Multi-channel isolation devices, multi-channel isolation packaging structures, and communication equipment

Abstract

This utility model discloses a multi-channel isolation device, a multi-channel isolation packaging structure, and a communication device, relating to the field of chip packaging technology. The device includes: a packaging carrier; multiple parallel signal transmission channels, each of which is disposed on the packaging carrier; and isolation structures disposed on both sides of the same signal transmission channel, with the same isolation structure between adjacent signal transmission channels. This application aims to ensure low cost for the multi-channel transmission device while achieving miniaturized packaging and effectively suppressing near-field crosstalk.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a multi-channel isolation device, a multi-channel isolation packaging structure, and a communication device. Background Technology

[0002] In millimeter-wave near-field multi-channel transmission, traditional multi-channel transmission devices typically reduce signal interference by increasing the channel spacing, which leads to a significant increase in the package size of the multi-channel transmission device, making it unsuitable for high-density integration. In addition, although traditional sputtering and electroplating shielding methods can improve electromagnetic compatibility, they are costly and not suitable for near-field isolation in the millimeter-wave band.

[0003] Therefore, while ensuring the low cost of multi-channel transmission devices, how to achieve miniaturized packaging and effectively suppress near-field crosstalk are technical problems that urgently need to be solved. Utility Model Content

[0004] The main objective of this invention is to propose a multi-channel isolation device, a multi-channel isolation packaging structure, and a communication device, aiming to ensure low cost of the multi-channel transmission device while achieving miniaturized packaging and effectively suppressing near-field crosstalk.

[0005] To achieve the above objectives, this utility model proposes a multi-channel isolation device, which includes: an encapsulation carrier;

[0006] Multiple parallel signal transmission channels are provided on the encapsulation carrier;

[0007] An isolation structure is provided on both sides of the same signal transmission channel, and the same isolation structure is provided between two adjacent signal transmission channels.

[0008] In one embodiment, the multi-channel isolation device includes a transmitter and a receiver, the transmitter and the receiver being disposed opposite to each other on the encapsulation carrier;

[0009] The transmitting device includes multiple transmitting antenna groups, the receiving device includes receiving antenna groups corresponding to each of the transmitting antenna groups, and the isolation structure is a wire array with traces perpendicular to the direction of the packaging carrier;

[0010] Each of the transmitting antenna groups and the corresponding receiving antenna group forms a signal transmission channel that is fixedly welded onto the packaging carrier, and the wire arrays are respectively arranged on both sides of the same signal transmission channel.

[0011] In one embodiment, the wire array is a metal wire array with conductive properties.

[0012] In one embodiment, the transmitting antenna group includes a transmitting chip and a transmitting antenna, wherein the transmitting chip is electrically connected to the transmitting antenna;

[0013] The receiving antenna group includes a receiving chip and a receiving antenna, and the receiving chip is electrically connected to the receiving antenna.

[0014] In one embodiment, the multi-channel isolation device includes multiple transmitting units and a receiving unit corresponding to each transmitting unit;

[0015] Each transmitting unit and its corresponding receiving unit form a signal transmission channel and are fixedly welded to the packaging carrier. Isolation pin welding holes are provided on both sides of the same signal transmission channel on the packaging carrier, and the same isolation pin welding hole is provided between two adjacent signal transmission channels.

[0016] In one embodiment, the isolation structure includes an isolation retaining wall member corresponding to the welding hole of the isolation pin;

[0017] Each of the aforementioned isolation barrier components and the corresponding isolation pin welding holes are assembled onto the encapsulation carrier by pressing or bonding.

[0018] In one embodiment, the isolation structure includes a transmitting antenna body corresponding to each of the transmitting units, and the transmitting unit includes a transmitting chip and a transmitting rectangular groove disposed opposite to the transmitting chip;

[0019] When all the isolation barrier components and corresponding isolation pin welding holes are assembled to the packaging carrier by pressing or bonding, the transmitting antenna body is simultaneously assembled into the transmitting rectangular groove and electrically connected to the transmitting chip.

[0020] In one embodiment, the isolation structure includes a receiving antenna body corresponding to each of the receiving units, and the receiving unit includes a receiving chip and a receiving rectangular groove disposed opposite to the receiving chip;

[0021] When all the isolation barrier components and corresponding isolation pin welding holes are assembled to the packaging carrier by pressing or bonding, the receiving antenna body is simultaneously assembled into the receiving rectangular groove and electrically connected to the receiving chip.

[0022] In addition, this utility model also proposes a multi-channel isolation packaging structure, wherein the multi-channel isolation packaging structure includes at least the multi-channel isolation device described in any one of the above.

[0023] In addition, this utility model also proposes a communication device, which includes at least the above-mentioned multi-channel isolation packaging structure.

[0024] This invention's multi-channel isolation device achieves miniaturized packaging and effectively suppresses near-field crosstalk while ensuring low cost for the multi-channel transmission device. Specifically, by setting multiple parallel signal transmission channels on the packaging carrier and setting isolation structures on both sides of the same signal transmission channel, adjacent signal transmission channels share the same isolation structure. This compact layout significantly reduces the packaging volume and effectively blocks near-field coupling caused by electromagnetic interference between adjacent signal transmission channels through the isolation structure. At the same time, the isolation structure can be implemented using simple processes such as metal wire arrays or isolation barrier components, avoiding the high cost of traditional sputtering electroplating. Thus, while ensuring low cost for the multi-channel transmission device, miniaturized packaging and effective suppression of near-field crosstalk are achieved. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the structure of an embodiment of the multi-channel isolation device provided by this utility model;

[0027] Figure 2 This is a schematic diagram of the frame of the multi-channel isolation device involved in the embodiments of this utility model;

[0028] Figure 3 The embodiments of this utility model involve Figure 2 Top view of the multi-channel isolation device shown;

[0029] Figure 4 This is another schematic diagram of the multi-channel isolation device involved in the embodiments of this utility model;

[0030] Figure 5 This is another schematic diagram of the multi-channel isolation device involved in the embodiments of this utility model;

[0031] Figure 6 This is a block diagram of the multi-channel isolation packaging structure involved in the embodiments of this utility model.

[0032] Explanation of icon numbers:

[0033] 100, Packaging carrier; 10_i, Signal transmission channel; 20_i, Isolation structure; RX1, Transmitter; TX1, Receiver; RX_i, Transmit antenna group; RX_Ci, Transmit chip; RX_Ri, Transmit antenna; RXRi, Transmit antenna body; Ri, Transmit rectangular groove; TX_i, Receive antenna group; TX_Ci, Receive chip; TX_Ti, Receive antenna; TXTi, Receive antenna body; Ti, Receive rectangular groove.

[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0036] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0038] In millimeter-wave near-field multi-channel transmission, traditional multi-channel transmission devices mainly suppress crosstalk between channels by increasing the spacing between transmission channels. However, this method significantly increases the package size, resulting in limited integration and making it difficult to meet the miniaturization and high-density requirements of modern electronic devices. In addition, although existing shielding technologies (such as sputtered electroplated metal layers) can improve electromagnetic compatibility, their processes are complex and costly, and their effect on suppressing near-field coupling in the millimeter-wave band is limited. They also introduce additional parasitic capacitance and losses. Especially in high-frequency multi-channel scenarios, existing solutions cannot balance size optimization and isolation performance, which restricts the application of millimeter-wave communication modules (i.e., communication equipment) in fields such as 5G, radar, and high-speed interconnects.

[0039] Therefore, there is an urgent need for a multi-channel anti-interference technology solution that can achieve high isolation, low loss, and controllable cost at the packaging level.

[0040] In summary, in order to address the aforementioned technical deficiencies and achieve miniaturized packaging while ensuring low cost of multi-channel transmission devices and effectively suppressing near-field crosstalk, this utility model proposes a multi-channel isolation device, a multi-channel isolation packaging structure, and a communication device.

[0041] In one embodiment of this utility model, please refer to Figure 1 , Figure 1 This is a schematic diagram of an embodiment of the multi-channel isolation device provided by this utility model. This application provides a multi-channel isolation device, which includes:

[0042] The package carrier 100 includes a plurality of parallel signal transmission channels 10_i, each of which is disposed on the package carrier 100; and an isolation structure 20_i, which is disposed on both sides of the same signal transmission channel 10_i, with the same isolation structure 20_i between two adjacent signal transmission channels 10_i.

[0043] In this embodiment, the multi-channel isolation device provided in this application includes a packaging carrier 100, multiple parallel signal transmission channels 10_i, and an isolation structure 20_i. The signal transmission channels 10_i are fixedly mounted on the packaging carrier 100 by welding. The isolation structures 20_i are located on both sides of the same signal transmission channel 10_i, with adjacent signal transmission channels 10_i sharing the same isolation structure 20_i. That is, the multi-channel isolation device provided in this application effectively reduces electromagnetic interference between channels through the isolation structure 20_i, achieving isolated transmission between multiple channels, while significantly increasing channel density and significantly reducing the package size. Compared to traditional sputtering electroplating methods, the multi-channel isolation device provided in this application is easier to implement and lower in cost, making it suitable for high-density packaging applications for millimeter-wave near-field transmission.

[0044] It should be noted that the packaging carrier can be a packaging substrate or a packaging frame.

[0045] Furthermore, in some feasible embodiments, reference is made to Figure 2 The multi-channel isolation device includes a transmitter RX1 and a receiver TX1, which are disposed opposite to each other on the packaging carrier 100. The transmitter RX1 includes multiple transmitting antenna groups RX_i, and the receiver TX1 includes a receiving antenna group TX_i corresponding to each transmitting antenna group RX_i. The isolation structure 20_i is a wire array with traces perpendicular to the packaging carrier 100. Each transmitting antenna group RX_i and the corresponding receiving antenna group TX_i form a signal transmission channel 10_i, which is fixedly soldered to the packaging carrier 100. The wire array is disposed on both sides of the same signal transmission channel 10_i.

[0046] In this embodiment, the present application is configured as follows: Figure 2 The multi-channel isolation device shown also includes a transmitter RX1 and a receiver TX1, which are disposed opposite to each other on the packaging carrier 100. The transmitter RX1 includes multiple transmitting antenna groups RX_i, and the receiver TX1 includes receiving antenna groups TX_i corresponding to each transmitting antenna group RX_i. Each transmitting antenna group RX_i and its corresponding receiving antenna group TX_i form an independent signal transmission channel 10_i, and are vertically routed along the packaging carrier 100 via a wire array as an isolation structure 20_i. This wire array is disposed on both sides of each signal transmission channel 10_i, effectively suppressing electromagnetic interference between adjacent channels and achieving high-density multi-channel parallel transmission. This significantly reduces the packaging size and improves integration while ensuring signal isolation performance, making it suitable for the high-efficiency anti-interference transmission requirements of millimeter-wave near-field communication.

[0047] It should be noted that the lead array is set on the packaging carrier 100 by vertical wire bonding. This lead array can be used... Figure 2 The solid circles arranged in an array within the dashed rectangle shown are represented by the rectangle itself. Figure 2 This is a front view of a multi-channel isolation device. Figure 3 for Figure 2 Top view of the multi-channel isolation device shown. Figure 3 The slashed circles in the transmitter chip RX_Ci shown indicate the signal pins of that transmitter chip RX_Ci. Figure 3 The slashed circles in the receiver chip TX_Ci shown represent the signal pins of the receiver chip TX_Ci.

[0048] Furthermore, in some other feasible embodiments, the wire array is a metal wire array with conductive properties.

[0049] In this embodiment, refer to Figure 2 This application employs a conductive metal wire array vertically disposed on the encapsulation carrier 100. This metal wire array is made of a highly conductive material and is arranged in parallel on both sides of each signal transmission channel 10_i. Through its conductive properties, it forms an electromagnetic shielding barrier, effectively absorbing and reflecting interference signals between adjacent channels.

[0050] It should be noted that the metal wire array can be a copper wire array or an aluminum wire array.

[0051] Furthermore, in some feasible embodiments, the transmitting antenna group RX_i includes a transmitting chip RX_Ci and RX_Ri, wherein the transmitting chip RX_Ci is electrically connected to the transmitting antenna RX_Ri; the receiving antenna group TX_i includes a receiving chip TX_Ci and a receiving antenna TX_Ti, wherein the receiving chip TX_Ci is electrically connected to the receiving antenna TX_Ti.

[0052] In this embodiment, the transmitting chip RX_Ci transmits electrical signals to the transmitting antenna RX_Ri, which converts them into electromagnetic wave signals. After near-field coupling, the signals are transmitted to the receiving antenna TX_Ti and converted back into electrical signals. The receiving chip TX_Ci then processes these signals to form independent signal transmission channels 10_i. Isolation structures 20_i, which are vertically arranged metal wire arrays, are provided on both sides of each signal transmission channel 10_i. This effectively suppresses electromagnetic interference between adjacent channels, enabling high-density multi-channel parallel transmission. While ensuring signal isolation performance, the package size is significantly reduced, and the integration is improved, making it suitable for the high-efficiency anti-interference transmission requirements of millimeter-wave near-field communication.

[0053] Furthermore, in some other feasible embodiments, reference is made to... Figure 2 The multi-channel isolation device includes multiple transmitting units and a receiving unit corresponding to each transmitting unit;

[0054] Each transmitting unit and its corresponding receiving unit form a signal transmission channel 10_i, which is fixedly welded to the packaging carrier 100. Isolation pin welding holes are provided on both sides of the packaging carrier 100 of the same signal transmission channel 10_i, and the same isolation pin welding hole is provided between two adjacent signal transmission channels 10_i.

[0055] In this embodiment, each transmitting unit is paired with a corresponding receiving unit to form an independent signal transmission channel 10_i, and isolation between channels is achieved by pressing or bonding the channel with the corresponding isolation barrier through the isolation pin welding holes. Specifically, each signal transmission channel 10_i is composed of a transmitting unit and a receiving unit and is fixedly welded to the packaging carrier 100. Isolation pin welding holes are provided on the packaging carrier 100 on both sides of each signal transmission channel 10_i. Two adjacent signal transmission channels 10_i share the same isolation pin welding hole. The isolation barrier is fixed to the corresponding isolation pin welding hole by pressing or bonding to form an electromagnetic shielding structure, which simplifies the production process and reduces the manufacturing cost. It is particularly suitable for millimeter-wave communication module applications that require mass production.

[0056] It should be noted that, Figure 4 The hollow circles in the array shown represent the solder holes for the isolation pins in the array. Figure 4 The solid circles (i.e., black-filled circles) in the array shown represent the array of isolation barrier components.

[0057] In another embodiment, reference is made to Figure 5 Each oppositely positioned transmitting antenna body RXRi and receiving antenna body TXTi forms a signal transmission channel. Metallized holes are provided on both sides of the same signal transmission channel, and two adjacent signal transmission channels share the same metallized hole to form an isolation barrier with antennas (i.e., an isolation structure). Next, the isolation barrier with antennas is pressed or bonded to the packaging substrate through each metallized hole, thereby effectively suppressing electromagnetic interference between adjacent channels, realizing high-density multi-channel parallel transmission, and significantly reducing the package size and improving integration while ensuring signal isolation performance. It is suitable for the high-efficiency anti-interference transmission requirements of millimeter-wave near-field communication.

[0058] It should be noted that this metallized hole can be used Figure 5 Each row of solid circles (i.e., circles filled with black) shown indicates that...

[0059] Furthermore, in some feasible embodiments, the isolation structure 20_i includes an isolation barrier corresponding to the welding hole of the isolation pin; each isolation barrier is assembled onto the encapsulation carrier 100 by pressing or bonding with the corresponding isolation pin welding hole.

[0060] Furthermore, in some other feasible embodiments, the isolation structure 20_i includes a transmitting antenna body RXRi corresponding to each of the transmitting units. The transmitting unit includes a transmitting chip RX_Ci and a transmitting rectangular groove Ri disposed opposite to the transmitting chip RX_Ci. When all the isolation barrier members and the corresponding isolation pin welding holes are assembled to the packaging carrier 100 by pressing or bonding, the transmitting antenna body RXRi is simultaneously assembled into the transmitting rectangular groove Ri and electrically connected to the transmitting chip RX_Ci.

[0061] Furthermore, in some feasible embodiments, the isolation structure 20_i includes a receiving antenna body TXTi corresponding to each of the receiving units. The receiving unit includes a receiving chip TX_Ci and a receiving rectangular groove Ti disposed opposite to the receiving chip TX_Ci. When all the isolation barrier components and corresponding isolation pin welding holes are assembled to the packaging carrier 100 by pressing or bonding, the receiving antenna body TXTi is simultaneously assembled into the receiving rectangular groove Ti and electrically connected to the receiving chip TX_Ci.

[0062] In summary, the multi-channel isolation device of this invention achieves miniaturized packaging and effectively suppresses near-field crosstalk while ensuring the low cost of the multi-channel transmission device. Specifically, by setting multiple parallel signal transmission channels 10_i on the packaging carrier 100, and setting isolation structures 20_i on both sides of the same signal transmission channel 10_i, adjacent signal transmission channels 10_i share the same isolation structure 20_i. This compact layout significantly reduces the packaging volume and effectively blocks near-field coupling caused by electromagnetic interference between adjacent signal transmission channels 10_i through the isolation structure 20_i. At the same time, the isolation structure 20_i can be implemented using simple processes such as metal wire arrays or isolation barrier components, avoiding the high cost problem of traditional sputtering electroplating. Thus, while ensuring the low cost of the multi-channel transmission device, miniaturized packaging and effective suppression of near-field crosstalk are achieved.

[0063] This utility model also proposes a multi-channel isolation packaging structure, referring to... Figure 6 , Figure 6 This is a block diagram of a multi-channel isolation packaging structure according to an embodiment of the present invention. The multi-channel isolation packaging structure includes at least the aforementioned multi-channel isolation device. The specific structure of the multi-channel isolation device is as described in the above embodiments. Since the multi-channel isolation packaging structure adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0064] This utility model also proposes a communication device, which includes at least the multi-channel isolation packaging structure described above. The specific structure of the communication device is as described in the above embodiments. Since the communication device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0065] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made using the contents of the present utility model specification and drawings under the technical concept of the present utility model, or direct / indirect applications in other related chip packaging technology fields, are included within the patent protection scope of the present utility model.

Claims

1. A multi-channel isolation device, characterized by, The multi-channel isolation device includes: Encapsulation carrier; Multiple parallel signal transmission channels are provided on the encapsulation carrier; An isolation structure is provided on both sides of the same signal transmission channel, and the same isolation structure is provided between two adjacent signal transmission channels.

2. The multi-pass isolation device of claim 1, wherein, The multi-channel isolation device includes a transmitter and a receiver, wherein the transmitter and the receiver are disposed opposite to each other on the encapsulation carrier; The transmitting device includes multiple transmitting antenna groups, the receiving device includes receiving antenna groups corresponding to each of the transmitting antenna groups, and the isolation structure is a wire array with traces perpendicular to the direction of the packaging carrier; Each of the transmitting antenna groups and the corresponding receiving antenna group forms a signal transmission channel that is fixedly welded onto the packaging carrier, and the wire arrays are respectively arranged on both sides of the same signal transmission channel.

3. The multi-pass isolation device of claim 2, wherein, The wire array is a metal wire array with conductive properties.

4. The multi-pass isolation device of claim 2, wherein, The transmitting antenna group includes a transmitting chip and a transmitting antenna, wherein the transmitting chip is electrically connected to the transmitting antenna; The receiving antenna group includes a receiving chip and a receiving antenna, and the receiving chip is electrically connected to the receiving antenna.

5. The multi-channel isolation device as described in claim 1, characterized in that, The multi-channel isolation device includes multiple transmitting units and a corresponding receiving unit for each transmitting unit; Each transmitting unit and its corresponding receiving unit form a signal transmission channel and are fixedly welded to the packaging carrier. Isolation pin welding holes are provided on both sides of the same signal transmission channel on the packaging carrier, and the same isolation pin welding hole is provided between two adjacent signal transmission channels.

6. The multi-channel isolation device as described in claim 5, characterized in that, The isolation structure includes an isolation retaining wall component corresponding to the welding holes of the isolation pins; Each of the aforementioned isolation barrier components and the corresponding isolation pin welding holes are assembled onto the encapsulation carrier by pressing or bonding.

7. The multi-channel isolation device as described in claim 6, characterized in that, The isolation structure includes a transmitting antenna body corresponding to each of the transmitting units, and the transmitting unit includes a transmitting chip and a transmitting rectangular groove disposed opposite to the transmitting chip; When all the isolation barrier components and corresponding isolation pin welding holes are assembled to the packaging carrier by pressing or bonding, the transmitting antenna body is simultaneously assembled into the transmitting rectangular groove and electrically connected to the transmitting chip.

8. The multi-channel isolation device as described in claim 7, characterized in that, The isolation structure includes a receiving antenna body corresponding to each receiving unit, and the receiving unit includes a receiving chip and a receiving rectangular groove disposed opposite to the receiving chip; When all the isolation barrier components and corresponding isolation pin welding holes are assembled to the packaging carrier by pressing or bonding, the receiving antenna body is simultaneously assembled into the receiving rectangular groove and electrically connected to the receiving chip.

9. A multi-channel isolation packaging structure, characterized in that, The multi-channel isolation packaging structure includes at least the multi-channel isolation device as described in any one of claims 1 to 8.

10. A communication device, characterized in that, The communication device includes at least the multi-channel isolation encapsulation structure as described in claim 9.

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