Pulse semiconductor laser power supply

Abstract

This utility model discloses a pulsed semiconductor laser power supply, relating to the field of laser power supply technology. It includes a housing and a power supply body. The housing contains a heat dissipation component for natural heat dissipation of the power supply body, a water-cooling component for heat dissipation of the power supply body, and a high-efficiency convection component for heat dissipation of the power supply body. Initially, this utility model dissipates heat to the power supply body only through the heat dissipation fins within the heat dissipation component. As the surface temperature of the power supply body gradually increases, the heat dissipation capacity inside the housing is gradually increased by activating the water-cooling component first, followed by the high-convection component, to cope with changes in the surface temperature of the power supply body. When the water-cooling component and the high-convection component operate simultaneously, combined with the heat dissipation capacity of the heat dissipation component, the temperature of the power supply body can be ensured to decrease slowly, allowing the heat dissipation capacity of the heat dissipation unit within the device to be adjusted in real time according to demand.

Description

Technical Field

[0001] This utility model relates to the field of laser power supply technology, and in particular to a pulsed semiconductor laser power supply. Background Technology

[0002] The pulsed semiconductor laser power supply is the core component driving a pulsed semiconductor laser (DPSSL). It generates high-repetition-rate, narrow-pulse-width current pulses to excite the semiconductor gain medium, achieving laser output. Its performance directly affects the laser's peak power, beam quality, and stability, and it is widely used in industrial processing, medical aesthetics, scientific research, and lidar. The switching transistors (such as MOSFETs and IGBTs) in the pulsed power supply generate power losses during high-frequency switching, including turn-on losses, turn-off losses, and conduction losses. These losses are released as heat, causing the power supply to generate significant heat. Therefore, pulsed semiconductor laser power supplies typically incorporate heat dissipation units to cool their internal components.

[0003] In the existing technology, the heat dissipation unit inside the pulsed semiconductor laser power supply is usually an air-cooled fan group. Its heat dissipation effect is fixed and difficult to adjust. After the laser power supply has been working for a period of time, the heat inside it will accumulate rapidly and the temperature will rise. At this time, the heat dissipation effect of the air-cooled fan group is generally poor and it is difficult to support the laser power supply to work for a long time. Utility Model Content

[0004] The purpose of this invention is to solve the problem of poor heat dissipation in existing technologies, and to propose a pulsed semiconductor laser power supply.

[0005] To address the problems existing in the prior art, the present invention adopts the following technical solution:

[0006] A pulsed semiconductor laser power supply includes a housing and a power supply body. The housing has multiple heat dissipation holes. The power supply body has two pairs of connecting posts fixedly mounted on it, with the ends of the two pairs of connecting posts fixedly connected to the inner wall of the housing. The housing contains a heat dissipation assembly for natural heat dissipation of the power supply body. The heat dissipation assembly includes multiple heat dissipation fins fixedly mounted on the side of the power supply body, with the multiple heat dissipation fins extending out of the housing. The housing contains a water-cooling assembly for heat dissipation of the power supply body. The housing also contains a high-efficiency convection assembly for high-efficiency heat dissipation of the power supply body. The high-efficiency convection assembly contains multiple nozzles, with the outlet ends of the multiple nozzles facing the multiple heat dissipation fins.

[0007] Preferably, the surfaces of the plurality of heat dissipation fins are designed with a wave-like shape.

[0008] Preferably, the water-cooled cooling component includes a miniature chiller and a water pipe. The miniature chiller is fixedly mounted on the upper end of the power supply body. The two ends of the water pipe are respectively fixedly mounted on the outlet and inlet of the miniature chiller. The water pipe is fixedly mounted on the power supply body and is in close contact with the surface of the power supply body.

[0009] Preferably, the strong convection component includes a miniature air compressor and an air pipe. The miniature air compressor is fixedly installed on the upper end of the power supply body, one end of the air pipe is fixedly installed at the air outlet of the miniature air compressor, and the air pipe is fixedly installed on the power supply body, with the air pipe in close contact with the surface of the power supply body.

[0010] Preferably, the portions of the water pipe and air pipe located on the lower surface of the power supply body are both bent.

[0011] Preferably, a temperature sensor is fixedly provided on the side of the power supply body.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] In this invention, the power supply body is initially cooled only by the heat dissipation fins inside the heat dissipation component. As the surface temperature of the power supply body gradually increases, the heat dissipation capacity inside the enclosure is gradually increased by first activating the water cooling component and then the high-convection component to cope with the changes in the surface temperature of the power supply body. When the water cooling component and the high-convection component work simultaneously, combined with the heat dissipation capacity of the heat dissipation component, the temperature of the power supply body can be ensured to drop slowly, ensuring that the power supply body is in normal operating condition. This allows the heat dissipation of the heat dissipation unit inside the device to be adjusted in real time according to the needs, making it highly practical. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a schematic cross-sectional view of the cover structure of this utility model;

[0017] Figure 3 This is a schematic diagram showing the positional relationship between the power supply unit, the micro chiller, and the micro air compressor of this utility model.

[0018] Figure 4 This is a schematic diagram of the bottom structure of the power supply body of this utility model;

[0019] Figure 5 For the present utility model Figure 3Enlarged diagram of point A in the middle.

[0020] The numbers in the diagram are: 1. Cover; 11. Heat dissipation hole; 12. Power supply body; 13. Connecting column; 2. Heat dissipation fins; 3. Miniature chiller; 31. Water pipe; 4. Miniature air compressor; 41. Air pipe; 42. Nozzle; 5. Temperature sensor. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Example: This example provides a pulsed semiconductor laser power supply. See [link to example]. Figure 1-5 Specifically, it includes a cover 1 and a power supply body 12. The cover 1 has multiple heat dissipation holes 11. The power supply body 12 is fixedly provided with two pairs of connecting posts 13. The ends of the two pairs of connecting posts 13 are fixedly connected to the inner wall of the cover 1. The cover 1 is provided with a heat dissipation component for natural heat dissipation of the power supply body 12. The heat dissipation component includes multiple heat dissipation fins 2 fixedly provided on the side of the power supply body 12. The multiple heat dissipation fins 2 extend out of the cover 1. The cover 1 is provided with a water cooling component for heat dissipation of the power supply body 12. The cover 1 is provided with a strong convection component for high-efficiency heat dissipation of the power supply body 12. The strong convection component is provided with multiple nozzles 42. The air outlet of the multiple nozzles 42 is directly facing the multiple heat dissipation fins 2.

[0024] When the pulsed semiconductor laser power supply is working, it first dissipates heat to the power supply body 12 only through the heat dissipation fins 2 in the heat dissipation component. As the surface temperature of the power supply body 12 slowly accumulates, the heat dissipation capacity inside the housing 1 is gradually increased in the order of first turning on the water cooling component and then turning on the strong convection component to cope with the change in surface temperature of the power supply body 12. When the water cooling component and the strong convection component work at the same time, together with the heat dissipation capacity of the heat dissipation component, the temperature of the power supply body 12 can be guaranteed to drop slowly, ensuring that the power supply body 12 is in normal working condition. The power supply body 12 is fixed inside the housing 1 by the connecting column 13, which avoids direct contact between the outer surface of the power supply body 12 and the inner wall of the housing 1, leaving a gap so that air can circulate between the power supply body 12 and the housing 1, thereby improving the heat dissipation efficiency.

[0025] The surfaces of multiple heat dissipation fins 2 are designed with a wave-like shape;

[0026] The surface of the heat dissipation fins 2 has a wave-like undulation, forming continuous peaks and troughs. This design increases the surface area of ​​the heat dissipation fins 2, thereby increasing the contact area with the air, improving heat exchange efficiency, and resulting in good heat dissipation.

[0027] The water-cooled cooling component includes a miniature chiller 3 and a water pipe 31. The miniature chiller 3 is fixedly mounted on the upper end of the power supply body 12. The two ends of the water pipe 31 are respectively fixedly mounted on the outlet end and the inlet end of the miniature chiller 3. The water pipe 31 is fixedly mounted on the power supply body 12 and is in close contact with the surface of the power supply body 12.

[0028] Sufficient coolant is added to the miniature chiller 3. The miniature chiller 3 cools the coolant. The miniature chiller 3 discharges the coolant, which enters the water pipe 31. The coolant flows in the water pipe 31 and finally flows into the miniature chiller 3 from the other end of the water pipe 31. Throughout the process, the low-temperature coolant is in full contact with the surface of the power supply body 12. The coolant exchanges heat with the surface of the power supply body 12, absorbing some of the heat generated by the power supply body 12 during operation, and dissipating heat from the power supply body 12.

[0029] The strong convection component includes a miniature air compressor 4 and an air pipe 41. The miniature air compressor 4 is fixedly installed on the upper end of the power supply body 12. One end of the air pipe 41 is fixedly installed at the air outlet of the miniature air compressor 4. The air pipe 41 is fixedly installed on the power supply body 12 and is in close contact with the surface of the power supply body 12.

[0030] The miniature air compressor 4 delivers high-pressure gas into the air pipe 41. The temperature of the high-pressure gas is much lower than that of the power supply body 12. When the high-pressure gas passes through the air pipe 41, it exchanges heat with the surface of the power supply body 12, absorbing some of the heat generated by the power supply body 12 during operation, and dissipating the heat of the power supply body 12. The high-pressure gas is then ejected from the nozzle 42, which rapidly sprays the high-pressure gas toward the heat dissipation fins 2, accelerating the airflow near the heat dissipation fins 2. The high-speed airflow accelerates the convection transfer of heat, and at the same time, by increasing the air turbulence, it further improves the heat dissipation efficiency of the power supply body 12, resulting in good heat dissipation effect.

[0031] The portions of water pipe 31 and air pipe 41 located on the lower surface of power supply body 12 are both bent.

[0032] The bent water pipe 31 and air pipe 41 increase the contact area of ​​the power supply body 12 surface, resulting in higher heat exchange efficiency and better heat dissipation per unit time.

[0033] A temperature sensor 5 is fixedly installed on the side of the power supply body 12;

[0034] Temperature sensor 5 can detect the temperature of the surface of the power supply body 12 in real time. When the temperature gradually exceeds different preset thresholds, the heat dissipation capacity inside the cover 1 is gradually improved by turning on the water cooling component first and then the strong convection component. Under the premise of ensuring heat dissipation effect, energy consumption is saved as much as possible.

[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A pulsed semiconductor laser power supply comprising a housing (1) and a power supply body (12), characterized in that: The cover (1) has multiple heat dissipation holes (11), and the power supply body (12) is fixedly provided with two pairs of connecting posts (13). The ends of the two pairs of connecting posts (13) are fixedly connected to the inner wall of the cover (1). The cover (1) is provided with a heat dissipation component for natural heat dissipation of the power supply body (12). The heat dissipation component includes multiple heat dissipation fins (2) fixedly arranged on the side of the power supply body (12). The multiple heat dissipation fins (2) extend out of the cover (1). The cover (1) is provided with a water cooling component for heat dissipation of the power supply body (12). The cover (1) is provided with a strong convection component for high-efficiency heat dissipation of the power supply body (12). The strong convection component is provided with multiple nozzles (42). The air outlets of the multiple nozzles (42) are all directly facing the multiple heat dissipation fins (2).

2. The pulsed semiconductor laser power supply of claim 1, wherein: The surfaces of the multiple heat dissipation fins (2) are designed with a wave-like shape.

3. The pulsed semiconductor laser power supply according to claim 1, characterized in that: The water-cooled cooling component includes a miniature chiller (3) and a water pipe (31). The miniature chiller (3) is fixedly installed on the upper end of the power supply body (12). The two ends of the water pipe (31) are respectively fixedly installed at the water outlet and water inlet of the miniature chiller (3). The water pipe (31) is fixedly installed on the power supply body (12) and is in close contact with the surface of the power supply body (12).

4. The pulsed semiconductor laser power supply of claim 1, wherein: The strong convection component includes a miniature air compressor (4) and an air pipe (41). The miniature air compressor (4) is fixedly installed on the upper end of the power supply body (12). One end of the air pipe (41) is fixedly installed at the air outlet of the miniature air compressor (4). The air pipe (41) is fixedly installed on the power supply body (12) and is in close contact with the surface of the power supply body (12).

5. The pulsed semiconductor laser power supply of claim 3, wherein: The portions of the water pipe (31) and air pipe (41) located on the lower surface of the power supply body (12) are both bent.

6. The pulsed semiconductor laser power supply of claim 1, wherein: A temperature sensor (5) is fixedly installed on the side of the power supply body (12).

Images