A stand and electromagnetic pen

Abstract

This application discloses a bracket and an electromagnetic pen. The bracket includes a pressure detection component housing, a connecting rod, a circuit board support, and a connecting circuit. The pressure detection component housing is used to accommodate a pressure detection component. The circuit board support is integrally formed with the pressure detection component housing and is used to support the circuit board. The connecting circuit is disposed on the surface of the bracket and extends from the pressure detection component housing to the circuit board support, and is used to transmit the electrical signal generated by the pressure detection component to the circuit board. The above solution simplifies the bracket structure.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a stand and an electromagnetic pen. Background Technology

[0002] With the advancement of technology, digital electronic information devices have acquired the function of trajectory input, which is usually achieved through handwriting input. Electromagnetic pens, as a type of digital electronic information device, have gained widespread application due to their precise positioning, excellent pressure sensitivity, and the fact that most employ passive technology.

[0003] Currently, electromagnetic pens require the installation of a support for the pen pressure detection component and a support for the circuit board, which is quite complex to set up. Utility Model Content

[0004] The main technical problem addressed by this application is to provide a stand and an electromagnetic pen that can simplify the stand structure.

[0005] To address the aforementioned issues, the first aspect of this application provides a bracket, including a pressure detection component receiving portion, a connecting rod, a circuit board support portion, and a connecting circuit. The pressure detection component receiving portion is used to accommodate a pressure detection component; the circuit board support portion is integrally formed with the pressure detection component receiving portion and is used to support the circuit board; the connecting circuit is disposed on the surface of the bracket and extends from the pressure detection component receiving portion to the circuit board support portion, and is used to transmit the electrical signal generated by the pressure detection component to the circuit board.

[0006] To address the aforementioned issues, a second aspect of this application provides an electromagnetic pen, comprising a circuit board, a pressure detection component, and a bracket as described in any of the preceding claims, wherein the circuit board and the pressure detection component are electrically connected via a connection circuit disposed on the surface of the bracket.

[0007] The above solution features an integrated bracket that can accommodate the pressure detection component and support the circuit board. The connection circuitry on the bracket surface enables direct electrical connection between the pressure detection component and the circuit board, simplifying the bracket structure. Attached Figure Description

[0008] Figure 1 This is a perspective view of one embodiment of the bracket of this application;

[0009] Figure 2 This is a bottom view of one embodiment of the bracket in this application;

[0010] Figure 3 This is a perspective view of another embodiment of the bracket in this application from another angle;

[0011] Figure 4 This is a partial structural schematic diagram of another embodiment of the bracket in this application;

[0012] Figure 5 This is a perspective view of another embodiment of the bracket of this application from another perspective;

[0013] Figure 6 This is a side view of one embodiment of the bracket in this application;

[0014] Figure 7 This is another side view of another embodiment of the bracket in this application;

[0015] Figure 8 This is another side view of yet another embodiment of the bracket of this application;

[0016] Figure 9 This is a schematic diagram of the structure of an embodiment of the pressure detection component of this application;

[0017] Figure 10 This is another side view of yet another embodiment of the bracket in this application.

[0018] Key reference numerals: 10, bracket; 11, pressure sensor housing; 111, base; 111a, first bearing surface; 112, limiting element; 1121, snap-fit ​​groove; 1121a, second bearing surface; 113, first contact portion; 114, second contact portion; 115, fourth surface; 12, circuit board bearing portion; 121, first surface; 122, second surface; 123, cutout portion; 1231, first cutout portion; 1232, second cutout portion; 124, third surface; 124 1. First sub-surface; 1242. Second sub-surface; 13. Connecting circuit; 131. First sub-circuit; 1311. First terminal of the first sub-circuit; 1312. Second terminal of the first sub-circuit; 132. Second sub-circuit; 1321. First terminal of the second sub-circuit; 1322. Second terminal of the second sub-circuit; 20. Pressure detection assembly; 21. Ceramic capacitor; 22. Insulating gasket; 23. Conductive silicone sheet; 231. Silicone sheet body; 232. Protrusion; 30. Circuit board; 31. Solder pad. Detailed Implementation

[0019] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0020] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0021] In this paper, the terms "system" and "network" are often used interchangeably. The term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " generally indicates that the preceding and following related objects have an "or" relationship. Furthermore, "many" in this paper means two or more.

[0022] See Figure 1 , Figure 1 This is a perspective view of one embodiment of the bracket in this application.

[0023] like Figure 1 As shown, the bracket 10 includes a pressure detection element receiving portion 11, a circuit board support portion 12, and a connecting circuit 13. The pressure detection element receiving portion 11 and the circuit board support portion 12 are integrally formed. The pressure detection element receiving portion 11 can accommodate the pressure detection assembly 20, and the circuit board support portion 12 can support the circuit board 30. The integrated bracket 10 can accommodate both the pressure detection assembly 20 and the circuit board 30.

[0024] See Figure 2 , Figure 2 This is a bottom view of an embodiment of the bracket in this application.

[0025] Combination Figure 1 and Figure 2 , Figure 2 The shaded area represents the connection circuit 13. The connection circuit 13 is disposed on the surface of the bracket 10 and extends from the pressure detection element receiving portion 11 to the circuit carrier portion, and is used to transmit the electrical signal generated by the pressure detection component 20 to the circuit board 30.

[0026] The aforementioned bracket 10 can be applied to an electromagnetic pen as part of its structure. The pressure detection component 20 can be used to detect the pressure transmitted by the pen tip, and the connection circuit 13 transmits the electrical signal related to the pen tip pressure to the circuit board 30, thereby enabling control based on the pen tip pressure.

[0027] In some embodiments, such as Figure 2 The connection circuit 13 may include a first sub-circuit 131 and a second sub-circuit 132, which are electrically insulated from each other. The first sub-circuit 131 and the second sub-circuit 132 respectively include a first end for electrical connection with the circuit board 30 and a second end for electrical connection with the pressure detection assembly 20.

[0028] Specifically, the circuit board 30 may include two connection terminals, which can be connected to the first terminal 1311 of the first sub-circuit and the first terminal 1321 of the second sub-circuit, respectively.

[0029] Specifically, the pressure detection component 20 includes two connection terminals, which can be connected to the second terminal 1312 of the first sub-circuit and the second terminal 1322 of the second sub-circuit, respectively.

[0030] The first sub-circuit 131 and the second sub-circuit 132 can be used to connect the two ends of the pressure detection component 20 to the two ends of the circuit board 30, so that the pressure detection component 20 and the electronic devices on the circuit board 30 form a circuit.

[0031] In some embodiments, the circuit board carrier 12 includes a first surface 121 and a second surface 122 facing each other. The first surface 121 is used to carry the circuit board 30. Further, the first surface 121 can be planar to facilitate carrying the circuit board 30.

[0032] Furthermore, the second surface 122 extends to both sides of the first surface 121 to form an enclosing structure.

[0033] In some applications, the second surface 122 can be a convex arc shape that can fit the shape of the electromagnetic pen's shell.

[0034] In some applications, the circuit board support portion 12 can be a semi-cylinder, with its side surface serving as the second surface 122 and its cross-section serving as the first surface 121. For example, the circuit board support portion 12 can be, but is not limited to, a semi-cylinder.

[0035] In some embodiments, the circuit board carrier 12 has a cutout 123 that extends from the first surface 121 to the second surface 122, so that a third surface 124 extending from the first surface 121 to the second surface 122 is formed on the circuit board carrier 12. The connecting circuit 13 can extend from the second surface 122 through the third surface 124 toward the first surface 121 to achieve electrical connection with the circuit board 30.

[0036] In some embodiments, such as Figure 1 As shown, the third surface 124 formed by the hollow portion 123 can be perpendicular to the first surface 121. Of course, the third surface 124 can also be non-perpendicular to the first surface 121, and can form a certain angle with the first surface 121.

[0037] In some embodiments, the number and shape of the cutout portion 123 can be adjusted. For example, the number of cutout portions 123 is one, and the first sub-circuit 131 and the second sub-circuit 132 are arranged on the third surface 124 formed by the cutout portion 123.

[0038] See Figure 3 , Figure 3 This is a perspective view of another embodiment of the bracket in this application.

[0039] See Figure 4 , Figure 4 This is a partial structural schematic diagram of another embodiment of the bracket in this application.

[0040] Figure 3 This is a schematic diagram showing the arrangement of the bracket 10 with the pressure detection component 20 and the circuit board 30. Figure 4 This is a partial upward view of the bracket 10 after it is assembled with the pressure detection component 20 and the circuit board 30.

[0041] See also Figure 3 and Figure 4 The circuit board 30 has a pad 31 on the side facing the first surface 121 corresponding to the cutout portion 123. When the first surface 121 supports the circuit board 30, one side surface of the circuit board 30 (not shown in the figure) is opposite to the first surface 121, and the pad 31 can protrude from the surface of the circuit board 30. At this time, the pad 31 is located inside the cutout portion 123. The connection circuit 13 extends from the third surface 124 formed by the cutout portion 123 toward the first surface 121 and can be used to contact the pad 31 to achieve electrical connection.

[0042] In some embodiments, the connection circuit 13 extends on the third surface 124, and the position of the pad 31 can be configured such that when the first surface 121 supports the circuit board 30, the pad 31 can contact the third surface 124. Through the coordination of the position of the pad 31 with the placement of the connection circuit 13, direct contact can be achieved between the pad 31 and the connection circuit 13 placed on the third surface 124, thereby achieving electrical connection between the connection circuit 13 and the pad 31 on the circuit board 30. For example, when the first surface 121 supports the circuit board 30, the pad 31 directly contacts the connection circuit 13 placed on the third surface 124.

[0043] In some embodiments, the connection circuit 13 extends on the third surface 124, and when the first surface 121 carries the circuit board 30, the pad 31 may not directly contact the third surface 124, such as... Figure 4 As shown, the two can be electrically connected in other ways. For example, by matching the position of the pad 31 with the position of the connection circuit 13, the connection circuit 13 on the third surface 124 is soldered to the pad 31, thereby enabling the connection circuit 13 to be electrically connected to the pad 31 on the circuit board 30.

[0044] It should be noted that the third surface 124 may include one or two sub-surfaces. If the third surface 124 includes only one sub-surface, the first sub-circuit 131 and the second sub-circuit 132 both extend to the first surface 121 through the same surface. The two sub-circuits are not in contact at their locations on this same surface, and they are electrically insulated from each other. (See reference...) Figure 5 , Figure 5 This is a perspective view of another embodiment of the bracket of this application. If the third surface 124 includes two sub-surfaces, such as the first sub-circuit 131 and the second sub-circuit 132, they can extend to the first surface 121 through the two sub-surfaces respectively. Figure 5 The shaded area represents the connection circuit 13.

[0045] In some embodiments, the cutout portion 123 includes a first cutout portion 1231 and a second cutout portion 1232. The first cutout portion 1231 forms a first sub-surface 1241, and the second cutout portion 1232 forms a second sub-surface 1242. The first sub-surface 1241 and the second sub-surface 1242 are referred to as a third surface 124. In the aforementioned scheme, the first sub-surface 1241 and the second sub-surface 1242 can be used to lay out the first sub-circuit 131 and the second sub-circuit 132, respectively.

[0046] Furthermore, such as Figure 5 As shown, the first hollow portion 1231 and the second hollow portion 1232 can be respectively provided on both sides of the first surface 121. The aforementioned two sides can be parallel sides.

[0047] In a specific application scenario, the first surface 121 has two side edges parallel to the axis of the electromagnetic pen, and the first hollow portion 1231 and the second hollow portion 1232 can be respectively provided on these two side edges. Furthermore, the first hollow portion 1231 and the second hollow portion 1232 have the same shape and size. Taking the axis of the electromagnetic pen as the axis of symmetry, the first hollow portion 1231 and the second hollow portion 1232 are arranged symmetrically along the axis of symmetry.

[0048] In some implementations, the first sub-circuit 131 extends from the second surface 122 through the first sub-surface 1241 to form the first terminal 1311 of the first sub-circuit. The second sub-circuit 132 extends from the second surface 122 through the second sub-surface 1242 to form the first terminal 1321 of the second sub-circuit.

[0049] Specifically, the first sub-circuit 131 can pass through the first sub-surface 1241 and form its first terminal 1311 on the first sub-surface 1241. The first sub-circuit 131 can be arranged at the boundary between the first sub-surface 1241 and the first surface 121 to form its first terminal 1311. Alternatively, the first circuit can also be arranged on the first surface 121 without contacting the boundary between the first sub-surface 1241 and the first surface 121 to form its first terminal 1311. The second sub-circuit 132 is similar.

[0050] See Figure 6 , Figure 6 This is a side view of one embodiment of the bracket in this application.

[0051] Figure 6 This is a side view along the axial direction of the electromagnetic pen. Figure 6 The shaded area represents the connection circuit 13. The pressure detection element receiving part 11 includes a first bearing surface 111a, a second bearing surface 1121a, a first contact part 113 protruding from the first bearing surface 111a, and a second contact part 114 protruding from the second bearing surface 1121a.

[0052] The second end 1312 of the first sub-circuit is attached to the first contact portion 113, and the second end 1322 of the second sub-circuit is attached to the second contact portion 114.

[0053] The pressure detection assembly 20 includes two connection ends, which can be respectively disposed on two different planes. When the pressure detection assembly 20 is housed in the pressure detection section receiving portion, the first bearing surface 111a and the second bearing surface 1121a can be respectively disposed opposite to the planes where the two connection ends of the pressure detection assembly 20 are located. The first contact portion 113 and the second contact portion 114 respectively contact the two connection ends of the pressure detection assembly 20 to realize that the second terminal 1312 of the first sub-circuit and the second terminal 1322 of the second sub-circuit are respectively electrically connected to the two connection ends of the pressure detection assembly 20.

[0054] See Figure 7 , Figure 7 This is another side view of another embodiment of the bracket in this application.

[0055] In some embodiments, the pressure detection element receiving portion 11 may include a base 111, which may be disposed on one side of the circuit board support portion 12. A first support surface 111a is formed on the side of the base 111 away from the circuit board support portion 12. A plurality of limiting members 112 are protruding from the first support surface 111a, and at least one limiting member 112 forms a second support surface 1121a on the side away from the circuit board support portion 12. The second support surface 1121a is further away from the circuit board support portion 12 than the first support surface 111a.

[0056] The first bearing surface 111a and the second bearing surface 1121a can both be perpendicular to the axis of the electromagnetic pen.

[0057] See Figure 8 , Figure 8 This is another side view of another embodiment of the bracket of this application.

[0058] In some implementation scenarios, the circuit board carrier 12 includes a second surface 122, and the pressure detection element receiving portion 11 and the circuit board carrier 12 are integrally structured. The second surface 122 extends from the pressure detection element receiving portion 11 to the circuit board carrier 12 to serve as a fourth surface 115. That is, one surface of the bracket 10 serves as the second surface 122 on the circuit board carrier 12 and as the fourth surface 115 on the pressure detection element receiving portion 11. Specifically, the second end 1312 of the first sub-circuit is disposed on the first contact portion 113. The first sub-circuit 131 can extend from the first contact portion 113 to the fourth surface 115, and from the fourth surface 115 to the second surface 122, passing through the third surface 124 to form the first end 1311 of the first sub-circuit. The second end 1322 of the second sub-circuit is disposed on the second contact portion 114. The second sub-circuit 132 can extend from the second contact portion 114 to the fourth surface 115, and from the fourth surface 115 to the second surface 122, passing through the third surface 124 to form the first end 1321 of the second sub-circuit.

[0059] In some embodiments, the first contact portion 113 is a frustum, and the contact surface with the pressure detection component 20 is circular.

[0060] In some embodiments, the second contact portion 114 is a frustum, and the contact surface with the pressure detection component 20 is circular.

[0061] Furthermore, the first sub-circuit 131 forms the first terminal 1311 of the first sub-circuit through the first sub-surface 1241, and the second sub-circuit 132 forms the first terminal 1321 of the second sub-circuit through the second sub-surface 1242.

[0062] In some embodiments, the limiting member 112 is provided with a snap-fit ​​groove 1121, the opening of which faces away from the circuit board support portion 12. The bottom surface of one of the snap-fit ​​grooves 1121 forms a second support surface 1121a.

[0063] Among them, multiple limiting components 112 surround to form a hollow space, which can be used to accommodate the pressure detection component 20.

[0064] In some implementation scenarios, two arc-shaped limiting members 112 are provided, and the two arc-shaped limiting members 112 together form a hollow space. The limiting members 112 are provided with snap-fit ​​grooves 1121, and the bottom surface of one of the snap-fit ​​grooves 1121 forms a second bearing surface 1121a.

[0065] See Figure 9 , Figure 9 This is a schematic diagram of the structure of an embodiment of the pressure detection component of this application.

[0066] The pressure detection assembly 20 may include a ceramic capacitor 21, an insulating washer 22, and a conductive silicone sheet 23 arranged sequentially. The ceramic capacitor 21 is located on one side of the circuit board carrier portion 12, and the conductive silicone sheet 23 is located on one side of the pressure detection element receiving portion 11. The insulating washer 22 is located between the ceramic capacitor 21 and the conductive silicone sheet 23.

[0067] The ceramic capacitor 21 is cylindrical, with its top and bottom surfaces serving as its two electrodes. The conductive silicone sheet 23 includes a silicone sheet body 231 and two protrusions 232. The silicone sheet body 231 can be a circular sheet with a diameter greater than or equal to the diameter of the ceramic capacitor 21. Generally, the diameter of the silicone sheet body 231 can be slightly larger than the diameter of the ceramic capacitor 21 to ensure that, within tolerance, the circular surface of the silicone sheet body 231 can cover the circular surface of the ceramic capacitor 21. The protrusions 232 are located at the periphery of the conductive silicone sheet 23. The two protrusions 232 are spaced 180 degrees apart. An insulating gasket 22, a thin annular plate, is disposed between the ceramic capacitor 21 and the conductive silicone sheet 23.

[0068] The insulating washer 22 keeps the conductive silicone sheet 23 and the ceramic capacitor 21 initially separated. When the conductive silicone sheet 23 is subjected to force, it deforms and gradually increases the contact area with the ceramic capacitor 21 from the middle to the edge.

[0069] See Figure 10 , Figure 10 This is another side view of yet another embodiment of the bracket in this application.

[0070] Figure 10 This is a side view along the axial direction of the electromagnetic pen after the bracket 10 is assembled with the pressure detection component 20 and the circuit board 30. Figure 7 In comparison.

[0071] The surface of the ceramic capacitor 21 away from the insulating washer 22 can serve as the first connection end of the pressure detection assembly 20. The first contact portion 113 is electrically connected to the first connection end. For example, the two can be pressed tightly together to achieve electrical connection, or they can be connected with conductive double-sided adhesive. The surface of the ceramic capacitor 21 near the insulating washer 22 can be electrically connected to the conductive silicone sheet 23. Furthermore, any protrusion 232 of the conductive silicone sheet 23 can serve as the second connection end of the pressure detection assembly 20. The second contact portion 114 contacts one of the protrusions 232 to achieve electrical connection.

[0072] In some embodiments, the connection circuit 13 extends over the surface of the support 10 and passes sequentially over multiple surfaces, including planar and curved surfaces. The junction corners of at least one pair of intersecting surfaces covered by the connection circuit 13 are rounded.

[0073] The connection circuit 13 passes through multiple surfaces sequentially, and the corners at the junctions of two adjacent surfaces can be rounded. This is to prevent the corners from affecting the electrical signal conduction of the connection circuit 13 and to improve the stability of the connection circuit 13.

[0074] For example, the first contact portion 113 is a frustum, and when the first sub-circuit 131 extends from the upper surface of the frustum to the side surface, the junction angle between the upper surface and the side surface of the frustum can be set as a rounded corner. When extending from the frustum to the fourth surface 115, the junction angle between the side surface of the frustum and the fourth surface 115 can be set as a rounded corner.

[0075] The fourth surface 115 and the second surface 122 may include several pairs of intersecting surfaces at their junction corners. When the connecting circuit 13 extends on the fourth surface 115 and the second surface 122, if it covers the junction corners, the junction corners can be set as rounded corners. When the connecting circuit 13 extends from the second surface 122 to the third surface 124, the junction corner between the second surface 122 and the third surface 124 can be set as a rounded corner.

[0076] In some embodiments, the support 10 is made of plastic. The connection circuit 13 is fabricated on the plastic surface using a 3D-MID (Three-dimensional Mechatronic Integrated Device) process to form a conductive pattern covering the plastic surface, thereby achieving electrical connection.

[0077] In some embodiments, the surface of the area covered by the connection circuit 13 may be slightly lower than the surface of other areas on the same side.

[0078] In some embodiments, the electromagnetic pen may include the bracket 10, circuit board 30, and pressure detection component 20 as described in the preceding embodiments. The circuit board 30 and pressure detection component 20 may be electrically connected via a connection circuit 13 arranged on the surface of the bracket 10. Of course, the bracket 10 may also have other structures and functions, and the electromagnetic pen may also have other structures besides the bracket 10, circuit board 30, and pressure detection component 20.

[0079] In some implementation scenarios, the electromagnetic pen with a variable capacitor structure may include the bracket 10, circuit board 30, and pressure detection component 20 as described in the previous embodiments. It may also include a pen refill and a magnetic core coil; the coil is connected to the circuit board 30 to form an LC circuit, and the magnetic core is fixed to the housing via a fixing silicone assembly. The housing is equipped with a buckle, and the buckle and the snap-fit ​​groove 1121 cooperate to snap the housing and bracket 10 together after assembly, pressing the outer edge of the conductive silicone sheet 23. The housing and bracket 10 together form an inner cavity, within which are sequentially arranged a pen refill clip, a conductive silicone sheet 23, an insulating washer 22, and a ceramic capacitor 21; the main body and the protrusions 232 on both sides of the conductive silicone sheet 23 are fixed by pressure after assembly with the housing and bracket 10, and one protrusion 232 of the conductive silicone sheet 23 is electrically connected to the second sub-circuit on the bracket 10 after being pressed; the bottom of the ceramic capacitor 21 is electrically connected to the first sub-circuit on the bracket 10 after being pressed. The circuit board 30 is placed on the plane of the bracket 10, and the bottom pad 31 of the circuit board 30 is electrically connected to the circuit of the bracket 10 after being soldered.

[0080] In its initial state, the magnetic core coil, ceramic capacitor 21, and circuit board 30 form an LC oscillation circuit. After the magnetic core coil is charged by induction on the writing tablet, the LC oscillation circuit generates a fixed initial frequency. During writing, the pen tip presses down, pushing the pen tip clip axially and transmitting the motion to the conductive silicone sheet 23. The conductive silicone sheet 23 deforms under pressure and comes into contact with the surface of the ceramic capacitor 21. The change in contact area alters the capacitance value output by the ceramic capacitor 21, thereby obtaining a corresponding frequency change. The writing tablet obtains the frequency change currently generated on the electromagnetic pen through electromagnetic interaction and calculates the corresponding pen pressure value.

[0081] When the pen is lifted to finish writing, the conductive silicone sheet 23 loses its force and returns to its initial state of not being in contact with the ceramic capacitor 21, and the LC oscillation circuit returns to its initial frequency state.

[0082] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus implementations described above are merely illustrative. For instance, the division of circuits or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0083] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0084] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0085] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods of various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A stent, characterized by, The holder, used in an electromagnetic pen, includes: Pressure sensing element receiving portion, used to accommodate pressure sensing components; The circuit board support portion is integrally formed with the pressure detection element receiving portion and is used to support the circuit board. A connecting circuit is disposed on the surface of the bracket and extends from the pressure detection component housing to the circuit board carrier, for transmitting the electrical signal generated by the pressure detection component to the circuit board.

2. The stent of claim 1, wherein The connection circuit includes a first sub-circuit and a second sub-circuit, which are electrically insulated from each other. The first sub-circuit and the second sub-circuit each include a first end for electrical connection with the circuit board and a second end for electrical connection with the pressure detection component.

3. The stent of claim 1 or 2, wherein, The circuit board support portion includes a first surface and a second surface opposite to each other, wherein the first surface is used to support the circuit board.

4. The stent of claim 3, wherein, The circuit board carrier has a cutout portion that extends from the first surface to the second surface, so that a third surface extending from the first surface to the second surface is formed on the circuit board carrier. The connection circuit extends from the second surface through the third surface to the first surface; The circuit board has a pad on the side facing the first surface corresponding to the cutout portion. When the first surface supports the circuit board, the connection circuit is used to contact the pad to achieve electrical connection.

5. The stent of claim 4, wherein, The hollowed-out portion includes a first hollowed-out portion and a second hollowed-out portion, which are respectively disposed on the two sides of the first surface; The third surface includes a first sub-surface and a second sub-surface, the first hollow portion corresponds to the first sub-surface, and the second hollow portion corresponds to the second sub-surface; The connection circuit includes an electrically isolated first sub-circuit and a second sub-circuit. Both the first sub-circuit and the second sub-circuit include a first end for electrical connection with the circuit board. The first sub-circuit extends from the second surface through the first sub-surface to form the first end of the first sub-circuit, and the second sub-circuit extends from the second surface through the second sub-surface to form the first end of the second sub-circuit.

6. The stent defined in Claim 1, wherein, The pressure detection element receiving portion includes a first bearing surface, a second bearing surface, a first contact portion protruding from the first bearing surface, and a second contact portion protruding from the second bearing surface; The connection circuit includes an electrically insulated first sub-circuit and a second sub-circuit. Both the first sub-circuit and the second sub-circuit include a second end for electrical connection with the pressure detection component. The second end of the first sub-circuit is attached to the first contact portion, and the second end of the second sub-circuit is attached to the second contact portion. When the pressure detection component is housed in the pressure detection element receiving portion, the first bearing surface and the second bearing surface are respectively disposed opposite to the planes where the two connection ends of the pressure detection component are located, and the first contact portion and the second contact portion respectively contact the two connection ends of the pressure detection component, so as to realize that the second end of the first sub-circuit and the second end of the second sub-circuit are respectively electrically connected to the two connection ends of the pressure detection component.

7. The stent defined in Claim 6, wherein, The pressure detection device receiving portion includes a base, and the side of the base away from the circuit board support portion forms the first support surface. A plurality of limiting members are protruding on the first support surface, and at least one of the limiting members forms the second support surface on the side away from the circuit board support portion.

8. The stent defined in Claim 7, wherein, The limiting member is provided with a snap-fit ​​groove, and the bottom surface of the snap-fit ​​groove forms the second bearing surface.

9. The stent defined in Claim 1, wherein, The connection circuit extends on the surface of the bracket and passes through multiple surfaces, and the intersection corners of at least one pair of intersecting surfaces covered by the connection circuit are rounded.

10. An electromagnetic pen, characterized by The electromagnetic pen includes: The bracket, circuit board, and pressure detection assembly as described in any one of claims 1 to 9, wherein the circuit board and the pressure detection assembly are electrically connected via a connection circuit arranged on the surface of the bracket.

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