A high impedance probe interface device with static electricity protection
By employing a multi-layered protective structure and dustproof design in the probe interface device, the problem of electrostatic damage to sensitive circuits is solved, achieving efficient electrostatic protection and stable signal transmission.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ANJIENENG TECH CO LTD
- Filing Date
- 2025-09-01
- Publication Date
- 2026-07-31
AI Technical Summary
Existing probe interface devices lack anti-static protection mechanisms, which can cause electrostatic discharge to interfere with signals and damage components in sensitive circuits.
It adopts a double-layer stainless steel shell, a nickel-plated high-impedance interface, and internal metal reinforcement layer, silver-plated copper foil PTFE composite layer, modified polyether ether ketone composite layer and copper foil shielding layer. Combined with conductive silicone sealing ring, it forms a multi-layer protection structure to ensure unobstructed electrostatic discharge path and prevent dust from entering through dustproof components.
It significantly improves anti-static capability, prevents damage to sensitive circuits by electrostatic discharge, and maintains signal integrity and transmission stability, thereby improving the long-term reliability of the device.
Smart Images
Figure CN224582636U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of probe interface technology, specifically to a high-impedance probe interface device with anti-static protection. Background Technology
[0002] Probe interface devices are intermediate components connecting probes and test equipment. Their core functions include signal transmission adaptation and system impedance matching. As a critical component connecting probes to other devices, their design directly affects the accuracy and stability of signal transmission. Probe interface devices are widely used in electronic testing, industrial non-destructive testing, energy monitoring, medical equipment, and semiconductor testing. However, current probe interface devices still have the following shortcomings:
[0003] For example, patent document CN222052253U discloses an ultrasonic flaw detector probe interface conversion device. This ultrasonic flaw detector probe interface conversion device, by installing a winding roller and a cable collection shell, allows for easy control of the motor's movement via the display screen and operation buttons on the control box. This, in turn, drives the winding roller to rotate inside the cable collection shell, thereby achieving automatic winding of the connecting wires. This enables the device to perform automatic wire winding and facilitates the arrangement of the wire structure. However, it lacks an anti-static protection mechanism, failing to effectively suppress electrostatic discharge damage to sensitive circuits, potentially leading to signal interference, common-mode errors, or even device damage. Utility Model Content
[0004] The purpose of this invention is to provide a high-impedance probe interface device with anti-static protection to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-impedance probe interface device with anti-static protection, comprising a high-impedance interface and a protective component. The high-impedance interface is an integrated structure, and an external wiring is connected to the bottom of the high-impedance interface. The outer shell of the high-impedance interface is made of double-layer stainless steel, and the surface of the high-impedance interface shell is nickel-plated. The protective component is disposed inside the high-impedance interface, and the protective component includes a metal reinforcement layer, a silver-plated copper foil PTFE composite layer, a modified polyether ether ketone composite layer, a copper foil shielding layer, and a conductive silicone sealing ring. The metal reinforcement layer is disposed on the inner surface of the high-impedance interface shell, and a silver-plated copper foil PTFE composite layer is disposed on the inner surface of the metal reinforcement layer. The modified polyether ether ketone composite layer is connected to the inner surface of the silver-plated copper foil PTFE composite layer.
[0006] Furthermore, the modified polyether ether ketone composite layer is an integrated structure, and a copper foil shielding layer is provided on the inner surface of the modified polyether ether ketone composite layer.
[0007] Furthermore, a conductive silicone sealing ring is provided on the upper inner side of the high-impedance interface, and the conductive silicone sealing ring is an integrated flexible structure.
[0008] Furthermore, the high-impedance interface and the external wiring are a tightly connected integrated structure, and the high-impedance interface is equipped with a dustproof component for interface dust protection.
[0009] Furthermore, the dustproof component includes a fixed base plate, a fixed snap-fit groove, a fixed snap-fit plate, a connecting plate, and a dustproof cover, with the fixed base plate disposed on the upper ends of both sides of the high-impedance interface.
[0010] Furthermore, a fixing slot is provided on the outer end of the upper surface of the fixing base plate, and a fixing plate is engaged and connected to the inner side of the fixing slot.
[0011] Furthermore, both the inner sides of the fixing clip plate and the fixing clip groove are made of magnetic material, and a connecting plate is installed on the upper surface of the fixing clip plate.
[0012] Furthermore, a dust cover is installed on the inner surface of the connecting plate, and the dust cover and the connecting plate are an integrated structure that is tightly connected.
[0013] This utility model provides a high-impedance probe interface device with anti-static protection, which has the following advantages:
[0014] 1. This utility model incorporates a protective component, comprising a metal reinforcement layer, a silver-plated copper foil PTFE composite layer, a modified polyetheretherketone composite layer, a copper foil shielding layer, and a conductive silicone sealing ring. During use, the metal reinforcement layer strengthens the overall casing of the high-impedance interface, improving its overall compressive strength and reducing damage. The silver-plated copper foil PTFE composite layer provides a low-resistance path for rapid static discharge, while the PTFE layer ensures insulation and reduces environmental interference. The modified polyetheretherketone composite layer forms a conductive channel through moisture absorption, providing long-term stable static dissipation and high-temperature resistance. The copper foil shielding layer achieves equipotential bonding, eliminating potential difference risks and shielding against electromagnetic interference. The conductive silicone sealing ring at the interface connection ensures a smooth static discharge path at the contact point. Thus, this device significantly enhances its anti-static capability through its multi-layered protective structure, effectively preventing damage to sensitive circuits from electrostatic discharge while maintaining signal integrity.
[0015] 2. This utility model incorporates a dustproof component, which includes a fixed base plate, a fixed snap-fit groove, a fixed snap-fit plate, a connecting plate, and a dust cover. In use, the dust cover engages with the outer side of the high-impedance interface, covering it. Simultaneously, the fixed snap-fit plate engages with the inner side of the fixed snap-fit groove, fixing the connecting plate to the fixed base plate. The magnetic structure of the connecting plate and the fixed base plate enables a quick and stable connection. The dust cover effectively prevents dust from entering the high-impedance interface, significantly improving the long-term reliability of the interface while maintaining signal transmission stability. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of a high-impedance probe interface device with anti-static protection according to the present invention;
[0017] Figure 2 This is a three-dimensional structural diagram of the protective component of a high-impedance probe interface device with anti-static protection according to the present invention;
[0018] Figure 3 This is a three-dimensional structural diagram of the dustproof component of a high-impedance probe interface device with anti-static protection according to this utility model.
[0019] In the diagram: 1. High-impedance interface; 2. External wiring; 3. Protective components; 301. Metal reinforcement layer; 302. Silver-plated copper foil PTFE composite layer; 303. Modified polyetheretherketone composite layer; 304. Copper foil shielding layer; 305. Conductive silicone sealing ring; 4. Dustproof components; 401. Fixing base plate; 402. Fixing slot; 403. Fixing plate; 404. Connecting plate; 405. Dust cover. Detailed Implementation
[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.
[0021] like Figures 1 to 3As shown, a high-impedance probe interface device with electrostatic discharge protection includes a high-impedance interface 1 and a protective component 3. The high-impedance interface 1 is an integrated structure, and an external wiring 2 is connected to the bottom of the high-impedance interface 1. The outer shell of the high-impedance interface 1 is made of double-layer stainless steel, and the surface of the outer shell of the high-impedance interface 1 is nickel-plated. The protective component 3 is disposed inside the high-impedance interface 1, and the protective component 3 includes a metal reinforcement layer 301, a silver-plated copper foil PTFE composite layer 302, a modified polyetheretherketone composite layer 303, a copper foil shielding layer 304, and a conductive silicone sealing ring 30. 5. A metal reinforcement layer 301 is disposed on the inner surface of the high impedance interface 1 housing, and a silver-plated copper foil PTFE composite layer 302 is disposed on the inner surface of the metal reinforcement layer 301. A modified polyether ether ketone composite layer 303 is connected to the inner surface of the silver-plated copper foil PTFE composite layer 302. The modified polyether ether ketone composite layer 303 is an integrated structure, and a copper foil shielding layer 304 is disposed on the inner surface of the modified polyether ether ketone composite layer 303. A conductive silicone sealing ring 305 is disposed at the upper inner end of the high impedance interface 1, and the conductive silicone sealing ring 305 is an integrated flexible structure.
[0022] The specific operation is as follows: During use, the outer shell of the high-impedance interface 1 is reinforced by the metal reinforcement layer 301 to improve the overall pressure resistance of the high-impedance interface 1 and make it less prone to damage. The silver-plated copper foil PTFE composite layer 302 provides a low-resistance path for rapid static discharge through the silver-plated copper foil, while the PTFE layer ensures insulation and reduces environmental interference. The modified polyether ether ketone composite layer 303 forms a conductive channel by absorbing moisture, which can stably dissipate static electricity and withstand high temperatures in the long term. The copper foil shielding layer 304 achieves equipotential connection, eliminates the risk of potential difference, and shields electromagnetic interference. The interface connection uses a conductive silicone sealing ring 305 to ensure a smooth static discharge path at the contact point.
[0023] Please refer to Figure 3 The high-impedance interface 1 and the external wiring 2 are a tightly connected integrated structure. The high-impedance interface 1 is equipped with a dustproof component 4 for interface dust protection. The dustproof component 4 includes a fixed base plate 401, a fixed snap-fit groove 402, a fixed snap-fit plate 403, a connecting plate 404, and a dust cover 405. The fixed base plate 401 is located on the upper ends of both sides of the high-impedance interface 1. The fixed snap-fit groove 402 is opened at the outer end of the upper surface of the fixed base plate 401. The fixed snap-fit plate 403 is snapped into the inner side of the fixed snap-fit groove 402. The inner sides of the fixed snap-fit plate 403 and the fixed snap-fit groove 402 are both made of magnetic material. The connecting plate 404 is installed on the upper surface of the fixed snap-fit plate 403. The dust cover 405 is installed on the inner surface of the connecting plate 404. The dust cover 405 and the connecting plate 404 are a tightly connected integrated structure.
[0024] The specific operation is as follows: When in use, the dust cover 405 is connected to the outside of the high impedance interface 1 by snapping it together, so that the dust cover 405 covers the outside of the high impedance interface 1. At the same time, the connecting plate 404 is fixed to the fixed base plate 401 by snapping it together with the inside of the fixed slot 402. The magnetic structure of the connecting plate 404 and the fixed base plate 401 can realize the quick and stable connection between the connecting plate 404 and the fixed base plate 401. The dust cover 405 can protect the interface of the high impedance interface 1 from dust.
[0025] In summary, as Figures 1 to 3 As shown, this anti-static protected high-impedance probe interface device, in use, firstly, reinforces the shell of the high-impedance interface 1 with a metal reinforcing layer 301, improving the overall compressive strength of the high-impedance interface 1 and making it less prone to damage. The silver-plated copper foil PTFE composite layer 302 provides a low-resistance path for rapid static discharge through the silver-plated copper foil, while the PTFE layer ensures insulation and reduces environmental interference. The modified polyetheretherketone composite layer 303 forms a conductive channel through moisture absorption, stably dissipating static electricity and resisting high temperatures over a long period of time. The copper foil shielding layer 304 achieves equipotential bonding, eliminating the risk of potential difference, and simultaneously shielding... To prevent electromagnetic interference, a conductive silicone sealing ring 305 is used at the interface connection to ensure a smooth path for static discharge at the contact point. The dust cover 405 is connected to the outside of the high-impedance interface 1 by a snap-fit connection, covering the outside of the high-impedance interface 1. At the same time, the connecting plate 404 is fixed to the fixed base plate 401 by a snap-fit connection between the fixed snap-fit plate 403 and the inside of the fixed snap-fit groove 402. The magnetic structure of the connecting plate 404 and the fixed base plate 401 enables a quick and stable connection between the connecting plate 404 and the fixed base plate 401. The dust cover 405 can prevent dust from entering the interface of the high-impedance interface 1.
[0026] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.
Claims
1. A high impedance probe interface device for static protection comprising a high impedance interface (1) and a protection assembly (3), characterized in that: The high-impedance interface (1) is an integrated structure, and an external wiring (2) is connected to the bottom of the high-impedance interface (1). The outer shell of the high-impedance interface (1) is made of double-layer stainless steel, and the surface of the outer shell of the high-impedance interface (1) is nickel-plated. The protective component (3) is located inside the high-impedance interface (1), and the protective component (3) includes a metal reinforcement layer (301), a silver-plated copper foil PTFE composite layer (302), a modified polyether ether ketone composite layer (303), a copper foil shielding layer (304), and a conductive silicone sealing ring (305). The metal reinforcement layer (301) is located on the inner surface of the outer shell of the high-impedance interface (1), and a silver-plated copper foil PTFE composite layer (302) is located on the inner surface of the metal reinforcement layer (301). A modified polyether ether ketone composite layer (303) is connected to the inner surface of the silver-plated copper foil PTFE composite layer (302).
2. A high impedance probe interface device for static protection according to claim 1, wherein, The modified polyether ether ketone composite layer (303) is an integrated structure, and a copper foil shielding layer (304) is provided on the inner surface of the modified polyether ether ketone composite layer (303).
3. A high impedance probe head interface device for static protection according to claim 1, wherein, The high-impedance interface (1) is provided with a conductive silicone sealing ring (305) on the upper inner side, and the conductive silicone sealing ring (305) is an integrated flexible structure.
4. A high impedance probe head interface device for static protection according to claim 1, wherein, The high-impedance interface (1) and the external wiring (2) are a tightly connected integrated structure, and the high-impedance interface (1) is provided with a dustproof component (4) for interface dust prevention.
5. A high impedance probe head interface device for static protection according to claim 4, wherein, The dustproof component (4) includes a fixed base plate (401), a fixed snap-fit groove (402), a fixed snap-fit plate (403), a connecting plate (404), and a dustproof cover (405), with the fixed base plate (401) located on the upper ends of both sides of the high impedance interface (1).
6. A high impedance probe head interface device protected against static electricity according to claim 5, characterized in that The upper surface of the fixed base plate (401) is provided with a fixed snap-fit groove (402) at the outer end, and a fixed snap-fit plate (403) is snap-fitted to the inner side of the fixed snap-fit groove (402).
7. A high impedance probe head interface device protected against static electricity according to claim 6, characterized in that The inner sides of the fixed card plate (403) and the fixed card slot (402) are both made of magnetic material, and a connecting plate (404) is installed on the upper surface of the fixed card plate (403).
8. A high impedance probe head interface device protected against static electricity according to claim 7, characterized in that A dust cover (405) is installed on the inner surface of the connecting plate (404), and the dust cover (405) and the connecting plate (404) are an integrated structure that is tightly connected.