Railway circuit compensation capacitor and potting jig

Abstract

This utility model relates to the field of track circuit technology, and provides a track circuit compensation capacitor and potting fixture. The capacitor includes a capacitor core, a first lead wire, a second lead wire, a housing, a positioning ring, and a sealing seat. The capacitor core and the positioning ring form a first potting space. The positioning ring has a first mounting hole, through which the first lead wire passes. The positioning ring also has a potting port that communicates with the first potting space. A second potting space is formed between the capacitor core and the sealing seat. The sealing seat has a second mounting hole, through which the second lead wire passes. By setting a material flow gap, the first and second potting spaces are connected. Resin flows from the first to the second potting space through the material flow gap, achieving one-time potting and improving the capacitor's sealing effect. The first and second mounting holes solve the positioning problem of the capacitor core within the housing.

Description

Technical Field

[0001] This utility model relates to the field of track circuit technology, specifically to a track circuit compensation capacitor and potting fixture. Background Technology

[0002] In railway signaling systems, track circuits are the core components for train position detection and signal transmission. Track circuit compensation capacitors, as key components, primarily compensate for signal attenuation caused by rail inductance, ensuring signal stability and detection accuracy during long-distance transmission. Because track circuit compensation capacitors operate in outdoor environments for extended periods, they must withstand complex conditions such as high and low temperature cycles, humidity, vibration, shock, and dust. Therefore, extremely high requirements are placed on the sealing, mechanical strength, and environmental adaptability of their encapsulation structure.

[0003] A capacitor consists of a capacitor core, two lead wires, a cylindrical plastic casing, and a sealing resin for the capacitor core. The current production method is as follows: winding the thin-film capacitor core, gold plating at both ends of the capacitor core, soldering the two lead wires, wrapping a foam strip around the waist of the capacitor core for insulation and centering, fitting the capacitor core into the cylindrical plastic casing, and then potting the resin chambers at both ends of the capacitor casing twice, which cures to form a compensation capacitor product.

[0004] The encapsulation process of this capacitor reveals several issues: the glue-wrapped insulation around the waist of the capacitor core and the failure of the foam strip centered on the capacitor core to be properly encapsulated with resin result in poor sealing. A distinct curing interface exists between the resin layers formed by the two encapsulation processes. This interface is prone to developing micro-gaps due to differences in resin shrinkage and accumulated curing stress. In long-term outdoor environments, moisture, dust, and impurities can easily seep into the casing through these gaps, causing the capacitor core to become damp and fail, or leading to poor lead contact. This can result in abnormal track circuit signals, and in severe cases, may affect train operation safety. Utility Model Content

[0005] To overcome the above-mentioned defects, the embodiments of this utility model provide a track circuit compensation capacitor and a potting fixture, which solves the technical problem in the prior art that when potting resin, the track circuit compensation capacitor needs to be potted twice at both ends of the capacitor core, resulting in the middle of the capacitor core not being filled with resin and thus having a poor sealing effect.

[0006] According to one aspect, at least one embodiment of the present invention provides a track circuit compensation capacitor, including a capacitor core, a first lead wire and a second lead wire disposed at both ends of the capacitor core, and a housing mounted on the outside of the capacitor core, further comprising: A positioning ring is disposed on one end of the outer shell. The capacitor core and the positioning ring form a first potting space. A first mounting hole is provided on the positioning ring. The first lead wire passes through the first mounting hole. A potting port is provided on the positioning ring. The potting port is connected to the first potting space. The potting port is used to pour in resin. A sealing seat is disposed on the other end of the housing, and a second potting space is formed between the capacitor core and the sealing seat. A second mounting hole is provided on the sealing seat, and the second lead wire passes through the second mounting hole. A material passage gap is formed between the outer peripheral wall of the capacitor core and the inner wall of the outer casing. The first potting space and the second potting space are connected through the material passage gap, which allows resin to pass through so that the resin flows into the second potting space.

[0007] Optionally, both the positioning ring and the sealing seat are interference-fitted with the inner peripheral wall of the housing.

[0008] Optional, also includes: A first protrusion is disposed on the outer periphery of the top surface of the positioning ring. The first protrusion can abut against one end face of the outer shell to block the connection between the outer shell peripheral wall and the positioning ring.

[0009] Optionally, the positioning ring includes two semicircular rings, which are joined together to form the positioning ring. Each of the two semicircular rings has a first semicircular groove at its center. The two first semicircular grooves are joined together to form the first mounting hole. The diameter of the first mounting hole is larger than the diameter of the first lead wire.

[0010] Optional, also includes: The second protrusion is disposed on the bottom outer periphery of the sealing seat. The second protrusion can abut against the other end face of the outer shell to block the connection between the outer shell peripheral wall and the sealing seat.

[0011] Optionally, the sealing seat includes two semicircular blocks, which are joined together to form the sealing seat. A second semicircular groove is provided at the center of each of the two semicircular blocks, and the two second semicircular grooves are joined together to form a second mounting hole. The diameter of the second mounting hole is smaller than the diameter of the second lead wire.

[0012] A potting fixture for fixing a track circuit compensation capacitor, comprising: Frame; A fixing plate is provided on the frame, and the fixing plate has a plurality of mounting slots for vertically placing and fixing the compensation capacitor; A support plate is disposed on the frame and located below the fixing plate. The support plate is used to support the bottom of the compensation capacitor. The support plate has a through groove for the second lead wire to pass through. One end of the through groove extends to the side wall of the support plate. The through groove has an opening located on the side wall of the support plate. The opening is used to allow the second lead wire to enter the through groove.

[0013] Optionally, the fixing plate has a wire-passing groove and a wire-binding groove. The wire-passing groove communicates with the mounting groove, and the wire-binding groove is located on the side of the mounting groove away from the wire-passing groove and communicates with the mounting groove. The first lead wire is used to enter the wire-binding groove through the wire-passing groove. The first lead wire can extend downward through the through groove to the bottom of the support plate, so that the wire-binding groove and the through groove limit the first lead wire.

[0014] Optional, also includes: A plurality of fixing clamps are provided on the bottom surface of the support plate. Each fixing clamp corresponds to a wire harness groove. Each fixing clamp has a wire clamping opening and is used to clamp the first lead wire and the second lead wire.

[0015] Optionally, the inner peripheral wall of the fixing clamp that contacts the first lead wire and the second lead wire is provided with a sponge pad.

[0016] The beneficial effects of this utility model are as follows: In this invention, the compensation capacitor is equipped with a positioning ring and a sealing seat. A first potting space and a second potting space are formed between the capacitor core, the positioning ring, and the sealing seat. A material passage gap is formed between the outer peripheral wall of the capacitor core and the inner wall of the outer shell, which connects the first potting space and the second potting space. Through the material passage gap between the capacitor core and the outer shell, the resin can fill all the spaces of the capacitor in one potting, solving the problem of the waist not being covered when potting twice in traditional methods. At the same time, it eliminates the curing interface of the two potting processes, avoiding gaps caused by differences in shrinkage rate and stress accumulation at the interface. Combined with the closed space of the positioning ring and the sealing seat, it prevents outdoor moisture and dust from seeping in, preventing the core from becoming damp and failing or the lead wires from making poor contact, and ensuring the long-term stable operation of the capacitor.

[0017] The positioning ring and sealing seat position the capacitor core, ensuring uniform resin coating. After curing, all three components are integrated with the outer shell, enhancing mechanical strength and enabling resistance to complex operating conditions such as high and low temperature cycles, vibration, and impact. This prevents lead wire breakage or resin cracking caused by core displacement, extending service life and reducing maintenance costs. The single-stage potting process eliminates the need for traditional steps such as wrapping foam tape around the waist, two potting cycles, and intermediate curing, shortening the production cycle. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of this utility model and these drawings without any creative effort.

[0019] Figure 1 This is a front view of the track circuit compensation capacitor in one embodiment of the present invention; Figure 2 for Figure 1 A cross-sectional view at AA in the embodiment; Figure 3 for Figure 1 A schematic diagram of the positioning ring in the embodiment; Figure 4 for Figure 1 A schematic diagram of the sealing seat in the embodiment; Figure 5 for Figure 1 A schematic diagram showing the positions of the positioning ring, sealing seat, and capacitor core in the embodiment; Figure 6 for Figure 1 A schematic diagram of the track circuit compensation capacitor in the embodiment; Figure 7 This is a schematic diagram showing the positions of the potting fixture and the compensation capacitor in another embodiment of the present invention; Figure 8 for Figure 7 A magnified view of section B; Figure 9 for Figure 7 A schematic diagram of the filling fixture in the embodiment; Figure 10 for Figure 7 A side view of the potting fixture in the embodiment; Figure 11 for Figure 7 The embodiment shows a schematic diagram of the fixing fixture.

[0020] In the diagram: 1. Outer shell; 100. Capacitor core; 1001. Material passage gap; 11. First lead wire; 12. Second lead wire; 2. Positioning ring; 2001. First potting space; 201. First mounting hole; 202. Potting port; 21. First boss; 22. Semicircular ring; 2201. First semicircular groove; 3. Sealing seat; 3001. Second potting space; 301. Second mounting hole; 31. Second boss; 32. Semicircular block; 3201. Second semicircular groove; 4. Frame; 5. Fixing plate; 501. Mounting groove; 502. Wire passage groove; 503. Wire harness groove; 6. Support plate; 601. Through groove; 6001. Opening; 7. Fixing clamp; 701. Wire clamping port; 71. Sponge pad. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit its scope.

[0022] To keep the drawings concise, only the parts relevant to the utility model are shown schematically in each drawing; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "a" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0023] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] To address signal attenuation caused by rail inductance, track circuit compensation capacitors have been developed. Their function is to offset rail inductance through their own capacitance, optimizing the impedance matching of the track circuit and ensuring stable amplitude and phase of the signal during long-distance transmission. This guarantees that trains can receive ground control signals accurately and in real time. However, track circuit compensation capacitors must operate in outdoor environments for extended periods, facing multiple complex challenges from natural environmental factors such as thermal expansion and contraction due to high and low temperature cycles, moisture corrosion from rain and snow, and material aging caused by ultraviolet radiation. These conditions require high sealing performance from the compensation capacitors; otherwise, they are prone to failure due to moisture absorption, poor lead contact, and other malfunctions, leading to track circuit instability.

[0028] Traditional compensation capacitors have drawbacks in the potting process, such as the lack of resin filling in the waist of the capacitor core and the formation of a curing interface after two potting processes, which leads to serious sealing failure problems. Therefore, this paper presents a track circuit compensation capacitor and potting fixture.

[0029] like Figures 1-6 As shown, a track circuit compensation capacitor according to an embodiment of the present invention is illustrated, including a capacitor core 100, a first lead wire 11 and a second lead wire 12 disposed at both ends of the capacitor core 100, a housing 1, a positioning ring 2 and a sealing seat 3 installed on the outside of the capacitor core 100.

[0030] Specifically, the capacitor core 100 has a cylindrical structure, and a first lead wire 11 and a second lead wire 12 are welded to both ends of the capacitor core 100, respectively. A shell 1 is provided on the outside of the capacitor core 100. The shell 1 has a cylindrical structure and its diameter is larger than that of the capacitor core 100. A positioning ring 2 is provided at one end of the shell 1, and a first potting space 2001 is formed between one end of the capacitor core 100 and the positioning ring 2. A first mounting hole 201 is provided on the positioning ring 2, and the end of the first lead wire 11 away from the capacitor core 100 passes through the first mounting hole 201 and extends to the outside of the positioning ring 2. A potting port 202 is also provided on the positioning ring 2, and the potting port 202 is connected to the first potting space 2001.

[0031] A sealing seat 3 is disposed at the other end of the outer casing 1, and a second potting space 3001 is formed between the other end of the capacitor core 100 and the sealing seat 3. A second mounting hole 301 is provided on the sealing seat 3, and the end of the second lead wire 12 away from the capacitor core 100 passes through the second mounting hole 301 and extends to the outside of the sealing seat 3. A material passage gap 1001 is formed between the outer peripheral wall of the capacitor core 100 and the inner wall of the outer casing 1, and the material passage gap 1001 can connect the first potting space 2001 and the second potting space 3001.

[0032] It should be noted that the first lead wire 11 and the second lead wire 12 are 2m long cylindrical wires. The positioning ring 2 and the sealing seat 3 are fixed to the two ends of the outer shell 1 respectively. The capacitor core 100 is placed inside the outer shell 1, so that the first lead wire 11 and the second lead wire 12 pass through the first mounting hole 201 and the second mounting hole 301 respectively and extend to the outside of the outer shell 1. Resin is injected into the first potting space 2001 through the potting port 202. Under its own flow, the resin flows from the first potting space 2001 into the second potting space 3001 through the material passage gap 1001 until the first potting space 2001, the material passage gap 1001 and the second potting space 3001 are filled. After the resin cures, the encapsulation of the capacitor core 100 and the outer shell 1 is completed.

[0033] It is understandable that by setting the material flow gap 1001 to connect the first potting space 2001 and the second potting space 3001, the resin can flow from the first potting space 2001 to the second potting space 3001 through the material flow gap 1001, so that the entire space around the capacitor core 100, including the waist area of ​​the capacitor core 100, can be filled in one potting, thus solving the problem that the waist of the capacitor core 100 is not filled with resin during two pottings.

[0034] Meanwhile, the single potting process avoids the problem of the curing interface formed by two potting processes, eliminates the tiny gaps caused by the difference in resin shrinkage rate and the accumulation of curing stress at the interface, and improves the sealing effect of the capacitor by combining the closed potting space formed by the positioning ring 2 and the sealing seat 3, preventing moisture, dust and impurities from penetrating into the shell and ensuring the stability of the capacitor core and lead connection. Secondly, the setting of the first mounting hole 201 and the second mounting hole 301 solves the positioning problem of the capacitor core 100 in the shell 1, so that the capacitor core 100 is fixed in the middle position of the shell 1, which makes it easy for the injected resin to completely seal the capacitor core 100.

[0035] It should be explained that after the resin potting is completed, the positioning ring 2 and the sealing seat 3 do not need to be removed, as they are connected to the outer shell 1 by the resin.

[0036] For example, such as Figure 2As shown, in some examples, the outer peripheral wall of the positioning ring 2 and the inner peripheral wall of the outer shell 1 are interference-fitted, and the outer peripheral wall of the sealing seat 3 and the inner peripheral wall of the outer shell 1 are also interference-fitted.

[0037] Specifically, the installation process is as follows: The first lead wire 11 is passed through the first mounting hole 201, and then the positioning ring 2 is pressed into one end of the outer casing 1, so that the capacitor core 100 is located inside the outer casing 1, and the outer peripheral wall of the positioning ring 2 is tightly fitted with the inner peripheral wall of the outer casing 1; then, the second lead wire 12 is passed through the second mounting hole 301, and the sealing seat 3 is pressed into the other end of the outer casing 1, so that the outer peripheral wall of the sealing seat 3 is tightly fitted with the inner peripheral wall of the outer casing 1. During the potting process, after the resin is injected into the first potting space 2001 through the potting port 202, due to the interference fit between the positioning ring 2, the sealing seat 3, and the outer casing 1, when the resin is full, the resin will not push the sealing seat 3 and the positioning ring 2 out from the end of the outer casing 1, nor will the resin leak from the gap between the positioning ring 2 and the outer casing 1, or the gap between the sealing seat 3 and the outer casing 1.

[0038] The interference fit between the positioning ring 2 and the sealing seat 3 and the outer shell 1 can directly seal the gap between the positioning ring 2, the sealing seat 3 and the outer shell 1, preventing the resin from leaking out of the gap during the potting process, and ensuring that the resin can fully fill the first potting space 2001, the material passage gap 1001 and the second potting space 3001; at the same time, the interference fit enhances the connection strength between the positioning ring 2, the sealing seat 3 and the outer shell 1, further improving the overall sealing performance and structural stability of the capacitor.

[0039] For example, such as Figure 3 and Figure 6 As shown, in some examples, a first protrusion 21 is provided on the outer periphery of the top surface of the positioning ring 2, and the first protrusion 21 extends circumferentially along the positioning ring 2 to form a ring structure. Specifically, when the positioning ring 2 is installed at one end of the housing 1, the bottom surface of the first protrusion 21 abuts against the end face of one end of the housing 1, completely covering the connection position between the peripheral wall of the housing 1 and the positioning ring 2. During glue filling, the resin flows from the first glue filling space 2001 through the material passage gap 1001 to the second glue filling space 3001 under its own gravity, and sequentially fills the second glue filling space, the material passage gap, and the first glue filling space. Even if it penetrates into the gap between the positioning ring 2 and the housing 1, it will be blocked by the abutment structure between the first protrusion 21 and the end face of the housing 1.

[0040] The first boss 21 abuts against one end face of the outer shell 1, forming an additional sealing structure at the connection position between the positioning ring 2 and the outer shell 1, forming a double seal with the fitting gap between the positioning ring 2 and the outer shell 1, further preventing the resin adhesive from leaking from the connection position; at the same time, the setting of the first boss 21 increases the contact area between the positioning ring 2 and the outer shell 1, improving the installation stability of the positioning ring 2 on the outer shell 1.

[0041] For example, such as Figure 3 As shown, in some examples, the positioning ring 2 is composed of two semicircular rings 22 spliced ​​together. Each semicircular ring 22 has a first semicircular groove 2201 at its center. After the two semicircular rings 22 are spliced ​​together, the two first semicircular grooves 2201 combine to form a first mounting hole 201, and the diameter of the first mounting hole 201 is larger than the diameter of the first lead wire 11.

[0042] The installation process is as follows: two semicircular rings 22 are respectively inserted from both sides of the first lead wire 11, so that the first lead wire 11 is located between the two first semicircular grooves 2201. Then the two semicircular rings 22 are spliced ​​together to form a complete positioning ring 2. The positioning ring 2 is then installed on one end of the outer shell 1.

[0043] Specifically, the two semicircular rings 22 can be spliced ​​together, so that the positioning ring 2 can be installed without having to pass through the end of the first lead wire 11, which simplifies the assembly process of the positioning ring 2 and the first lead wire 11 and improves production efficiency. The diameter of the first mounting hole 201 is larger than the diameter of the first lead wire 11. When the capacitor core 100 is put into the housing 1, the positioning ring 2 can slide on the first lead wire 11 by splicing the two semicircular rings 22, so that the positioning ring 2 is installed on one end of the housing 1. This solves the problem that when the diameter of the first mounting hole 201 is equal to or smaller than the diameter of the first lead wire 11, the two semicircular rings 22 of the positioning ring 2 cannot be finely adjusted to be fixed on one end of the housing 1 after splicing.

[0044] For example, such as Figure 4 As shown, in some examples, a second protrusion 31 is provided on the bottom outer periphery of the sealing seat 3, and the second protrusion 31 extends circumferentially along the sealing seat 3 to form an annular structure. Specifically, when the sealing seat 3 is installed at the other end of the housing 1, the top surface of the second protrusion 31 abuts against the end face of the other end of the housing 1, completely covering the connection position between the peripheral wall of the housing 1 and the sealing seat 3.

[0045] It should be noted that during the glue-filling process, after the resin flows into the second glue-filling space 3001, if it tries to penetrate into the gap between the sealing seat 3 and the outer shell 1, it will be blocked by the abutting structure between the second protrusion 31 and the end face of the outer shell 1. The abutting between the second protrusion 31 and the other end face of the outer shell 1 forms an additional sealing structure at the connection position between the sealing seat 3 and the outer shell 1, forming a double seal with the fitting gap between the sealing seat 3 and the outer shell 1, preventing the resin from leaking from this connection position; at the same time, the second protrusion 31 increases the contact area between the sealing seat 3 and the outer shell 1, improving the installation stability of the sealing seat 3 on the outer shell 1, avoiding axial displacement of the sealing seat 3 during glue filling or vibration, and ensuring the stability of the second glue-filling space 3001.

[0046] For example, such as Figure 4 and Figure 5As shown, in some examples, the sealing seat 3 is composed of two semicircular blocks 32 spliced ​​together. Each semicircular block 32 has a second semicircular groove 3201 at its center. After the two semicircular blocks 32 are spliced ​​together, the two second semicircular grooves 3201 combine to form a second mounting hole 301, and the diameter of the second mounting hole 301 is smaller than the diameter of the second lead wire 12.

[0047] The installation process is as follows: two semicircular blocks 32 clamp the second lead wire 12 from both sides, so that the second lead wire 12 is located between the two second semicircular grooves 3201. The two semicircular blocks 32 are spliced ​​to form a complete sealing seat 3. Then the sealing seat 3 is installed on the other end of the outer shell 1. Since the diameter of the second mounting hole 301 is slightly smaller than the diameter of the second lead wire 12, the inner wall of the sealing seat 3 is tightly fitted with the outer peripheral wall of the second lead wire 12 after splicing.

[0048] It should be noted that, firstly, the positions of the two semicircular blocks 32 of the sealing seat 3 and the second lead wire 12 are adjusted. Then, the two semicircular blocks 32 of the sealing seat 3 clamp the second lead wire 12. Then, the sealing seat 3 with the second lead wire 12 and the capacitor core 100 is placed into the outer shell 1. The sealing seat 3 and the inner peripheral wall of the outer shell 1 are interference-fitted, so that the second mounting hole 301 and the second lead wire 12 are also interference-fitted. Next, the two semicircular rings 22 of the positioning ring 2 are spliced ​​onto the first lead wire 11. By setting the diameter of the first mounting hole 201 to be larger than the diameter of the first lead wire 11, the position of the positioning ring 2 can be finely adjusted so that the positioning ring 2 can be interference-fitted with the end of the outer shell 1, thereby forming a complete seal on the outer shell 1.

[0049] Specifically, the splicing structure of the two semicircular blocks 32 allows the sealing seat 3 to be installed without having to pass through the end of the second lead wire 12, simplifying the assembly process of the sealing seat 3 and the second lead wire 12 and improving production efficiency; the diameter of the second mounting hole 301 is smaller than the diameter of the second lead wire 12, so that the sealing seat 3 and the second lead wire 12 form an interference fit, tightly wrapping the second lead wire 12, preventing the resin glue from leaking from the gap between the two, and preventing moisture from seeping in through the gap later, thus enhancing the sealing performance at the second lead wire 12.

[0050] It should be noted that the first mounting hole 201 located at the center of the positioning ring 2 and the second mounting hole 301 located at the center of the sealing seat 3 can simultaneously serve as concentric positioning, ensuring that the capacitor core 100 is coaxial with the outer shell 1. The material passage gap 1001 is evenly distributed along the outer circumference of the capacitor core 100, ensuring that the resin can flow evenly and fill the entire material passage gap 1001, avoiding the problem of local unfilled areas due to uneven gaps, and improving the potting quality.

[0051] Potting is a crucial step in the production of track circuit compensation capacitors. It involves filling the entire space between the capacitor core 100 and the outer casing 1 with resin adhesive to form a complete sealing layer. This sealing layer must not only prevent the intrusion of moisture, dust, and impurities, but also buffer the impact of train vibrations on the capacitor core 100. Simultaneously, it secures the connection points between the first lead wire 11 and the second lead wire 12 and the capacitor core 100, preventing poor electrical contact. Therefore, the quality of the potting process directly determines the sealing performance, mechanical strength, and service life of the compensation capacitor, making it a critical factor affecting the stability of the track circuit.

[0052] For example, such as Figures 7-11 As shown, a potting fixture is used to fix the track circuit compensation capacitor during the potting of resin glue. The potting fixture includes a frame 4, a fixing plate 5, and a support plate 6. Specifically, the fixing plate 5 is fixedly installed on the upper part of the frame 4, and has a plurality of vertically penetrating mounting grooves 501. The shape of the mounting grooves 501 is adapted to the outer periphery of the outer shell 1 of the compensation capacitor, and is used to vertically insert the compensation capacitor and restrict its horizontal displacement.

[0053] Furthermore, the support plate 6 is fixedly mounted on the frame 4 and located directly below the fixing plate 5. The top surface of the support plate 6 supports the bottom of the compensation capacitor. The support plate 6 has several through slots 601, each corresponding to a mounting slot 501, and one end of each through slot 601 extends to the side wall of the support plate 6, forming an opening 6001. When potting the resin, the compensation capacitor is vertically placed into the mounting slot 501. The positioning ring 2 of the compensation capacitor and the first lead wire 11 are located above the fixing plate 5, and the sealing seat 3 at the bottom of the compensation capacitor is supported by the support plate 6. The second lead wire 12 enters the through slot 601 through the opening 6001 and extends downwards from the through slot 601 to the frame 4.

[0054] The mounting groove 501 of the fixing plate 5 provides horizontal restriction for the compensation capacitor, and the support plate 6 provides vertical support for the compensation capacitor. The two work together to keep the compensation capacitor vertical during the potting process, ensuring that the resin can flow naturally under gravity and fill the material passage gap 1001 and the two potting spaces. The opening 6001 of the through groove 601 facilitates the quick insertion of the second lead wire 12 into the through groove 601, ensuring the smoothness of the potting process.

[0055] For example, such as Figure 8 and Figure 9As shown, in some examples, the fixing plate 5 has a wire passage groove 502 and a wire harness groove 503. The wire passage groove 502 communicates with the mounting groove 501, and the wire harness groove 503 is located on the side of the mounting groove 501 away from the wire passage groove 502 and communicates with the mounting groove 501. The first lead wire 11 is used to enter the wire harness groove 503 through the wire passage groove 502. The first lead wire 11 can extend downward through the through groove 601 to the bottom of the support plate 6 so that the wire harness groove 503 and the through groove 601 limit the first lead wire 11.

[0056] Specifically, the fixing plate 5 also has a wire-passing groove 502 and a wire-binding groove 503. The wire-passing groove 502 extends along the width direction of the fixing plate 5, one end of the wire-passing groove 502 is connected to the mounting groove 501, and the other end of the wire-passing groove 502 extends to one side edge of the fixing plate 5 to form a wire-passing opening; the wire-binding groove 503 is located on the side of the mounting groove 501 away from the wire-passing groove 502 and is connected to the mounting groove 501, and the wire-binding groove 503 is vertically aligned with the corresponding through groove 601. During potting, the first lead wire 11 enters from the wire-passing groove 502, passes through the mounting groove 501 and enters the wire-binding groove 503, then extends downward through the through groove 601 to the bottom of the support plate 6. The wire-binding groove 503 restricts the horizontal displacement of the first lead wire 11, and the through groove 601 restricts the vertical displacement of the first lead wire 11.

[0057] The wire guide 502 guides the direction of the first lead wire 11, and the wire harness 503 and the through groove 601 cooperate to limit the first lead wire 11, preventing the part of the first lead wire 11 above the fixed plate 5 from blocking the potting port 202 during the potting process, thereby solving the problem of potting continuity and improving the potting efficiency.

[0058] For example, such as Figure 10 and Figure 11 As shown, in some examples, the potting fixture also includes several fixing clamps 7, which are disposed on the bottom surface of the support plate 6 and correspond one-to-one with the wire harness grooves 503. The fixing clamps 7 have wire clamping openings 701.

[0059] During potting, the first lead wire 11 and the second lead wire 12 extend to the bottom of the support plate 6 and are then placed together into the clamping port 701 of the fixing clamp 7. The fixing clamp 7 applies clamping force to the two lead wires through the clamping port 701.

[0060] The fixing clamp 7 clamps the first lead wire 11 and the second lead wire 12 through the clamping port 701, further restricting the displacement of the lead wires. It should be noted that the fixing clamp 7 can clamp only the first lead wire 11, or clamp the first lead wire 11 and the second lead wire 12 at the same time. The second lead wire 12 needs to be manually inserted into the fixing clamp 7 by the operator. The main function of the fixing clamp 7 is to restrict the position of the first lead wire 11 and prevent the first lead wire 11 from blocking the glue dispensing port 202, thereby preventing the resin from falling onto the first lead wire 11.

[0061] For example, such as Figure 11 As shown, in some examples, the inner peripheral wall of the fixing clamp 7 that contacts the first lead wire 11 and the second lead wire 12 is provided with a sponge pad 71.

[0062] The sponge pad 71 creates a flexible contact between the fixing clamp 7 and the first lead wire 11 and the second lead wire 12. While ensuring the clamping force to limit the displacement of the first lead wire 11 and the second lead wire 12, it avoids the problem of scratching or squeezing damage to the surface of the lead wires by the hard inner peripheral wall of the clamp, protecting the insulation layer and conductor structure integrity of the first lead wire 11 and the second lead wire 12; ensuring stable conductivity, avoiding abnormal electrical performance of the capacitor caused by damage to the lead wires, and improving the reliability of the product.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A track circuit compensation capacitor, comprising a capacitor core (100), a first lead wire (11) and a second lead wire (12) disposed at both ends of the capacitor core (100), and a housing (1) mounted on the outside of the capacitor core (100), characterized in that, Also includes: A positioning ring (2) is disposed on one end of the outer shell (1). The capacitor core (100) and the positioning ring (2) form a first potting space (2001). A first mounting hole (201) is provided on the positioning ring (2). The first lead wire (11) passes through the first mounting hole (201). A potting port (202) is provided on the positioning ring (2). The potting port (202) is connected to the first potting space (2001). The potting port (202) is used to pour in resin glue. A sealing seat (3) is disposed on the other end of the outer shell (1). A second potting space (3001) is formed between the capacitor core (100) and the sealing seat (3). A second mounting hole (301) is provided on the sealing seat (3). The second lead wire (12) passes through the second mounting hole (301). Wherein, a material passage gap (1001) is formed between the outer peripheral wall of the capacitor core (100) and the inner wall of the outer shell (1). The first potting space (2001) and the second potting space (3001) are connected through the material passage gap (1001). The material passage gap (1001) allows resin to pass through so that the resin flows into the second potting space (3001).

2. A track circuit compensation capacitor according to claim 1, characterised in that, Both the positioning ring (2) and the sealing seat (3) are interference-fitted with the inner peripheral wall of the outer shell (1).

3. A track circuit compensation capacitor according to claim 1, characterised in that, Also includes: The first boss (21) is disposed on the outer periphery of the top surface of the positioning ring (2). The first boss (21) can abut against one end face of the outer shell (1) to block the connection position between the peripheral wall of the outer shell (1) and the positioning ring (2).

4. A track circuit compensation capacitor according to claim 3, characterised in that, The positioning ring (2) includes two semicircular rings (22), which are spliced ​​together to form the positioning ring (2). A first semicircular groove (2201) is provided at the center of each of the two semicircular rings (22), and the two first semicircular grooves (2201) are spliced ​​together to form the first mounting hole (201). The diameter of the first mounting hole (201) is larger than the diameter of the first lead wire (11).

5. A track circuit compensation capacitor according to claim 1, characterised in that, Also includes: The second protrusion (31) is disposed on the bottom outer periphery of the sealing seat (3). The second protrusion (31) can abut against the other end face of the outer shell (1) to block the connection position between the peripheral wall of the outer shell (1) and the sealing seat (3).

6. A track circuit compensation capacitor according to claim 5, characterized in that, The sealing seat (3) includes two semicircular blocks (32), which are spliced ​​together to form the sealing seat (3). A second semicircular groove (3201) is provided at the center of each of the two semicircular blocks (32), and the two second semicircular grooves (3201) are spliced ​​together to form the second mounting hole (301). The diameter of the second mounting hole (301) is smaller than the diameter of the second lead wire (12).

7. A potting jig for securing a track circuit compensation capacitor according to any one of claims 1 to 6, characterized in that include: Frame (4); A fixing plate (5) is set on the frame (4). The fixing plate (5) has several mounting slots (501) for vertically placing and fixing the compensation capacitor. A support plate (6) is disposed on the frame (4) and located below the fixing plate (5). The support plate (6) is used to support the bottom of the compensation capacitor. The support plate (6) has a through groove (601) for the second lead wire (12) to pass through. One end of the through groove (601) extends to the side wall of the support plate (6). The through groove (601) has an opening (6001) located on the side wall of the support plate (6). The opening (6001) is used to allow the second lead wire (12) to enter the through groove (601).

8. The potting fixture of claim 7, wherein, The fixing plate (5) has a wire passage groove (502) and a wire harness groove (503). The wire passage groove (502) is connected to the mounting groove (501). The wire harness groove (503) is located on the side of the mounting groove (501) away from the wire passage groove (502) and is connected to the mounting groove (501). The first lead wire (11) is used to enter the wire harness groove (503) through the wire passage groove (502). The first lead wire (11) can extend downward through the through groove (601) to the bottom of the support plate (6) so that the wire harness groove (503) and the through groove (601) limit the first lead wire (11).

9. The potting fixture of claim 8, wherein, Also includes: The fixing clamp (7) has several of them. The fixing clamp (7) is set on the bottom surface of the support plate (6). The fixing clamp (7) corresponds one-to-one with the wire harness groove (503). The fixing clamp (7) has a wire clamping port (701). The fixing clamp (7) is used to clamp the first lead wire (11) and the second lead wire (12).

10. The potting fixture of claim 9, wherein, The inner peripheral wall of the fixing clamp (7) that contacts the first lead wire (11) and the second lead wire (12) is provided with a sponge pad (71).

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