A heat sink aluminum substrate
By designing a detachable heatsink fin structure, the problem of difficult disassembly and cleaning of heatsink fins in existing technologies is solved, realizing a convenient maintenance process and efficient dust cleaning, and improving the maintenance efficiency of the aluminum base plate of the graphics card heatsink.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN GUORUN HARDWARE PROD CO LTD
- Filing Date
- 2025-09-15
- Publication Date
- 2026-07-31
AI Technical Summary
The integrated design of the heat dissipation fins on the aluminum base plate of existing graphics card heat sinks makes them difficult to disassemble and clean, leading to dust accumulation and affecting heat dissipation performance.
The design features a detachable heatsink fin structure connected by removable screws, facilitating fin removal and cleaning.
The maintenance process for the heat sink fins has been simplified, the maintenance efficiency of the substrate has been improved, and the stability of the heat dissipation effect has been ensured.
Smart Images
Figure CN224581861U_ABST
Abstract
Description
[0001] This utility model relates to the technical field of graphics card substrates, specifically to a heat sink aluminum substrate. Background Technology
[0002] Aluminum substrate for graphics card heatsinks is an important heat dissipation material, widely used in electronic devices, especially in the field of graphics card heat dissipation. It is mainly based on aluminum and is responsible for conducting heat from electronic components to the external heat dissipation environment. The aluminum substrate utilizes its high thermal conductivity to quickly conduct heat to external heat dissipation devices (such as heat sinks or air), thereby reducing the temperature of the device and ensuring the normal operation of the equipment.
[0003] Aluminum substrates are mainly used for core heat dissipation in graphics cards. Their main function is to conduct the heat generated by the graphics card chip to the aluminum substrate through thermally conductive materials. Utilizing the high thermal conductivity of the aluminum substrate, the heat is further transferred to the heat sink fins or external heat dissipation devices. During the heat dissipation process, the heat sink fins become charged due to friction in the airflow. Charged bodies easily attract dust particles from the air. The airflow will carry dust to the fin surface, causing dust to accumulate in the gaps between the fins, affecting the heat dissipation effect and requiring regular cleaning. However, existing heat sink fins are fixed to the substrate as a single piece, and the gaps between the heat sink fins are small, making it difficult to clean the dust. Utility Model Content
[0004] This utility model provides a heat sink aluminum substrate with the advantages of easy disassembly of heat sink fins and convenient cleaning and maintenance of heat sink fins, so as to solve the problem of inconvenient disassembly and cleaning of existing substrate heat sink fin integrated design.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat sink aluminum substrate, comprising a substrate body, wherein the substrate body includes a ventilation section and a heat dissipation section, wherein: The substrate body surface is fitted with a flat copper tube for heat conduction, and a fixing foot plate is detachably installed on one side of the substrate. Preferably, the substrate body is provided with a plurality of through mounting holes, and the fixing foot plate is mounted on the side of the substrate body by mounting screws.
[0006] The heat dissipation section includes symmetrically arranged heat dissipation fins, which are detachably mounted on both sides of the substrate body and are attached to the upper side of the flat copper tube. Preferably, the flat copper tubes are arranged in a U-shape on the upper end of the substrate body, and the heat dissipation fins are symmetrically covered by two parts on the protrusions on both sides of the flat copper tubes.
[0007] Preferably, the heat dissipation fins are arranged at equal intervals with tiny gaps between each fin, and an assembly plate connecting all the heat dissipation fins is installed on the side of each heat dissipation fin. The assembly plate is connected to the base plate body by disassembly screws.
[0008] Preferably, the upper end of the substrate body is symmetrically provided with a plurality of insertion slots, the insertion slots are evenly distributed on both sides of the protruding parts at both ends of the flat copper tube, and the bottom of the heat dissipation fins protrudes downward and is movably connected to the insertion slots.
[0009] The ventilation section includes a fixed aluminum plate in the middle of the substrate body for ventilation.
[0010] Preferably, the ventilation section includes multiple ventilation plates that are mounted through the fixed aluminum plate. The ventilation plates are provided with through air slots, and the upper end of the fixed aluminum plate is also provided with multiple mounting holes for fixing cooling fans.
[0011] In one specific technical solution, two ventilation panels are provided, and the two ventilation panels are symmetrically fixed inside the fixed aluminum plate.
[0012] In another specific technical solution, three ventilation plates are provided, which are equidistantly arranged in a fixed aluminum plate. Extended fins are installed on the side of the heat dissipation fins that are close to each other, and the extended fins are attached to the upper end of the flat copper tube.
[0013] Compared with the prior art, the present invention provides an aluminum substrate for a heat sink, which has the following advantages: This invention features detachable heat sink fins, allowing for the removal and cleaning of heat sink fins used for heat dissipation after prolonged operation and dust accumulation on the graphics card substrate, without disassembling the substrate itself. This simplifies the maintenance process for the heat sink fins, and the removed fins allow for more convenient and faster dust removal from the gaps, thus improving the overall maintenance efficiency of the substrate. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present utility model; Figure 2 This is a schematic diagram showing the overall structure of this utility model disassembled; Figure 3 This is a schematic diagram of the substrate body structure of this utility model; Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model; Figure 5 This utility model Figure 4 Enlarged view of area A in the middle.
[0015] In the diagram: 1. Base plate body; 11. Mounting hole base; 12. Insertion slot; 13. Flat copper tube; 2. Fixing foot plate; 21. Assembly screw; 3. Ventilation section; 31. Fixing aluminum plate; 32. Ventilation plate; 321. Air duct; 33. Mounting hole base; 4. Heat dissipation section; 41. Assembly plate; 42. Removal screw; 43. Heat dissipation fins; 431. Extension fins. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1
[0017] Please see the appendix Figure 1-3 A heat sink aluminum substrate includes a substrate body 1, the substrate body 1 including a ventilation section 3 and a heat dissipation section 4, wherein: A flat copper tube 13 for heat conduction is mounted on the surface of the substrate body 1, and a fixing foot plate 2 is detachably mounted on one side of the substrate. The heat dissipation section 4 includes symmetrically arranged heat dissipation fins 43, which are detachably mounted on both sides of the substrate body 1 and are attached to the upper side of the flat copper tube 13. The ventilation section 3 includes a fixed aluminum plate 31 in the middle of the substrate body 1 for ventilation.
[0018] Please refer to the appendix. Figure 3 The ventilation section 3 includes multiple ventilation plates 32 that are installed through the fixed aluminum plate 31. The ventilation plates 32 are provided with through air slots 321. The upper end of the fixed aluminum plate 31 is also provided with multiple mounting holes 33 for fixing the cooling fan.
[0019] Specifically, the cooling fan on the graphics card is fixed to the outside of the base plate through mounting hole 33. In this embodiment, it is used for a dual-fan model graphics card, and the number of cooling fans installed is two.
[0020] Furthermore, there are two ventilation panels 32, which are symmetrically fixed inside the fixed aluminum plate 31.
[0021] In this embodiment, the two ventilation plates 32 correspond to the cooling fans and are used for graphics cards with dual cooling fans.
[0022] Please refer to the appendix. Figure 2 Appendix Figure 3 The flat copper tubes 13 are arranged in a U-shape on the upper part of the substrate body 1, and the heat dissipation fins 43 are symmetrically covered by two parts on the protrusions on both sides of the flat copper tubes 13.
[0023] Furthermore, the heat dissipation fins 43 are arranged at equal intervals with tiny gaps between each fin. An assembly plate 41 connecting all the heat dissipation fins 43 is installed on the side of the heat dissipation fins 43. The assembly plate 41 is connected to the base plate body 1 by disassembly screws 42.
[0024] Specifically, when the components and other parts mounted on the substrate 1 generate heat during use, some of the heat is conducted from the electronic components to the external heat dissipation environment through the aluminum substrate 1, which is based on aluminum. At the same time, some of the heat is absorbed by the flat copper tube 13. The heat is transferred along the flat copper tube 13 to both sides of the flat copper tube 13 and then dissipated through the heat dissipation fins 43.
[0025] Furthermore, the upper end of the substrate body 1 is symmetrically provided with a plurality of insertion slots 12, which are evenly distributed on both sides of the protruding parts at both ends of the flat copper tube 13. The bottom of the heat dissipation fin 43 protrudes downward and is movably connected to the insertion slots 12.
[0026] Specifically, the insertion slot 12 can improve the fit between the heat dissipation fins 43 and the substrate body 1, and can also position the heat dissipation fins 43 during installation.
[0027] Please refer to the appendix. Figure 3 The substrate body 1 is equipped with multiple through mounting holes 11, and the fixing foot plate 2 is installed on the side of the substrate body 1 by mounting screws 21.
[0028] Specifically, when installing the base plate 1, the mounting foot plate 2 is installed on the side of the base plate 1 by mounting screw 21, and then the base plate 1 is installed inside the graphics card casing by screws through the mounting hole seat 11 on the base plate 1 and the hole on the mounting foot plate 2. Example 2
[0029] This embodiment is used for graphics cards with three cooling fans. The difference from Embodiment 1 is that the base plate body 1 and the fixed aluminum plate 31 are longer, and there are more internal ventilation plates 32. Please refer to the attached document. Figure 4 There are three ventilation plates 32, which are equidistantly arranged in the fixed aluminum plate 31. Extended fins 431 are installed on the side of the heat dissipation fins 43 that are close to each other, and the extended fins 431 are attached to the upper end of the flat copper tube 13.
[0030] In this embodiment, three ventilation plates 32 correspond to cooling fans and are used for graphics cards with three cooling fans. Due to their long length, the heat dissipation fins 43 on both sides extend with extended fins 431. The extended fins 431 are attached to the flat copper pipe 13 to improve the heat conduction and heat dissipation efficiency of the flat copper pipe 13.
[0031] The working principle and usage process of this utility model are as follows: During normal use, the cooling fan on the graphics card is fixed to the outside of the substrate body 1 through the mounting hole 33. When the components and other parts mounted on the other side of the substrate body 1 generate heat during use, some of the heat is conducted from the electronic components to the external heat dissipation environment through the aluminum substrate body 1, which is based on aluminum. At the same time, some of the heat is absorbed by the flat copper tube 13. The heat is transferred along the flat copper tube 13 to both sides of the flat copper tube 13 and then dissipated through the heat dissipation fins 43. During long-term operation, a certain amount of dust will accumulate in the gaps between the heat dissipation fins 43. At this time, after opening the graphics card backplate, the entire heat dissipation fin 43 can be removed by unscrewing the disassembly screws 42. The heat dissipation fin 43 can then be cleaned and maintained. After the cleaning is completed, the bottom of the heat dissipation fin 43 is inserted into the insertion slot 12 to position the heat dissipation fin 43. Then, the disassembly screws 42 are tightened to reinstall the heat dissipation fin 43 onto the substrate body 1.
Claims
1. A heat sink aluminum substrate comprising a substrate body (1), characterized in that, The substrate body (1) includes a ventilation section (3) and a heat dissipation section (4), wherein: The substrate body (1) is mounted with a flat copper tube (13) for heat conduction, and a fixing foot plate (2) is detachably mounted on one side of the substrate. The heat dissipation part (4) includes symmetrically arranged heat dissipation fins (43), which are detachably installed on both sides of the substrate body (1) and are attached to the upper side of the flat copper tube (13). The ventilation section (3) includes a fixed aluminum plate (31) in the middle of the substrate body (1) for ventilation.
2. The heat spreader aluminum substrate of claim 1, wherein: The ventilation section (3) includes multiple ventilation plates (32) that are installed through the fixed aluminum plate (31). The ventilation plates (32) are provided with through air grooves (321). The upper end of the fixed aluminum plate (31) is also provided with multiple mounting holes (33) for fixing the cooling fan.
3. The heat spreader aluminum substrate of claim 2, wherein: There are two ventilation panels (32), which are symmetrically fixed inside the fixed aluminum plate (31).
4. The heat spreader aluminum substrate of claim 2, wherein: There are three ventilation plates (32), which are arranged equidistantly in the fixed aluminum plate (31). The heat dissipation fins (43) are connected to each other on one side with an extension fin (431), which is attached to the upper end of the flat copper tube (13).
5. A heat spreader aluminum substrate as claimed in claim 3 or 4, wherein: The flat copper tube (13) is arranged in a U-shape on the upper end of the substrate body (1), and the heat dissipation fins (43) are symmetrically covered on both sides of the protrusions of the flat copper tube (13) in two parts.
6. The heat spreader aluminum substrate of claim 5, wherein: The heat dissipation fins (43) are arranged at equal intervals and there are small gaps between each fin. The side end of the heat dissipation fins (43) is equipped with an assembly plate (41) that connects all the heat dissipation fins (43). The assembly plate (41) is connected to the substrate body (1) by disassembly screws (42).
7. The heat spreader aluminum substrate of claim 6, wherein: The substrate body (1) is symmetrically provided with multiple insertion slots (12) on the upper end. The insertion slots (12) are evenly distributed on both sides of the protruding parts at both ends of the flat copper tube (13). The bottom of the heat dissipation fin (43) protrudes downward and is movably connected to the insertion slots (12).
8. The heat spreader aluminum substrate of claim 7, wherein: The substrate body (1) is equipped with a plurality of through mounting holes (11), and the fixing foot plate (2) is mounted on the side of the substrate body (1) by mounting screws (21).