An automatic temperature control device for testing LPDDR memory chips

Abstract

This utility model discloses an automatic temperature control device for testing LPDDR memory chips. It includes a main body and a dust removal mechanism located on one side of the main body. Continuous airflow reduces dust accumulation inside the device during component placement. The air nozzle is moved back into the main frame, and the sealing plate, losing its support, rotates back to its original position, blocking one side of the main frame. An insulation plate further reduces temperature penetration during heating. After holding the handle and closing the cover, the heating element is activated via the control panel to begin heating. A temperature sensor monitors and stabilizes the temperature at the desired level, completing the test. This effectively reduces the amount of dust accumulated on the inner wall of the device, the area supporting the components, and the surface of the placed components when there are many components under test and the placement time is long. This is due to frequent manual placement by personnel, thus ensuring the accuracy of some LPDDR memory chip test data.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor memory testing, specifically relating to an automatic temperature control device for testing LPDDR memory chips. Background Technology

[0002] LPDDR memory chip testing plays a crucial role in the semiconductor industry. It is used to verify whether the performance of LPDDR memory chips during the production process meets design specifications and to ensure their stability and reliability under various operating conditions. Through a series of test procedures, such as conformance testing, speed testing, and temperature tolerance testing, potential defects and failures of memory chips can be detected, preventing defective products from entering the market.

[0003] In some existing automatic temperature control devices for testing LPDDR memory chips, the device cover needs to be opened during operation, multiple sets of components to be tested need to be manually placed in, and then the cover needs to be closed to start heating. When there are many components to be tested, resulting in a long placement time, the inner wall of the device directly exposed to the external environment, the area used to support the components to be tested, and the surface of the placed components are very easy to be covered with dust brought in by personnel during the frequent manual placement process. This has a very adverse effect on the accuracy of the temperature tolerance measurement values ​​of the components to be tested. Utility Model Content

[0004] The technical problem this invention aims to solve is to overcome existing defects and provide an automatic temperature control device for testing LPDDR memory chips. This addresses the issue mentioned in the background section where existing automatic temperature control devices for testing LPDDR memory chips require opening the device cover and manually placing multiple sets of components to be tested before closing the cover and starting the heating process. When the number of components to be tested is large, leading to a long placement time, the inner wall of the device, directly exposed to the external environment, the area supporting the components, and the surface of the placed components are easily covered with dust accumulated during frequent manual placement. This has a severely detrimental effect on the accuracy of the temperature tolerance measurement values ​​of the components to be tested.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic temperature control device for testing LPDDR memory chips, comprising a main body and a dust removal mechanism disposed on one side of the main body to reduce the amount of dust adhering inside the device during component placement by continuous airflow. The dust removal mechanism includes a main frame fixedly connected to one side of the chamber, a sealing plate rotatably connected to one side of the main frame, a slide rail symmetrically arranged on one side of the main frame, a moving frame slidably connected to the outside of the slide rail, a push bar fixedly connected to one side of the moving frame, a main frame slidably connected to the outside of the push bar, and several bases symmetrically arranged on the top of the other side of the moving frame. A screw is threadedly connected to the inner side of the base, a rotating vane is threadedly connected to the outer side of the screw, an air nozzle is fixedly connected to the top of the rotating vane, an adapter hose is fixedly connected to one end of the air nozzle, a main pipe is fixedly connected to one side of the adapter hose, an air pump is fixedly installed at one end of the main pipe, and the main frame is fixedly installed on one side of the air pump. During the process of the inner side of the device being exposed to the external environment, airflow is applied to the inner side through the air nozzle, thereby reducing the amount of dust adhering inside the device and on the surface of the placed components under test.

[0006] Preferably, a control panel is fixedly installed on one side of the chamber, several locking strips are symmetrically arranged on one side of the interior of the chamber, a temperature sensor is fixedly installed on the other side of the interior of the chamber, a cover chamber is rotatably connected to one side of the chamber, a base plate is fixedly connected to the bottom of the cover chamber, a heating wire is fixedly connected to the bottom of the base plate, and the air pump, temperature sensor and heating wire are all electrically connected to the control panel.

[0007] Preferably, a handle is fixedly connected to one side of the cover, the outer surface of the handle is deburred, and a compartment body is rotatably connected to one side of the cover.

[0008] Preferably, a sliding rod is fixedly connected to one side of the moving frame, and several sliding rods are symmetrically arranged. The main frame is slidably connected to the outside of the sliding rod.

[0009] Preferably, a washer is movably connected to the outer side of one end of the screw, a base is threadedly connected to the outer side of the screw, and a sliding frame is fixedly connected to the bottom of the base.

[0010] Preferably, a bracket is fixedly connected to the bottom of the main frame, and two brackets are symmetrically arranged. The bracket has a hollow triangular structure, and a compartment body is fixedly connected to one side of the bracket.

[0011] Preferably, a heat insulation plate is fixedly connected to one side of the sealing plate, and a main frame is rotatably connected to the outside of the sealing plate, with the sealing plate located on one side of the air nozzle.

[0012] Preferably, a mounting block is fixedly connected to the outside of the main tube, and several mounting blocks are symmetrically arranged. A main frame is fixedly connected to the bottom of the mounting block.

[0013] Compared with the prior art, this utility model provides an automatic temperature control device for testing LPDDR memory chips, which has the following advantages: 1. This utility model, by setting air nozzles, rotates counterclockwise to loosen each gasket, reducing the pressure of the inner wall of the base pressing against the outer wall of the rotating blade, thus releasing the locking of the rotating blade position. Then, each air nozzle is adjusted to the required angle, and the screw is rotated clockwise to fix the angle position. After holding the handle, the top cover of the chamber is flipped over, exposing the inner side of the chamber to the external environment. The outer wall of the push bar is pinched to push the moving frame along the outer wall of the slide rail to the front sealing plate of the air nozzle, causing the sealing plate to flip inside the main frame, exposing the air nozzle to the inner side of the chamber. During the adjustment and translation of the air nozzle angle, the adapter hose, due to its material, can deform to adapt to the position change of the air nozzle. Then, the air pump is turned on through the control panel to guide the airflow from the main pipe into each adapter hose, and finally, the air nozzle blows on the inner wall of the chamber. During the continuous air blowing process... Place the LPDDR memory chip test components one by one into the slot. After placement, turn off the air pump and reverse the operation to move the air nozzle back into the main frame. At the same time, the sealing plate loses its support and rotates back to reset, blocking one side of the main frame. The heat insulation plate reduces the degree of temperature penetration during heating. After holding the handle, close the cover. Turn on the heating wire through the control panel to start heating. The temperature sensor monitors and stabilizes the temperature at the required level to complete the test. This method can effectively reduce the amount of dust on the inner wall of the device, the area supporting the test components, and the surface of the placed components that are directly exposed to the external environment when there are many test components and the placement time is long. This is due to the frequent manual placement by personnel, thus ensuring the accuracy of some LPDDR memory chip test data. 2. By setting a sliding rod, this utility model can effectively ensure the stability of the frame position during movement and reduce its swing amplitude; 3. By setting up a heat insulation plate, this utility model can effectively reduce the occurrence of temperature directly penetrating into the inner side of the main frame during the heating process, affecting the air nozzle and adapter hose.

[0014] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a scientific and reasonable structure, is safe and convenient to use, and provides great help to people. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is an isometric structural diagram of an automatic temperature control device for testing LPDDR memory chips proposed in this utility model. Figure 2This is an exploded structural diagram of an automatic temperature control device for testing LPDDR memory chips proposed in this utility model. Figure 3 This is a schematic diagram of the dust removal mechanism of an automatic temperature control device for testing LPDDR memory chips proposed in this utility model. Figure 4 This is an exploded structural diagram of the dust removal mechanism of an automatic temperature control device for testing LPDDR memory chips proposed in this utility model. In the diagram: Main body 1, chamber 101, control panel 102, locking strip 103, temperature sensor 104, cover chamber 105, base plate 106, heating wire 107, dust removal mechanism 2, main frame 201, sealing plate 202, slide rail 203, moving frame 204, base 205, rotating vane 206, air nozzle 207, adapter hose 208, main pipe 209, air pump 210, push bar 211, screw 212, handle 3, slide bar 4, gasket 5, bracket 6, insulation plate 7, mounting block 8. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-4This utility model provides a technical solution: an automatic temperature control device for testing LPDDR memory chips, including a main body 1 and a dust removal mechanism 2 disposed on one side of the main body 1, which reduces the amount of dust adhering inside the device during component placement by continuous airflow. The dust removal mechanism 2 includes a main frame 201 fixedly connected to one side of the chamber 101, a sealing plate 202 rotatably connected to one side of the main frame 201, slide rails 203 symmetrically arranged inside one side of the main frame 201, a sliding frame 204 slidably connected to the outside of the slide rails 203, a push bar 211 fixedly connected to one side of the sliding frame 204, the main frame 201 slidably connected to the outside of the push bar 211, and several bases 205 symmetrically arranged on the top of the other side of the sliding frame 204. A screw 212 is threaded onto the inner side of the base 205, and a vane 206 is threaded onto the outer side of the screw 212. An air nozzle 207 is fixedly connected to the top of the vane 206. An adapter hose 208 is fixedly connected to one end of the air nozzle 207, and a main pipe 209 is fixedly connected to one side of the adapter hose 208. An air pump 210 is fixedly installed at one end of the main pipe 209, and a main frame 201 is fixedly installed on one side of the air pump 210. During the process of the inner side of the device being exposed to the external environment, air is blown through the air nozzle 207 to reduce the amount of dust adhering to the inside of the device and the surface of the placed test element. The counterclockwise rotation loosens each gasket 5, reducing the pressure of the inner wall of the base 205 on the outer wall of the vane 206, thus relieving pressure. After locking the position of the rotating blade 206, adjust each air nozzle 207 to the required angle, and fix the angle position by rotating the screw 212 clockwise. Hold the handle 3 and flip the cover 105 on the top of the chamber 101 to expose the inside of the chamber 101 to the external environment. Pinch the outer wall of the push bar 211 to push the moving frame 204 to slide along the outer wall of the slide rail 203 to the front top sealing plate 202 of the air nozzle 207, so that the sealing plate 202 flips inside the main frame 201, exposing the air nozzle 207 to the inside of the chamber 101. During the adjustment and translation of the air nozzle 207, the adapter hose 208 can deform due to its material to adapt to the position change of the air nozzle 207. Then, turn on the air pump 2 via the control panel 102. 10. Airflow is introduced from the main pipe 209 into each adapter hose 208, and finally blown by the air nozzle 207 onto the inner wall of the chamber 101. During the continuous airflow, the test components of the LPDDR memory chips are placed one by one into the card strip 103. After placement, the air pump 210 is turned off. The operation is reversed, and the air nozzle 207 is moved back into the main frame 201. At the same time, the sealing plate 202 loses its support and rotates back to its original position, blocking one side of the main frame 201. The heat insulation plate 7 reduces the degree of temperature penetration during heating. After holding the handle 3, the cover chamber 105 is closed. The heating wire 107 is turned on through the control panel 102 to start heating. The temperature is monitored by the temperature sensor 104 and stabilized at the required level to complete the test.

[0018] In this invention, preferably, a control panel 102 is fixedly installed on one side of the chamber 101, and several retaining strips 103 are symmetrically arranged on one side of the interior of the chamber 101. A temperature sensor 104 is fixedly installed on the other side of the interior of the chamber 101. A cover chamber 105 is rotatably connected to one side of the chamber 101. A base plate 106 is fixedly connected to the bottom of the cover chamber 105. A heating wire 107 and an air pump 210 are fixedly connected to the bottom of the base plate 106. The temperature sensor 104 and the heating wire 107 are all electrically connected to the control panel 102. The component to be tested is placed into the retaining strips 103 in sequence, the cover chamber 105 is closed, and under the monitoring of the temperature sensor 104, the heating wire 107 is turned on through the control panel 102 to raise the temperature and test the high temperature resistance of the component.

[0019] In this utility model, preferably, a handle 3 is fixedly connected to one side of the cover 105. The outer surface of the handle 3 is deburred. The cover 105 is rotatably connected to the compartment body 101, which can effectively facilitate personnel to directly hold and open the cabinet and close the cover 105.

[0020] In this utility model, preferably, a sliding rod 4 is fixedly connected to one side of the moving frame 204, and several sliding rods 4 are symmetrically arranged. The main frame 201 is slidably connected to the outside of the sliding rod 4, which can effectively ensure the stability of the position of the moving frame 204 during the movement and reduce its swing amplitude.

[0021] In this utility model, preferably, a washer 5 is movably connected to the outer side of one end of the screw 212, a base 205 is threadedly connected to the outer side of the screw 212, and a sliding frame 204 is fixedly connected to the bottom of the base 205. This can effectively reduce the loosening range of the screw 212 during long-term use and ensure the stability of the screw 212.

[0022] In this utility model, preferably, a bracket 6 is fixedly connected to the bottom of the main frame 201. Two brackets 6 are symmetrically arranged. The bracket 6 has a hollow triangular structure. A compartment 101 is fixedly connected to one side of the bracket 6, which can effectively ensure the stability of the main frame 201 structure.

[0023] In this utility model, preferably, a heat insulation plate 7 is fixedly connected to one side of the sealing plate 202, and a main frame 201 is rotatably connected to the outside of the sealing plate 202. The sealing plate 202 is located on one side of the air nozzle 207, which can effectively reduce the occurrence of the situation where the temperature directly penetrates into the inside of the main frame 201 during the heating process, affecting the air nozzle 207 and the adapter hose 208.

[0024] In this utility model, preferably, the main pipe 209 is fixedly connected to the outer side of the mounting block 8, and several mounting blocks 8 are symmetrically arranged. The bottom of the mounting block 8 is fixedly connected to the main frame 201, which can effectively improve the stability of the main pipe 209 during use.

[0025] The working principle and usage process of this utility model are as follows: In use, rotate counterclockwise and loosen each gasket 5 to reduce the pressure of the inner wall of the base 205 on the outer wall of the rotating plate 206, thus releasing the lock on the position of the rotating plate 206. Then, adjust each air nozzle 207 to the required angle, rotate the screw 212 clockwise to fix the angle position, hold the handle 3, and flip the cover 105 on top of the chamber 101 to expose the inner side of the chamber 101 to the external environment. Then, squeeze the outer wall of the push bar 211 to push... The movable frame 204 slides along the outer wall of the slide rail 203 to the front top sealing plate 202 of the air nozzle 207, causing the sealing plate 202 to flip inside the main frame 201, exposing the air nozzle 207 to the inside of the chamber 101. During the adjustment and translation of the air nozzle 207, the adapter hose 208, due to its material, can deform to adapt to the positional change of the air nozzle 207. Then, the air pump 210 is turned on via the control panel 102 to introduce airflow from the main pipe 209 into each adapter hose 208, and finally... The air nozzle 207 blows air onto the inner wall of the chamber 101. During the continuous airflow, the test components for LPDDR memory chips are placed one by one into the retainer 103. After placement, the air pump 210 is turned off, and the operation is reversed to move the air nozzle 207 back into the main frame 201. At the same time, the sealing plate 202 loses its support and rotates back to its original position, blocking one side of the main frame 201. The heat insulation plate 7 reduces the degree of temperature penetration during heating. After holding the handle 3, the cover chamber 105 is closed. The heating wire 107 is turned on via the control panel 102 to start heating. The temperature is monitored by the temperature sensor 104 to stabilize the temperature at the required level, completing the test. This effectively reduces the amount of dust adhering to the inner wall of the device, the area supporting the test components, and the surface of the placed components when there are many test components and the placement time is long. This is due to the frequent manual placement by personnel, thus ensuring the accuracy of some LPDDR memory chip test data.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic temperature control device for testing LPDDR memory chips, characterized in that: The device includes a main body (1) and a dust removal mechanism (2) located on one side of the main body (1) to reduce the amount of dust adhering inside the device during the placement of components by continuous air blowing. The dust removal mechanism (2) includes a main frame (201) fixedly connected to one side of the chamber (101). A sealing plate (202) is rotatably connected to one side of the main frame (201). A slide rail (203) is symmetrically arranged on one side inside the main frame (201). A moving frame (204) is slidably connected to the outside of the slide rail (203). A push bar (211) is fixedly connected to one side of the moving frame (204). The main frame (201) is slidably connected to the outside of the push bar (211). Several bases (2) are symmetrically arranged on the top of the other side of the moving frame (204). 05), the base (205) is threaded with a screw (212) on the inner side, and a rotary vane (206) is threaded with the outer side of the screw (212). An air nozzle (207) is fixedly connected to the top of the rotary vane (206). An adapter hose (208) is fixedly connected to one end of the air nozzle (207). A main pipe (209) is fixedly connected to one side of the adapter hose (208). An air pump (210) is fixedly installed at one end of the main pipe (209). A main frame (201) is fixedly installed on one side of the air pump (210). During the process of the inner side of the device being exposed to the external environment, the air nozzle (207) blows air onto the inner side, thereby reducing the amount of dust adhering inside the device and on the surface of the placed test element.

2. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: A control panel (102) is fixedly installed on one side of the chamber (101). Several clips (103) are symmetrically arranged on one side of the interior of the chamber (101). A temperature sensor (104) is fixedly installed on the other side of the interior of the chamber (101). A cover chamber (105) is rotatably connected to one side of the chamber (101). A base plate (106) is fixedly connected to the bottom of the cover chamber (105). A heating wire (107) is fixedly connected to the bottom of the base plate (106). The air pump (210), the temperature sensor (104), and the heating wire (107) are all electrically connected to the control panel (102).

3. The automatic temperature control device for testing LPDDR memory chips according to claim 2, characterized in that: A handle (3) is fixedly connected to one side of the cover (105). The outer surface of the handle (3) has been deburred. A compartment body (101) is rotatably connected to one side of the cover (105).

4. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: A sliding rod (4) is fixedly connected to one side of the moving frame (204), and several sliding rods (4) are symmetrically arranged. The main frame (201) is slidably connected to the outside of the sliding rod (4).

5. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: A washer (5) is movably connected to the outer side of one end of the screw (212), and a base (205) is threadedly connected to the outer side of the screw (212). A sliding frame (204) is fixedly connected to the bottom of the base (205).

6. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: The bottom of the main frame (201) is fixedly connected to a bracket (6). There are two brackets (6) symmetrically arranged. The bracket (6) is a hollow triangular structure. The compartment (101) is fixedly connected to one side of the bracket (6).

7. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: A heat insulation plate (7) is fixedly connected to one side of the sealing plate (202), and a main frame (201) is rotatably connected to the outside of the sealing plate (202). The sealing plate (202) is located on one side of the air nozzle (207).

8. The automatic temperature control device for testing LPDDR memory chips according to claim 1, characterized in that: The main tube (209) is fixedly connected to an installation block (8) on its outer side. Several installation blocks (8) are symmetrically arranged. The bottom of the installation block (8) is fixedly connected to a main frame (201).

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