A movable spring sheet capable of blocking high-temperature metal spatters and an electromagnetic relay

Abstract

This utility model relates to the field of electromagnetic relay technology, specifically disclosing a movable spring that can block high-temperature metal spatter and an electromagnetic relay. The movable spring has spaced movable contact connection positions, mounting structure arrangement positions, and a first surface that cooperates with a stationary spring in its height direction. On the first surface of the movable spring, there is a baffle plate protruding from the thickness direction of the movable spring and located between the movable contact connection positions and the mounting structure arrangement positions. The baffle plate serves to block the falling of high-temperature metal spatter generated by ignition arc. This utility model enables the movable spring to block the downward spread of ignition arc through its own structure, and can also catch and block a portion of the falling high-temperature metal spatter, delaying its fall to achieve a cooling effect, thus improving the ablation effect of high-temperature metal spatter on the underlying plastic structural components during the falling process.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic relay technology, specifically to a moving spring that can block high-temperature metal splashes, and an electromagnetic relay containing the moving spring. Background Technology

[0002] Electromagnetic relays are a common type of automatic switch in circuit structures. The technical requirements for their electrical durability are very high. Taking the currently widely used general-purpose ultra-small high-power electromagnetic relays (≥16A) as an example, their rated load nominal electrical durability index is required to be basically 100,000 times. They have the technical characteristics of large current level and long service life.

[0003] The electrical durability test of electromagnetic relays exposes them to an environment with high arc energy and high arc temperature. This results in a significant amount of high-temperature metal spatter being generated during contact operation, and the arc moving between the moving and stationary contacts during contact separation. These phenomena can easily cause ablation of plastic structural components near the contacts. In particular, the hot metal spatter can easily ablate the underlying plastic base, push card, etc., affecting the insulation withstand voltage performance. Utility Model Content

[0004] The technical objective of this utility model is to address the unique characteristics of the electromagnetic relay, such as arcing and the susceptibility of the plastic structural components below the contacts to ablation, as well as the shortcomings of the prior art, by providing a movable spring that can prevent high-temperature metal spatter from falling and improve the ablation effect of high-temperature metal spatter on the plastic structural components below during the splashing and falling process, and an electromagnetic relay containing the movable spring.

[0005] The technical objective of this utility model is achieved through the following technical solution: a moving spring that can block high-temperature metal splashes, wherein the moving spring has moving contact connection positions arranged at intervals, mounting structure arrangement positions, and a first surface that cooperates with the stationary spring in the height direction; The moving contact connection position is used to connect the moving contact and is located on the upper side of the moving spring in the height direction; The mounting structure is positioned for assembly on the base of the electromagnetic relay, located on the lower side of the moving spring in the height direction. On the first surface of the movable spring, there is a baffle that protrudes from the thickness direction of the movable spring and is located between the movable contact connection position and the mounting structure arrangement position; The baffle is used to block the falling of high-temperature metal spatter generated by the ignition of the arc.

[0006] The aforementioned technical measures address the unique characteristics of the electromagnetic relay, such as arcing and the susceptibility of the plastic structural components below the contacts to ablation. Using a moving spring as a carrier, a baffle is protruded from the surface of the moving spring facing the stationary spring, positioned below the moving contact connection. This baffle blocks the high-temperature metal spatter generated by the arcing during contact from falling in the spatial path. Therefore, in the operating environment of the moving spring, without the need for additional assemblies, the moving spring itself can effectively block the downward spread of the arcing during contact and can also catch and delay the falling high-temperature metal spatter, achieving a cooling effect. This mitigates the ablation effect of the high-temperature metal spatter on the underlying plastic structural base during its fall, thus improving the insulation and withstand voltage performance of the resulting electromagnetic relay. Meanwhile, since the baffle that blocks high-temperature metal spatter is formed with a moving spring as the carrier, the high-temperature metal spatter gathered on the baffle will automatically shake off due to the elastic swing of the moving spring during or after the cooling process, as the electromagnetic relay operates. The metal spatter falling onto the base is relatively randomly dispersed and left empty for purification below the baffle, making it less likely to cause local or continuous accumulation of metal spatter on the base, further reducing the impact on the insulation withstand voltage performance of the formed electromagnetic relay.

[0007] While achieving the above-mentioned technical effects, the above-mentioned technical measures use the moving spring as a carrier to form the baffle, without the need to form additional independent structural parts and assembly carriers, which helps to simplify the forming structure of the electromagnetic relay. It can be achieved without increasing the technical difficulty of electromagnetic relay assembly and manufacturing cost.

[0008] As one of the preferred technical solutions, the width of the baffle in the width direction of the movable spring is greater than the diameter of the movable contact connected to the upper movable contact connection position; Furthermore, the arrangement of the baffle in the width direction of the movable spring, when projected onto the height direction of the movable spring, can block the diameter outline of the upper movable contact.

[0009] The aforementioned technical measures address the effect of the baffle in preventing the high-temperature metal spatter generated by the ignition arc. It can effectively catch and block most of the high-temperature metal spatter in the width direction of the moving spring, with a large coverage area. Without affecting the contact closing action, it has a good effect in catching and blocking high-temperature metal spatter. At the same time, it helps to expand the relatively empty clean area on the base directly below the baffle, so as to reduce the adhesion of metal spatter in this area of ​​the base. Thus, it leaves as much space as possible as a clean area on the high-risk breakdown path between the moving spring assembly and the stationary spring assembly on the base, effectively reducing the conductive path that may be formed by the complete and continuous accumulation of metal spatter between the moving spring assembly and the stationary spring assembly on the base, and avoiding the formation of withstand voltage breakdown.

[0010] As one of the preferred technical solutions, the moving spring also has push-lock connection positions arranged at intervals between the moving contact connection position and the mounting structure arrangement position in the height direction; The baffle is located between the moving contact connection position and the push card connection position; The baffle also serves to prevent the spread of the ignition arc to the push card connection position.

[0011] The above-mentioned technical measures address the unique characteristics of the interaction between the moving spring and the push card in a push-rod electromagnetic relay. The arc generated by the contact can easily ablate the plastic structural component push card below the contact. A baffle is formed on the surface of the moving spring facing the stationary spring, positioned between the moving contact connection position and the push card connection position. The baffle blocks the moving contact and the push card connected by the moving spring in the spatial path. Thus, in the operating environment of the moving spring, it not only prevents the arc from spreading to the push card, but also catches and delays the falling of some high-temperature metal splashes, achieving a cooling effect and improving the ablation effect of high-temperature metal splashes on the plastic structural component below during the falling process.

[0012] Furthermore, the push-lock connection position on the moving spring is located directly below the moving contact connection position in the height direction of the moving spring; Furthermore, the arrangement of the baffle in the width direction of the movable spring, when projected onto the height direction of the movable spring, can obscure the diameter profile of the lower push-lock connection position.

[0013] The above-mentioned technical measures are based on the connection of the moving spring of the push rod electromagnetic relay to the moving contact and the push card in a specific positional relationship. This enables the baffle to effectively shield and protect the push card connector below the moving contact in the spatial path. It has a significant effect on slowing down and blocking the falling high-temperature metal splashes, which is beneficial to improving the ablation effect of high-temperature metal splashes on the plastic structural components below during the falling process.

[0014] Furthermore, the baffle on the moving spring is positioned on the first surface close to the push-lock connection position and far from the moving contact connection position. This technical measure is based on the connection between the moving spring of the push-rod electromagnetic relay and the moving contact and the push-lock in a specific positional relationship. While not interfering with the contact mating structure and ensuring the contact control performance of the electromagnetic relay, the baffle effectively shields and protects the push-lock connector below the moving contact in the spatial path, reducing or even avoiding the ablation of the push-lock connector by the arc, and reducing or even avoiding the ablation of the push-lock connector by the splash of high-temperature metal spatter.

[0015] As one of the preferred technical solutions, the moving spring is a multi-layered stacked structure of springs; The baffle is an integrally bent structure of the spring that makes up the movable spring.

[0016] The aforementioned technical measures form the baffle with a stacked structure of moving springs. Firstly, the stacked structure of the moving springs increases current carrying capacity. Secondly, the integrated structure of the baffle on the moving springs facilitates its molding. Thirdly, the molding position and protrusion height of the baffle on the moving springs are easily adjustable by bending. Fourthly, it facilitates heat dissipation from the moving springs. Therefore, the baffle formed with a stacked structure of moving springs has significant technical advantages.

[0017] Furthermore, the baffle is a spring sheet of the movable spring sheet formed by bending it at an angle; The blocking working surface of the baffle facing the contact point is fitted with the first surface at the connection position of the moving contact at an obtuse angle.

[0018] The aforementioned technical measures, on the one hand, can provide good shielding protection for the push-type connector below the moving contact, reducing or even avoiding the ablation of the push-type connector by arcing and / or high-temperature metal spatter; on the other hand, the baffle does not have a function of collecting high-temperature metal spatter, so that although some of the high-temperature metal spatter adheres to the baffle's blocking surface, it does not accumulate, but forms a slow cooling process to reduce the direct fall of high-temperature metal spatter onto the plastic structural base below, and improve the ablation effect of high-temperature metal spatter on the plastic structural base below during the splashing and falling process. In this way, it does not affect the design fit clearance between the baffle and the contact, as well as between the baffle and the stationary spring, thus ensuring the contact control performance of the electromagnetic relay.

[0019] An electromagnetic relay has a base and a magnetic circuit portion and a contact portion mounted on the base; The contact portion has a movable spring sheet that forms part of the movable spring assembly; The moving spring is any of the moving spring structures described above that can block high-temperature metal splashes.

[0020] The electromagnetic relay described above, without affecting its normal operation, uses the above-mentioned structure of moving reed and stationary reed in combination, which will inevitably have the technical advantages of the above-mentioned moving reed and is also conducive to realizing high power current carrying.

[0021] Furthermore, the electromagnetic relay is a push rod type electromagnetic relay, having a base and a magnetic circuit part, a contact part, and a push clip between the armature in the magnetic circuit part and the moving spring in the contact part mounted on the base. The push clip serves as a connector for connecting the movable spring, extending from the first surface of the movable spring through the push clip connection position of the movable spring; The height of the baffle on the movable spring, which protrudes from the first surface of the movable spring, corresponds at least to the height of the end of the push card extending from the first surface of the movable spring in the height direction of the movable spring.

[0022] The aforementioned push-rod type electromagnetic relay, without affecting its normal operation, uses the aforementioned structure of moving spring in conjunction with push card, stationary spring, etc., which will inevitably possess the technical advantages of the aforementioned moving spring and is also conducive to achieving high power current carrying capacity.

[0023] Furthermore, the baffle on the moving spring has a third gap with the stationary spring in the initial state; In the initial state, there is a first gap between the moving contact and the stationary contact of the contact part; Furthermore, the third gap is larger than the first gap.

[0024] Furthermore, the baffle on the moving spring has a second gap with the stationary contact on the stationary spring in the initial state; In the initial state, there is a first gap between the moving contact and the stationary contact of the contact part; Furthermore, the second gap is larger than the first gap.

[0025] The above technical measures are based on the special cooperation between the moving and stationary springs of the push rod electromagnetic relay under the push of the push card. While effectively shielding and protecting the push card connector below the moving contact, they do not interfere with the contact cooperation structure between the moving and stationary contacts, thus reliably ensuring the contact control performance of the electromagnetic relay.

[0026] The beneficial technical effects of this utility model are as follows: The above-mentioned technical measures address the unique characteristics of electromagnetic relays, such as arcing and the susceptibility of the plastic structural components below the contacts to ablation. They form a moving spring that can block high-temperature metal spatter and interrupt the arc, thus preventing the high-temperature metal spatter from falling and the arc from spreading in the spatial path. Therefore, without the need for additional assemblies, the moving spring itself can effectively block the downward (e.g., towards the push-button) spread of the arc from the contacts, and can also catch and delay the falling high-temperature metal spatter, achieving a cooling effect and mitigating the ablation effect of the high-temperature metal spatter on the lower plastic structural base during its fall. While achieving the aforementioned technical effects, the above-mentioned technical measures also feature a simple molding structure, easy assembly, and good stability, making them particularly suitable for push-rod type electromagnetic relays where the push-button is located below the contacts. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the moving spring of this utility model.

[0028] Figure 2 for Figure 1 A magnified view of a portion of the image.

[0029] Figure 3 for Figure 1The diagram shows the structure of the moving spring in the thickness direction.

[0030] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0031] Figure 5 for Figure 1 The diagram shows the structure of the movable spring in the horizontal direction.

[0032] Figure 6 This is a schematic diagram of the structure of the electromagnetic relay of this utility model.

[0033] Figure 7 for Figure 6 A magnified view of a portion of the image.

[0034] Figure 8 for Figure 6 The diagram shows a 3D view of the electromagnetic relay.

[0035] Figure 9 for Figure 8 A schematic diagram of a local structure.

[0036] The symbols in the diagram have the following meanings: A—Magnetic circuit section; B—Contact section; B1—First gap; B2—Second gap; B3—Third gap; C—Push card; D—Base; X—Width direction; Y—Height direction; Z—Thickness direction; α—Including angle; 1—Moving spring; 11—Moving contact connection position; 12—Push card connection position; 13—First surface; 14—Mounting structure layout position; 2—Moving contact; 3—Baffle; 31—Obstruction working surface; 4—Stationary spring; 5—Stationary contact. Detailed Implementation

[0037] This utility model relates to the field of electromagnetic relay technology, specifically a movable spring that can block high-temperature metal splashes and provide arc isolation, and a (push-rod type) electromagnetic relay including the movable spring. The main technical solution of this utility model will be specifically described below with reference to several embodiments. Embodiment 1 is illustrated in conjunction with the accompanying drawings—that is… Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 The technical solution of this utility model is clearly and thoroughly explained; although other embodiments are not shown in separate drawings, their main structures can still be referred to the drawings of Embodiment 1.

[0038] It should be noted that the accompanying drawings of this utility model are schematic, and unnecessary details have been simplified to clarify the technical purpose of this utility model, so as to avoid obscuring the technical solution contributed by this utility model to the prior art. In addition, the expressions such as "about" and "basically" regarding quantity or fit relationship in the following text mean that reasonable assembly errors and processing errors are allowed in the industry, and do not literally describe absolute quantity or fit relationship.

[0039] Example 1 See Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the electromagnetic relay of this utility model is a push rod type electromagnetic relay, which mainly consists of a base D and a magnetic circuit part A (including coil frame, coil, iron core, yoke, armature, etc.) assembled on the base D, a contact part B (including moving spring assembly and stationary spring assembly, wherein the moving spring assembly has moving spring 1 and moving contact 2, and the stationary spring assembly has stationary spring 4 and stationary contact 5), and a push card C located between the armature of the magnetic circuit part A and the moving spring 1 of the contact part B. In the initial state, the elastic force of the moving spring 1 in contact part B is basically in a free state, the moving contact 2 and the stationary contact 5 are disconnected and maintain the designed clearance fit, and the armature is disconnected from the iron core and maintains the designed clearance fit. When the excitation current of magnetic circuit part A rises to the design value, the electromagnetic attraction torque will overcome the elastic reaction torque of the moving spring 1 in contact part B, causing the armature to rotate and the armature to be attracted to the iron core as designed. This will drive the pusher C to push the moving spring 1 in contact part B, realizing the closure of the moving contact 2 and the stationary contact 2 in contact part B. When the excitation current decreases to the design value, the elastic reaction torque of the moving spring 1 in contact part B is greater than the electromagnetic attraction torque, the elastic force of the moving spring 1 is released and reset, and the armature of magnetic circuit part A returns to the initial state.

[0040] In the above-mentioned push-rod type electromagnetic relay molding structure, in order to meet the technical requirements of insulation withstand voltage, both the push card C and the base D are plastic structural parts.

[0041] In the aforementioned push-rod type electromagnetic relay molding structure, to meet the design requirements of ultra-small size and electromagnetic attraction, with the base D as a reference, the push card C is located below the contact point of the contact portion B. The push card C has a connector for connecting the moving spring 1. This connector passes through the push card connection position on the moving spring 1 and faces the stationary spring 4, and is relatively close to the moving contact 2 connected to the moving spring 1, so that the connector of the push card C for connecting the moving spring 1 is located below the area near the moving contact 2. In electrical durability tests and high current carrying conditions, arcing may occur between the moving contact 2 and the stationary contact 5 of the contact portion B. The arcing process will also generate high-temperature metal spatter. Since the connector of the push card C for connecting the moving spring 1 is located in the area near the moving contact 2, this connector of the push card C is easily affected by the arcing between the contacts. In addition, since the push card C and the base D are located below the contacts, the high-temperature metal spatter will also have an ablation effect on the push card C and the base D, which are the lower structures, during the splashing and falling process.

[0042] Based on this, in order to prevent the arc from spreading to the connector of the push card C and to prevent ablation, as well as to prevent some of the high-temperature metal splashes from ablation the connector of the push card C and the base D during the splashing and falling process, the moving spring 1 of the above-mentioned push rod electromagnetic relay adopts a baffle 3 structure that can block high-temperature metal splashes and block arcs. That is, the moving spring 1 uses its own structure of baffle 3 to block the arc from spreading to the push card C, and to receive and block some of the high-temperature metal splashes that are splashing and falling, and to delay their fall.

[0043] For details, see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the moving spring 1 adopts a double-layered overlapping structure, at least at the moving contact connection position 11. The main spring portion of the moving spring 1 is adjacent to the magnetic circuit portion A, and the overlapping spring portion of the moving spring 1 is adjacent to the stationary spring 4. This structure of the moving spring 1 has the following structural features: Relative to the height direction Y, there are three positions: a moving contact connection position 11, a push card connection position 12, and a mounting structure arrangement position 14, arranged with vertical spacing. The moving contact connection position 11 is used to connect the moving contact 2 and is located on the upper side in the height direction Y. The push card connection position 12 is used as a connector for inserting the push card C and is located in the middle of the height direction Y. The mounting structure arrangement position 14 is used for assembly on the base D of the electromagnetic relay and is located on the lower side in the height direction Y. In the aforementioned structure, the push card connection position 12 is located directly below the moving contact connection position 11. Relative to the positional relationship (or thickness direction Z) with the stationary spring 4, the first surface 13 faces and engages with the stationary spring 4, and the moving contact connection position 11 and the push card connection position 12 are perforated structures that penetrate the first surface 13 and the opposite back surface, respectively.

[0044] The moving spring 1 of the above structure is riveted to the moving contact 2 through the moving contact connection 11. The spherical crown surface of the moving contact 2 protrudes at the first surface 13 and cooperates with the stationary contact 5 of the stationary spring 4. The corresponding connector of the push card C is fitted through the push card connection 12. The corresponding connector of the push card C protrudes from the first surface 13.

[0045] At the overlapping spring of the aforementioned stacked structure of the moving spring 1, a baffle 3 protruding from the first surface 13 is integrally bent. This baffle 13 is located between the moving contact connection position 11 and the push card connection position 12, with its relative position closer to the push card connection position 12 and farther away from the moving contact connection position 11. Of course, the aforementioned proximity should not interfere with the fitting relationship between the corresponding connector of the push card C and the moving spring 1. The baffle 3 has a surface facing the contact side, which is the blocking working surface 31.

[0046] The protrusion of the baffle 3 on the first surface 13 of the movable spring 1 should, at least in the width direction X of the movable spring 1, be able to block the lower push card connection position 12—that is, the connector of the push card C—from the orthographic projection view in the height direction Y, and also be able to block the diameter outline of the movable contact 2 connected to the upper movable contact connection position 11 from the orthographic projection view in the height direction Y. In other words, the width of the baffle 3 in the width direction X of the movable spring 1 is greater than the diameter of the lower push card connection position 12 and also greater than the diameter of the movable contact 2 connected to the upper movable contact connection position 11, and in the height direction Y of the movable spring 1, it can cover the position of the lower push card connection position 12 from the orthographic projection view, and cover the diameter outline of the upper movable contact 2 from the width direction X.

[0047] The height (or size) of the protrusion structure of the baffle 3 on the first surface 13 of the moving spring 1 is not necessarily better the higher the protrusion is, but rather the protrusion should be raised without interfering with the cooperation between the moving spring 1 and the stationary spring 4, or between the moving contact 2 and the stationary contact 5.

[0048] More specifically, such as Figure 6 and Figure 7 Especially Figure 7As shown, in the reference position (initial state) of the disconnected state, there is a first gap B1 between the moving contact 2 and the stationary contact 5 of the contact portion B. There is a third gap B3 between the protruding outer edge of the baffle 3 (closest to the contour edge of the stationary spring 4) and the stationary spring 4 (as mentioned above, in the initial state). There is a second gap B2 between the blocking working surface 31 of the baffle 3 and the stationary contact 5 (as mentioned above, in the initial state). It is required that the aforementioned second gap B2 and third gap B3 are each larger than the first gap B1, typically approximately twice the size of the first gap B1. This ensures that the structural height of the baffle 3 protruding from the first surface 13 of the moving spring 1 is substantially aligned in the height direction Y of the moving spring 1 with the end position of the connector of the push card C extending from the first surface 13 of the moving spring 1.

[0049] The structure described above can block high-temperature metal splashes and the arc-blocking moving spring 1. In the push rod type electromagnetic relay structure, the baffle 3 blocks the diffusion of the contact arc to the corresponding connector of the push card C, and blocks and slows down some of the contact splashes during the splashing and falling process. Of course, it also forms heat dissipation fins for the moving spring 1 itself to carry current and the arc radiation heat.

[0050] Based on the aforementioned forming structure and function of the baffle 3 on the moving spring 1, to prevent contact spatter adhering to it from accumulating and falling off, and to avoid interference with the fit between the moving spring 1 and the stationary spring 4, and between the moving contact 2 and the stationary contact 5 due to accumulation, the baffle 3 has a bend-formed structure on the first surface 13 of the moving spring 1. This results in an obtuse angle α between the blocking working surface 31 of the baffle 3 and the first surface 13 at the moving contact connection position 11. The typical value of this angle α is between 95° and 120°. If it is too small, contact spatter will easily accumulate and not fall off; if it is too large, it will interfere with the assembly structure of the moving contact, push card, etc. 95° to 105° is preferred. Of course, when the moving spring 1 swings elastically in the push rod type electromagnetic relay structure, it can also achieve the effect of shaking off and separating the contact spatter adhering to the baffle 3.

[0051] In view of the inventiveness of the research results of this utility model, the applicant conducted a prior search and analysis.

[0052] During the applicant's search, it was found that Chinese patent documents disclose the placement of metal arc-blocking plates near the contacts of an electromagnetic relay to achieve the effects of arc blocking, heat dissipation, and preventing glass beads in the plastic structure from splashing to the contacts. See the technology published in Chinese patent document entitled "A High-Power Electromagnetic Relay with a Pushing Mechanism", publication number CN103985607 A, publication date August 13, 2014. However, in this technology, firstly, the metal arc-isolating sheet is assembled in a relatively independent structure near the contact point of the contact part. This relatively independent assembly structure inevitably complicates the molding structure of the electromagnetic relay, increasing the assembly technology difficulty and manufacturing cost of the electromagnetic relay. Secondly, because the metal arc-isolating sheet avoids the contact mating structure of the contact part, it needs to form a fixed carrier near the contact point that does not interfere with the contact mating structure, thus fixing it on the relative structure above the contact point. This can only block the influence of the arc between the contacts at the top, and cannot be applied to the push rod type electromagnetic relay with the push card located below the contact point. Thirdly, the arrangement structure of the metal arc-isolating sheet above the contact point cannot slow down or block the splashing and falling process of the high-temperature metal spatter generated between the contacts, and therefore cannot improve the ablation effect of the high-temperature metal spatter on the plastic structural base below during the splashing and falling process.

[0053] Compared to the search results, this invention addresses the unique challenges of arcing in electromagnetic relays and the susceptibility of the plastic structure beneath the contacts to ablation. Using a movable spring that works in conjunction with the push-card mechanism as a carrier, a baffle is formed protruding from the surface of the movable spring facing the stationary spring, positioned between the movable contact connection and the push-card connection. This baffle blocks the movable contact and the push-card in their spatial path. Therefore, in the operating environment of the movable spring, without the need for additional structures, the movable spring itself can prevent the arc from spreading to the push-card. It also catches and slows down the fall of some high-temperature metal spatter, achieving a cooling effect and mitigating the ablation of the plastic base structure caused by the falling high-temperature metal spatter. While achieving the aforementioned technical effects, this invention uses the movable spring as a carrier for forming the baffle, eliminating the need for additional independent structural components and assembly carriers. This simplifies the electromagnetic relay's molding structure, achieving this without significantly increasing the assembly difficulty or manufacturing cost.

[0054] Example 2 The rest of the content of this embodiment is the same as that of embodiment 1, except that: The width of the baffle in the width direction X of the moving spring is basically aligned with the width of the moving spring at the current position.

[0055] In this way, while effectively isolating the corresponding connector of the push card, the blocking and slowing effect on high-temperature metal splashes is even better.

[0056] Example 3 The rest of the content of this embodiment is the same as that of embodiment 1, except that: The push-lock connection position on the moving spring consists of two round holes / C-shaped holes arranged on both sides of the width direction X below the moving contact connection position; Correspondingly, the baffles on the first surface of the moving spring are two pieces that are positioned opposite the holes on both sides of the push card connection position. These two baffles are arranged at an angle in the width direction X of the moving spring, between the moving contact connection position and the corresponding hole below, forming a structure similar to an inverted V-shape on the first surface of the moving spring.

[0057] Example 4 The rest of the content of this embodiment is the same as that of embodiment 1, except that: The baffle is fixed to the first surface of the moving spring by a combined connection structure (such as welding).

[0058] Although this embodiment can achieve the technical purpose and effect of this utility model to a certain extent, the increased assembly difficulty, increased manufacturing cost, and impact on the performance of the moving spring structure brought about by the combined structure are unavoidable and are not the preferred option.

[0059] Example 5 The rest of the content of this embodiment is the same as that of embodiment 1, except that: The moving spring is a single-layer spring structure. An approximately U-shaped structural slit is opened in the area between the moving contact connection position and the push card connection position. The spring at the structural slit is bent toward the first surface to form a baffle.

[0060] This embodiment can improve the heat dissipation and elasticity of the moving spring. Of course, the design of these properties is based on the overall performance design considerations of the push rod electromagnetic relay.

[0061] Example 6 The rest of the content of this embodiment is the same as that of embodiment 1, except that: Increase the clearance between the baffle and the stationary spring and stationary contact. The baffle's blocking working surface is formed with a slightly curved structure, or the baffle is formed with an approximately right-angle fit relative to the first surface where the moving contact is connected.

[0062] The above embodiments are only used to illustrate the present invention and are not intended to limit it.

[0063] Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications can still be made to the above embodiments, or equivalent substitutions can be made to some of the technical features. For example, if the formed electromagnetic relay is a non-push rod structure, then there is no need to form a push-lock connection position on the moving spring, so that the baffle is formed between the moving contact connection position and the mounting structure arrangement position. The baffle mainly serves to prevent high-temperature metal splashes from falling. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the present invention.

Claims

1. A movable spring that can block high-temperature metal splashes, wherein the movable spring (1) has movable contact connection positions (11) arranged at intervals, mounting structure arrangement positions (14) and a first surface (13) that cooperates with the stationary spring (4) in the height direction (Y). The moving contact connection position (11) is used to connect the moving contact (2) and is located on the upper side of the moving spring (1) in the height direction (Y); The mounting structure arrangement (14) is used for assembly on the base (D) of the electromagnetic relay, and is located on the lower side of the moving spring (1) in the height direction (Y); Its features are: On the first surface (13) of the movable spring (1), there is a baffle (3) that protrudes from the thickness direction (Z) of the movable spring (1) and is located between the movable contact connection position (11) and the mounting structure arrangement position (14). The baffle (3) is used to block the splashing and falling of high-temperature metal spatter generated by the ignition of the arc.

2. The spring sheet capable of blocking high-temperature metal splashes according to claim 1, characterized in that: The width dimension of the baffle (3) in the width direction (X) of the moving spring (1) is greater than the diameter of the moving contact (2) connected to the upper moving contact connection position (11); Furthermore, the arrangement of the baffle (3) in the width direction (X) of the moving spring (1) and its orthogonal projection in the height direction (Y) of the moving spring (1) can block the diameter outline of the upper moving contact (2).

3. The spring sheet capable of blocking high-temperature metal splashes according to claim 1, characterized in that: The moving spring (1) also has push-lock connection positions (12) arranged at intervals between the moving contact connection position (11) and the mounting structure arrangement position (14) in the height direction (Y). The baffle (3) is located between the moving contact connection position (11) and the push card connection position (12); The baffle (3) also serves to block the spread of the ignition arc to the push card connection position (12).

4. The spring sheet capable of blocking high-temperature metal splashes according to claim 3, characterized in that: The push-lock connection position (12) on the moving spring (1) is located directly below the moving contact connection position (11) in the height direction (Y) of the moving spring (1); Furthermore, the arrangement of the baffle (3) in the width direction (X) of the movable spring (1) and its orthogonal projection in the height direction (Y) of the movable spring (1) can block the diameter profile of the lower push card connection position (12).

5. The spring sheet capable of blocking high-temperature metal splashes according to claim 3, characterized in that: The baffle (3) on the moving spring (1) is shaped on the first surface (13) at a position close to the push card connection position (12) and far away from the moving contact connection position (11).

6. The spring sheet capable of blocking high-temperature metal splashes according to claim 1 or 3, characterized in that: The moving spring (1) is a multi-layered stacked structure of springs; The baffle (3) is an integral bent structure of the spring that makes up the moving spring (1).

7. The spring sheet capable of blocking high-temperature metal splashes according to claim 6, characterized in that: The baffle (3) is a spring formed by bending the spring of the moving spring (1) with an inclined surface; The baffle (3) has an obtuse angle (α) between its blocking working surface (31) facing the contact point and the first surface (13) at the moving contact connection position (11).

8. An electromagnetic relay having a base (D) and a magnetic circuit portion (A) and a contact portion (B) mounted on the base (D); The contact portion (B) has a moving spring (1) that makes up the moving spring assembly. Its features are: The movable spring (1) is the movable spring structure that can block high-temperature metal splashes as described in any one of claims 1 to 7.

9. The electromagnetic relay according to claim 8, characterized in that: The electromagnetic relay is a push rod type electromagnetic relay, having a base (D) and a magnetic circuit part (A), a contact part (B) assembled on the base (D), and a push clip (C) between the armature of the magnetic circuit part (A) and the moving spring (1) of the contact part (B). The push card (C) serves as a connector for connecting the movable spring (1), extending from the first surface (13) of the movable spring (1) through the push card connection position (12) of the movable spring (1); The baffle (3) on the movable spring (1) has a structural height that protrudes from the first surface (13) of the movable spring (1), and in the height direction (Y) of the movable spring (1), it corresponds at least to the structural height of the end of the push card (C) extending from the first surface (13) of the movable spring (1).

10. The electromagnetic relay according to claim 8 or 9, characterized in that: The baffle (3) on the moving spring (1) has a third gap (B3) between it and the stationary spring (4) in the initial state. In the initial state, there is a first gap (B1) between the moving contact (2) and the stationary contact (5) of the contact part (B). Furthermore, the third gap (B3) is larger than the first gap (B1).

11. The electromagnetic relay according to claim 8 or 9, characterized in that: The baffle (3) on the moving spring (1) has a second gap (B2) between it and the stationary contact (5) on the stationary spring (4) in the initial state. In the initial state, there is a first gap (B1) between the moving contact (2) and the stationary contact (5) of the contact part (B). Furthermore, the second gap (B2) is larger than the first gap (B1).

Images