An automatic secondary insertion and removal device for memory modules

Abstract

This invention provides an automatic secondary insertion and removal device for memory modules, including a base with a base plate on it. A sliding cylinder is mounted on the base plate, and a pressure sensor and a pressure plate are sequentially connected to the output end of the sliding cylinder. This invention utilizes a secondary insertion and removal design. The first insertion / removal establishes initial contact between the memory module and the slot. The second insertion / removal effectively removes the oxide film on the surface of the memory module's gold fingers through deep friction, solving the problem of poor contact caused by the oxide film. The sliding cylinder precisely controls the downward pressure, and a stepper motor, in conjunction with an angle sensor, accurately adjusts the tightness angle of the latches. A pressure buffer provides overpressure protection, preventing problems such as gold finger deformation and motherboard slot damage caused by inconsistent force and angle during manual operation. Simultaneously, it significantly shortens the insertion and removal time of a single memory module, improving the overall efficiency of the server production line and reducing labor costs and the risk of component damage.

Description

Technical Field

[0001] This utility model relates to a memory module insertion and removal device, and in particular to an automatic secondary insertion and removal device for memory modules, belonging to the field of terminal technology. Background Technology

[0002] In server manufacturing, memory modules are core components, and the reliability of their contact with the motherboard slot directly affects the server's operational stability. The metal strip beneath the memory module is prone to oxide film formation due to storage environment or oxidation, leading to poor contact and affecting memory data retrieval. Traditional manual insertion and removal methods are difficult to precisely control the force and number of insertions, and cannot effectively remove the oxide film, resulting in low efficiency. Therefore, developing a tooling system capable of automatic secondary insertion and removal and targeted oxide film removal is of great significance for improving server manufacturing quality and efficiency. In server production lines, memory module installation is a critical process, directly impacting server performance and stability. Currently, memory module insertion and removal suffer from several issues: Oxide film affects contact performance. The gold fingers of memory modules are made of gold-plated copper alloy strips, which are prone to oxide film formation during long-term storage or exposure to air. This oxide film increases contact resistance, leading to unstable memory signal transmission and even system crashes or blue screens. Manual insertion and removal involves random insertion and removal attempts and force, making it difficult to ensure effective oxide film removal. Traditional manual memory module insertion and removal requires alignment, pressing, and locking, with each operation taking approximately 15-20 seconds. When multiple memory modules need to be installed on a server motherboard, this prolonged time significantly impacts production schedules. Furthermore, manual operation involves varying insertion and removal force and angles. Excessive force can deform the gold fingers and damage the motherboard slot; angular deviations can cause the memory module to tilt, resulting in wear on the gold fingers. When inserting or removing memory modules, uncontrolled ejection can easily collide with delicate components such as capacitors and resistors on the motherboard, causing damage. Most existing automatic memory insertion and removal devices on the market only perform single-step insertion and removal, lacking a secondary insertion / removal mechanism to address oxide film issues, thus failing to completely resolve poor contact problems. Some devices have low pressure control precision and coarse rotation angle control, leading to inadequate or excessive locking of the latches, still posing a risk of damage. Different specifications and lengths of memory modules require different insertion / removal force and latch operation angles; existing devices mostly use fixed parameters, making them difficult to adapt flexibly and lacking versatility. Therefore, there is an urgent need for a tooling that can automatically perform secondary insertion and removal, precisely control pressure and angle, effectively remove oxide film, and be compatible with various memory modules, in order to solve the above problems. Summary of the Invention

[0003] In view of this, the present invention provides an automatic secondary insertion and removal device for memory modules to solve or alleviate the technical problems existing in the prior art, and at least provides a beneficial option.

[0004] The technical solution of this utility model is implemented as follows: An automatic secondary insertion and removal device for memory modules includes a base, a base plate on the base, a sliding cylinder mounted on the base plate, a pressure sensor and a pressure plate connected sequentially to the output end of the sliding cylinder, and a pressure head fixedly connected to the side of the pressure plate away from the pressure sensor; a sliding guide rail is provided on the base plate, a connecting plate is slidably connected to the sliding guide rail, a vertical plate and a stepper motor are fixedly connected to the connecting plate, a fixed plate is fixedly connected to the vertical plate, the output end of the stepper motor passes through the fixed plate and is fixedly connected to a lever, and a baffle is provided on the lever; an angle sensor is provided on the fixed plate corresponding to the baffle; a pressure buffer is installed on the side of the base plate opposite to the sliding cylinder, and the output end of the pressure buffer is fixedly connected to the connecting plate.

[0005] More preferably, the slide cylinder is vertically mounted on the base plate, and its output axis is perpendicular to the table surface of the base plate, used to drive the pressure head to move up and down in the vertical direction to realize the insertion and removal of memory modules.

[0006] More preferably, the upper end face of the pressure sensor is fixedly connected to the output end of the slide cylinder, and the lower end face is fixedly connected to the pressure plate, for real-time detection of the downward pressure of the slide cylinder driving the pressure head.

[0007] More preferably, the bottom of the pressure head is provided with a double-convex structure that is adapted to both ends of the memory module. The double-convex structure is used to simulate a manual pressing action and act on the upper ends of the memory module.

[0008] More preferably, the bottom of the end of the lever away from the stepper motor is provided with an inclined wave groove, the inclination angle of the inclined wave groove is adapted to the inclination angle of the memory module slot latch, and the wave groove is used to increase the friction with the latch.

[0009] More preferably, the angle sensor is a photoelectric sensor, with its detection end positioned corresponding to the baffle, used to obtain the rotation angle of the lever by detecting the rotation angle of the baffle.

[0010] More preferably, the pressure damper and the slide cylinder are located on opposite sides of the base plate, and the pressure damper is used to drive the connecting plate to slide along the sliding guide rail and provide cushioning.

[0011] More preferably, the levers are symmetrically distributed on both sides of the pressure head and correspond one-to-one with the latching positions of the memory module slots; the slide cylinder, pressure sensor, angle sensor, stepper motor and pressure buffer are electrically connected and coordinated for control to complete the secondary insertion and removal of the memory module.

[0012] The present invention has the following advantages due to the adoption of the above technical solution: I. This utility model uses a two-stage insertion and removal design. The first insertion and removal establishes initial contact between the memory module and the slot. The second insertion and removal effectively removes the oxide film on the surface of the memory module's gold fingers through deep friction, solving the problem of poor contact caused by the oxide film. This reduces the occurrence of malfunctions such as system crashes and blue screens during server operation and significantly improves the contact reliability between the memory module and the motherboard slot.

[0013] II. This utility model realizes the automation of memory module insertion and removal. The slide cylinder precisely controls the downward pressure, the stepper motor and angle sensor accurately adjust the tightness of the latch, and the pressure buffer provides overpressure protection, avoiding problems such as gold finger deformation and motherboard slot damage caused by inconsistent force and angle during manual operation. At the same time, it significantly shortens the insertion and removal time of a single memory module, improves the overall efficiency of the server production line, and reduces labor costs and the risk of component damage.

[0014] Third, this utility model has strong compatibility. By replacing the pressure head with different specifications, it can be adapted to memory modules of various lengths and widths. Moreover, the pressure parameters, rotation angle, etc. can be flexibly adjusted according to the needs of different memory module models. It is suitable for large-scale, multi-model server production scenarios and has wide applicability.

[0015] Fourth, the present invention has a compact structure and high precision in the coordination of each component: the double convex structure of the pressure head simulates the manual pressing action, the inclined wave groove of the lever enhances the friction with the buckle, and the angle sensor and pressure sensor provide real-time feedback of parameters to ensure that the secondary insertion and removal action is stable and controllable, thereby improving the stability of equipment operation and the safety of operation.

[0016] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural diagram of the present invention.

[0018] Figure 2 This is a structural diagram of the pressure buffer and connecting plate in this utility model.

[0019] in: 10-Base; 11-Base plate; 12-Slide cylinder; 13-Pressure sensor; 14-Pressure plate; 15-Pressure head; 16-Sliding guide rail; 17-Pressure buffer; 20-Connecting plate; 21-Upright plate; 22-Fixing plate; 23-Angle sensor; 24-Stepper motor; 25-Toggle lever; 26-Baffle plate. Detailed Implementation In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0020] In the description of this utility model, it should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to or indirectly connected to the other element.

[0021] In the description of this utility model, it should be noted that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0022] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figure 1-2 As shown, this embodiment of the present invention provides an automatic secondary insertion and removal device for memory modules, including a base 10. In one embodiment, a base plate 11 is provided on the base 10, and a sliding cylinder 12 is installed on the base plate 11. The output end of the sliding cylinder 12 is sequentially connected to a pressure sensor 13 and a pressure plate 14. A pressure head 15 is fixedly connected to the side of the pressure plate 14 away from the pressure sensor 13. A sliding guide rail 16 is provided on the base plate 11, and a connecting plate 20 is slidably connected to the sliding guide rail 16. A vertical plate 21 and a stepper motor 24 are fixedly connected to the connecting plate 20. A fixed plate 22 is fixedly connected to the vertical plate 21. The output end of the stepper motor 24 passes through the fixed plate 22 and is fixedly connected to a lever 25. A baffle 26 is provided on the lever 25. An angle sensor 23 is provided on the fixed plate 22 corresponding to the baffle 26. A pressure buffer 17 is installed on the side of the base plate 11 opposite to the sliding cylinder 12. The output end of the pressure buffer 17 is fixedly connected to the connecting plate 20. By orderly connecting and arranging components such as the base 10, base plate 11, slide cylinder 12, pressure sensor 13, pressure plate 14, pressure head 15, sliding guide rail 16, connecting plate 20, upright plate 21, stepper motor 24, fixing plate 22, lever 25, baffle 26, angle sensor 23, and pressure buffer 17, a complete automated insertion and removal system is formed. The base 10 and base plate 11 provide stable support for the entire device, ensuring that the device will not shake during operation. The insertion and removal actuator composed of slide cylinder 12, pressure sensor 13, pressure plate 14, and pressure head 15 cooperates with the latching operation mechanism composed of stepper motor 24, lever 25, and angle sensor 23. With the assistance of sliding guide rail 16 and pressure buffer 17, automatic secondary insertion and removal of memory modules can be achieved. This structural design allows for clear division of labor among components, enabling them to work together and laying the foundation for precise operation. Meanwhile, the pressure buffer 17 and the slide cylinder 12 are positioned on opposite sides of the base plate 11, avoiding mutual interference between components and improving space utilization and operational stability.

[0025] In one embodiment, the slide cylinder 12 is vertically mounted on the base plate 11, with its output axis perpendicular to the table surface of the base plate 11. It drives the pressure head 15 to move vertically up and down to achieve the insertion and removal of the memory module. The upper end face of the pressure sensor 13 is fixedly connected to the output end of the slide cylinder 12, and the lower end face is fixedly connected to the pressure plate 14. It is used to detect the downward pressure of the pressure head 15 driven by the slide cylinder 12 in real time. The bottom of the pressure head 15 has a double-convex structure adapted to both ends of the memory module. The double-convex structure simulates a manual pressing action and acts on the upper two ends of the memory module. The vertical installation of the slide cylinder 12 ensures the precise lifting direction of the pressure head 15, guaranteeing that the memory module can be accurately inserted into the slot or smoothly removed, avoiding damage to the memory module or slot due to directional deviation. The pressure sensor 13 detects the pressure in real time and can feed the pressure data back to the control system to facilitate control of the downward pressure, preventing excessive pressure from damaging the memory module and motherboard, and also preventing insufficient pressure from causing incomplete insertion or removal. The double-convex structure of the pressure head 15 conforms to human pressing habits, can accurately act on both ends of the memory module, making the clips evenly stressed and achieving reliable clamping. At the same time, it simulates human action to improve the fit of the operation and ensure the insertion and removal effect.

[0026] In one embodiment, the bottom of the end of the lever 25 furthest from the stepper motor 24 is provided with an inclined wave groove. The inclination angle of the wave groove is adapted to the inclination angle of the memory module slot latch, and the wave groove is used to increase the friction with the latch. The angle sensor 23 is a photoelectric sensor, and its detection end is set corresponding to the baffle 26. It is used to obtain the rotation angle of the lever 25 by detecting the rotation angle of the baffle 26. The pressure buffer 17 and the slide cylinder 12 are respectively located on both sides of the base plate 11. The pressure buffer 17 is used to drive the connecting plate 20 to slide along the sliding guide rail 16 and provide buffering. The levers 25 are symmetrically distributed on both sides of the pressure head 15 and correspond one-to-one with the latch position of the memory module slot. The slide cylinder 12, pressure sensor 13, angle sensor 23, stepper motor 24 and pressure buffer 17 are electrically connected and coordinated for control to complete the secondary insertion and removal action of the memory module. The inclined wave groove at the bottom of the lever 25 matches the tilt angle of the buckle, allowing it to fit tightly against the buckle, increasing friction to prevent slippage during operation, and ensuring that the buckle can be effectively clamped or opened. The photoelectric angle sensor 23 obtains the angle of the lever 25 by detecting the rotation angle of the baffle 26, with high precision, ensuring that the rotation angle of the lever 25 is accurate and avoiding damage to the buckle or incomplete locking caused by over-rotation or under-rotation. The pressure buffer 17 drives the connecting plate 20 to slide along the sliding guide rail 16 and provides buffering, making the adjustment of the lever 25 position smooth and avoiding impact. The levers 25 are symmetrically distributed on both sides of the pressure head 15 and correspond one-to-one with the buckle positions, ensuring that the buckle operation on both sides is synchronous and consistent. The slide cylinder 12, pressure sensor 13, angle sensor 23, stepper motor 24 and pressure buffer 17 are electrically connected and coordinated for control, realizing the automated and precise operation of the secondary insertion and removal. Through the first initial contact and the second deep friction, the oxide film is effectively removed, improving contact reliability, while improving production efficiency and reducing the risk of manual operation.

[0027] When this utility model is in operation: during the initialization phase, after the device is powered on, the control system performs a self-test. If there is any abnormality in the components or parameters, an alarm will be triggered. The operator will pre-insert the memory stick into the motherboard slot and position the server motherboard with the memory stick installed at the designated position on the workbench of the base plate 11, ensuring that the position of the memory stick is aligned with the pressure head 15.

[0028] During the first insertion / removal, the control system sends a command, the slide cylinder 12 is vented, the piston rod extends and drives the pressure sensor 13, pressure plate 14 and pressure head 15 downward; when the pressure head 15 contacts the memory module, the pressure sensor 13 detects the downward pressure in real time and feeds it back to the control system. When the pressure reaches the preset value, the slide cylinder 12 maintains the pressure for 1 second to ensure that the memory module is initially inserted into the slot; then the slide cylinder 12 drives the pressure head 15 to rise to the initial position, the stepper motor 24 drives the lever 25 to rotate, and the slot latch is initially clamped by the action of the inclined wave groove at the bottom of the lever 25 and the buckle. The angle sensor 23 detects the rotation angle of the baffle 26 to ensure that the lever 25 rotates to the preset angle and then controls the stepper motor 24 to stop.

[0029] During the second insertion / removal, the stepper motor 24 rotates in the reverse direction, driving the lever 25 to open the latch. The memory module pops upward under the elastic force of the slot. At this time, the pressure head 15 is above the memory module, preventing it from popping out completely. The control system then controls the slide cylinder 12 to press down, repeating the pressure control process of the first insertion / removal, so that the memory module is reinserted into the slot. The pressure sensor 13 ensures that the downward pressure is suitable for the second insertion / removal. After the slide cylinder 12 rises, the stepper motor 24 drives the lever 25 to rotate again, and the latch fully clamps the memory module through a deep locking action. The angle sensor 23 detects the rotation angle again to ensure that the locking is in place. During this process, the pressure buffer 17 drives the connecting plate 20 to slide smoothly along the sliding guide rail 16, providing a buffer for the position adjustment of the lever 25 and avoiding damage to components caused by the impact of the action.

[0030] Throughout the entire process, the pressure adjustment of the slide cylinder 12, the rotation angle control of the stepper motor 24, and the buffering action of the pressure buffer 17 are coordinated and linked through the control system. Through the pressure difference and friction of the two insertions and removals, the oxide film on the surface of the gold fingers of the memory module is effectively removed, while ensuring the precise locking force of the latch, and finally completing the automated secondary insertion and removal operation of the memory module.

[0031] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An automatic secondary insertion and removal device for memory modules, characterized in that: Includes a base (10), on which a base plate (11) is provided, and a sliding cylinder (12) is mounted on the base plate (11). The output end of the sliding cylinder (12) is sequentially connected to a pressure sensor (13) and a pressure plate (14). A pressure head (15) is fixedly connected to the side of the pressure plate (14) away from the pressure sensor (13). A sliding guide rail (16) is provided on the base plate (11), and a connecting plate (20) is slidably connected to the sliding guide rail (16). A vertical plate (2) is fixedly connected to the connecting plate (20). 1) and a stepper motor (24), a fixed plate (22) is fixedly connected to the upright plate (21), the output end of the stepper motor (24) passes through the fixed plate (22) and is fixedly connected to a lever (25), the lever (25) is provided with a baffle (26); the fixed plate (22) is provided with an angle sensor (23) corresponding to the baffle (26), and a pressure buffer (17) is installed on the bottom plate (11) on the side opposite to the slide cylinder (12), the output end of the pressure buffer (17) is fixedly connected to the connecting plate (20).

2. The automatic secondary plugging device for memory bank according to claim 1, characterized in that: The slide cylinder (12) is vertically mounted on the base plate (11), and its output axis is perpendicular to the table surface of the base plate (11). It is used to drive the pressure head (15) to rise and fall in the vertical direction to realize the insertion and removal of memory modules.

3. The automatic secondary plugging device for memory bank according to claim 2, characterized in that: The upper end face of the pressure sensor (13) is fixedly connected to the output end of the slide cylinder (12), and the lower end face is fixedly connected to the pressure plate (14), which is used to detect the downward pressure of the slide cylinder (12) driving the pressure head (15) in real time.

4. The automatic secondary plugging device for memory bank according to claim 1, characterized in that: The bottom of the pressure head (15) is provided with a double convex structure that is adapted to both ends of the memory module. The double convex structure is used to simulate manual pressing action and act on the upper ends of the memory module.

5. The automatic secondary plugging device for memory bank according to claim 1, characterized in that: The bottom of the lever (25) away from the stepper motor (24) is provided with an inclined wave groove. The inclined angle of the wave groove is adapted to the inclined angle of the memory slot latch, and the wave groove is used to increase the friction with the latch.

6. The automatic secondary plugging device for memory bank according to claim 5, characterized in that: The angle sensor (23) is a photoelectric sensor, and its detection end is set corresponding to the baffle (26) to obtain the rotation angle of the lever (25) by detecting the rotation angle of the baffle (26).

7. The automatic secondary plugging device for memory bank according to claim 1, characterized in that: The pressure buffer (17) and the slide cylinder (12) are located on both sides of the base plate (11). The pressure buffer (17) is used to drive the connecting plate (20) to slide along the sliding guide rail (16) and provide buffering.

8. The automatic secondary plugging device for memory bank according to claim 1, characterized in that: The levers (25) are symmetrically distributed on both sides of the pressure head (15) and correspond one-to-one with the snap-on positions of the memory module slots; the slide cylinder (12), pressure sensor (13), angle sensor (23), stepper motor (24) and pressure buffer (17) are electrically connected and coordinated to complete the secondary insertion and removal of the memory module.

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