electronic devices

Abstract

This disclosure relates to an electronic device. The electronic device includes: a metal floor; a frame radiator located outside the metal floor; a circuit board spaced between the metal floor and the frame radiator along a first direction perpendicular to the thickness direction of the electronic device; the circuit board has a groove and a transition portion forming the bottom surface of the groove; the groove is recessed along one edge of the circuit board toward the opposite edge; a button module electrically connected to the circuit board; the circuit board includes a first wiring layer and a second wiring layer; the first wiring layer includes a first metal region located on one side of the transition portion, the first metal region generating a distributed capacitance with the metal floor; the second wiring layer includes button signal lines electrically connected to the button module, the button signal lines being conducted from one side of the transition portion through the transition portion to the other side of the transition portion, the button signal lines forming a distributed inductance; the distributed capacitance and the distributed inductance form a resonant circuit to adjust the resonant frequency of the circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of terminal technology, and more particularly to an electronic device. Background Technology

[0002] In order to arrange as many antennas as possible in a limited space, the side button frame of existing electronic devices can serve as an antenna radiator while realizing the button function, and the power supply of the antenna radiator and the button module are laid out on the same circuit board.

[0003] However, because the circuit board is close to the antenna radiator and the metal traces are laid out face-to-face with the antenna radiator, the circuit board will be excited by clutter. If the resonant frequency of the clutter falls within the band of the antenna radiator, it will greatly affect the radiation efficiency of the antenna radiator. Utility Model Content

[0004] This disclosure provides an electronic device to address the shortcomings of the related art.

[0005] According to embodiments of this disclosure, an electronic device is provided, comprising:

[0006] Metal flooring;

[0007] A frame radiator, the frame radiator being located on the outside of the metal floor;

[0008] The circuit board is spaced between the metal floor and the frame radiator along a first direction, which is perpendicular to the thickness direction of the electronic device. The circuit board has a groove and a transition portion forming the bottom surface of the groove. The groove is recessed along one edge of the circuit board toward the opposite edge.

[0009] A button module, which is electrically connected to the circuit board;

[0010] The circuit board includes a first trace layer and a second trace layer. The first trace layer includes a first metal region located on one side of the transition portion, and the first metal region and the metal ground plane generate a distributed capacitance. The second trace layer includes a button signal line electrically connected to the button module. The button signal line is conducted from one side of the transition portion through the transition portion to the other side of the transition portion. The button signal line forms a distributed inductance. The distributed capacitance and the distributed inductance form a resonant circuit to adjust the resonant frequency of the circuit board.

[0011] Optionally, the button module is disposed on the second wiring layer, the second wiring layer is disposed facing the frame radiator, and the button module and the first metal area are located on the same side of the transition portion.

[0012] Optionally, the circuit board further includes a third trace layer disposed facing the frame radiator, the second trace layer being located between the first trace layer and the third trace layer, and the button module being disposed on the third trace layer.

[0013] Optionally, the circuit board further includes a grounding spring, which is located on one side of the transition portion and on a different side of the transition portion from the first metal region.

[0014] Optionally, the third routing layer includes a second metal region, the first metal region and the second metal region are located on the same side of the transition portion, and both the first metal region and the second metal region are grounded through the grounding spring.

[0015] Optionally, the circuit board further includes a power supply contact and a metal spring, wherein the power supply contact is disposed in the portion of the third trace layer that extends into the groove, and the metal spring is electrically connected to the power supply contact and the frame radiator.

[0016] Optionally, the circuit board further includes a slot formed by recessing into the circuit board along the bottom of the groove.

[0017] Optionally, the slit includes a first slit and a second slit, which are formed by recesses in opposite directions.

[0018] Optionally, the frame radiator covers at least one of the mid-to-high frequency band, the N78 frequency band, and the N77 frequency band, and the circuit board resonates at 1.471 GHz.

[0019] Optionally, a filling medium may also be included, which is disposed between the metal floor and the circuit board.

[0020] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0021] As can be seen from the above embodiments, the present disclosure uses distributed capacitors and distributed inductors to form a resonant circuit. The resonant circuit can adjust the resonant frequency of the circuit board that is excited to resonate, and adjust the resonant frequency to the out-of-band of the target radiation frequency band of the frame radiator. This is beneficial to improving the radiation performance of the frame radiator, and also helps to reduce the number of tuning elements configured on the circuit board to adjust the resonance of the circuit board, thus optimizing the spatial layout of the circuit board.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0024] Figure 1 This is a schematic diagram of the layout of an electronic device in related technologies.

[0025] Figure 2 yes Figure 1 Smith chart of the middle side border segment in the unmatched state.

[0026] Figure 3 yes Figure 1 Input return loss curve of the middle side frame segment in unmatched state.

[0027] Figure 4 yes Figure 1 Transmission and radiation efficiency curves of the middle side frame segment under unmatched conditions.

[0028] Figure 5 yes Figure 1 Smith chart of the middle side frame segment when matching the N78 band.

[0029] Figure 6 yes Figure 1 Input return loss curve of the middle side frame segment in the matched state.

[0030] Figure 7 yes Figure 1 Transmission and radiation efficiency curves of the middle side frame segment under matched conditions.

[0031] Figure 8 This is a partial schematic diagram of an electronic device according to an exemplary embodiment.

[0032] Figure 9 This is a schematic diagram of a circuit board according to an exemplary embodiment.

[0033] Figure 10 This is a schematic diagram illustrating the connection between a circuit board and a filling dielectric layer according to an exemplary embodiment.

[0034] Figure 11 This is an exploded view of a circuit board according to an exemplary embodiment.

[0035] Figure 12 This is a schematic diagram of another circuit board according to an exemplary embodiment.

[0036] Figure 13 This is an input return loss curve of a frame radiator illustrated according to an exemplary embodiment.

[0037] Figure 14This is a graph illustrating the radiation efficiency of a frame radiator according to an exemplary embodiment.

[0038] Figure 15 This is an exploded schematic diagram of another circuit board according to an exemplary embodiment.

[0039] Figure 16 This is a schematic cross-sectional view of a circuit board according to an exemplary embodiment. Detailed Implementation

[0040] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0041] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0042] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0043] Figure 1 This describes the layout relationship between the side button frame 101, the circuit board 102, and the metal base plate 103 in related technologies. The side button frame 101 can have an opening for keycaps to pass through. When the user presses the keycap, it can trigger the button module on the circuit board 102 in a direction perpendicular to the side button frame 101, thus triggering the corresponding function of the electronic device. At the same time, the side button frame 101 can also serve as an antenna radiator, with the feed point of the antenna radiator located on the circuit board, and the two are electrically connected by a metal spring.

[0044] Based on simulations conducted using the existing solution, the applicant discovered that, as... Figures 2-3As shown, in the initial unmatched state of the side button frame 101, resonance occurs at a position of 4.13 GHz, and as... Figure 4 As shown, the resonance at the 4.13 GHz position exhibits a significant efficiency dip. Since this resonance lies within the N77 and N78 frequency bands, when the side key frame 101 is tuned to radiate signals in the N77 and N78 frequency bands through matching, as... Figures 5-7 As shown, due to the resonance at this 4.13 GHz location, the reflection coefficient near the sidebands of the N77 and N78 frequency bands shows a slight decrease, and as... Figure 7 As shown, a significant efficiency dip of -8.4dB appears at the 4.13GHz position of the sidebands in the N77 and N78 bands. This efficiency drop is faster than that at positions farther from 4.13GHz in the N77 and N78 bands. Therefore, the performance of the side button frame 101 in the N77 and N78 bands is poor.

[0045] Based on this, such as Figures 8-10 As shown, this disclosure provides an electronic device, which includes a metal floor 1, a frame radiator 2, a circuit board 3, and a button module 4. The button module 4 is electrically connected to the circuit board 3, and enables the electronic device to perform power, volume, and brightness adjustments. The frame radiator 2 is located outside the metal floor 1, and the circuit board 3 is spaced between the frame radiator 2 and the metal floor 1 along a first direction. That is, there is a gap between the circuit board 3 and both the frame radiator 2 and the metal floor 1. This first direction is perpendicular to the thickness direction of the electronic device and parallel to the screen panel. To improve the overall reliability of the electronic device, a filling medium 5 is also included. The filling medium 5 is disposed between the metal floor 1 and the circuit board 3, sealing the gap between them. The dielectric constant of the filling medium 5 can be adaptively selected based on its impact on the radiation performance of the frame radiator 2; for example, the filling medium 5 may include FR4 dielectric.

[0046] In this embodiment, the circuit board 3 has a groove 31 and a transition portion 32 formed on the bottom surface of the groove 31. The groove 31 is formed by recessing along one edge of the circuit board 3 toward the opposite edge, and the groove 31 does not penetrate the circuit board 3 in the recessed direction, so that the transition portion 32 can be formed simultaneously by means of the recess of the groove 31. For example, the groove 31 can be recessed along the thickness direction of the electronic device. The structure of the groove 31 and the transition portion 32 is described in terms of the morphological features of the circuit board 3.

[0047] Furthermore, in another dimension, namely the routing layout of circuit board 3, such as Figure 11 As shown, the circuit board 3 also includes a first wiring layer 33 and the first wiring layer 33 includes a first metal region 331 located on one side of the transition portion 32, for example... Figure 10 As shown, the first metal region 331 is located on the right side of the transition portion 32. The first metal region 331 is positioned face-to-face with the metal ground plane 1, thereby generating distributed capacitance between the first metal region 331 and the metal ground plane 1. The first wiring layer 33 may refer to a metal layer or may include a substrate and a metal layer connected to the substrate.

[0048] The circuit board 3 also includes a second wiring layer 34, which includes a button signal line 341 electrically connected to the button module 4. This button signal line 341 runs from one side of the transition section 32 through the transition section 32 to the other side. In other words, the button signal line 341 can be routed through the transition section 32 to transmit signals from one side of the transition section 32 to the other. This button signal line 341 can form a distributed inductor. The distributed inductor and distributed capacitor are electrically connected to form a resonant circuit. This resonant circuit can adjust the resonant frequency excited on the circuit board 3, which is beneficial for adjusting the resonant frequency excited on the circuit board 3 to outside the target radiation frequency band of the frame radiator 2. This improves the radiation performance of the frame radiator 2 and reduces the number of tuning elements required to adjust the resonance of the circuit board 3, thus optimizing the spatial layout of the circuit board 3. The second wiring layer 34 can be a metal layer or can include a substrate and a metal layer connected to the substrate.

[0049] The inductance value of the distributed inductor can be adjusted by changing the width and length of the button signal line 341, which can be adjusted using the length and width of the transition section 32. The capacitance value of the distributed capacitor can be adjusted by changing the coupling area between the first metal region 331 and the metal ground plane 1.

[0050] For example, such as Figure 12 As shown, in order to adjust the length and width dimensions of the transition portion 32, the circuit board 3 also includes a slot formed by recessing into the circuit board 3 along the bottom of the groove 31, thereby increasing the length and width of the transition portion 32. Figure 12 The length dimension in the left-right direction can be reduced, while the width dimension of the transition portion 32 can be decreased. For example, the slit may include a first slit 38 and a second slit 39, which are formed by recesses in opposite directions, such as... Figure 12As shown, the first slit 38 is formed from the bottom of the groove 31 towards the left, and the second slit 39 is formed from the bottom of the groove 31 towards the right. The dimensions of the first slit 38 and the second slit 39 may be equal or unequal. Of course, in other embodiments, the circuit board 3 may also include either the first slit 38 or the second slit 39, and this disclosure does not impose any limitations on this.

[0051] Simulations were conducted based on this technical solution, taking the coverage of one or more of the mid-to-high frequency bands, N77, and N78 frequency bands by the frame radiator 2 as an example. Figure 13 and Figure 14 As shown, by adjusting the capacitance value of the distributed capacitor and the inductance value of the distributed inductor, the resonant frequency of circuit board 3 can be adjusted to 1.14GHz. This resonant frequency is far from the mid-to-high frequency band (greater than 1.7GHz), the N77 band, and the N78 band. Under this scheme, as... Figure 14 The passive efficiency of the frame radiator 2 shown is, i.e. Figure 14 As shown by the orange curve, there are no efficiency dips in the range of 1.7GHz-4.2GHz, which can improve antenna radiation efficiency compared to existing solutions.

[0052] Of course, in this embodiment, taking the occurrence of the clutter resonance of the circuit board 102 at 1.14 GHz as an example, it is possible to adjust the capacitance value of the distributed capacitor and the inductance value of the distributed inductor according to the coverage frequency band of the frame radiator 2, so that the clutter resonance of the circuit board 102 occurs outside the coverage frequency band of the frame radiator 2, especially at a frequency greater than the coverage frequency band, and the difference is less than or equal to 100 MHz. In this way, the radiation efficiency of the frame radiator 2 can be improved by the resonance of the circuit board 102.

[0053] In some embodiments, the button module 4 can be disposed on the second wiring layer 34, and the second wiring layer 34 is disposed facing the frame radiator 2. The button module 4 and the first metal area 331 are located on the same side of the transition portion 32. In this design, both the button module 4 and the button signal line 341 are disposed on the second wiring layer 34, which helps to reduce the number of wiring layers on the circuit board 3. At the same time, the design that the button module 4 and the first metal area 331 are located on the same side of the transition portion 32 facilitates the grounding of the button module 4 through the first metal area 331 using metallized vias, thereby achieving electromagnetic protection.

[0054] In other embodiments, such as Figure 15As shown, the circuit board 3 also includes a third routing layer 35 facing the frame radiator 2. A second routing layer 34 is disposed between the first routing layer 33 and the third routing layer 34, and the button module 4 is disposed on the third routing layer 35. Electrical connection between the button module 4 and the button signal line 341 can be achieved subsequently through metallized vias. This design, similar to a sandwich structure, facilitates a fully enclosed ground structure design for the button signal line 341 through the first routing layer 33 and the second routing layer 34, which helps generate distributed inductance through the button signal line 341.

[0055] For example, still using Figure 16 As shown, the circuit board 3 also includes a grounding spring 36, which is located on one side of the transition section 32. The grounding spring 36 and the first metal area 331 are located on different sides of the transition section 32. Of course, when the circuit board 3 includes multiple grounding springs 36, each grounding spring 36 is located on a different side of the transition section 32 from the first metal area 331. This can realize the floating design of the first metal area 331, which is beneficial to the formation of distributed capacitance between the first metal area 331 and the metal ground 1.

[0056] Furthermore, the third wiring layer 35 may also include a second metal region 351. The first metal region 331 and the second metal region 351 are located on the same side of the transition section 32, and both the first metal region 331 and the second metal region 351 are grounded through the ground return spring 36. Since the ground return spring 36 is located on a different side of the transition section 32 from the first metal region 331 and the second metal region 351, it is also necessary to achieve electrical connection between the first metal region 331 and the second metal region 351 and the ground return spring 36 through metal traces located in the transition section 32. This allows for the grounding of the button signal line 341, enabling the design of a distributed inductor based on the button signal line 341.

[0057] In the above embodiments, the figures are still used. Figure 15 and Figure 16 As shown, the circuit board 3 also includes a power supply contact 37 and a metal spring (not shown). The power supply contact 37 is located in the portion of the third trace layer 35 that extends into the groove 31. The metal spring electrically connects the frame radiator 2 and the power supply contact 37. Based on this structure, by designing the positional relationship between the power supply contact 37 and the transition portion 32, the position of the transition portion 32 can be configured as a tuning sensitive area. Therefore, based on the size design of the transition portion 32 and the size design of the button signal line 341, the position of the noise resonance can be adjusted relatively significantly, reducing the difficulty of debugging.

[0058] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0059] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, include: Metal flooring; A frame radiator, the frame radiator being located on the outside of the metal floor; The circuit board is spaced between the metal floor and the frame radiator along a first direction, which is perpendicular to the thickness direction of the electronic device. The circuit board has a groove and a transition portion forming the bottom surface of the groove. The groove is recessed along one edge of the circuit board toward the opposite edge. A button module, which is electrically connected to the circuit board; The circuit board includes a first trace layer and a second trace layer. The first trace layer includes a first metal region located on one side of the transition portion, and the first metal region and the metal ground plane generate a distributed capacitance. The second trace layer includes a button signal line electrically connected to the button module. The button signal line is conducted from one side of the transition portion through the transition portion to the other side of the transition portion. The button signal line forms a distributed inductance. The distributed capacitance and the distributed inductance form a resonant circuit to adjust the resonant frequency of the circuit board.

2. The electronic device according to claim 1, characterized in that, The button module is disposed on the second wiring layer, which is disposed facing the frame radiator. The button module and the first metal area are located on the same side of the transition portion.

3. The electronic device according to claim 1, characterized in that, The circuit board further includes a third trace layer disposed facing the frame radiator, the second trace layer being located between the first trace layer and the third trace layer, and the button module being disposed on the third trace layer.

4. The electronic device according to claim 3, characterized in that, The circuit board also includes a grounding spring, which is located on one side of the transition portion and on a different side of the transition portion from the first metal region.

5. The electronic device according to claim 4, characterized in that, The third routing layer includes a second metal region. The first metal region and the second metal region are located on the same side of the transition portion, and both the first metal region and the second metal region are grounded through the ground return spring.

6. The electronic device according to claim 3, characterized in that, The circuit board also includes a power supply contact and a metal spring. The power supply contact is located in the portion of the third trace layer that extends into the groove. The metal spring is electrically connected to the power supply contact and the frame radiator.

7. The electronic device according to claim 1, characterized in that, The circuit board also includes a slot formed by recessing into the circuit board along the bottom of the groove.

8. The electronic device according to claim 7, characterized in that, The slit includes a first slit and a second slit, which are formed by recesses in opposite directions.

9. The electronic device according to claim 1, characterized in that, The frame radiator covers at least one of the mid-to-high frequency band, the N78 frequency band, and the N77 frequency band, and the circuit board resonates at 1.471 GHz.

10. The electronic device according to claim 1, characterized in that, It also includes a filling medium disposed between the metal floor and the circuit board.

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