Anti-tin creep structure for flat panel connectors

Abstract

This utility model discloses a solder-resistant anti-crawling structure for a flat connector. Several terminals of the flat connector can be accommodated in terminal receiving slots on a plastic housing. Each terminal includes a retaining part, a soldering part, and an elastic support arm. The retaining part is fixedly connected to the terminal receiving slot. A soldering surface located on the outer side of the lower end of the plastic housing is formed on the soldering part at the lower end of the retaining part. The soldering surface can be flatly attached to and soldered to the PAD surface on the circuit board. The lower end of the elastic support arm is fixedly connected to the soldering part, and the upper end of the elastic support arm has a conductive contact part for elastic contact conduction. A recessed flux receiving groove is formed on the inner sidewall of the lower end of each terminal receiving slot of the plastic housing. Excess solder and flux generated during the soldering of the terminal to the circuit board can be accommodated in the flux receiving groove. This utility model ensures the stability of signal transmission, guarantees the high-frequency transmission performance of the connector, and improves the soldering strength between the terminal and the circuit board.

Description

Technical Field

[0001] This utility model relates to a terminal for a connector, and more particularly to a solder anti-climbing structure for a flat connector. Background Technology

[0002] The chip module 10 and circuit board 20 are generally electrically connected through a flat connector 30 to achieve functional expansion. The conductive terminals of the flat connector are of a press-fit structure. The terminals include a retaining part, a soldering part, an elastic support arm, and an elastic contact arm 14. The soldering part of the terminal is located on the outer side of the lower end of the plastic shell. The lower side of the soldering part forms a horizontal soldering surface. The soldering surface of the soldering part is soldered onto the circuit board to achieve electrical connection between the terminal and the circuit board. On both sides of the soldering part are the retaining part and the elastic support arm extending upward, respectively. The retaining part of the terminal is used to fix and position the terminal inside the plastic shell. The elastic contact arm is located at the upper end of the retaining part. An upper contact point 141 protruding from the outer side of the upper end of the plastic shell is formed on the elastic contact arm. The elastic contact arm is also provided with a lower contact point 142 located inside the plastic shell. When the upper contact point on the elastic contact arm is pressed down by the chip module, the lower contact point on the elastic contact arm tightly contacts the conductive contact part at the upper end of the elastic support arm. At this time, the terminal forms a closed loop, and a dual-channel signal transmission structure is formed between the chip module and the circuit board to improve the high-frequency performance of the flat connector.

[0003] During the SMT soldering process between the terminal and the circuit board, the solder paste is heated in a reflow oven to melt the tin metal. After the reflow oven cools down, the tin metal solidifies, thus soldering the terminal to the PAD surface of the circuit board. During the solder paste melting process, the main components of the solder paste are tin beads, flux (rosin), activators, etc. The active substances in the solder paste have good fluidity and may carry the dissolved flux to the conductive contact part at the upper end of the elastic support arm of the terminal. After the flux solidifies, it adheres to the surface of the conductive contact part, resulting in poor contact between the conductive contact part at the upper end of the elastic support arm of the terminal and the lower contact point of the elastic contact arm, which seriously affects the high-frequency performance of the connector during signal transmission. Utility Model Content

[0004] To overcome the above deficiencies, this utility model provides a solder anti-climbing structure for flat panel connectors. This solder anti-climbing structure can prevent flux from flowing to the conductive contact surface at the upper end of the elastic support arm of the terminal when the soldering part of the terminal is soldered to the circuit board, thereby fully ensuring the signal transmission stability and high-frequency transmission performance of the flat panel connector.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a solder anti-crawling structure for a flat connector. The flat connector includes a plastic shell and terminals. Several terminal receiving slots are arranged at intervals inside the plastic shell, and several terminals can be accommodated in each terminal receiving slot. Each terminal includes a retaining part, a soldering part, and an elastic support arm. The retaining part can be fixedly connected to the terminal receiving slot. The soldering part is located at the lower end of the retaining part, and a soldering surface is formed on the soldering part located on the outer side of the lower end of the plastic shell. The soldering surface can be flatly attached to and soldered to the PAD surface on the circuit board. The lower end of the elastic support arm is fixedly connected to the soldering part, and a conductive contact part for elastic contact conduction is formed at the upper end of the elastic support arm. A flux receiving groove with a recessed structure is formed on the inner side wall of the lower end of each terminal receiving slot of the plastic shell. Excess solder and flux generated when the soldering part of the terminal is soldered to the PAD surface on the circuit board can be accommodated in the flux receiving groove.

[0006] As a further improvement of this utility model, the flux receiving groove is located on the side wall of the holding part of the terminal receiving groove, which is in close contact with the terminal.

[0007] As a further improvement of this utility model, the lower end of the terminal receiving groove forms a stepped structure with an outward expansion. At least one protrusion is provided on the stepped surface of the stepped structure, and the lower end face of the protrusion is higher than the lower end face of the plastic shell. The flux receiving groove is the gap between the protrusion and the inner sidewall of the lower end of the terminal receiving groove and the adjacent protrusion, or the groove structure on the sidewall of the protrusion.

[0008] As a further improvement of this utility model, a recessed groove structure is formed at the lower end of the plastic shell, and the terminal receiving grooves are arranged at intervals on the bottom surface of the recessed groove structure.

[0009] As a further improvement of this utility model, the flux receiving groove is a through-hole groove that runs vertically through the side wall of the plastic shell.

[0010] As a further improvement of this utility model, a terminal holding groove with an upper width greater than a lower width is formed on one side of the terminal receiving groove. The holding part of the terminal is a T-shaped structure with an upper width greater than a lower width. A protruding holding point is formed on the side of the upper end of the holding part along its width direction. The holding part of the terminal can be tightly inserted into the terminal holding groove, and the holding point on the side of the holding part of the terminal can interfere with the side wall of the terminal holding groove. The stepped surface between the upper and lower ends of the holding part of the terminal stops on the stepped surface at the upper and lower ends of the terminal holding groove. The flux receiving groove is located on the side wall of the terminal holding groove along the thickness direction of the terminal holding part.

[0011] As a further improvement of this utility model, a siphon groove is formed on the holding part and the welding part of the terminal, and the siphon groove on the terminal is directly connected to the flux receiving groove on the plastic shell.

[0012] As a further improvement of this utility model, the height of the end of the siphon groove on the terminal located at the terminal holding part is lower than the height of the conductive contact part at the upper end of the elastic support arm.

[0013] As a further improvement of this utility model, the siphon groove on the terminal forms a receiving cavity with increased width at one end of the terminal holding part.

[0014] As a further improvement of this utility model, the holding part, welding part and elastic support part of the terminal are an integral structure formed by bending, and the holding part and welding part are connected by an outer arc bending edge, and the elastic support part and welding part are also connected by an outer arc bending edge.

[0015] The beneficial technical effects of this utility model are as follows: By forming a flux receiving groove on the lower side wall of the terminal receiving groove in the plastic shell, when the terminal welding part of the flat connector is welded to the circuit board, excess solder paste and flux enter the flux receiving groove, thereby reducing the flow of flux to the conductive contact part at the upper end of the elastic support arm. This prevents molten solder paste from climbing up the elastic support arm to the conductive contact part surface, thus ensuring stable contact and conduction between the lower contact point of the elastic contact arm and the conductive contact part surface at the upper end of the elastic support arm when the upper contact point of the elastic contact arm of the chip module is pressed down. This ensures the stability of signal transmission and the high-frequency transmission performance of the connector. This utility model also provides a siphon groove on the terminal to accommodate flux and excess solder, while increasing the welding area between the terminal and the circuit board, improving the welding strength between the terminal and the circuit board, and effectively preventing the solder joint from breaking under the pull-out force. Attached Figure Description

[0016] Figure 1 A 3D view showing the electrical connection between chip modules and circuit boards via a flat panel connector;

[0017] Figure 2 This is a front view of the positional state of the chip module when it begins to contact the flat panel connector in the existing technology.

[0018] Figure 3 This is a front view of the terminal state when the chip module begins to contact the upper contact point of the terminal in the prior art;

[0019] Figure 4 A front view of the positional state of the chip module when it is pressed against the flat panel connector in the prior art;

[0020] Figure 5This is a front view of the terminal state when the upper contact point of the chip module clamping terminal is in the prior art;

[0021] Figure 6 An exploded perspective view showing the electrical connection between the chip module and the circuit board via the flat connector of this utility model.

[0022] Figure 7 This is an exploded perspective view of the present invention;

[0023] Figure 8 This is a first perspective view of the first structure of this utility model;

[0024] Figure 9 This is a second perspective view of the first type of terminal of this utility model;

[0025] Figure 10 for Figure 9 Enlarged view of section A in the middle;

[0026] Figure 11 for Figure 9 Sectional view along the BB direction;

[0027] Figure 12 for Figure 11 Central C-section defense map;

[0028] Figure 13 This is a front view of the first structure of this utility model in the state of being welded to the circuit board;

[0029] Figure 14 for Figure 13 Enlarged view of section D;

[0030] Figure 15 This is a perspective view of the plastic shell of the first structure of this utility model;

[0031] Figure 16 for Figure 15 Enlarged view of section E in the middle;

[0032] Figure 17 This is a perspective view of the second type of terminal of this utility model;

[0033] Figure 18 for Figure 17 Enlarged view of section F in the middle;

[0034] Figure 19 for Figure 17 Central GG-direction sectional view;

[0035] Figure 20 for Figure 19 Central H-section defense map;

[0036] Figure 21 This is a front view of the second structure of this utility model in the state of being welded to the circuit board;

[0037] Figure 22 for Figure 21 Enlarged view of the middle section (I);

[0038] Figure 23 This is a perspective view of the plastic shell of the second structure of this utility model;

[0039] Figure 24 for Figure 23 Enlarged view of the middle J section. Detailed Implementation

[0040] Example: A solder anti-creep structure for a flat panel connector. The flat panel connector includes a plastic shell 2 and terminals 1. A plurality of terminal receiving slots 21 are arranged at intervals inside the plastic shell 2, and a plurality of terminals 1 can be accommodated in each terminal receiving slot 21. Each terminal 1 includes a retaining part 11, a soldering part 12, and an elastic support arm 13. The retaining part 11 can be fixedly connected to the terminal receiving slot 21. The soldering part 12 is located at the lower end of the retaining part 11, and a soldering surface is formed on the soldering part 12 on the outer side of the lower end of the plastic shell 2. The welding surface can be flatly attached to and welded to the PAD surface on the circuit board. The lower end of the elastic support arm 13 is fixedly connected to the welding part 12. The upper end of the elastic support arm 13 has a conductive contact part 131 for elastic contact conduction. The lower inner side wall of each terminal receiving groove 21 of the plastic shell 2 has a recessed flux 4 receiving groove 22. When the welding part 12 of the terminal 1 is welded to the PAD surface on the circuit board, the excess solder 3 and flux 4 generated can be contained in the flux 4 receiving groove 22.

[0041] A flux 4 receiving groove 22 is formed on the lower side wall of the terminal receiving groove 21 of the plastic shell 2 of the flat connector. During soldering, the molten flux 4 flows into the flux 4 receiving groove 22. After solidification, the flux 4 is solidified inside the flux 4 receiving groove 22. This greatly reduces the amount of flux 4 flowing into the surface of the elastic support arm 13 during soldering, thereby ensuring that the terminal 1 forms a stable closed-loop conduction structure when it is pressed down by the chip module. This ensures the stable transmission of signals by the terminal 1 inside the connector and ensures dual-channel high-frequency transmission.

[0042] The flux 4 receiving tank 22 is located on one side wall of the terminal receiving tank 21, which is close to the holding part 11 of the terminal 1. This can guide excess solder 3 and flux 4 to flow toward the holding part 11 of the terminal 1, and prevent them from flowing toward the elastic support arm 13.

[0043] The lower end of the terminal receiving groove 21 forms a stepped structure with an outward expansion. At least one protrusion 23 is provided on the stepped surface of the stepped structure, and the lower end face of the protrusion 23 is higher than the lower end face of the plastic shell 2. The flux 4 receiving groove 22 is the gap between the protrusion 23 and the inner sidewall of the lower end of the terminal receiving groove 21, as well as between adjacent protrusions 23, or a groove structure on the sidewall of the protrusion 23. By providing the protrusion 23, the lower end height of the flux 4 receiving groove 22 can be reduced, making it closer to the soldering surface, thereby fully absorbing excess solder 3 and flux 4.

[0044] The lower end of the plastic housing 2 has a recessed structure, and terminal receiving slots 21 are arranged at intervals on the bottom surface of the recessed structure. The recessed structure allows the PADs on the circuit board to enter, reducing the overall height of the connector after it is connected to the circuit board. At the same time, it allows the lower surface of the flat connector to lie flat against the surface of the circuit board to form a stable support.

[0045] The flux 4 receiving tank 22 is a through-hole groove 25 that runs vertically through the side wall of the plastic shell 2. The through-hole groove 25 forms a vertically continuous structure, which can act as a siphon for the flux 4. When the solder paste melts, the flux 4 can be sequentially absorbed into the through-hole groove 25. This effectively prevents the flux 4 from climbing up along the elastic support arm 13.

[0046] One side of the terminal receiving groove 21 has a terminal holding groove 24 with an upper width greater than the lower width. The holding part 11 of the terminal 1 has a T-shaped structure with an upper width greater than the lower width. The upper end of the holding part 11 of the terminal 1 has an outwardly protruding holding point 111 on its side along its width direction. The holding part 11 of the terminal 1 can be tightly inserted into the terminal holding groove 24, and the holding point 111 on the side of the holding part 11 of the terminal 1 can interfere with the side wall of the terminal holding groove 24. The stepped surface between the upper and lower ends of the holding part 11 of the terminal 1 stops on the stepped surface between the upper and lower ends of the terminal holding groove 24. The flux 4 receiving groove 22 is located on the side wall of the terminal holding groove 24 along the thickness direction of the holding part 11 of the terminal 1. As terminal 1 is inserted into terminal receiving groove 21, the retaining part 11 on terminal 1 is inserted into terminal retaining groove 24. When terminal 1 is inserted to a certain depth, the lower step surface of the retaining part 11 is blocked by the step surface of terminal retaining groove 24 and cannot be inserted further, thus limiting the insertion depth of terminal 1. At the same time, the retaining point 111 on the retaining part 11 of terminal 1 is embedded and fixedly connected to the side wall of terminal retaining groove 24 to form a fixed position. Since the soldering part 12 of terminal 1 is soldered to the circuit board, terminal 1 will not be pulled out upwards, thus achieving the fixed positioning of terminal 1 and plastic shell 2. The flux 4 receiving groove 22 is set on the side wall of terminal retaining groove 24, which can work together with the retaining part 11 of terminal 1 to guide the solder 3 and flux 4.

[0047] A siphon groove 112 is formed on the holding part 11 and the welding part 12 of the terminal 1, and the siphon groove 112 on the terminal 1 is directly connected to the flux 4 receiving groove 22 on the plastic shell 2. At the same time, when the tin is solidified, the solder 3 and flux 4 flow upward along the siphon groove 112 on the holding part 11 of the terminal 1, preventing them from flowing upward along the elastic support arm 13. At the same time, the siphon groove 112 can also increase the welding area and increase the welding force by containing the tin.

[0048] The siphon groove 112 on the terminal 1 is located at one end of the terminal 1 holding portion 11 at a height lower than the height of the conductive contact portion 131 at the upper end of the elastic support arm 13. Since the height of the siphon groove 112 is lower than the height of the conductive contact portion 131 at the upper end of the elastic support arm 13, no flux 4 will reach the surface of the conductive contact portion 131 at the upper end of the elastic support arm 13.

[0049] The siphon groove 112 on the terminal 1 forms an enlarged receiving cavity at one end of the terminal 1 holding portion 11. The enlarged structure at the upper end of the siphon groove 112 can block the downward flow of flux 4.

[0050] The holding part 11, the welding part 12, and the elastic support part of the terminal 1 are an integral structure formed by bending. The holding part 11 and the welding part 12 are connected by an outer arc bending edge, and the elastic support part and the welding part 12 are also connected by an outer arc bending edge. In this way, a gap is formed between the two sides of the welding part 12 of the terminal 1 and the PAD surface of the circuit board to accommodate the solder 3, ensuring the welding firmness.

Claims

1. A solder-resistant anti-climbing structure for a flat panel connector, the flat panel connector comprising a plastic shell (2) and terminals (1), wherein a plurality of terminal receiving slots (21) are spaced apart inside the plastic shell, and a plurality of terminals can be accommodated in each terminal receiving slot, the terminals comprising a retaining part (11), a soldering part (12) and an elastic support arm (13), the retaining part being fixedly connected to the terminal receiving slot, the soldering part being disposed at the lower end of the retaining part, and a soldering surface being formed on the soldering part located on the outer side of the lower end of the plastic shell, the soldering surface being able to be flatly attached to and soldered to the PAD surface on the circuit board, the lower end of the elastic support arm being fixedly connected to the soldering part, and a conductive contact part (131) for elastic contact conduction being formed at the upper end of the elastic support arm, characterized in that: The lower inner wall of each terminal receiving groove of the plastic shell has a recessed flux receiving groove (22), and the excess solder (3) and flux (4) generated when the welding part of the terminal is welded to the PAD surface on the circuit board can be contained in the flux receiving groove.

2. The anti-tin creep structure for flat panel connectors according to claim 1, characterized in that: The flux receiving groove is located on the side wall of the terminal receiving groove, which is close to the holding part of the terminal.

3. The anti-tin creep structure for flat panel connectors according to claim 1 or 2, characterized in that: The lower end of the terminal receiving groove forms a stepped structure with an outward expansion. At least one protrusion (23) is provided on the stepped surface of the stepped structure, and the lower end face of the protrusion is higher than the lower end face of the plastic shell. The flux receiving groove is the gap between the protrusion and the inner side wall of the lower end of the terminal receiving groove and the adjacent protrusion or the groove structure on the side wall of the protrusion.

4. The anti-tin creep structure for flat panel connectors according to claim 3, characterized in that: The lower end of the plastic shell has a recessed groove structure, and the terminal receiving slots are arranged at intervals on the bottom surface of the recessed groove structure.

5. The anti-tin creep structure for flat panel connectors according to claim 1 or 2, characterized in that: The flux receiving tank is a through-hole groove (25) that runs vertically along the side wall of the plastic shell.

6. The anti-tin creep structure for flat panel connectors according to claim 1, characterized in that: A terminal holding groove (24) with an upper width greater than a lower width is formed on one side of the terminal receiving groove. The terminal holding part is a T-shaped structure with an upper width greater than a lower width. A protruding holding point (111) is formed on the side of the upper end of the terminal holding part along its width direction. The terminal holding part can be tightly inserted into the terminal holding groove, and the holding point on the side of the terminal holding part can interfere with the side wall of the terminal holding groove. The step surface between the upper and lower ends of the terminal holding part stops on the step surface at the upper and lower ends of the terminal holding groove. The flux receiving groove is located on the side wall of the terminal holding groove along the thickness direction of the terminal holding part.

7. The anti-tin creep structure for flat panel connectors according to claim 1, characterized in that: A siphon groove (112) is formed on the holding part and the welding part of the terminal, and the siphon groove on the terminal is directly connected to the flux receiving groove on the plastic shell.

8. The anti-tin creep structure for flat panel connectors according to claim 7, characterized in that: The siphon groove on the terminal is located at one end of the terminal holding part at a height lower than the height of the conductive contact part at the upper end of the elastic support arm.

9. The anti-tin creep structure for flat panel connectors according to claim 7, characterized in that: The siphon groove on the terminal forms an enlarged receiving cavity at one end of the terminal holding part.

10. The anti-tin creep structure for flat panel connectors according to claim 1, characterized in that: The terminal's retaining part, welding part, and elastic support part are an integral structure formed by bending, and the retaining part and welding part are connected by an outer arc bending edge, and the elastic support part and welding part are also connected by an outer arc bending edge.

Images