Passive cooling device

Abstract

This application discloses a passive heat dissipation device, including a limiting base, a supporting base, and a heat-conducting component. The limiting base has a limiting groove on its bottom surface. The heat-conducting component includes a first horizontal section, an inclined transition section, and a second horizontal section. The two ends of the inclined transition section are connected to the first and second horizontal sections respectively, and the transition section raises the second horizontal section. The top surface of the supporting base provides support for at least a portion of the second horizontal section. A first heat dissipation fin group is disposed on the top surface of the limiting base. At least two of the multiple sub-heat dissipation fin groups of the second heat dissipation fin group are located on the top and bottom surfaces of the supporting base, respectively. The sub-heat dissipation fin groups located on the top surface of the supporting base are at least in contact with the second horizontal section, and the bottom surface of the supporting base is at least not in direct contact with the motherboard. This application at least solves the problem that passive heat sinks in related technologies are unable to meet the heat dissipation requirements of high-power CPUs (such as 500W and above).

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and more particularly to passive heat dissipation devices. Background Technology

[0002] With the rapid development of electronic technology, the performance of central processing units (CPUs) has been significantly improved. However, this has also led to a sharp increase in CPU power consumption and heat generation. This trend is particularly evident in high-performance computing devices such as servers and workstations, which often require continuous large-scale data processing and computation, placing higher demands on the CPU's heat dissipation capabilities. Related heat dissipation solutions mainly include two types: air cooling and water cooling. Air cooling relies on forced convection by fans, which suffers from problems such as high noise and easy dust accumulation. While water cooling systems are more efficient, they are complex in structure, expensive, and carry the risk of leakage.

[0003] Passive heatsinks, as a fanless design, offer advantages such as zero noise, high reliability, and maintenance-free operation. However, most passive heatsinks in this technology suffer from limited heat dissipation capacity, making it difficult to meet the cooling requirements of modern high-power CPUs (such as 500W and above). This heat dissipation issue is particularly pronounced for devices such as servers and workstations that require prolonged high-load operation. Utility Model Content

[0004] This application provides a passive heat dissipation device to at least solve the problem that passive heat sinks in the related art are unable to meet the heat dissipation requirements of high-power CPUs (such as 500W and above).

[0005] This application provides a passive heat dissipation device, including a limiting base, a supporting base, and a heat-conducting component. The limiting base has a limiting groove on its bottom surface, and the supporting base has fasteners. The heat-conducting component includes a first horizontal section, an inclined transition section, and a second horizontal section. The two ends of the inclined transition section are respectively connected to the first and second horizontal sections, and the second horizontal section is raised. The limiting base, through the limiting groove, limits the first horizontal section to the heat source of the server, so that at least a portion of the first horizontal section is in direct contact with the heat source. The top surface of the supporting base provides support for at least a portion of the second horizontal section. The passive cooling device further includes a first heat dissipation fin group and a second heat dissipation fin group. The first heat dissipation fin group is disposed on the top surface of the limiting base. The second heat dissipation fin group has multiple sub-heat dissipation fin groups, at least two of which are located on the top surface and bottom surface of the support base, respectively. Fasteners pass through the sub-heat dissipation fin groups located on the bottom surface of the support base and are used to connect with the motherboard. At least the sub-heat dissipation fin groups located on the top surface of the support base are fitted against the second horizontal segment, and at least the bottom surface of the support base is not in direct contact with the motherboard.

[0006] In one exemplary embodiment, multiple sub-heat sink fin groups are staggered in the vertical direction.

[0007] In one exemplary embodiment, the heat-conducting assembly includes a plurality of heat-conducting pipes, each heat-conducting pipe having a first horizontal section, an inclined transition section, and a second horizontal section; wherein, the plurality of heat-conducting pipes located in the first horizontal section are closely arranged and extend in the horizontal direction; the plurality of heat-conducting pipes located in the inclined transition section are staggered into two groups of heat-conducting pipes, wherein the slope of each heat-conducting pipe in the first group of heat-conducting pipes is greater than the slope of each heat-conducting pipe in the second group of heat-conducting pipes, so that the two groups of heat-conducting pipes are arranged in a bifurcated manner in the vertical direction; the plurality of heat-conducting pipes located in the second horizontal section are formed by each heat-conducting pipe in the two groups of heat-conducting pipes located in the inclined transition section extending in the horizontal direction.

[0008] In an exemplary embodiment, the multiple heat pipes in the first group of heat pipes located in the second horizontal segment are divided into two sub-groups of heat pipes, which extend in opposite directions; the multiple heat pipes in the second group of heat pipes located in the second horizontal segment are divided into two sub-groups of heat pipes, which extend in opposite directions.

[0009] In an exemplary embodiment, the plurality of sub-heat dissipation fin groups include a first sub-heat dissipation fin group, a second sub-heat dissipation fin group, and a third sub-heat dissipation fin group; wherein, the first sub-heat dissipation fin group is located at the bottom surface of the support base; the second sub-heat dissipation fin group has receiving areas on both sides of its vertical direction, and the two receiving areas are respectively used to receive two sets of heat conduction pipe groups located in the second horizontal segment, so that the second sub-heat dissipation fin group is located at the top surface of the support base and between the two sets of heat conduction pipe groups; the third sub-heat dissipation fin group is disposed on the receiving area of ​​the top surface of the second sub-heat dissipation fin group and covers the heat conduction pipe group located above it.

[0010] In one exemplary embodiment, the limiting base has multiple adjustment holes, which are spaced apart circumferentially around the limiting base; the passive heat dissipation device also includes multiple adjustment screws, which correspond one-to-one with the multiple adjustment holes. Each adjustment screw is fitted with a spring on its outer periphery, and the spring is used to provide a clamping force on the adjustment screw toward the heat source side, so that the limiting base tightly fits the first horizontal section against the heat source.

[0011] In an exemplary embodiment, the first heat dissipation fin group includes a first heat dissipation fin body and a plurality of U-shaped heat pipes. The first heat dissipation fin body is disposed on the top surface of the limiting base and has a plurality of U-shaped receiving grooves. The plurality of U-shaped receiving grooves are spaced apart along a direction perpendicular to the fin arrangement direction of the first heat dissipation fin body. The plurality of U-shaped heat pipes are disposed one-to-one with the plurality of U-shaped receiving grooves. The openings of two adjacent U-shaped heat pipes face different directions.

[0012] In an exemplary embodiment, the first spacing between two adjacent first heat dissipation fins in the first heat dissipation fin group ranges from 1.8 to 2.2 mm; and / or, the first thickness of the first heat dissipation fin ranges from 0.3 to 0.5 mm; and / or, the second spacing between two adjacent second heat dissipation fins in the second heat dissipation fin group ranges from 1.8 to 2.2 mm; and the second thickness of the second heat dissipation fin ranges from 0.3 to 0.5 mm.

[0013] In one exemplary embodiment, the support base includes a support body and two support arms, wherein the top surface of the support body is used to provide support for at least a portion of the second horizontal segment; the two support arms are connected to the sidewall of the support body facing the limiting base side, and the two support arms extend in a direction away from the support body and provide support for at least a portion of the second horizontal segment exposed outside the support body.

[0014] In one exemplary embodiment, the passive heat dissipation device further includes a first thermally conductive patch attached to the surface of the first heat dissipation fin assembly facing away from the limiting base; and / or, the passive heat dissipation device further includes a second thermally conductive patch attached to the bottom surface of the limiting base.

[0015] This application provides a passive heat dissipation device, including a limiting base, a supporting base, and a heat-conducting component. The limiting base has a limiting groove on its bottom surface, and the supporting base has fasteners. The heat-conducting component includes a first horizontal section, an inclined transition section, and a second horizontal section. The two ends of the inclined transition section are respectively connected to the first and second horizontal sections, and the second horizontal section is raised. The limiting base, through the limiting groove, limits the first horizontal section to the heat source of the server, so that at least a portion of the first horizontal section is in direct contact with the heat source. The top surface of the supporting base provides support for at least a portion of the second horizontal section. The passive cooling device further includes a first heat dissipation fin group and a second heat dissipation fin group, wherein the first heat dissipation fin group is disposed on the top surface of the limiting base; the second heat dissipation fin group has multiple sub-heat dissipation fin groups, at least two of which are located on the top surface and bottom surface of the support base, respectively, and fasteners pass through the sub-heat dissipation fin groups located on the bottom surface of the support base and are used to connect with the motherboard; wherein at least the sub-heat dissipation fin groups located on the top surface of the support base are fitted against the second horizontal segment, and at least the bottom surface of the support base is not in direct contact with the motherboard.

[0016] This application uses a limiting groove in the limiting base to limit the first horizontal segment of the heat-conducting component at the heat source of the server, thereby allowing at least a portion of the first horizontal segment to directly contact the heat source. Simultaneously, the top surface of the supporting base provides support for at least a portion of the second horizontal segment, ensuring both the installation reliability and the thermal conductivity reliability of the heat-conducting component. Furthermore, the first heat dissipation fin group is disposed on the top surface of the limiting base; at least two of the multiple sub-heat dissipation fin groups of the second heat dissipation fin group are located on the top and bottom surfaces of the supporting base, respectively. The sub-heat dissipation fin groups located on the top surface of the supporting base are at least in contact with the second horizontal segment, and the bottom surface of the supporting base is at least not in direct contact with the motherboard. This significantly improves the heat conduction efficiency and heat dissipation area of ​​the passive cooling device, thereby achieving effective heat dissipation for high-power heat sources, and is particularly suitable for heat sources with power consumption of 500W and above. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A top-view structural schematic diagram of a passive heat dissipation device provided in an embodiment of this application;

[0019] Figure 2 for Figure 1 A structural schematic diagram of the passive cooling device from the bottom view;

[0020] Figure 3 for Figure 1 A side view of the structure of the passive heat dissipation device;

[0021] Figure 4 for Figure 1 An exploded view of the passive cooling device.

[0022] The above figures include the following reference numerals:

[0023] 10. Limiting base; 11. Limiting groove; 12. Adjustment hole;

[0024] 20. Support base; 21. Fastener; 22. Support body; 23. Support arm;

[0025] 30. Thermal conductive component; 31. First horizontal section; 32. Inclined transition section; 33. Second horizontal section; 34. Thermal pipe;

[0026] 40. First heat dissipation fin assembly; 41. First heat dissipation fin body; 411. U-shaped receiving groove; 42. U-shaped heat pipe;

[0027] 50. Second heat dissipation fin group; 51. First sub-heat dissipation fin group; 52. Second sub-heat dissipation fin group; 521. Accommodation area; 53. Third sub-heat dissipation fin group;

[0028] 60. Adjusting screw; 70. Spring; 80. First thermal conductive pad; 90. Second thermal conductive pad. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0030] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] The embodiments of this application provide a passive heat dissipation device. The device is described in detail below in conjunction with its structure and working principle (the technical terms involved must be explained).

[0033] like Figures 1 to 4As shown, the passive cooling device includes a limiting base 10, a supporting base 20, and a heat-conducting component 30. The limiting base 10 has a limiting groove 11 on its bottom surface, and the supporting base 20 has fasteners 21. The heat-conducting component 30 includes a first horizontal section 31, an inclined transition section 32, and a second horizontal section 33. The two ends of the inclined transition section 32 are respectively connected to the first horizontal section 31 and the second horizontal section 33, and the second horizontal section 33 is raised. The limiting base 10 uses the limiting groove 11 to limit the first horizontal section 31 at the heat source of the server, so that at least a portion of the first horizontal section 31 is in direct contact with the heat source. The top surface of the supporting base 20 is used to provide at least a portion of the second horizontal section 33 with the heat source. The passive heat dissipation device also includes a first heat dissipation fin group 40 and a second heat dissipation fin group 50. The first heat dissipation fin group 40 is disposed on the top surface of the limiting base 10. The second heat dissipation fin group 50 has multiple sub-heat dissipation fin groups, at least two of which are located on the top surface and bottom surface of the support base 20, respectively. Fasteners 21 pass through the sub-heat dissipation fin groups located on the bottom surface of the support base 20 and are used to connect to the motherboard. At least the sub-heat dissipation fin groups located on the top surface of the support base 20 are fitted against the second horizontal segment 33, and at least the bottom surface of the support base 20 is not in direct contact with the motherboard.

[0034] This application uses the limiting groove 11 of the limiting base 10 to limit the first horizontal segment 31 of the heat-conducting component 30 at the heat source of the server, so that at least part of the first horizontal segment 31 is in direct contact with the heat source; at the same time, the top surface of the supporting base 20 provides support for at least part of the second horizontal segment 33, ensuring the installation reliability of the heat-conducting component 30 and the thermal conductivity reliability of the heat-conducting component 30; in addition, the first heat dissipation fin group 40 is disposed on the top surface of the limiting base 10; at least two of the multiple sub-heat dissipation fin groups of the second heat dissipation fin group 50 are respectively located on the top surface and the bottom surface of the supporting base 20, and at least the sub-heat dissipation fin group located on the top surface of the supporting base 20 is in close contact with the second horizontal segment 33, and at least the bottom surface of the supporting base 20 is not in direct contact with the motherboard, which significantly improves the heat conduction efficiency and heat dissipation area of ​​the passive heat dissipation device, thereby achieving effective heat dissipation of high-power heat sources, especially suitable for heat sources with power consumption of 500W and above.

[0035] It should be noted that, in this application, the aforementioned heat source mainly refers to a central processing unit (CPU) with a power consumption of 500W or higher.

[0036] Furthermore, the support base 20 is made of AL6063-T5 aluminum alloy, with dimensions of 118×92.4×10mm. The bottom surface has a precision-machined plane with a flatness error of less than or equal to 0.05mm, and is pre-coated with TC-5888 thermal grease.

[0037] Furthermore, the bottom surface of the limiting base 10, in contact with the CPU, is mirror-polished with a surface roughness Ra ≤ 0.8 μm. The limiting base 10 is equipped with reinforcing ribs, which improve overall rigidity while maintaining lightweight design. The mirror polishing and reinforcing rib design ensure good contact between the limiting base 10 and the CPU and the stability of the entire passive heat dissipation device structure. The mirror polishing reduces the thermal resistance of the contact surface between the limiting base 10 and the CPU, while the reinforcing ribs improve the structural strength of the limiting base 10. The technology in this application reduces the contact thermal resistance between the passive heat dissipation device and the CPU and enhances structural stability, ensuring the long-term reliable operation of the passive heat dissipation device. In other embodiments, other surface treatment technologies or structural reinforcement methods, such as plating, coatings, and composite materials, can be used to solve the problems of poor contact between the limiting base 10 and the CPU or insufficient structural strength, thereby improving the heat dissipation performance and reliability of the passive heat dissipation device.

[0038] Furthermore, the limiting base 10 adopts an SPCC steel bracket (273.6×72×9.2mm), equipped with 6 AISI1018 material screws (φ8×29.18mm) and matching springs (SWP material, φ9×18mm), providing a fastening force of 150±10%kgf to ensure good contact with the CPU.

[0039] It should be noted that in this application, the limiting base 10 is made of SPCC steel and has dimensions of 273.6×72×9.2mm; it is equipped with 6 AISI1018 material adjustment screws. And matching springs made of SWP material, A clamping force of 150±10% kgf is provided to ensure good contact between the limiting base 10 and the CPU. This application ensures a tight contact between the passive heatsink and the CPU by using high-strength steel and precise dimensional design, as well as by equipping it with an adjusting screw 60 and a spring 70. The design of the limiting base 10 follows mechanical engineering principles, ensuring the installation stability of the passive heatsink and the contact pressure with the CPU. The technology in this application achieves stable contact between the passive heatsink and the CPU, ensuring the heat dissipation performance of the passive heatsink. In other embodiments, the problems of poor contact or insufficient installation stability between the passive heatsink and the CPU can be solved by adjusting the material, size, and installation system parameters of the limiting base 10, thereby improving the heat dissipation efficiency and reliability of the passive heatsink.

[0040] Furthermore, the first heat dissipation fin group 40 and the second heat dissipation fin group 50 have a total of more than 500 heat dissipation fins. The heat dissipation fin material is AL1100 aluminum alloy with an anodized surface. The fin spacing is 1.8-2.2 mm, and the thickness is 0.3-0.5 mm. The first heat dissipation fin group 40 and the second heat dissipation fin group 50 are tightly connected to the heat conduction component 30, and the contact between the first heat dissipation fin group 40 and the second heat dissipation fin group 50 and the heat conduction pipe 34 enhances heat conduction. Thus, by optimizing the spacing and thickness of the heat dissipation fins and ensuring a tight connection with the heat conduction pipe 34, efficient heat dissipation of the passive cooling device is ensured. The technology in this application achieves efficient heat dissipation of the passive cooling device, which is particularly suitable for the heat dissipation requirements of high-power CPUs. In other embodiments, the problem of insufficient heat dissipation capacity of the passive cooling device can be solved by adjusting the spacing, thickness, shape, and material of the heat dissipation fins, as well as the connection method between the heat dissipation fins and the heat conduction pipe 34, thereby further improving the heat dissipation performance.

[0041] It should be noted that in this application, multiple sub-heat dissipation fin groups are staggered in the vertical direction. This helps to increase the heat dissipation area.

[0042] like Figures 1 to 4 As shown, the heat-conducting assembly 30 includes multiple heat-conducting pipes 34, each heat-conducting pipe 34 having a first horizontal section 31, an inclined transition section 32, and a second horizontal section 33. The heat-conducting pipes 34 located in the first horizontal section 31 are closely arranged and extend horizontally. The heat-conducting pipes 34 located in the inclined transition section 32 are staggered into two groups of heat-conducting pipes. The slope of each heat-conducting pipe 34 in the first group is greater than the slope of each heat-conducting pipe 34 in the second group, so that the two groups of heat-conducting pipes are arranged in a bifurcated manner in the vertical direction. The heat-conducting pipes 34 located in the second horizontal section 33 are formed by the horizontal extension of each heat-conducting pipe 34 in the two groups of heat-conducting pipes located in the inclined transition section 32.

[0043] It should be noted that in this application, the internal working fluid of the heat pipe 34 of the heat-conducting component 30 is water, and nanoparticles are added to enhance heat transfer performance. The addition of nanoparticles is based on nanofluid technology, which significantly improves the thermal conductivity of the working fluid by suspending the nanoparticles in the water-based working fluid. The addition of nanoparticles utilizes Brownian motion and the interface effect between the nanoparticles and the pipe wall to enhance the heat conduction inside the heat pipe 34. The technology in this application works to achieve a significant improvement in the internal heat conduction performance of the heat pipe 34, thereby improving the heat dissipation efficiency of the entire passive heat dissipation device. In other embodiments, the problem of low internal heat transfer efficiency of the heat pipe 34 can also be solved by using other types of nanofluids or reinforcing materials, such as graphene, carbon nanotubes, etc., further improving the heat dissipation performance.

[0044] Furthermore, the heat conduction component 30 includes 11 C1020 copper heat conduction pipes 34 with a diameter of 8mm and a length ranging from 153.14mm to 339.76mm. The heat conduction pipes 34 adopt an asymmetrical distribution design, are densely arranged in the area corresponding to the CPU core, and are connected to the support base 20 by welding process, with a contact area greater than or equal to 95%.

[0045] It should be noted that, in other embodiments, this application ensures efficient heat conduction and dissipation capabilities of the passive cooling device by selecting high thermal conductivity aluminum alloy materials and copper heat pipes 34, as well as precision machining and anodizing treatment. The asymmetric distribution of the heat pipes 34 follows thermodynamic principles, optimizing the heat conduction path between the heat pipes 34 and the heat sink fins, thus improving heat dissipation efficiency. The technical solution in this application significantly improves the heat conduction efficiency and heat dissipation area of ​​the passive cooling device, thereby achieving effective heat dissipation for high-power CPUs, especially suitable for CPUs with a TDP of 500W or higher. In other embodiments, the number, material, and diameter of the heat pipes 34, as well as the spacing, thickness, and shape of the heat sink fins, can be adjusted to adapt to the heat dissipation needs of CPUs with different power and size, solving the heat dissipation problem of high-power CPUs.

[0046] like Figure 4 As shown, the multiple heat pipes 34 in the first group of heat pipes located in the second horizontal segment 33 are divided into two sub-groups of heat pipes, which extend in opposite directions; the multiple heat pipes 34 in the second group of heat pipes located in the second horizontal segment 33 are divided into two sub-groups of heat pipes, which extend in opposite directions.

[0047] like Figures 1 to 4 As shown, the multiple sub-heat dissipation fin groups include a first sub-heat dissipation fin group 51, a second sub-heat dissipation fin group 52, and a third sub-heat dissipation fin group 53; wherein, the first sub-heat dissipation fin group 51 is located on the bottom surface of the support base 20; the second sub-heat dissipation fin group 52 has accommodating areas 521 on both sides of the vertical direction, and the two accommodating areas 521 are respectively used to accommodate two sets of heat pipe groups located in the second horizontal section 33, so that the second sub-heat dissipation fin group 52 is located on the top surface of the support base 20 and between the two sets of heat pipe groups; the third sub-heat dissipation fin group 53 is covered by the accommodating area 521 on the top surface of the second sub-heat dissipation fin group 52 and covers the heat pipe group located above.

[0048] It should be noted that, in this application, the overall dimensions of the first heat dissipation fin group 40 are 116×91.5×54.5mm, and the dimensions of the first sub-heat dissipation fin group 51, the second sub-heat dissipation fin group 52, and the third sub-heat dissipation fin group 53 are 273.6×44×19mm, 273.6×44×26.5mm, and 259.2×44×14mm, respectively. The total number of heat dissipation fins in the first heat dissipation fin group 40 is 61+1, and the total number of heat dissipation fins in the first sub-heat dissipation fin group 51, the second sub-heat dissipation fin group 52, and the third sub-heat dissipation fin group 53 are 152+1, 152+1, and 144+1, respectively. The heat dissipation fins are made of AL1100 aluminum alloy and the surface is anodized.

[0049] like Figure 4 As shown, the limiting base 10 has multiple adjustment holes 12, which are spaced apart around the circumference of the limiting base 10; the passive heat dissipation device also includes multiple adjustment screws 60, which correspond one-to-one with the multiple adjustment holes 12. Each adjustment screw 60 is fitted with a spring 70 on its outer periphery. The spring 70 is used to provide a clamping force to the adjustment screw 60 toward the heat source, so that the limiting base 10 tightly fits the first horizontal section 31 against the heat source.

[0050] like Figures 1 to 4 As shown, the first heat dissipation fin group 40 includes a first heat dissipation fin body 41 and a plurality of U-shaped heat pipes 42. The first heat dissipation fin body 41 is disposed on the top surface of the limiting base 10, and the first heat dissipation fin body 41 has a plurality of U-shaped receiving grooves 411, which are spaced apart along a direction perpendicular to the fin arrangement direction of the first heat dissipation fin body 41. The plurality of U-shaped heat pipes 42 are disposed one-to-one with the plurality of U-shaped receiving grooves 411, and the openings of two adjacent U-shaped heat pipes 42 have different orientations.

[0051] It should be noted that, in this application, the first spacing between two adjacent first heat dissipation fins in the first heat dissipation fin group 40 ranges from 1.8 to 2.2 mm; and / or, the first thickness of the first heat dissipation fin ranges from 0.3 to 0.5 mm; and / or, the second spacing between two adjacent second heat dissipation fins in the second heat dissipation fin group 50 ranges from 1.8 to 2.2 mm; and the second thickness of the second heat dissipation fin ranges from 0.3 to 0.5 mm.

[0052] like Figures 1 to 4As shown, the support base 20 includes a support body 22 and two support arms 23, wherein the top surface of the support body 22 is used to provide support for at least a portion of the second horizontal segment 33; the two support arms 23 are connected to the side wall of the support body 22 facing the limiting base 10, and the two support arms 23 extend in a direction away from the support body 22, and provide support for at least a portion of the second horizontal segment 33 exposed outside the support body 22.

[0053] like Figure 1 , Figure 2 , Figure 4 As shown, the passive heat dissipation device further includes a first thermally conductive patch 80, which is attached to the surface of the first heat dissipation fin assembly 40 on the side away from the limiting base 10; and / or, the passive heat dissipation device further includes a second thermally conductive patch 90, which is attached to the bottom surface of the limiting base 10.

[0054] like Figures 1 to 4 As shown, the passive cooling device provided in this application has an overall size of 273.6×220.04×64.7mm and a weight of 1443.2g. It adopts a layered, staggered fin design to optimize airflow channels; the heat pipes 34 are arranged in a "dense at the base and dispersed at the ends" pattern. This application achieves efficient heat dissipation in a limited space by optimizing the overall size, weight, and fin layout of the passive cooling device, as well as the arrangement of the heat pipes 34. The layered, staggered fin design and the arrangement of the heat pipes 34 follow the principles of fluid mechanics and heat conduction, optimizing airflow paths and heat transfer efficiency. The technology in this application enables efficient heat dissipation of the passive cooling device in a compact space, making it particularly suitable for high-performance computing devices such as servers and workstations. In other embodiments, the overall size, fin layout, and heat pipe arrangement of the passive cooling device can be adjusted to adapt to the heat dissipation needs of different devices and solve heat dissipation problems in space-constrained environments.

[0055] It should be noted that in this application, all materials used in the passive heat dissipation device comply with RoHS 2.0 environmental standards. The combined use of the limiting base 10, supporting base 20, heat-conducting component 30, first heat dissipation fin group 40, and second heat dissipation fin group 50 meets environmental requirements. This application ensures the environmental performance of the passive heat dissipation device by selecting materials that meet environmental standards. The selection of materials follows environmental regulations and standards, ensuring the environmental friendliness of the passive heat dissipation device during production, use, and disposal. The technology in this application achieves the environmental performance of the passive heat dissipation device, meeting the requirements of environmental regulations and standards. In other embodiments, other types of environmentally friendly materials, such as lead-free alloys and biodegradable materials, can be used to address the problem of insufficient environmental friendliness of passive heat dissipation device materials, further improving the environmental performance of the passive heat dissipation device.

[0056] Furthermore, the passive heat dissipation device provided in this application adopts a fully passive heat dissipation design with no moving parts. The connection relationship between the limiting base 10, supporting base 20, heat-conducting component 30, first heat dissipation fin group 40, and second heat dissipation fin group 50 achieves silent operation and improved reliability. This application ensures the silent operation and high reliability of the passive heat dissipation device by adopting a fully passive heat dissipation design. The passive heat dissipation design follows thermodynamic principles, utilizing natural convection and heat conduction for heat dissipation, avoiding noise and failure risks associated with moving parts. The technology in this application achieves silent operation and high reliability of the passive heat dissipation device, making it particularly suitable for applications sensitive to noise or requiring high reliability. In other embodiments, the noise and reliability issues of the passive heat dissipation device can be solved by optimizing the structural design and material selection, further improving the silent performance and long-term operational reliability of the passive heat dissipation device.

[0057] The technical solution of this application relates to the working process. Combining the above-described embodiments, the working process of this application is as follows: When the CPU generates heat during operation, the limiting base 10, through the limiting groove 11, directly contacts at least a portion of the first horizontal segment 31 of the heat-conducting component 30 with the CPU, rapidly transferring heat to the first horizontal segment 31. The water-based working fluid inside the heat pipe 34, due to the addition of nanoparticles, has significantly improved thermal conductivity, enabling it to quickly absorb and transfer heat. The asymmetrical distribution design of the heat pipe 34 allows for more concentrated heat transfer in the core area. Then, through the dispersed arrangement at the end of the heat pipe 34 (the second horizontal segment 33), the heat is evenly distributed to the first heat dissipation fin group 40 and the second heat dissipation fin group 50. The second heat dissipation fin group 50 adopts a layered staggered design, optimizing the airflow channel and improving heat dissipation efficiency. The limiting base 10, through its reinforced rib structure and precise fastening force design, ensures stable contact between the passive heat dissipation device and the CPU. The entire heat dissipation process is carried out without any moving parts, achieving silent operation and high reliability.

[0058] The passive heat dissipation device provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A passive heat dissipating device, characterized by, include: The limiting base (10) and the supporting base (20) are provided, wherein the bottom surface of the limiting base (10) is provided with a limiting groove (11) and the supporting base (20) is provided with fasteners (21); A heat-conducting component (30) includes a first horizontal section (31), an inclined transition section (32), and a second horizontal section (33). The two ends of the inclined transition section (32) are respectively connected to the first horizontal section (31) and the second horizontal section (33), and the second horizontal section (33) is raised. The limiting base (10) is used by the limiting groove (11) to limit the first horizontal segment (31) at the heat source of the server, so that at least part of the first horizontal segment (31) is used to directly contact the heat source; The top surface of the support base (20) is used to provide support for at least a portion of the second horizontal segment (33); The passive cooling device also includes: The first heat dissipation fin group (40) is disposed on the top surface of the limiting base (10); The second heat dissipation fin group (50) has a plurality of sub-heat dissipation fin groups, at least two of the plurality of sub-heat dissipation fin groups are respectively located on the top surface and the bottom surface of the support base (20), and the fastener (21) passes through the sub-heat dissipation fin group located on the bottom surface of the support base (20) and is used to connect to the motherboard; Specifically, at least the sub-heat dissipation fin group located on the top surface of the support base (20) is fitted with the second horizontal segment (33), and at least the bottom surface of the support base (20) is not in direct contact with the motherboard.

2. The passive heat dissipating device according to claim 1, wherein, The multiple sub-heat dissipation fin groups are staggered in the vertical direction.

3. The passive heat dissipation device according to claim 1, characterized in that, The heat-conducting component (30) includes a plurality of heat-conducting pipes (34), each of the plurality of heat-conducting pipes (34) having a first horizontal section (31), a tilted transition section (32), and a second horizontal section (33); Among them, the plurality of heat pipes (34) located in the first horizontal segment (31) are closely arranged and extend in the horizontal direction; The multiple heat pipes (34) located in the inclined transition section (32) are staggered into two groups of heat pipes. The slope of each heat pipe (34) in the first group of heat pipes is greater than the slope of each heat pipe (34) in the second group of heat pipes, so that the two groups of heat pipes are arranged in a bifurcated shape in the vertical direction. The plurality of heat pipes (34) located in the second horizontal section (33) are formed by each heat pipe (34) in one of the two groups of heat pipes located in the inclined transition section (32) extending in the horizontal direction.

4. The passive heat dissipation device according to claim 3, characterized in that, The plurality of heat pipes (34) in the first group of heat pipe groups located in the second horizontal segment (33) are divided into two sub-groups of heat pipe groups, which extend in opposite directions. The multiple heat pipes (34) in the second group of heat pipes located in the second horizontal segment (33) are divided into two sub-groups of heat pipes, which extend in opposite directions.

5. The passive heat dissipation device according to claim 4, characterized in that, The plurality of said sub-heating fin groups include a first sub-heating fin group (51), a second sub-heating fin group (52), and a third sub-heating fin group (53); The first sub-heat dissipation fin group (51) is located on the bottom surface of the support base (20); The second sub-heat dissipation fin group (52) has accommodating areas (521) on both sides of the vertical direction. The two accommodating areas (521) are respectively used to accommodate the two sets of heat pipe groups located in the second horizontal section (33), so that the second sub-heat dissipation fin group (52) is located on the top surface of the support base (20) and between the two sets of heat pipe groups. The third sub-heat dissipation fin group (53) is disposed on the receiving area (521) on the top surface of the second sub-heat dissipation fin group (52) and covers the heat pipe group located above it.

6. The passive heat dissipation device according to claim 1, characterized in that, The limiting base (10) has a plurality of adjustment holes (12), which are spaced apart around the circumference of the limiting base (10); The passive cooling device also includes: Multiple adjusting screws (60) are provided, and each adjusting screw (60) corresponds to a multiple adjusting hole (12). Each adjusting screw (60) is fitted with a spring (70) on its outer periphery. The spring (70) is used to provide a clamping force to the adjusting screw (60) towards the heat source so that the limiting base (10) tightly fits the first horizontal section (31) against the heat source.

7. The passive heat dissipation device according to claim 1, characterized in that, The first heat dissipation fin assembly (40) includes: The first heat dissipation fin body (41) is disposed on the top surface of the limiting base (10), and the first heat dissipation fin body (41) has a plurality of U-shaped receiving grooves (411), and the plurality of U-shaped receiving grooves (411) are spaced apart along a direction perpendicular to the fin arrangement direction of the first heat dissipation fin body (41). Multiple U-shaped heat pipes (42) are arranged one-to-one at multiple U-shaped receiving grooves (411); Furthermore, the openings of two adjacent U-shaped heat pipes (42) face different directions.

8. The passive heat dissipation device according to any one of claims 1 to 7, characterized in that, The first spacing between two adjacent first heat dissipation fins in the first heat dissipation fin group (40) ranges from 1.8 to 2.2 mm; and / or, The first thickness of the first heat dissipation fin ranges from 0.3 to 0.5 mm; and / or, The second spacing between two adjacent second heat dissipation fins in the second heat dissipation fin group (50) ranges from 1.8 to 2.2 mm. The second thickness of the second heat dissipation fin is in the range of 0.3 to 0.5 mm.

9. The passive heat dissipation device according to any one of claims 1 to 7, characterized in that, The support base (20) includes: The support body (22) has a top surface that provides support for at least a portion of the second horizontal segment (33); Two support arms (23) are connected to the side wall of the support body (22) facing the limiting base (10), and the two support arms (23) extend away from the support body (22) and provide support for at least part of the second horizontal segment (33) exposed outside the support body (22).

10. The passive heat dissipating device according to any one of claims 1 to 7, characterized in that, The passive cooling device also includes: A first thermally conductive patch (80) is attached to the surface of the first heat dissipation fin assembly (40) facing away from the limiting base (10); and / or, The second thermally conductive patch (90) is attached to the bottom surface of the limiting base (10).

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