Flat panel connector terminal desoldering structure

Abstract

This utility model discloses a solder removal structure for a flat connector terminal. The terminal includes a retaining part, a soldering part, an elastic contact arm, and an elastic support arm. The retaining part and the elastic support arm extend upward from both sides of the soldering part. A conductive contact surface is formed at the upper end of the elastic support arm. One end of the elastic contact arm is fixed to the upper end of the retaining part, and a lower contact point is formed at the other end. When the elastic contact arm is subjected to downward pressure, its lower contact point can tightly contact the conductive contact surface at the upper end of the elastic support arm to achieve closed-loop conduction of the terminal. A scraping structure is formed on the surface of the lower contact point of the elastic contact arm. When the scraping structure slides relative to the conductive contact surface, it can scrape the surface of the conductive contact surface, thereby removing the flux adhering to the conductive contact surface. This utility model ensures that the flat connector terminal can form stable dual-channel communication when pressed by the chip module, thereby ensuring the stability of the terminal signal transmission and ensuring the high-frequency transmission performance of the connector.

Description

Technical Field

[0001] This utility model relates to a connector terminal, and more particularly to a solder removal structure for a flat connector terminal. Background Technology

[0002] The chip module 10 and circuit board 20 are generally electrically connected through a flat connector 30 to achieve functional expansion. The conductive terminals of the flat connector are of a press-fit structure. The terminals include a retaining part, a soldering part, an elastic support arm, and an elastic contact arm. The soldering part of the terminal is located on the outer side of the lower end of the plastic shell. The lower side of the soldering part forms a horizontal soldering surface. The soldering surface of the soldering part is soldered onto the circuit board to achieve electrical connection between the terminal and the circuit board. On both sides of the soldering part are the retaining part and the elastic support arm extending upward, respectively. The retaining part of the terminal is used to fix and position the terminal within the plastic shell. The elastic contact arm is located at the upper end of the retaining part. An upper contact point protruding from the outer side of the upper end of the plastic shell is formed on the elastic contact arm. The elastic contact arm also has a lower contact point located within the plastic shell. When the upper contact point on the elastic contact arm is pressed down by the chip module, the lower contact point on the elastic contact arm tightly contacts the conductive contact part at the upper end of the elastic support arm. At this time, the terminal forms a closed loop, and a dual-channel signal transmission structure is formed between the chip module and the circuit board to improve the high-frequency performance of the flat connector.

[0003] During the SMT soldering process between the terminal and the circuit board, the solder paste is heated in a reflow oven to melt the tin metal. After the reflow oven cools down, the tin metal solidifies, thus soldering the terminal to the PAD surface of the circuit board. During the solder paste melting process, the main components of the solder paste are tin beads, flux (rosin), activators, etc. The active substances in the solder paste have good fluidity and may carry the dissolved flux to the conductive contact part at the upper end of the elastic support arm of the terminal. After the flux solidifies, it adheres to the surface of the conductive contact part, resulting in poor contact between the conductive contact part at the upper end of the elastic support arm of the terminal and the lower contact point of the elastic contact arm, which seriously affects the high-frequency performance of the connector during signal transmission. Utility Model Content

[0004] To overcome the above deficiencies, this utility model provides a solder removal structure for flat connector terminals. This structure can remove flux from the conductive contact surface at the upper end of the elastic support arm, thereby fully ensuring the signal transmission stability and high-frequency transmission performance of the flat connector.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a solder removal structure for a flat connector terminal. The terminal includes a holding part for fixing and positioning with a plastic shell, a welding part for welding with the surface of a circuit board, an elastic contact arm and an elastic support arm for contacting a chip module. The holding part and the elastic support arm extend upward from both sides of the welding part. A conductive contact surface is formed at the upper end of the elastic support arm. One end of the elastic contact arm is fixed to the upper end of the holding part, and a lower contact point is formed at the other end of the elastic contact arm. When the elastic contact arm is subjected to downward pressure, its lower contact point can make it tightly contact the conductive contact surface at the upper end of the elastic support arm to achieve closed-loop conduction of the terminal. A scraping structure is formed on the surface of the lower contact point of the elastic contact arm. When the scraping structure slides relative to the conductive contact surface, it can scrape the surface of the conductive contact surface, thereby removing the flux adhering to the conductive contact surface.

[0006] As a further improvement of this utility model, the scraping structure is a groove structure or a convex structure, and the lower contact point at the other end of the elastic contact arm is a convex arc bending surface that is bent downwards. The groove structure and the convex structure extend along the extension direction of the other end of the elastic contact arm, and the groove structure and the convex structure cross the convex arc bending surface that serves as the lower contact point.

[0007] As a further improvement of this utility model, the conductive contact surface at the upper end of the elastic support arm is an uneven, rough contact surface.

[0008] As a further improvement of this utility model, the conductive contact surface at the upper end of the elastic support arm is formed into a rough contact surface by setting a number of grooves or pitted structures.

[0009] As a further improvement of this utility model, several undulating tooth-like structures are formed on both sides of the elastic support arm.

[0010] As a further improvement of this utility model, the holding part and the elastic support arm are bent upward from both sides of the welding part to form an outer arc bending surface, and a solder-accommodating gap is formed between the outer arc bending surface and the circuit board, so that the solder paste during welding can be accommodated in the solder-accommodating gap.

[0011] As a further improvement of this utility model, the holding part of the terminal extends in the vertical direction, the elastic support arm extends obliquely in a direction that has an angle with the vertical direction, and the elastic support arm gradually moves away from the holding part from bottom to top. The conductive contact surface at the upper end of the elastic support arm is a bent edge with an angle with the vertical direction greater than the angle between the elastic support arm and the vertical direction.

[0012] As a further improvement of this utility model, the width of the conductive contact surface is greater than the width of the elastic support arm.

[0013] As a further improvement of this utility model, the other end of the elastic contact arm is also provided with an upper contact point, and a slotted structure is formed on the upper contact point.

[0014] As a further improvement of this utility model, the upper contact point at the other end of the elastic contact arm is an upwardly convex arc bending surface formed by bending.

[0015] The beneficial technical effects of this utility model are as follows: By providing a groove structure or a bump structure on the lower contact point of the elastic contact arm of the terminal, when the upper contact point on the elastic contact arm of the terminal is subjected to the downward pressure of the chip module, the elastic contact arm deforms elastically, causing the lower contact point on it to gradually contact the conductive contact surface on the elastic support arm, and slide along the conductive contact surface for a certain distance before stopping. When the lower contact point of the elastic contact arm slides relative to the conductive contact surface on the elastic support arm, the groove structure or bump structure on the lower contact point can weld the soldering part of the terminal to the circuit board. The flux that climbs onto the conductive contact surface of the elastic support arm during connection is scraped off, ensuring stable conduction between the lower contact point of the elastic contact arm and the conductive contact surface of the elastic support arm during use. This prevents flux from covering the conductive contact surface due to solder creep during connector soldering, which could cause poor contact between the elastic support arm and the elastic contact arm. This ensures that after the flat panel connector is soldered onto the circuit board, it can form a stable dual-channel communication when pressed and connected to the chip module, thus guaranteeing the stability of terminal signal transmission and ensuring the high-frequency transmission performance of the connector. Attached Figure Description

[0016] Figure 1 A 3D view showing the electrical connection between chip modules and circuit boards via a flat panel connector;

[0017] Figure 2 An exploded 3D view showing the electrical connection between the chip module and the circuit board via a flat panel connector;

[0018] Figure 3 An exploded front view showing the electrical connection between the chip module and the circuit board via a flat panel connector;

[0019] Figure 4 A 3D view of an existing flat panel connector;

[0020] Figure 5 A three-dimensional view of the terminals of an existing flat panel connector;

[0021] Figure 6 Main view of the chip module's position status when it begins to contact the existing flat panel connector;

[0022] Figure 7 This is a front view of the terminal status when the chip module begins to contact the upper contact point of an existing terminal.

[0023] Figure 8 Main view showing the positional status of the chip module when it is pressed against the existing flat panel connector;

[0024] Figure 9 A front view of the terminal state when the chip module is pressed against the upper contact point of the existing terminal;

[0025] Figure 10 This is a first perspective view of the first type of terminal of this utility model;

[0026] Figure 11 This is a second perspective view of the first type of terminal of this utility model;

[0027] Figure 12 This is a third perspective view of the first type of terminal of this utility model;

[0028] Figure 13 This is a perspective view of the first type of terminal and circuit board welding state of this utility model;

[0029] Figure 14 This is a first perspective view of the second type of terminal of this utility model;

[0030] Figure 15 This is a second perspective view of the second type of terminal of this utility model;

[0031] Figure 16 This is a third perspective view of the second type of terminal of this utility model. Detailed Implementation

[0032] Example: A solder removal structure for a flat connector terminal. Terminal 1 includes a holding part 11 for fixing and positioning with a plastic shell 2, a soldering part 12 for soldering to the surface of a circuit board 20, an elastic contact arm 14 for contacting a chip module, and an elastic support arm 13. The holding part 11 and the elastic support arm 13 extend upward from both sides of the soldering part 12. A conductive contact surface 131 is formed at the upper end of the elastic support arm 13. One end of the elastic contact arm 14 is fixed to the upper end of the holding part 11, and the other end of the elastic contact arm 14 forms a lower contact point 142. When the elastic contact arm 14 is subjected to downward pressure, its lower contact point 142 can tightly contact the conductive contact surface 131 at the upper end of the elastic support arm 13 to achieve closed-loop conduction of terminal 1. A scraping structure is formed on the surface of the lower contact point 142 of the elastic contact arm 14. When the scraping structure slides relative to the conductive contact surface 131, it can scrape the surface of the conductive contact surface 131, thereby removing the flux stuck to the conductive contact surface 131.

[0033] When the terminal 1 of the flat panel connector is soldered on the circuit board 20, excess solder and flux will climb up the retaining part 11 and the elastic support arm 13. If the flux climbs onto the conductive contact surface 131 at the upper end of the elastic support arm 13, it will solidify on the conductive contact surface 131 after cooling and adhere to the conductive contact surface 131 of the elastic support arm 13. A groove structure or a bump structure is provided on the lower contact point 142 of the elastic contact arm 14 of the flat panel connector terminal 1. When the upper contact point on the elastic contact arm 14 of the terminal 1 is subjected to the downward pressure of the chip module, the elastic contact arm 14 elastically deforms, causing the lower contact point 142 on it to gradually contact the conductive contact surface 131 on the elastic support arm 13, slide along the conductive contact surface 131 for a certain distance and then stop. When the lower contact point 142 of terminal 1 slides relative to the conductive contact surface 131 on the elastic support arm 13, the groove structure or protrusion structure on the lower contact point 142 can scrape off the flux that climbs onto the conductive contact surface 131 on the elastic support arm 13 when the soldering part 12 of terminal 1 is soldered to the circuit board 20. This allows the conductive contact surface 131 at the upper end of the elastic support arm 13 to maintain an effective conductive connection with the lower contact point 142 at the other end of the elastic contact arm 14. At this time, terminal 1 forms a conductive closed-loop structure, and the chip module and circuit board 20 transmit signals through dual channels. This invention ensures that terminal 1 forms a stable closed-loop conductive structure when it is pressed down by the chip module, ensuring stable signal transmission of terminal 1 in the connector and ensuring high-frequency transmission through dual channels.

[0034] The scraping structure is a groove structure or a convex structure. The lower contact point 142 at the other end of the elastic contact arm 14 is a convex arc bending surface that is bent downwards. The groove structure and the convex structure extend along the extension direction of the other end of the elastic contact arm 14, and the groove structure and the convex structure cross the convex arc bending surface that serves as the lower contact point 142. The lower contact point 142 is bent to form a convex arc bend surface that contacts the conductive contact surface 131. This avoids the two getting stuck together during contact and ensures that the lower contact point 142 can slide smoothly relative to the conductive contact surface 131. The extension directions of the groove structure and the convex point structure are perpendicular to the convex arc bend surface, so that the lower contact point 142 scrapes the flux adhering to the conductive contact surface 131 when it first contacts the conductive contact surface 131. Furthermore, during the elastic deformation of the elastic contact arm 14, when the elastic contact arm 14, as a different part of the convex arc bend surface of the lower contact point 142, contacts the conductive contact surface 131, it also ensures that the groove structure and the convex point structure continuously scrape the conductive contact surface 131. This effectively improves the contact performance between the lower contact point 142 of the elastic contact arm 14 and the conductive contact surface 131 of the elastic support arm 13.

[0035] The conductive contact surface 131 at the upper end of the elastic support arm 13 is an uneven, rough contact surface. This roughness increases the scraping performance when it comes into contact with the lower contact point 142, removing surface flux and improving contact performance.

[0036] The surface of the conductive contact surface 131 at the upper end of the elastic support arm 13 is roughened by setting a number of grooves 1311 or pitted structures.

[0037] The elastic support arm 13 has several undulating tooth-like structures 132 formed on both sides. When flux flows through this area, the tooth-like structures 132 can block and contain it, preventing the flux from continuing to flow upward.

[0038] The retaining part 11 and the elastic support arm 13 are bent upwards from both sides of the welding part 12 to form outer arc bending surfaces 121. A solder-accommodating gap is formed between the outer arc bending surface 121 and the circuit board 20, allowing the solder paste to be contained within the gap. This creates a gap between the welding part 12 of the terminal 1 and the PAD surface of the circuit board 20, ensuring a strong solder joint.

[0039] The retaining portion 11 of terminal 1 extends vertically, and the elastic support arm 13 extends obliquely along a direction that forms an angle with the vertical direction. The elastic support arm 13 gradually moves away from the retaining portion 11 from bottom to top. The conductive contact surface 131 at the upper end of the elastic support arm 13 is a bent edge with an angle greater than the angle between the elastic support arm 13 and the vertical direction. The retaining portion 11 of terminal 1 uses a vertically extending bent edge, which ensures that terminal 1 is fixed within the plastic housing 2. The non-obliquely extending upward structure of the elastic support arm 13 ensures that its upper conductive contact surface 131 can deform smoothly under pressure. Furthermore, the slope of the conductive contact surface 131 is gentler than that of the elastic support arm 13, ensuring stable contact with the lower contact point 142 of the elastic contact arm 14. Simultaneously, due to the greater slope of the elastic support arm 13, it is less conducive to flux climbing.

[0040] The width of the conductive contact surface 131 is greater than the width of the elastic support arm 13. This increases the contact area between the lower contact point 142 of the elastic contact arm 14 and the conductive contact surface 131 at the upper end of the elastic support arm 13, reducing the influence of flux on contact conductivity.

[0041] The other end of the elastic contact arm 14 is also provided with an upper contact point, on which a slotted structure 1411 is formed. This increases the scratching effect of contact with the chip module and improves contact performance.

[0042] The upper contact point at the other end of the elastic contact arm 14 is an upwardly convex arc-shaped bent surface formed by bending. The elastic contact arm 14 contacts the chip module through the convex arc-shaped bent surface, which can prevent the elastic contact arm 14 from getting stuck when it is deformed under pressure.

Claims

1. A desoldering structure for a flat connector terminal, the terminal (1) comprising a retaining part (11) for fixing and positioning with a plastic shell (2), a welding part (12) for welding with the surface of a circuit board (20), an elastic contact arm (14) for contacting a chip module, and an elastic support arm (13), the retaining part and the elastic support arm extending upward from both sides of the welding part, the upper end of the elastic support arm forming a conductive contact surface (131), one end of the elastic contact arm being fixed to the upper end of the retaining part, and the other end of the elastic contact arm forming a lower contact point (142), the elastic contact arm being subjected to downward pressure so that its lower contact point can tightly contact the conductive contact surface at the upper end of the elastic support arm to achieve closed-loop conduction of the terminal, characterized in that: The lower contact point surface of the elastic contact arm has a scraping structure. When the scraping structure slides relative to the conductive contact surface, it can scrape the surface of the conductive contact surface, thereby removing the flux stuck to the conductive contact surface.

2. The flat cable connector terminal de-tinning structure according to claim 1, characterized by: The scraping structure is a groove structure or a convex structure. The lower contact point at the other end of the elastic contact arm is a convex arc bending surface that is bent downwards. The groove structure and the convex structure extend along the extension direction of the other end of the elastic contact arm, and the groove structure and the convex structure cross the convex arc bending surface that serves as the lower contact point.

3. The flat cable connector terminal de-tinning structure according to claim 1 or 2, characterized by: The conductive contact surface at the upper end of the elastic support arm is an uneven, rough contact surface.

4. The planar connector terminal de-tinning structure according to claim 3, characterized by: The conductive contact surface at the upper end of the elastic support arm is roughened by setting several grooves (1311) or pitted structures.

5. The planar connector terminal de-tinning structure of claim 1, wherein: The elastic support arm has several undulating tooth-like structures (132) formed on both sides.

6. The planar connector terminal de-tinning structure of claim 1, wherein: The retaining part and the elastic support arm are bent upward from both sides of the welding part to form an outer arc bending surface (121). The outer arc bending surface and the circuit board form a solder-accommodating gap, and the solder paste during welding can be accommodated in the solder-accommodating gap.

7. The planar connector terminal de-tinning structure of claim 3, wherein: The holding portion of the terminal extends vertically, and the elastic support arm extends obliquely along a direction that forms an angle with the vertical direction. The elastic support arm gradually moves away from the holding portion from bottom to top, and the conductive contact surface at the upper end of the elastic support arm is a bent edge with an angle with the vertical direction greater than the angle between the elastic support arm and the vertical direction.

8. The flat cable connector terminal de-tinning structure according to claim 1 or 7, characterized by: The width of the conductive contact surface is greater than the width of the elastic support arm.

9. The planar connector terminal de-tinning structure of claim 1, wherein: The other end of the elastic contact arm is also provided with an upper contact point, on which a slotted structure (1411) is formed.

10. The planar connector terminal de-tinning structure of claim 1, wherein: The upper contact point at the other end of the elastic contact arm is an upwardly convex arc bending surface formed by bending.

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