An alloy foil resistive electrode structure

Abstract

This utility model discloses an alloy foil resistor electrode structure, including a substrate. An alloy sheet is fixedly connected to the lower end of a reinforcing bump, and a protective layer is attached to the middle of the lower end of the alloy sheet. Copper-plated electrodes are attached to both sides of the lower end of the alloy sheet. Sputtered nickel-chromium layers are distributed on both sides of the substrate, and an electroplated copper layer is attached to the outer wall of the sputtered nickel-chromium layer. An electroplated nickel layer is attached to the outer wall of the electroplated copper layer, and an electroplated tin layer is fitted onto the outer wall of the electroplated nickel layer. Steps are formed on both sides of the lower end of the electroplated tin layer. This alloy foil resistor electrode structure can reduce the size by 50% by using steps with a width of 0-0.14mm. During soldering, the soldering effect is better, saving costs and reducing solder consumption. Furthermore, the alloy sheet can be inserted and bonded by the reinforcing bump and adhesive, ensuring stable installation. The heat-conducting layer and electroplated copper layer also allow for more efficient heat dissipation, resulting in better performance.

Description

Technical Field

[0001] This utility model relates to the field of alloy foil resistor technology, specifically to an alloy foil resistor electrode structure. Background Technology

[0002] Resistance is a physical quantity that represents the degree to which a conductor impedes the flow of electric current. The greater the resistance of a conductor, the greater its ability to impede the flow of current. Different conductors generally have different resistances; resistance is an inherent property of the conductor itself. Resistance causes a change in the amount of electrons that can flow through the conductor; the lower the resistance, the greater the amount of electrons that can flow through, and vice versa. Superconductors, however, have no resistance.

[0003] A current chip alloy foil resistor structure (CN201920643078.3) features a chip alloy foil, with the foil chip formed by sequentially joining multiple foil lines end-to-end. All foil lines are flat on the same horizontal plane, achieving a non-inductive structure for the resistor body. The copper oxide ceramic shell significantly improves the heat dissipation performance of the resistor body, enabling it to withstand stronger pulse energy. However, it has drawbacks: existing equipment is costly, the step width is large, solder paste creeps into the step during soldering, resulting in high solder consumption, poor alloy sheet stability, and inadequate heat dissipation. Therefore, a new alloy foil resistor electrode structure is needed to solve these problems. Utility Model Content

[0004] The purpose of this invention is to provide an alloy foil resistor electrode structure to solve the problems mentioned in the background art, such as the waste of cost, large step width, large solder consumption due to solder paste crawling into the step during soldering, poor stability of the alloy sheet, and poor heat dissipation of the sheet.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an alloy foil resistive electrode structure, comprising a substrate, a polyimide film attached to the outer wall of the substrate, a thermally conductive layer attached to the upper end of the polyimide film, an adhesive distributed at the middle position of the lower end of the substrate, a reinforcing protrusion inserted into the inner wall of the adhesive, an alloy sheet fixedly connected to the lower end of the reinforcing protrusion, a protective layer attached to the middle position of the lower end of the alloy sheet, copper-plated electrodes attached to both sides of the lower end of the alloy sheet, sputtered nickel-chromium layers attached to both sides of the substrate, an electroplated copper layer attached to the outer wall of the sputtered nickel-chromium layer, an electroplated nickel layer attached to the outer wall of the electroplated copper layer, an electroplated tin layer fitted onto the outer wall of the electroplated nickel layer, steps formed on both sides of the lower end of the electroplated tin layer, and a code fixedly connected to the upper end of the thermally conductive layer.

[0006] Preferably, the electroplated tin layer, electroplated copper layer, sputtered nickel-chromium layer, and electroplated nickel layer are distributed in four layers surrounding both sides of the substrate.

[0007] Preferably, the protective layer is made of double-layered glass, and the protective layer and the alloy sheet are installed in a capping manner.

[0008] Preferably, the width of the step is 0 to 0.14 mm.

[0009] Preferably, the polyimide film is distributed and fitted onto the outer wall of the substrate, the thermally conductive layer is distributed and overlapped on the polyimide film, and the thermally conductive layer is made of graphite.

[0010] Preferably, the alloy sheet is inserted and bonded to the substrate by reinforcing bumps and adhesive, and the reinforcing bumps are hollow structures.

[0011] Compared with the prior art, the beneficial effects of this utility model are: the alloy foil resistor electrode structure can reduce the step width by 50% by 0~0.14mm, resulting in better solder climbing effect during welding, saving costs, and consuming less solder during welding. Moreover, the alloy sheet can be inserted and bonded by reinforcing bumps and adhesive, ensuring stable installation. Furthermore, the heat dissipation can be achieved more efficiently through the heat-conducting layer and electroplated copper layer, resulting in better performance. Attached Figure Description

[0012] Figure 1 This is a front view of an alloy foil resistive electrode structure according to the present invention; Figure 2 This utility model relates to an alloy foil resistive electrode structure. Figure 1 Enlarged view of point A in the middle; Figure 3 This utility model relates to an alloy foil resistive electrode structure. Figure 1 Enlarged view at point B in the middle; Figure 4 This utility model relates to an alloy foil resistive electrode structure. Figure 1 Enlarged view of point C in the middle.

[0013] In the diagram: 1. Substrate, 2. Character code, 3. Electroplated tin layer, 4. Protective layer, 5. Adhesive, 6. Step, 7. Thermal conductive layer, 8. Polyimide film, 9. Electroplated copper layer, 10. Sputtered nickel-chromium layer, 11. Alloy sheet, 12. Copper-plated electrode, 13. Electroplated nickel layer, 14. Reinforcing bump. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-4 This utility model provides a technical solution: an alloy foil resistor electrode structure, including a substrate 1, a code 2, an electroplated tin layer 3, a protective layer 4, an adhesive 5, a step 6, a thermally conductive layer 7, a polyimide film 8, an electroplated copper layer 9, a sputtered nickel-chromium layer 10, an alloy sheet 11, a plated copper electrode 12, an electroplated nickel layer 13, and a reinforcing bump 14. The polyimide film 8 is attached to the outer wall of the substrate 1, and the thermally conductive layer 7 is attached to the upper end of the polyimide film 8. The polyimide film 8 is distributed and overlapped with the outer wall of the substrate 1. The thermally conductive layer 7 is distributed and overlapped on the polyimide film 8. The thermally conductive layer 7 is made of graphite. This allows the polyimide film 8 to effectively solve the problem of easy breakage and deformation of the substrate, and can also assist in heat dissipation.

[0016] An adhesive 5 is attached to the middle of the lower end of the substrate 1, and a reinforcing protrusion 14 is inserted into the inner wall of the adhesive 5. An alloy sheet 11 is fixedly connected to the lower end of the reinforcing protrusion 14, and a protective layer 4 is attached to the middle of the lower end of the alloy sheet 11. The protective layer 4 is made of double-layer glass, and the protective layer 4 and the alloy sheet 11 are installed in a cover-like manner, so that the protective layer 4 can effectively cover and protect, and the protective effect is good.

[0017] The alloy sheet 11 is inserted and bonded to the substrate 1 through reinforcing bumps 14 and adhesive 5. The reinforcing bumps 14 are hollow, which allows the alloy sheet 11 to be supported and reinforced, ensuring stable installation. Copper-plated electrodes 12 are attached to both sides of the lower end of the alloy sheet 11. Sputtered nickel-chromium layers 10 are attached to both sides of the substrate 1, and electroplated copper layers 9 are attached to the outer wall of the sputtered nickel-chromium layers 10. Electroplated nickel layers 13 are attached to the outer wall of the electroplated copper layers 9, and electroplated tin layers 3 are fitted onto the outer wall of the electroplated nickel layers 13. The electroplated tin layers 3, electroplated copper layers 9, sputtered nickel-chromium layers 10, and electroplated nickel layers 13 are distributed in four layers around the sides of the substrate 1, which makes the structure more stable and allows for effective heat dissipation.

[0018] Steps 6 are provided on both sides of the lower end of the electroplated tin layer 3. The width of the steps 6 is 0 to 0.14 mm. This makes the solder climbing effect better during soldering and saves costs. The small step width means that less solder is consumed during soldering. The upper end of the heat-conducting layer 7 is fixedly connected with the code 2.

[0019] Working principle: When using this alloy foil resistor electrode structure, the device is first assembled and processed. When bonding the alloy sheet 11, the reinforcing bump 14 can be inserted into the adhesive 5, and the adhesive 5 can penetrate into the reinforcing bump 14 for filling and bonding. Then, it is uniformly soldered through the step 6, followed by soldering. In use, it can be stably used by the dual heat dissipation of the electroplated copper layer 9 and the heat-conducting layer 7. This is the usage process of this alloy foil resistor electrode structure.

[0020] It should be noted that this utility model is an alloy foil resistor electrode structure. All components are standard parts or parts known to those skilled in the art. Its structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods. Furthermore, all electrical components mentioned above refer to power elements, electrical components, and the matching monitoring computer and power supply connected by wires. The specific connection method should refer to the working principle mentioned above, and the electrical connection between each electrical component should be completed in the order of operation. The detailed connection method is a well-known technology in the field.

[0021] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An alloy foil resistance electrode structure comprising a substrate (1), the outer wall of which is attached with a polyimide film (8), and the upper end of the polyimide film (8) is attached with a heat-conducting layer (7), characterized in that: The substrate (1) has adhesive (5) attached to the middle of its lower end, and a reinforcing bump (14) is inserted into the inner wall of the adhesive (5). An alloy sheet (11) is fixedly connected to the lower end of the reinforcing bump (14), and a protective layer (4) is attached to the middle of the lower end of the alloy sheet (11). Copper-plated electrodes (12) are attached to both sides of the lower end of the alloy sheet (11). Sputtered nickel-chromium layers (10) are attached to both sides of the substrate (1), and an electroplated copper layer (9) is attached to the outer wall of the sputtered nickel-chromium layer (10). An electroplated nickel layer (13) is attached to the outer wall of the electroplated copper layer (9), and an electroplated tin layer (3) is fitted to the outer wall of the electroplated nickel layer (13). Steps (6) are provided on both sides of the lower end of the electroplated tin layer (3). A code (2) is fixedly connected to the upper end of the thermally conductive layer (7).

2. An alloy foil resistive electrode structure according to claim 1, characterized in that: The electroplated tin layer (3), electroplated copper layer (9), sputtered nickel-chromium layer (10) and electroplated nickel layer (13) are distributed in four layers around the two sides of the substrate (1).

3. An alloy foil resistive electrode structure according to claim 2, wherein: The protective layer (4) is made of double-layer glass, and the protective layer (4) and the alloy sheet (11) are installed in a cover-fitting manner.

4. An alloy foil resistive electrode structure according to claim 3, wherein: The width of the step (6) is 0 to 0.14 mm.

5. An alloy foil resistive electrode structure according to claim 4, wherein: The polyimide film (8) is distributed and fitted on the outer wall of the substrate (1), and the thermal conductive layer (7) is distributed and overlapped on the polyimide film (8), and the thermal conductive layer (7) is made of graphite.

6. An alloy foil resistive electrode structure according to claim 5, wherein: The alloy sheet (11) is inserted and bonded to the substrate (1) by means of reinforcing bumps (14) and adhesive (5), and the reinforcing bumps (14) are hollow structures.

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