is provided with a second cooling cavity, which is in communication with the first cooling cavity.

[0010] In one embodiment, the second plate segment has a clearance groove on the side facing the main board.

[0011] In one embodiment, the liquid cooling heat dissipation device further includes a sealing ring, which is disposed between the liquid cooling plate and the chip packaging unit, and is used to seal the first cooling cavity.

[0012] This utility model also provides a server board that can solve at least one of the above-mentioned technical problems.

[0013] A server board includes the liquid cooling heat dissipation device described above, and further includes a motherboard and a chip packaging unit. The chip packaging unit includes a chip, an integrated substrate, and a heat sink. The chip is disposed between the heat sink and the integrated substrate and is connected to the heat sink and the integrated substrate. The side of the integrated substrate opposite to the chip is connected to the motherboard.

[0014] In one embodiment, the heat sink includes a heat sink substrate and a plurality of heat sink fins, each of the heat sink fins being spaced apart along a first direction on the side of the heat sink substrate opposite to the chip, the liquid cooling plate abutting against the heat sink substrate, and the heat sink fins being housed in the first cooling cavity.

[0015] In one embodiment, the side of the heat dissipation fins facing away from the heat dissipation substrate abuts against the cavity wall of the first cooling cavity.

[0016] In one embodiment, the heat dissipation fins extend along a second direction, and the liquid inlet and the liquid outlet are located at both ends of the liquid cooling plate along the second direction, wherein the second direction is set at an angle to the first direction.

[0017] Beneficial effects:

[0018] The liquid cooling heat dissipation device provided in this embodiment of the utility model is used for server boards. The liquid cooling heat dissipation device includes a liquid cooling plate and a heat exchanger. The liquid cooling plate is used to abut against the chip packaging unit of the server board to form a first cooling cavity between the liquid cooling plate and the chip packaging unit. The first cooling cavity is used to accommodate part of the heat sink of the chip packaging unit. The liquid cooling plate is provided with an inlet and an outlet that communicate with the first cooling cavity. One end of the heat exchanger is connected to the inlet, and the other end of the heat exchanger is connected to the outlet. The heat exchanger is used to cool the cooling medium that enters the first cooling cavity through the inlet. The liquid cooling plate is attached to the chip packaging unit of the server board, thereby creating a first cooling cavity between the liquid cooling plate and the chip packaging unit. This allows the cooling medium entering the first cooling cavity through the liquid inlet to immerse part of the heat sink on the chip packaging unit housed in the first cooling cavity, thereby removing heat from the heat sink and improving the heat dissipation effect. By setting up heat exchange components connected to the liquid inlet and outlet, the cooling medium entering the first cooling cavity through the liquid inlet is cooled, thereby achieving circulating heat dissipation. That is, while steadily improving the heat dissipation efficiency, compared with the existing technology of overall immersion liquid cooling, the partial cold plate liquid cooling method in this application can also reduce the cost of equipment and cooling medium.

[0019] This utility model also provides a server board, including the aforementioned liquid cooling heat dissipation device, and further including a motherboard and a chip packaging unit. The chip packaging unit includes a chip and a heat sink connected to the chip, with the chip disposed between the motherboard and the heat sink. This server board can achieve at least one of the aforementioned technical effects. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention.

[0021] Figure 2 This is a first schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board.

[0022] Figure 3 This is a second schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board.

[0023] Figure 4 The third schematic diagram shows a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board.

[0024] Icon labels:

[0025] 100-Liquid cooling plate; 110-First cooling chamber; 111-Liquid inlet; 112-Liquid outlet; 120-First plate segment; 130-Second plate segment; 140-Second cooling chamber; 150-Allowing groove; 160-First thermal interface material layer; 170-Target component; 180-Sealing ring; 190-Limiting groove; 200-Heat exchanger; 210-Heat exchanger; 220-First tube; 230-Second tube; 300-Chip packaging unit; 310-Chip; 320-Heat sink; 321-Heat dissipation substrate; 322-Heat dissipation fins; 323-Flow channel; 330-Support base; 331-Accommodation groove; 340-Second thermal interface material layer; 350-Integrated substrate; 400-Main board. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] As servers and other electronic devices continue to evolve towards higher integration, miniaturization, and higher frequencies, the demands on heat dissipation performance are becoming increasingly stringent. While traditional air cooling can provide some cooling, it is often insufficient to meet these growing cooling requirements. Although total immersion liquid cooling can achieve highly efficient heat dissipation, it requires immersing the entire device in the cooling medium, which undoubtedly increases the cost of both the equipment and the cooling medium.

[0033] To address the aforementioned problems, one embodiment of this utility model provides a liquid cooling heat dissipation device applied to server boards. This device enables cyclic heat dissipation, steadily improving heat dissipation efficiency while reducing the cost of equipment and the liquid cooling medium. The following is a detailed description of this liquid cooling heat dissipation device.

[0034] See Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention. Figure 2 This is a first schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board. The liquid cooling heat dissipation device provided in this embodiment of the present invention includes a liquid cooling plate 100 and a heat exchanger 200. The liquid cooling plate 100 is used to abut against a chip packaging unit 300 of the server board, forming a first cooling cavity 110 between the liquid cooling plate 100 and the chip packaging unit 300. The first cooling cavity 110 is used to accommodate a portion of the heat sink 320 of the chip packaging unit 300, and the liquid cooling plate 100 is provided with an inlet 111 and an outlet 112 communicating with the first cooling cavity 110. One end of the heat exchanger 200 is connected to the inlet 111, and the other end of the heat exchanger 200 is connected to the outlet 112. The heat exchanger 200 is used to cool the cooling medium entering the first cooling cavity 110 through the inlet 111.

[0035] Specifically, the liquid cooling plate 100 abuts against the chip packaging unit 300 of the server board, thereby forming a first cooling cavity 110 between the liquid cooling plate 100 and the chip packaging unit 300. This allows the low-temperature cooling medium entering the first cooling cavity 110 through the liquid inlet 111 to immerse part of the heat sink 320 on the chip packaging unit 300 housed in the first cooling cavity 110, removing heat from the heat sink 320 and thus cooling the chip 310. Furthermore, by providing a heat exchanger 200 connected to the liquid inlet 111 and the liquid outlet 112, the high-temperature cooling medium flowing out through the liquid outlet 112 is cooled, allowing the cooling medium entering the first cooling cavity 110 through the liquid inlet 111 to return to a low-temperature state, thus achieving cyclic heat dissipation. While steadily improving heat dissipation efficiency, compared to overall immersion liquid cooling, the partial cold plate liquid cooling method used in this application can also reduce the cost of equipment and cooling medium.

[0036] The cooling medium flows into the first cooling chamber 110 through the inlet 111. After exchanging heat with the heat sink 320 of the chip packaging unit 300, the high-temperature cooling medium flows out through the outlet 112, thus achieving cooling. After heat exchange through the heat exchanger 200, the low-temperature cooling medium flows back into the first cooling chamber 110 through the inlet 111 for circulating heat dissipation. Preferably, the cooling medium is a fluorinated liquid.

[0037] It should be noted that the server board includes a motherboard 400, a chip packaging unit 300, and a liquid cooling device. The chip packaging unit 300 includes a chip 310, an integrated substrate 350, and a heat sink 320. The chip 310 is disposed between the integrated substrate 350 and the heat sink 320 and is connected to both. The side of the integrated substrate 350 facing away from the chip 310 is connected to the motherboard 400. The heat sink 320 includes a heat sink substrate 321 and multiple heat sink fins 322, with each heat sink fin 322 spaced apart on the side of the heat sink substrate 321 facing away from the chip 310. In this application, the liquid cooling plate 100 abuts against the heat sink substrate 321 to form a first cooling cavity 110 between the liquid cooling plate 100 and the heat sink substrate 321, and each heat sink fin 322 is accommodated in the first cooling cavity 110, thereby increasing the contact area between the heat sink 320 and the cooling medium and improving heat dissipation performance.

[0038] Furthermore, the liquid inlet 111 and liquid outlet 112 are located on the side of the liquid cooling plate 100 away from the motherboard 400 of the server board, thereby facilitating the overall piping layout and preventing interference with the electronic components on the motherboard 400. The liquid inlet 111 uses a liquid inlet connector, and the liquid outlet 112 uses a liquid outlet connector. The liquid inlet and liquid outlet connectors are welded and fixed to the liquid cooling plate 100, thereby connecting the liquid inlet 111 and liquid outlet 112 to the first cooling chamber 110.

[0039] See Figure 1 In one embodiment, the heat exchanger 200 includes a heat exchanger 210, a first pipe 220, and a second pipe 230. One end of the first pipe 220 is connected to the liquid inlet 111, and the other end is connected to the outlet of the heat exchanger 210. One end of the second pipe 230 is connected to the liquid outlet 112, and the other end is connected to the inlet of the heat exchanger 210. The heat exchanger 210 is used to exchange heat with the cooling medium flowing into the first pipe 220 via the second pipe 230, so as to reduce the temperature of the cooling medium flowing into the first cooling chamber 110, thereby performing circulating heat dissipation and improving heat dissipation efficiency.

[0040] See Figure 1 , Figure 2 and Figure 3 , Figure 3 This is a second schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board. In one embodiment, the liquid cooling plate 100 includes a first plate segment 120 and two second plate segments 130 connected to the first plate segment 120. The two second plate segments 130 are respectively located on both sides of the first plate segment 120. The first plate segment 120 is used to abut against the heat sink 320 to form a first cooling cavity 110, and the second plate segments 130 are used to abut against the target component 170 on the motherboard 400 of the server board.

[0041] Specifically, the target component 170 is a heat-generating component mounted on the motherboard 400, such as a metal oxide semiconductor field effect transistor (MOS). The target component 170 is located on one side of the chip 310 and is in contact with the second plate segment 130. This allows the target component 170 to conduct heat to the cooling medium inside the first cooling cavity 110 of the liquid cooling plate 100 through the second plate segment 130. The heat is carried away by the flow of the cooling medium. In other words, by expanding the size of the liquid cooling plate 100, the range of electronic components of the server board cooled by the liquid cooling plate 100 is expanded, thereby improving the overall heat dissipation performance.

[0042] See Figure 1 , Figure 2 and Figure 3 In one embodiment, the second plate segment 130 is provided with a first thermal interface material layer 160, and the second plate segment 130 is used to abut against the target component 170 on the motherboard 400 through the first thermal interface material layer 160.

[0043] Specifically, a first thermal interface material layer 160 is filled between the target component 170 and the second plate segment 130 to ensure thermal contact between them, thereby facilitating heat conduction and improving the heat dissipation reliability of the liquid cooling device. The first thermal interface material layer 160 can be silicone grease, a thermal pad, or the like.

[0044] See Figure 1 , Figure 2 and Figure 4 , Figure 4 This is a third schematic diagram of a liquid cooling heat dissipation device provided in an embodiment of the present invention applied to a server board. In one embodiment, a second cooling cavity 140 is provided in the second board segment 130, and the second cooling cavity 140 is connected to the first cooling cavity 110.

[0045] Specifically, the second cooling chamber 140 is connected to the first cooling chamber 110, allowing the cooling medium in the first cooling chamber 110 to flow into the second cooling chamber 140 to remove heat from the second plate segment 130, thereby improving the heat dissipation efficiency for the target component 170. Preferably, the second cooling chamber 140 extends to the region of the second plate segment 130 corresponding to the target component 170.

[0046] See Figure 1 , Figure 2 , Figure 3 and Figure 4In one embodiment, the second board segment 130 has a clearance groove 150 on the side facing the motherboard 400, which can avoid other electronic components on the motherboard 400, thereby allowing for the proper arrangement of the liquid cooling plate 100. In addition, the clearance groove 150 can also protect other electronic components on the motherboard 400.

[0047] See Figure 1 , Figure 2 , Figure 3 and Figure 4 In one embodiment, the liquid cooling heat dissipation device further includes a sealing ring 180, which is disposed between the liquid cooling plate 100 and the chip packaging unit 300 and is used to seal the first cooling cavity 110.

[0048] Specifically, the sealing ring 180 is located between the liquid cooling plate 100 and the radiator 320 to seal the gap between the liquid cooling plate 100 and the radiator 320, thereby sealing the first cooling chamber 110. This allows the cooling medium in the first cooling chamber 110 to stably submerge part of the radiator 320 and allows the cooling medium in the first cooling chamber 110 to be introduced into the heat exchanger 210 through the liquid outlet 112 to cool the high-temperature cooling medium. This allows the cooling medium to circulate and dissipate heat, improving the reliability of the liquid cooling heat dissipation device.

[0049] Furthermore, the liquid cooling plate 100 is provided with a limiting groove 190 on the side facing the motherboard 400. The limiting groove 190 is arranged around the circumference of the chip packaging unit 300. The sealing ring 180 is accommodated in the limiting groove 190, thereby stably limiting the position of the sealing ring 180 to stably seal the first cooling cavity 110.

[0050] See Figure 1 , Figure 2 , Figure 3 and Figure 4 This utility model embodiment also provides a server board, including the above-mentioned liquid cooling heat dissipation device, and further including a motherboard 400 and a chip packaging unit 300. The chip packaging unit 300 includes a chip 310, an integrated substrate 350 and a heat sink 320. The chip 310 is disposed between the integrated substrate 350 and the heat sink 320 and is connected to the integrated substrate 350 and the heat sink 320. The side of the integrated substrate 350 away from the chip 310 is connected to the motherboard 400.

[0051] Specifically, this application uses a liquid cooling plate 100 to abut against the chip packaging unit 300 of the server board, thereby creating a first cooling cavity 110 between the liquid cooling plate 100 and the chip packaging unit 300. This allows the low-temperature cooling medium entering the first cooling cavity 110 through the liquid inlet 111 to contact part of the heat sink 320 of the chip packaging unit 300 contained in the first cooling cavity 110 with the cooling medium, removing heat from the heat sink 320 to cool the chip 310. Furthermore, by providing a heat exchanger 200 connected to the liquid inlet 111 and the liquid outlet 112, the high-temperature cooling medium flowing out through the liquid outlet 112 is cooled, allowing the cooling medium entering the first cooling cavity 110 through the liquid inlet 111 to return to a low-temperature state, thus achieving cyclic heat dissipation. While steadily improving heat dissipation efficiency, compared to overall immersion liquid cooling, the partial cold plate liquid cooling method used in this application can also reduce the cost of equipment and cooling medium.

[0052] Furthermore, the heat sink 320 and the chip 310 are integrated into a single package. The side wall of the heat sink 320 facing the motherboard 400 is soldered to the chip 310, and the chip 310 is fixed to the motherboard 400 by soldering. Soldering improves the reliability of the connection.

[0053] Furthermore, a second thermal interface material layer 340 is provided between the heat sink 320 and the chip 310. The presence of the second thermal interface material layer 340 reduces the contact thermal resistance between the chip 310 and the heat sink 320, thereby facilitating heat conduction and improving the heat dissipation efficiency of the chip 310. Preferably, the second thermal interface material layer 340 is made of the same material as the first thermal interface material layer 160.

[0054] It should be noted that when the chip 310 is attached to the heat sink 321, there are often extremely fine and uneven gaps between them. If the chip 310 and the heat sink 320 are directly connected, these gaps will reduce the contact area between them, and air will be trapped within these gaps. Because air has low thermal conductivity, the contact thermal resistance between the chip 310 and the heat sink 320 will be high, severely hindering heat conduction. Therefore, using a welding thermal interface material can fully fill these gaps, expelling the air and establishing an effective heat conduction channel between the chip 310 and the heat sink 320, significantly reducing contact thermal resistance and improving heat dissipation performance. During the welding process, appropriate pressure needs to be applied to the heat sink 320 to ensure tight contact between the heat sink 320 and the second thermal interface material layer 340.

[0055] Furthermore, the projected area of ​​the heatsink 320 relative to the motherboard 400 is larger than the projected area of ​​the chip 310 relative to the motherboard 400, allowing the projected area of ​​the heatsink 320 relative to the motherboard 400 to completely cover the projected area of ​​the chip 310 relative to the motherboard 400. In other words, after the chip 310 is soldered to the heatsink 320, the heatsink 320 can completely cover the chip 310 to fully absorb the heat generated by the chip 310.

[0056] See Figure 1 and Figure 2 In one embodiment, the heat sink 320 includes a heat sink substrate 321 and a plurality of heat sink fins 322. Each heat sink fin 322 is spaced apart along a first direction on the side of the heat sink substrate 321 away from the chip 310. The liquid cooling plate 100 abuts against the heat sink substrate 321, and the heat sink fins 322 are accommodated in the first cooling cavity 110.

[0057] Specifically, the liquid cooling plate 100 abuts against the heat dissipation substrate 321 to form a first cooling cavity 110. By accommodating the heat dissipation fins 322 in the first cooling cavity 110, the contact area between the heat sink 320 and the cooling medium is increased, thereby improving the heat dissipation performance of the heat sink 320.

[0058] Furthermore, the projected area of ​​the heat sink 322 relative to the motherboard 400 is larger than the projected area of ​​the chip 310 relative to the motherboard 400, so that the projected area of ​​the heat sink 322 relative to the motherboard 400 can cover the projected area of ​​the chip 310 relative to the motherboard 400. In other words, after the chip 310 is soldered to the heat sink substrate 321, the heat sink 322 can completely cover the chip 310 to fully absorb the heat generated by the chip 310.

[0059] See Figure 1 , Figure 2 , Figure 3 and Figure 4 In one embodiment, the side of the heat dissipation fin 322 facing away from the heat dissipation substrate 321 abuts against the cavity wall of the first cooling cavity 110, thereby forming a plurality of flow channels 323 spaced apart along the first direction between adjacent heat dissipation fins 322, so that the cooling medium in the first cooling cavity 110 passes through the flow channels 323, thereby stably removing the heat on the heat dissipation fins 322.

[0060] See Figure 1 , Figure 2 , Figure 3 and Figure 4 In one embodiment, the heat dissipation fins 322 extend along a second direction, and the liquid inlet 111 and the liquid outlet 112 are located at both ends of the liquid cooling plate 100 along the second direction, wherein the second direction is set at an angle to the first direction.

[0061] Specifically, the cooling medium entering through the inlet 111 flows through the flow channels 323 extending in the second direction to one end near the outlet 112, so as to absorb heat from each heat dissipation fin 322 at the same time. Then, through the heat exchanger 210, the cooled medium dissipates heat from each heat dissipation fin 322 again, thereby improving the heat dissipation uniformity and the heat dissipation effect.

[0062] Furthermore, the second direction is perpendicular to the first direction and also perpendicular to the thickness direction of the chip packaging unit 300. Here, the first direction is the width direction of the chip packaging unit 300, and the second direction is the length direction of the chip packaging unit 300. In other embodiments, the first direction is the length direction of the chip packaging unit 300, and the second direction is the width direction of the chip packaging unit 300.

[0063] See Figure 1 and Figure 2 In one embodiment, the chip packaging unit 300 further includes a support base 330, which is disposed between the integrated substrate 350 and the heat sink 320 substrate to support the heat sink substrate 321, thereby improving the stability of the chip packaging unit 300. The support base 330 is a metal ring circumferentially arranged around the heat sink 320 and is bonded to the integrated substrate 350 by an adhesive layer.

[0064] Furthermore, the support base 330 has a receiving groove 331 on the side facing the motherboard 400 for accommodating some electronic components, thus providing protection. It should be noted that when soldering the chip 310 relative to the heat sink 320, the receiving groove 331 on the support base 330 can cover the electronic components, improving the problem of soldering products splashing onto and damaging the electronic components. The location, number, and size of the receiving groove 331 are selected according to the actual location, number, shape, and size of the electronic components. For example, the receiving groove 331 may be an annular groove surrounding the heat sink 320; or, there may be multiple receiving grooves 331 arranged circumferentially around the heat sink 320. The motherboard 400 is soldered to the integrated substrate 350.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A liquid cooling heat sink for a server board card, comprising: The liquid cooling heat dissipation device includes: A liquid cooling plate, wherein the liquid cooling plate is used to abut against a chip packaging unit of a server board to form a first cooling cavity between the liquid cooling plate and the chip packaging unit, the first cooling cavity being used to accommodate a portion of the heat sink on the chip packaging unit, and the liquid cooling plate having an inlet and an outlet communicating with the first cooling cavity; and, A heat exchanger, one end of which is connected to the liquid inlet and the other end of which is connected to the liquid outlet, is used to cool the cooling medium that enters the first cooling chamber through the liquid inlet.

2. The liquid cooling heat sink of claim 1, wherein, The liquid cooling plate includes a first plate segment and two second plate segments connected to the first plate segment. The two second plate segments are respectively located on both sides of the first plate segment. The first plate segment is used to abut against the heat sink to form the first cooling cavity. The second plate segments are used to abut against the target component on the motherboard of the server board.

3. The liquid cooling heat sink of claim 2, wherein, The second plate segment is provided with a first thermal interface material layer, and the second plate segment is used to abut against the target component on the motherboard through the first thermal interface material layer.

4. The liquid cooling heat sink of claim 2, wherein, The second plate segment is provided with a second cooling cavity, which is connected to the first cooling cavity.

5. The liquid cooling heat sink of claim 2, wherein, The second plate segment has a clearance groove on the side facing the main plate.

6. The liquid cooling heat sink of any one of claims 1-5, wherein, The liquid cooling heat dissipation device also includes a sealing ring, which is used to be disposed between the liquid cooling plate and the chip packaging unit, and the sealing ring is used to seal the first cooling cavity.

7. A server board card, characterized by, The liquid cooling heat dissipation device according to any one of claims 1-6 further includes a motherboard and a chip packaging unit. The chip packaging unit includes a chip, an integrated substrate and a heat sink. The chip is disposed between the heat sink and the integrated substrate and is connected to the heat sink and the integrated substrate. The side of the integrated substrate opposite to the chip is connected to the motherboard.

8. The server board card of claim 7, wherein, The heat sink includes a heat sink substrate and a plurality of heat sink fins. Each heat sink fin is spaced apart along a first direction on the side of the heat sink substrate opposite to the chip. The liquid cooling plate abuts against the heat sink substrate, and the heat sink fins are housed in the first cooling cavity.

9. The server board card of claim 8, wherein, The heat dissipation fins abut against the cavity wall of the first cooling chamber on the side opposite to the heat dissipation substrate.

10. The server board card of claim 9, wherein, The heat dissipation fins extend along a second direction, and the liquid inlet and the liquid outlet are located at both ends of the liquid cooling plate along the second direction, wherein the second direction is set at an angle to the first direction.

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