A high temperature resistant conductive metal film

Abstract

This utility model relates to a high-temperature resistant conductive metal film, including a take-up roller with a metal film assembly wound around it. The metal film assembly includes a bottom protective layer wound around the take-up roller, a substrate layer fixedly mounted on the bottom protective layer, a bonding layer fixedly mounted on the substrate layer, a buffer layer fixedly mounted on the bonding layer, a barrier layer fixedly mounted on the buffer layer, and a high-temperature stabilizing layer fixedly mounted on the barrier layer. The bottom protective layer protects the substrate from environmental corrosion and provides a symmetrical structure to balance thermal stress. The substrate layer provides structural support and dimensional stability. The bonding layer enhances the adhesion between the conductive film and the substrate, preventing peeling. The buffer layer provides flexibility to accommodate minor deformations of the substrate, preventing cracking or peeling caused by thermal stress.

Description

Technical Field

[0001] This utility model relates to the field of conductive metal film technology, specifically a high-temperature resistant conductive metal film. Background Technology

[0002] In high-end technology fields such as aerospace, energy and nuclear industries, the demand for conductive materials that can operate stably in extreme high-temperature environments is becoming increasingly urgent.

[0003] However, traditional conductive metal films mostly use conventional metal materials such as silver and copper. Although these materials have excellent conductivity, they are prone to oxidation, volatilization or diffusion reaction with the substrate under high temperature conditions, which leads to a sharp decline in conductivity or even failure. Moreover, during long-term high-temperature service, it is still difficult to avoid problems such as interlayer diffusion and thermal stress cracking, which cannot meet the stringent requirements of the above-mentioned extreme application scenarios for the comprehensive performance of conductive metal films.

[0004] Therefore, a high-temperature resistant conductive metal film is proposed to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a high-temperature resistant conductive metal film.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature resistant conductive metal film, comprising a take-up roller, a metal film assembly wound on the take-up roller, the metal film assembly comprising a bottom protective layer, the bottom protective layer wound on the take-up roller, a substrate layer fixedly mounted on the bottom protective layer, a bonding layer fixedly mounted on the substrate layer, a buffer layer fixedly mounted on the bonding layer, a barrier layer fixedly mounted on the buffer layer, a high-temperature stabilizing layer fixedly mounted on the barrier layer, a conductive layer fixedly mounted on the high-temperature stabilizing layer, and an outer protective layer fixedly mounted on the conductive layer.

[0007] Preferably, the take-up roller is cylindrical in shape, and the bottom protective layer is made of silicon nitride.

[0008] Preferably, the substrate layer is made of polyimide.

[0009] Preferably, the bonding layer is made of nickel.

[0010] Preferably, the buffer layer is made of graphene.

[0011] Preferably, the barrier layer is made of titanium nitride, and the high-temperature stabilizing layer is made of molybdenum.

[0012] Preferably, the conductive layer is made of copper, and the outer protective layer is made of aluminum oxide.

[0013] Compared with the prior art, this utility model provides a high-temperature resistant conductive metal film, which has the following beneficial effects:

[0014] 1. This utility model provides a bottom protective layer to protect the substrate from environmental erosion and provides a symmetrical structure to balance thermal stress. It also provides a substrate layer to provide structural support and dimensional stability. Furthermore, it provides a bonding layer to enhance the adhesion between the conductive film and the substrate and prevent peeling. Finally, it provides a buffer layer to provide flexibility to accommodate minor deformations of the substrate and prevent cracking or peeling caused by thermal stress.

[0015] 2. This utility model includes a barrier layer to inhibit the diffusion of metal atoms to adjacent layers, preventing a decrease in conductivity or interlayer reaction; a high-temperature stabilizing layer to enhance the stability of the conductive layer at high temperatures, preventing metal diffusion or volatilization; a conductive layer to provide high conductivity; and an outer protective layer to provide wear-resistant, corrosion-resistant, and oxidation-resistant protection, preventing material oxidation or mechanical damage in high-temperature environments.

[0016] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a high-temperature resistant conductive metal film proposed in this utility model.

[0018] Figure 2 This is a schematic diagram of a high-temperature resistant conductive metal film assembly proposed in this utility model.

[0019] Figure 3 This is a partially exploded schematic diagram of a metal film assembly of a high-temperature resistant conductive metal film proposed in this utility model.

[0020] In the figure: 1. Take-up roller; 2. Metal film assembly; 21. Bottom protective layer; 22. Substrate layer; 23. Bonding layer; 24. Buffer layer; 25. Barrier layer; 26. High temperature stable layer; 27. Conductive layer; 28. Outer protective layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example:

[0023] Please see Figure 1 - Figure 3 This embodiment discloses a high-temperature resistant conductive metal film, including a take-up roller 1 for winding a metal film assembly 2. The take-up roller 1 is wound with the metal film assembly 2, which includes a bottom protective layer 21 wound around the take-up roller 1. The bottom protective layer 21 protects the substrate from environmental corrosion and provides a symmetrical structure to balance thermal stress. A substrate layer 22 is fixedly mounted on the bottom protective layer 21, providing structural support and dimensional stability. A bonding layer 23 is fixedly mounted on the substrate layer 22, enhancing the adhesion between the conductive film and the substrate and preventing peeling. A buffer layer 24 is fixedly mounted on the bonding layer 23. 4. To provide flexibility, adapt to minor deformations of the substrate, and prevent cracking or peeling caused by thermal stress, a barrier layer 25 is fixedly installed on the buffer layer 24. By setting the barrier layer 25, the diffusion of metal atoms to adjacent layers is inhibited, avoiding a decrease in conductivity or interlayer reaction. A high-temperature stabilizing layer 26 is fixedly installed on the barrier layer 25. By setting the high-temperature stabilizing layer 26, the stability of the conductive layer 27 at high temperatures is enhanced, preventing metal diffusion or volatilization. A conductive layer 27 is fixedly installed on the high-temperature stabilizing layer 26. By setting the conductive layer 27, high conductivity is provided. An outer protective layer 28 is fixedly installed on the conductive layer 27. By setting the outer protective layer 28, wear-resistant, corrosion-resistant, and oxidation-resistant protection is provided, preventing material oxidation or mechanical damage in high-temperature environments.

[0024] The take-up roller 1 is cylindrical in shape and is used to take up the metal film assembly 2. The bottom protective layer 21 is made of silicon nitride. The bottom protective layer 21 is used to protect the substrate from environmental corrosion and at the same time provide a symmetrical structure to balance thermal stress.

[0025] The substrate layer 22 is made of polyimide and is provided to provide structural support and dimensional stability.

[0026] The bonding layer 23 is made of nickel. By providing the bonding layer 23, the adhesion between the conductive film and the substrate is enhanced, and peeling is prevented.

[0027] The buffer layer 24 is made of graphene. By providing the buffer layer 24, it is used to provide flexibility to accommodate the slight deformation of the substrate and prevent cracking or peeling caused by thermal stress.

[0028] The barrier layer 25 is made of titanium nitride. By setting the barrier layer 25, it is used to suppress the diffusion of metal atoms to adjacent layers and avoid the decrease in conductivity or interlayer reaction. The high temperature stabilizing layer 26 is made of molybdenum. By setting the high temperature stabilizing layer 26, it is used to enhance the stability of the conductive layer 27 at high temperatures.

[0029] The conductive layer 27 is made of copper and is provided to provide high conductivity. The outer protective layer 28 is made of aluminum oxide and is provided to provide wear-resistant, corrosion-resistant and oxidation-resistant protection, preventing material oxidation or mechanical damage in high-temperature environments.

[0030] The base protective layer 21 protects the substrate from environmental corrosion and provides a symmetrical structure to balance thermal stress. The substrate layer 22 provides structural support and dimensional stability. The bonding layer 23 enhances the adhesion between the conductive film and the substrate and prevents peeling. The buffer layer 24 provides flexibility to accommodate minor deformations of the substrate and prevents cracking or peeling caused by thermal stress. The barrier layer 25 inhibits the diffusion of metal atoms to adjacent layers, preventing a decrease in conductivity or interlayer reactions. The high-temperature stabilizing layer 26 enhances the stability of the conductive layer 27 at high temperatures and prevents metal diffusion or volatilization. The conductive layer 27 provides high conductivity. The outer protective layer 28 provides wear-resistant, corrosion-resistant, and oxidation-resistant protection to prevent material oxidation or mechanical damage in high-temperature environments.

[0031] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that can achieve its beneficial effects can be implemented.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature resistant conductive metal film, comprising a take-up roller (1), characterized in that: A metal film assembly (2) is wound around the take-up roller (1). The metal film assembly (2) includes a bottom protective layer (21). The bottom protective layer (21) is wound around the take-up roller (1). A substrate layer (22) is fixedly installed on the bottom protective layer (21). A bonding layer (23) is fixedly installed on the substrate layer (22). A buffer layer (24) is fixedly installed on the bonding layer (23). A barrier layer (25) is fixedly installed on the buffer layer (24). A high-temperature stabilizing layer (26) is fixedly installed on the barrier layer (25). A conductive layer (27) is fixedly installed on the high-temperature stabilizing layer (26). An outer protective layer (28) is fixedly installed on the conductive layer (27).

2. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The take-up roller (1) is cylindrical in shape, and the bottom protective layer (21) is made of silicon nitride.

3. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The substrate layer (22) is made of polyimide.

4. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The bonding layer (23) is made of nickel.

5. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The buffer layer (24) is made of graphene.

6. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The barrier layer (25) is made of titanium nitride, and the high-temperature stabilizing layer (26) is made of molybdenum.

7. The high-temperature resistant conductive metal film according to claim 1, characterized in that: The conductive layer (27) is made of copper, and the outer protective layer (28) is made of aluminum oxide.

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