A surface-mount non-solid electrolyte tantalum capacitor

Abstract

This application relates to the field of tantalum capacitor technology, and in particular to a surface-mount non-solid electrolyte tantalum capacitor, which includes a capacitor body, an insulating pad, a positive electrode plate, and a negative electrode plate. Positive and negative leads are respectively led out from the upper and lower end faces of the capacitor body. A through hole is formed in the middle of the insulating pad. Arc-shaped grooves are formed on the sidewalls of both the positive and negative electrode plates. The positive lead passes through the through hole and is placed in the arc-shaped groove of the positive electrode plate for welding and fixing. The negative lead is placed in the arc-shaped groove of the negative electrode plate for welding and fixing. The lead-hole-groove layout increases the welding contact area, thereby optimizing the welding process and effectively improving the mechanical strength and vibration and heat resistance of the solder joint. Simultaneously, the surface-mount mounting eliminates the problem of bending long leads required in traditional methods, simplifying the installation process. This application features improved installation efficiency.

Description

Technical Field

[0001] This application relates to the field of tantalum capacitor technology, and in particular to a surface-mount non-solid electrolyte tantalum capacitor. Background Technology

[0002] Tantalum capacitors are high-performance electronic components whose main functions include filtering, energy storage, signal coupling and decoupling, and forming timing or oscillation circuits with resistors.

[0003] In related technologies, tantalum capacitors are classified into solid tantalum capacitors and liquid tantalum capacitors according to the electrolyte type. Solid tantalum capacitors use solid electrolytes such as manganese dioxide, have a long lifespan and low leakage current, and are suitable for consumer electronics. Liquid tantalum capacitors use liquid electrolytes such as all-tantalum electrolytic capacitors, have higher voltage resistance, but are larger in size and are mostly used in military and aerospace fields.

[0004] Existing liquid tantalum capacitors have the following problems: Traditional liquid tantalum capacitors mostly use axial or radial lead structures, which require through-hole welding or manual bending of the leads during installation. This results in low installation efficiency and occupies a large amount of circuit board space. Manual bending of the leads can also easily cause mechanical stress to the sealed glass structure of the capacitor body, leading to seal failure or damage to the internal structure. Utility Model Content

[0005] To improve installation efficiency, this application provides a surface-mount non-solid electrolyte tantalum capacitor.

[0006] This application provides a surface-mount non-solid electrolyte tantalum capacitor using the following technical solution: A surface-mount non-solid electrolyte tantalum capacitor includes a capacitor body, an insulating pad, a positive electrode plate, and a negative electrode plate. A positive electrode lead and a negative electrode lead are respectively led out from the upper and lower end faces of the capacitor body. A through hole is formed in the middle of the insulating pad. Arc-shaped grooves are formed on the side walls of the positive electrode plate and the negative electrode plate. The positive electrode lead passes through the through hole and is placed in the arc-shaped groove of the positive electrode plate for welding and fixing. The negative electrode lead is placed in the arc-shaped groove of the negative electrode plate for welding and fixing.

[0007] By adopting the above solution, the surface mount installation eliminates the problem of bending long leads required in traditional installations, and improves installation efficiency by simplifying the installation process.

[0008] Preferably, the capacitor body is cylindrical in shape, and a groove is provided around the circumference of the upper end of the capacitor body at about one-sixth of the distance. The groove is an internal sealing design structure of the tantalum capacitor.

[0009] By adopting the above solution, the groove provides a precise positioning reference for the internal tantalum core and sealing components, ensuring the correct alignment of each component during the packaging process.

[0010] Preferably, the cross-section of the insulating pad is set to be a circle with the same size as the end face of the tantalum capacitor, and the two circular surfaces of the insulating pad are respectively attached to the positive electrode and the upper end face of the tantalum capacitor, and the negative electrode is attached to the lower end face of the tantalum capacitor.

[0011] By adopting the above solution, the risk of short circuits is reduced, and the current path is optimized.

[0012] Preferably, the positive electrode and the negative electrode are L-shaped structures composed of two surfaces, and the included angle between the two surfaces is 90°.

[0013] By adopting the above scheme, a self-supporting frame is formed, which strengthens the overall structural rigidity, and the two vertical surfaces of the positive and negative electrodes contact the capacitor body and the PCB board respectively, thereby improving the positioning accuracy.

[0014] Preferably, the bending angles of the positive electrode and the negative electrode can be either opposite or in the opposite direction.

[0015] By adopting the above solution, different PCB layout requirements can be met, thus improving design flexibility.

[0016] Preferably, the lengths of the positive electrode lead and the negative electrode lead are approximately 0.4-0.7 mm.

[0017] By adopting the above solution, the AC impedance is reduced compared to the traditional long lead structure, and it is also easier to solder.

[0018] Preferably, the capacitor body has an airtight structure, and the tantalum shell of the capacitor body and the tantalum-glass insulator are sealed by laser welding.

[0019] By adopting the above solution, the risk of electrolyte leakage is reduced and the service life of electronic components is extended.

[0020] Preferably, the outer wall of the capacitor body is fitted with a transparent insulating sleeve.

[0021] By adopting the above solution, additional electrical insulation protection is provided for tantalum capacitors, and scratch damage to the tantalum casing surface is reduced during installation.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. Surface mount technology eliminates the need to bend traditional long leads, simplifying the installation process and improving installation efficiency; 2. It improves the vibration resistance and design flexibility of the device; 3. It reduces the risk of short circuits and electrolyte leakage in the device, and extends its service life. Attached Figure Description

[0023] Figure 1 This is a front view of the reverse bending structure according to an embodiment of this application.

[0024] Figure 2 This is a side view of the opposing bending structure according to an embodiment of this application.

[0025] Explanation of reference numerals in the attached diagram: 1. Capacitor body; 11. Groove; 12. Positive lead; 13. Negative lead; 2. Insulating pad; 21. Through hole; 3. Positive electrode plate; 4. Negative electrode plate; 5. Arc-shaped groove. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0027] This application discloses a surface-mount non-solid electrolyte tantalum capacitor. (Refer to...) Figure 1-2 A surface-mount non-solid electrolyte tantalum capacitor includes a capacitor body 1, an insulating pad 2, a positive electrode 3, and a negative electrode 4. In this embodiment, a positive electrode lead 12 and a negative electrode lead 13 with a length of 0.5 mm are respectively led out from the upper and lower end faces of the capacitor body 1. A through hole 21 with a diameter of 1 mm is opened in the middle of the insulating pad 2. Arc-shaped grooves 5 are opened on the side walls of the positive electrode 3 and the negative electrode 4. The positive electrode lead 12 passes through the through hole 21 and is placed in the arc-shaped groove 5 of the positive electrode 3 for welding and fixing. The negative electrode lead 13 is placed in the arc-shaped groove 5 of the negative electrode 4 for welding and fixing.

[0028] Therefore, the short leads reduce AC impedance compared to traditional long leads and are easier to solder. At the same time, the arc-shaped groove 5 structure increases the soldering contact area of ​​the positive and negative leads, thereby ensuring the firmness of the lead soldering, improving the soldering strength, and reducing the occurrence of solder joint failure due to vibration or thermal cycling.

[0029] Furthermore, by using a flat chip structure combined with a hole-slot layout, the internal volume ratio of the capacitor is effectively increased, saving installation space compared to the traditional axial packaging structure and improving space utilization. In addition, the surface mount installation eliminates the problem of bending long leads, simplifying the installation process and improving installation efficiency.

[0030] Specifically, the capacitor body 1 is cylindrical in shape, and a groove 11 is provided around the top of the cylinder at about one-sixth of the distance. This groove 11 provides a buffer space for the thermal expansion of different materials inside the capacitor, so that the stress is evenly distributed, reducing the risk of sealing failure caused by local stress concentration, and can also form a complete moisture barrier to block the path of external moisture penetration.

[0031] Furthermore, the groove 11 serves as an internal sealing design structure for the tantalum capacitor, providing a precise positioning reference for the internal tantalum core and sealing components. This ensures the correct alignment of each component during the packaging process, comprehensively improving positioning accuracy and sealing integrity under extreme environments.

[0032] Specifically, in this embodiment, the insulating pad 2 is made of polytetrafluoroethylene, and the cross-section of the insulating pad 2 is set to be a circle with the same size as the end face of the tantalum capacitor. The two circular surfaces of the insulating pad 2 are respectively attached to the positive electrode 3 and the upper end face of the tantalum capacitor, and the negative electrode 4 is attached to the lower end face of the tantalum capacitor.

[0033] Therefore, the circular cross-section ensures that the insulating pad 2 and the positive electrode 3 and the upper end face of the capacitor form a gapless and complete contact, reducing the risk of short circuit between the positive electrode 3 and the tantalum shell. At the same time, it blocks the leakage channel of the internal electrolyte and forms the shortest current loop with the negative electrode 4, thereby optimizing the circuit path.

[0034] Furthermore, the insulating pad 2 promotes axial heat dissipation, while the negative electrode 4 provides a radial heat dissipation surface, synergistically improving heat dissipation efficiency.

[0035] In the process described above, the positive electrode 3 and the negative electrode 4 are L-shaped structures composed of two surfaces, with an included angle of 90° between the two surfaces, forming a self-supporting frame that strengthens the overall structural rigidity. Furthermore, the two vertical surfaces of the positive and negative electrodes contact the capacitor body 1 and the PCB board respectively, which can automatically align during mounting, improving positioning accuracy and assembly qualification rate.

[0036] Furthermore, the vertical surfaces of the L-shaped structures of the positive and negative electrodes provide an ideal working plane for welding the arc-shaped groove 5, ensuring that welding tools can access the working surface without obstruction, thereby improving welding quality.

[0037] Meanwhile, the bending angles of the positive electrode 3 and the negative electrode 4 can be bent in opposite directions or in reverse. This bidirectional adjustable design can adapt to different PCB layout requirements such as high-density integration or irregularly shaped circuit boards, improving design flexibility and installation compatibility.

[0038] On the other hand, the capacitor body 1 is a hermetically sealed structure. The tantalum shell of the capacitor body 1 and the tantalum-glass insulator are sealed by laser welding to form a continuous and tightly sealed interface, which effectively blocks the intrusion of external moisture, salt spray and other corrosive media. At the same time, it reduces the volatilization or leakage of internal electrolyte, ensuring that the capacitor maintains stable dielectric performance in extreme temperature and humidity environments. Moreover, the metallurgical bonding layer formed by laser welding has high tensile strength and shear resistance, and can withstand high-frequency vibration and mechanical impact, ensuring the long-term reliability of the packaging structure under dynamic working conditions and extending the service life of electronic components.

[0039] In addition, a transparent insulating sleeve is provided on the outer wall of the capacitor body 1. In this embodiment, the insulating sleeve is made of polyester heat shrink tubing, which provides additional electrical insulation protection for the tantalum capacitor and reduces scratch damage to the surface of the tantalum shell during installation while suppressing leakage current.

[0040] The implementation principle of a surface-mount non-solid electrolyte tantalum capacitor according to an embodiment of this application is as follows: the device reduces AC impedance through short lead design, increases welding contact area and optimizes welding process with hole-slot layout, effectively improving the mechanical strength and vibration and heat resistance of the solder joint. At the same time, surface-mount installation eliminates the problem of bending traditional long leads, and improves installation efficiency by simplifying the installation process.

[0041] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A chip tantalum capacitor of the non-solid electrolyte type, characterized in that, The capacitor includes a capacitor body (1), an insulating pad (2), a positive electrode plate (3), and a negative electrode plate (4). A positive electrode lead (12) and a negative electrode lead (13) are respectively led out from the upper and lower end faces of the capacitor body (1). A through hole (21) is provided in the middle of the insulating pad (2). Arc-shaped grooves (5) are provided on the side walls of the positive electrode plate (3) and the negative electrode plate (4). The positive electrode lead (12) passes through the through hole (21) and is placed in the arc-shaped groove (5) of the positive electrode plate (3) and welded and fixed. The negative electrode lead (13) is placed in the arc-shaped groove (5) of the negative electrode plate (4) and welded and fixed.

2. A surface-mount non-solid electrolyte tantalum capacitor according to claim 1, characterized in that, The capacitor body (1) is cylindrical in shape. A groove (11) is provided around the circumference of the upper end of the capacitor body (1) at about one-sixth of the length. The groove (11) is the internal sealing design structure of the tantalum capacitor.

3. A surface-mount non-solid electrolyte tantalum capacitor according to claim 2, characterized in that, The cross-section of the insulating pad (2) is set to be a circle with the same size as the end face of the tantalum capacitor. The two circular surfaces of the insulating pad (2) are respectively attached to the positive electrode (3) and the upper end face of the tantalum capacitor, and the negative electrode (4) is attached to the lower end face of the tantalum capacitor.

4. A surface-mount non-solid electrolyte tantalum capacitor according to claim 1, characterized in that, The positive electrode (3) and the negative electrode (4) are L-shaped structures composed of two surfaces, and the included angle between the two surfaces is 90°.

5. A surface-mount non-solid electrolyte tantalum capacitor according to claim 4, characterized in that, The bending angles of the positive electrode (3) and the negative electrode (4) can be bent in opposite directions or in the opposite direction.

6. A surface-mount non-solid electrolyte tantalum capacitor according to claim 1, characterized in that, The lengths of the positive lead (12) and the negative lead (13) are approximately 0.4-0.7 mm.

7. A surface-mount non-solid electrolyte tantalum capacitor according to claim 1, characterized in that, The capacitor body (1) is a gas-tight structure, and the tantalum shell of the capacitor body (1) and the tantalum-glass insulator are sealed by laser welding.

8. A surface-mount non-solid electrolyte tantalum capacitor according to claim 2, characterized in that, The capacitor body (1) is fitted with a transparent insulating sleeve on its outer wall.

Images