Storage devices, data cables, and storage device assemblies

Abstract

This application discloses a storage device, a data cable, and a storage device assembly. The storage device is used to connect to a connector of the data cable. The connector has conductive components. The storage device includes a housing, a circuit board, and an adsorption component. The housing has a receiving cavity and a plug-in interface, with the plug-in interface communicating with the receiving cavity. The circuit board is disposed in the receiving cavity and includes a contact portion corresponding to the plug-in interface. The adsorption component is disposed in the receiving cavity and configured to adsorb the connector to the surface of the housing, allowing the conductive components to be inserted into the plug-in interface and make electrical contact with the contact portion. This storage device eliminates the interface module, saving the space in the receiving cavity occupied by the interface module's structural height in the vertical direction. This overcomes the height limitation imposed by the interface module on the storage device, thereby reducing the height of the storage device and making it thinner and more portable.

Description

Technical Field

[0001] This application belongs to the field of hard disk technology, and specifically relates to a storage device, a data cable, and a combination of storage devices. Background Technology

[0002] Hard drives are used to store data. A hard drive consists of a circuit board, an interface module (such as a Type-C interface) soldered to the circuit board, and a casing covering the circuit board. The interface module is usually located on the side of the casing. When the interface module is plugged into the host, the circuit board can exchange data with the host. However, the complex structure of the interface module results in a large size in the height direction. The height of the hard drive is greater than the height of the interface module, making the hard drive thick and inconvenient to carry. Utility Model Content

[0003] This application provides a storage device, a data cable, and a combination of storage devices that can reduce the height of the storage device.

[0004] This application provides a storage device for a connector for interfacing with a data cable. The connector has conductive components. The storage device includes a housing, a circuit board, and an adsorption component. The housing has a receiving cavity and a plug-in interface, with the plug-in interface communicating with the receiving cavity. The circuit board is disposed in the receiving cavity and includes a contact portion corresponding to the plug-in interface. The adsorption component is disposed in the receiving cavity and is configured to adsorb the connector to the surface of the housing, so that the conductive components are inserted into the plug-in interface to make electrical contact with the contact portion.

[0005] In the aforementioned storage device, when the adsorption component adsorbs the connector until it abuts against the surface of the housing, the connector and storage device are stably connected. The conductive component is inserted into the interface to make electrical contact with the contact portion, thus electrically connecting the connector to the circuit board, enabling the storage device to transmit data via the data cable. The storage device contacts the conductive component through the contact portion of the circuit board to achieve electrical connection between the data cable and the storage device. Compared to storage devices with an interface module, this storage device eliminates the interface module, saving the space occupied by the interface module's structural height in the vertical direction of the receiving cavity. This overcomes the height limitation imposed by the interface module on the storage device, thereby reducing the height of the storage device and making it thinner and more portable.

[0006] In some embodiments, the circuit board has a first side and a second side opposite each other in the height direction, a contact portion is disposed on the first side, and the surface of the contact portion is flush with the first side.

[0007] The aforementioned contact portion is flush with the first surface, so that the arrangement of the contact portion does not increase the height space occupied by the circuit board in the height direction, thereby compressing the height of the storage device.

[0008] In some embodiments, the circuit board has a clearance structure configured to accommodate an adsorption element.

[0009] The aforementioned clearance structure can accommodate at least part of the adsorption component. Compared to the adsorption component being stacked on the circuit board, the clearance structure can position the adsorption component relative to the circuit board and save the height space occupied by the adsorption component and the circuit board, making the storage device structure compact and helping to reduce the height of the storage device.

[0010] In some embodiments, the storage device includes two adsorption elements spaced apart, and a contact portion is formed between the two adsorption elements.

[0011] The aforementioned contact portion is located between two adsorption components, which can automatically align the connector and the contact portion to prevent the conductive component from shifting relative to the contact portion. The two adsorption components can accurately position the connector and stably adsorb the connector to the surface of the housing, so that the conductive component is automatically aligned and stably inserted into the interface, thereby ensuring stable electrical contact between the contact portion and the conductive component, and making the electrical connection between the data cable and the circuit board reliable and stable.

[0012] In some embodiments, the adsorption element is configured as a magnet.

[0013] Without external force, the magnet can attract the connector to the surface of the housing, ensuring stable contact between the contact part and the conductive component; applying external force to the connector can quickly separate the connector from the housing surface, allowing the wire assembly to be pulled out of the interface; the connector and the storage device are connected by magnetic force, facilitating quick connection and disconnection of the data cable and the storage device, making the operation simple.

[0014] In some embodiments, the housing includes a top cover and a base; the top cover has a second mating surface, and an insertion interface is provided through the second mating surface; the base has a first mating surface, the first mating surface has a first groove, and the second mating surface is stacked on the first mating surface when the top cover is connected to the base, and the first groove, the second mating surface and the first mating surface together form a receiving cavity.

[0015] The aforementioned housing is formed by stacking and connecting an upper cover and a base, making assembly convenient.

[0016] In some embodiments, the first mating surface has a notch that connects to a first groove and is configured to accommodate at least a portion of the adsorption element.

[0017] The aforementioned notch can accommodate at least part of the adsorption element. Compared to the adsorption element being stacked on the first mating surface, the notch can position the adsorption element relative to the base, and can also save the height space occupied by the adsorption element and the base, making the storage device structure compact and helping to reduce the height of the storage device.

[0018] In some embodiments, the base has a protruding ring that protrudes from the first mating surface and surrounds the first groove; the protruding ring is configured to abut against the outside of the top cover when the top cover is connected to the base.

[0019] When the top cover is connected to the base, the convex ring surrounds the top cover and abuts against the outside of the top cover to position the top cover and the base, thus preventing the top cover from shifting relative to the base.

[0020] In some embodiments, the top cover is provided with a positioning part, and the circuit board is provided with a positioning hole. The positioning part passes through the positioning hole to position the circuit board to the top cover.

[0021] The aforementioned top cover passes through a positioning hole via a positioning part to position the circuit board relative to the top cover.

[0022] This application also provides a data cable configured to be electrically connected to a storage device as described in any of the above embodiments; the data cable includes a cable body and a connector disposed at the end of the cable body, the connector having a conductive component, the connector being configured to attract the attracting component, such that the conductive component is inserted into the plug interface and makes electrical contact with the contact portion.

[0023] This application also provides a storage device assembly, including a data cable and a storage device as described in any of the above embodiments; the data cable includes a cable body and a connector at the end of the cable body, the connector having a conductive component, the connector being configured to attract the attracting element, such that the conductive component is inserted into the connector and makes electrical contact with the contact portion.

[0024] In the aforementioned data cable and storage device combination, the connector and the magnetic attachment are magnetically connected to each other, allowing the conductive components to be inserted into the interface for electrical contact. This ensures a stable connection between the data cable and the storage device, enabling the storage device to exchange data via the data cable. Using this storage device and data cable saves space in the vertical direction occupied by the interface module's structural height, resulting in a thinner storage device and making the entire storage device combination easy to carry. Attached Figure Description

[0025] Figure 1 This is a perspective view of a storage device assembly in one embodiment of this application.

[0026] Figure 2 yes Figure 1 Exploded view of the storage device.

[0027] Figure 3 yes Figure 1 A cross-sectional view of the storage device along line III-III.

[0028] Figure 4 yes Figure 1 A partial view of the 3D diagram of the data cable.

[0029] Explanation of main component symbols 100. Storage device; 10. Housing; 101. Receiving cavity; 102. Socket; 11. Base; 111. First mating surface; 112. First groove; 113. Notch; 114. Protruding ring; 12. Top cover; 121. Second mating surface; 122. Second groove; 123. Positioning part; 20. Circuit board; 201. First surface; 202. Second surface; 203. Clearance structure; 2031. Clearance hole; 2032. Clearance groove; 204. Positioning hole; 21. Contact part; 30. Adsorption element; 200. Storage device assembly; 210. Data cable; 211. Cable body; 212. Connector; 2121. Abutment surface; 2122. Conductive component; 2122a. Conductive terminal; 2123. Mating part; 213. Interface module; Z, height direction.

[0030] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0032] In the description of the embodiments of this application, the technical terms "first", "second", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.

[0033] In the description of the embodiments of this application, the term "perpendicular" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately perpendicular. The term "parallel" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately parallel.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0036] Hard drives are used to store data. A hard drive consists of a circuit board, an interface module (such as a Type-C interface) soldered to the circuit board, and a casing covering the circuit board. The interface module is usually located on the side of the casing. When the interface module is plugged into the host, the circuit board can exchange data with the host. However, the complex structure of the interface module results in a large size in the height direction. The height of the hard drive is greater than the height of the interface module, making the hard drive thick and inconvenient to carry.

[0037] An interface module is a highly integrated connector system that includes a metal housing and an electrical connection structure. The electrical connection structure includes multiple pins housed inside the metal housing. The metal housing guides the insertion and removal of the male / female connector, enabling electrical connection between the male / female connector and the interface. To accommodate and protect the multiple pins, the metal housing is typically thick, resulting in a relatively thick overall interface.

[0038] This application provides a storage device for a connector for interfacing with a data cable. The connector has conductive components. The storage device includes a housing, a circuit board, and an adsorption component. The housing has a receiving cavity and a plug-in interface, with the plug-in interface communicating with the receiving cavity. The circuit board is disposed in the receiving cavity and includes a contact portion corresponding to the plug-in interface. The adsorption component is disposed in the receiving cavity and is configured to adsorb the connector to the surface of the housing, so that the conductive components are inserted into the plug-in interface to make electrical contact with the contact portion.

[0039] In the aforementioned storage device, when the adsorption component adsorbs the connector until it abuts against the surface of the housing, the connector and storage device are stably connected. The conductive component is inserted into the interface to make electrical contact with the contact portion, thus electrically connecting the connector to the circuit board, enabling the storage device to transmit data via the data cable. The storage device contacts the conductive component through the contact portion of the circuit board to achieve electrical connection between the data cable and the storage device. Compared to storage devices with an interface module, this storage device eliminates the interface module, saving the space occupied by the interface module's structural height in the vertical direction of the receiving cavity. This overcomes the height limitation imposed by the interface module on the storage device, thereby reducing the height of the storage device and making it thinner and more portable.

[0040] The embodiments of this application will be further described below with reference to the accompanying drawings. Unless otherwise specified, the various embodiments in this application can be combined with each other.

[0041] Please see Figure 1 This application provides a storage device assembly 200, including a data cable 210 and a storage device 100. The data cable 210 includes a cable body 211 and a connector 212. The connector 212 is located at one end of the cable body 211 and is used to plug into and mate with the storage device 100, so that the cable body 211 is electrically connected to the storage device 100. Exemplarily, the storage device 100 includes a hard disk.

[0042] In some embodiments, the other end of the cable 211 is provided with a Type-C interface module 213, which is used to connect to a host computer so that the storage device 100 and the host computer can transmit or exchange data via the data cable 210. In other embodiments, both ends of the cable 211 are provided with connectors 212, one connector 212 is connected to the storage device 100 and the other connector is connected to the host computer; or, the other end of the cable 211 is directly electrically connected to the host computer, both of which enable the storage device 100 and the host computer to transmit or exchange data via the data cable 210.

[0043] Please combine Figure 2 and Figure 3 The storage device 100 includes a housing 10, a circuit board 20, and an adsorption member 30. The housing 10 has a receiving cavity 101 and an insertion interface 102. The circuit board 20 and the adsorption member 30 are both disposed in the receiving cavity 101 so that the housing 10 can install and protect the circuit board 20 and the adsorption member 30. The circuit board 20 includes a contact portion 21. The insertion interface 102 communicates with the receiving cavity 101, and the contact portion 21 corresponds to the insertion interface 102, so that the conductive component 2122 can make electrical contact with the contact portion 21 by inserting into the insertion interface 102.

[0044] Please see Figure 4 The connector 212 has an abutment surface 2121 and a conductive component 2122 protruding from the abutment surface 2121, and a mating part 2123 is embedded in the abutment surface 2121. Please refer to Figure 1 When the connector 212 is inserted into the storage device 100, the mating part 2123 corresponds to and adsorbs the adsorbent 30, so that the adsorbent 30 adsorbs the mating surface 2121 to the surface of the housing 10 through the adsorbing mating part 2123. The conductive component 2122 passes through the plug-in interface 102 at least partially and makes electrical contact with the contact part 21, thereby making the data line 210 electrically connected to the circuit board 20.

[0045] Understandably, by mutually adsorbing the mating part 2123 and the adsorption part 30, the abutment surface 2121 is stably and tightly abutted against the surface of the housing 10, ensuring a stable insertion and engagement between the connector 212 and the storage device 100. This reduces the risk of the connector 212 detaching from the storage device 100 without external force, causing the data cable 210 to disconnect from the storage device 100. In some embodiments, the area of ​​the housing 10 with the insertion interface 102 and the abutment surface 2121 are both planar, increasing the contact area between the abutment surface 2121 and the housing 10, making the connection between the abutment surface 2121 and the housing 10 stable and less prone to relative sliding and misalignment.

[0046] The storage device 100 contacts the conductive component 2122 through the contact portion 21 of the circuit board 20 to realize the electrical connection between the data line 210 and the storage device 100. Compared with the storage device 100 with an interface module 213 (such as a Type-C interface module 213), the above-mentioned storage device 100 removes the interface module 213, which can save the space in the height direction Z of the receiving cavity 101 occupied by the structural height of the interface module 213 itself, break through the storage height limitation of the interface module 213 on the device, thereby reducing the height of the storage device 100, making the storage device 100 thin and easy to carry.

[0047] In some embodiments, the outer periphery of the housing 10 is provided with rounded corners, making the outer side of the storage device 100 thinner.

[0048] Please see Figure 4 The conductive component 2122 includes multiple conductive terminals 2122a, all of which protrude from the contact surface 2121. Please refer to... Figure 2 The circuit board 20 is provided with multiple contact portions 21, and the housing 10 is provided with multiple insertion interfaces 102 at intervals. Each insertion interface 102 is connected to the receiving cavity 101, and each insertion interface 102 corresponds to one contact portion 21. When the contact surface 2121 abuts against the surface of the housing 10, multiple conductive terminals 2122a pass through the corresponding insertion interface 102 and make electrical contact with the corresponding contact portion 21.

[0049] Please combine Figure 2 and Figure 3 In some embodiments, the housing 10 includes a base 11 and a top cover 12. The base 11 has a first mating surface 111 with a first groove 112. The top cover 12 has a second mating surface 121 with a second groove 122. An insertion interface 102 is provided through the second mating surface 121 to communicate with the outside and the receiving cavity 101.

[0050] The second mating surface 121 is stacked on the first mating surface 111 when the upper cover 12 is connected to the base 11. The first groove 112, the second groove 122, the second mating surface 121 and the first mating surface 111 together form the receiving cavity 101, which is easy to assemble.

[0051] In some embodiments, the first mating surface 111 is provided with a notch 113, which connects to the first groove 112. The notch 113 is configured to accommodate at least a portion of the adsorption member 30. By accommodating at least a portion of the adsorption member 30 through the notch 113, compared to the adsorption member 30 being stacked on the first mating surface 111, the notch 113 can position the adsorption member 30 relative to the base 11, and can also save the height space occupied by the adsorption member 30 and the base 11, making the storage device 100 more compact and helping to reduce the height of the storage device 100.

[0052] In some embodiments, the upper cover 12 is provided with a positioning part 123, and the circuit board 20 is provided with a positioning hole 204. The positioning part 123 passes through the positioning hole 204 to position the circuit board 20 to the upper cover 12, thereby positioning the position of the circuit board 20 relative to the upper cover 12.

[0053] For example, the positioning part 123 is a positioning post. There are two positioning holes 204, which are respectively located at two opposite corners of the circuit board 20. The positioning part 123 corresponds to the positioning hole 204 one by one to prevent the circuit board 20 from shifting relative to the top cover 12.

[0054] In some embodiments, the base 11 is provided with a protruding ring 114, which protrudes from the first mating surface 111 and surrounds the first groove 112. When the upper cover 12 is connected to the base 11, the protruding ring 114 abuts against the outer side of the upper cover 12 to position the relative position of the upper cover 12 and the base 11, so as to prevent the upper cover 12 from shifting relative to the base 11.

[0055] In some embodiments, the bottom of the second groove 122 is provided with adhesive backing, which is used to bond the area of ​​the circuit board 20 other than the contact portion 21.

[0056] When assembling the storage device 100: First, the circuit board 20 is installed into the second groove 122, so that each positioning part 123 passes through a positioning hole 204 until the circuit board 20 is adhered to the backing adhesive, so that the circuit board 20 is bonded to the top cover 12. Then, adhesive is applied to the first mating surface 111, so that the adhesive surrounds the outer periphery of the first groove 112. The second mating surface 121 is stacked on the first mating surface 111, the adhesive is squeezed, and after the adhesive cures, a sealing layer is formed between the first mating surface 111 and the second abutment surface 2121, so that the first mating surface 111 and the second abutment surface 2121 are bonded together.

[0057] The bonding between the top cover 12 and the base 11 seals the connection area between them, protecting the circuit board 20 inside the receiving cavity 101 and making the surface of the storage device 100 smoother than a bolted connection. The protruding ring 114 prevents adhesive from overflowing when the second mating surface 121 is stacked on top of the first mating surface 111. Understandably, the adhesive on the first mating surface 111 will flow outward when pressed by the second mating surface 121. The area where the protruding ring 114 contacts the top cover 12 can accommodate some of the adhesive, making it less likely to overflow. After the adhesive cures, it also makes the bonding between the top cover 12 and the base 11 more secure.

[0058] Please see Figure 2In some embodiments, the circuit board 20 has a first surface 201 and a second surface 202 opposite each other in the height direction Z. A contact portion 21 is provided on the first surface 201, and the surface of the contact portion 21 is flush with the first surface 201, so that the provision of the contact portion 21 does not increase the height space occupied by the circuit board 20 in the height direction Z, thereby compressing the height of the storage device 100.

[0059] Please combine Figure 3 The first surface 201 is flat to facilitate the adhesion of adhesive backing, ensuring a stable connection between the circuit board 20 and the top cover 12, thereby maintaining the correspondence between the contact portion 21 and the insertion interface 102. The second surface 202 has electronic components, and the first groove 112 can accommodate the electronic components to prevent the circuit board 20 from being crushed.

[0060] Please combine Figure 2 and Figure 3 In some embodiments, the circuit board 20 is provided with a clearance structure, which is configured to accommodate the adsorption member 30. Compared with the adsorption member 30 being stacked on the circuit board 20, the clearance structure can position the adsorption member 30 relative to the circuit board 20, and can also save the height space occupied by the adsorption member 30 and the circuit board 20, making the storage device 100 compact and helping to reduce the height of the storage device 100.

[0061] In some embodiments, the storage device 100 includes two adsorption members 30, which are spaced apart such that the contact portion 21 is located between the two adsorption members 30. The adsorption members 30 are adhesively bonded to the bottom of the second groove 122 to prevent them from shifting along the height direction Z. In other embodiments, the storage device 100 includes one or more adsorption members 30, with one adsorption member 30 surrounding the outside of the contact portion 21, or two or more adsorption members 30 distributed around the outside of the contact portion 21.

[0062] The contact surface 2121 of the connector 212 is embedded with two mating parts 2123, with each adsorption member 30 corresponding to one mating part 2123. This allows for automatic alignment of the connector 212 with the contact portion 21, preventing the conductive component 2122 from shifting relative to the contact portion 21. The two adsorption members 30 can accurately position the connector 212 and stably adsorb it onto the surface of the housing 10, enabling the conductive component 2122 to automatically align and stably insert into the connector 102. This ensures stable electrical contact between the contact portion 21 and the conductive component 2122, making the electrical connection between the data cable 210 and the circuit board 20 reliable and stable.

[0063] In some embodiments, the adsorption element 30 is a magnet. The mating element 2123 is a magnet or a metal component. When the mating element 2123 is a magnet, the corresponding magnetic poles of the adsorption element 30 and the mating element 2123 are opposite, allowing the adsorption element 30 to attract the mating element 2123. When the mating element 2123 is a metal component (such as iron, cobalt, or nickel), the adsorption element 30 magnetically attracts the mating element 2123. In other embodiments, the adsorption element 30 is a metal component, and the mating element 2123 corresponding to the adsorption element 30 is a magnet.

[0064] Without external force, the magnet can attract the connector 212 to the surface of the housing 10, ensuring stable contact between the contact portion 21 and the conductive component 2122. Applying external force to the connector 212 can quickly separate the connector 212 from the surface of the housing 10, allowing the wire assembly to be pulled out of the connector 102. The connector 212 is connected to the storage device 100 by magnetic force, facilitating quick connection and disconnection of the data cable 210 and the storage device 100, making the operation simple and fast. The adsorption element 30 can be a permanent magnet or an electromagnet.

[0065] In some embodiments, the clearance structure includes a clearance hole 2031 and a clearance groove 2032. The clearance hole 2031 accommodates and positions an adsorption member 30. When the upper cover 12 is connected to the base 11, the clearance groove 2032 and the notch 113 together accommodate and position an adsorption member 30, resulting in a compact and reliable structure.

[0066] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A storage device for interfacing a terminal of a data line, said terminal having a conductive component, characterized in that, The storage device includes: The housing has a receiving cavity and a plug-in interface, the plug-in interface communicating with the receiving cavity; A circuit board is disposed in the receiving cavity, the circuit board including a contact portion corresponding to the insertion interface; An adsorption element is disposed in the receiving cavity and configured to adsorb the connector to the surface of the housing, so that the conductive component is inserted into the plug interface and makes electrical contact with the contact portion.

2. The memory device of claim 1, wherein, The circuit board has a first side and a second side opposite each other in the height direction, the contact portion is disposed on the first side, and the surface of the contact portion is flush with the first side.

3. The memory device of claim 1, wherein, The circuit board has a clearance structure, which is configured to accommodate the adsorption element.

4. The memory device of claim 1 or 3, wherein, The storage device includes two adsorption elements, which are spaced apart, and the contact portion is formed between the two adsorption elements.

5. The memory device of claim 4, wherein, The adsorption element is constructed as a magnet.

6. The memory device of any one of claims 1 to 3, wherein, The housing includes a base and a top cover; The base is provided with a first mating surface, and the first mating surface is provided with a first groove; The upper cover is provided with a second mating surface, the second mating surface is provided with a second groove, and the insertion interface is provided through the second mating surface; When the upper cover is connected to the base, the second mating surface is stacked on the first mating surface, and the first groove, the second groove, the second mating surface and the first mating surface together form the receiving cavity.

7. The memory device of claim 6, wherein, The first mating surface has a notch that connects to the first groove and is configured to accommodate at least a portion of the adsorption element.

8. The memory device of claim 6, wherein, The base is provided with a protruding ring that protrudes from the first mating surface and surrounds the first groove; the protruding ring is configured to abut against the outer side of the upper cover when the upper cover is connected to the base.

9. The memory device of claim 6, wherein, The upper cover is provided with a positioning part, and the circuit board is provided with a positioning hole. The positioning part passes through the positioning hole to position the circuit board to the upper cover.

10. A data cable, characterized in that, It is configured to be electrically connected to the storage device as described in any one of claims 1 to 9; The data cable includes a cable body and a connector at the end of the cable body. The connector has a conductive component and is configured to attract the attracting element, so that the conductive component is inserted into the plug interface and makes electrical contact with the contact portion.

11. A storage device assembly, characterized in that, Includes a data cable and a storage device as described in any one of claims 1 to 9; The data cable includes a cable body and a connector at the end of the cable body. The connector has a conductive component and is configured to attract the attracting element, so that the conductive component is inserted into the plug interface and makes electrical contact with the contact portion.

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