A vehicle-mounted wireless charging device

Abstract

This utility model discloses a vehicle-mounted wireless charging device, including a bracket, a lower cover, a heat dissipation device, and a cooling fan. The bracket has a first heat-conducting structure and a second heat-conducting structure that are in close contact with each other. The second heat-conducting structure is positioned above the first heat-conducting structure, and a wireless charging module is disposed between the first and second heat-conducting structures. The lower cover is detachably mounted below the bracket, and a circuit board is disposed between the lower cover and the bracket. The heat dissipation device is connected to the first heat-conducting structure, and the circuit board is in close contact with the lower cover. The cooling fan is used to force convection of air around the heat dissipation device and the lower cover to dissipate heat. This utility model employs a heat dissipation system composed of a heat dissipation device and a cooling fan. The forced air convection generated by a single cooling fan simultaneously dissipates heat from both the heat dissipation device and the lower cover, thus addressing the heat dissipation issues of multiple heat sources such as the back of the phone, the charging coil, and the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of vehicle-mounted wireless charging technology, and in particular to a vehicle-mounted wireless charging device. Background Technology

[0002] With the development of smartphones, most phones now feature wireless charging capabilities. Magnetic car wireless chargers, designed for this application scenario, have seen rapid growth due to their convenience and safety. Car wireless charging technology primarily utilizes the principle of electromagnetic induction to achieve contactless power transfer to mobile devices while the vehicle is in motion.

[0003] Magnetic car wireless chargers contain multiple heat sources, including the back of the phone, the magnetic charging coil, and heat-generating components on the PCBA. While using multiple independent cooling systems for different heat sources can prevent thermal coupling between different areas and achieve good heat dissipation, it also has the following drawbacks:

[0004] 1. Increased space and cost: Using multiple independent cooling systems requires additional investment in hardware such as heat dissipation components (such as heat sinks and liquid cooling pipes) and fans, which takes up space in the vehicle and increases the corresponding installation and maintenance costs, thus increasing the overall cost of the wireless charger.

[0005] 2. Noise superposition: Each cooling system is equipped with independent cooling components such as fans, which will generate a certain amount of noise when working. When multiple cooling systems are running at the same time, the noise will be superimposed, resulting in a significant increase in the overall noise level. This will reduce the user experience, especially in the relatively quiet environment of the car, where the noise problem will be more obvious.

[0006] 3. NVH deterioration: NVH (noise, vibration and harshness) is one of the important indicators for evaluating the comfort of a car. The operation of multiple independent cooling systems will cause more vibration and noise, which will worsen the NVH level in the car, affect the comfort of the driver and passengers, and may also interfere with the vehicle's electronic equipment, affecting its normal operation.

[0007] Therefore, there is an urgent need to develop a heat dissipation solution that can address the heat generation issues caused by multiple heat sources in wireless chargers. Utility Model Content

[0008] In order to overcome the technical problems of the above-mentioned magnetic wireless charging technology, such as space occupation, high cost, noise and NVH deterioration caused by using multiple independent heat dissipation systems for multiple heat sources, this utility model provides an in-vehicle wireless charging device.

[0009] The technical solution adopted by this utility model to solve its problem is:

[0010] A vehicle-mounted wireless charging device, comprising:

[0011] The bracket has a first heat-conducting structure and a second heat-conducting structure that are in close contact with each other. The second heat-conducting structure is located above the first heat-conducting structure, and a wireless charging module is provided between the first heat-conducting structure and the second heat-conducting structure.

[0012] A lower cover is detachably mounted below the bracket, and a circuit board is provided between the lower cover and the bracket;

[0013] The heat dissipation device and the cooling fan are arranged adjacently, the heat dissipation device is connected to the first heat conduction structure, and the circuit board is attached to the lower cover;

[0014] The cooling fan is used to force convection of air around the heat dissipation device and the lower cover to dissipate heat from the heat dissipation device and the lower cover.

[0015] In the above technical solution, the first and second heat-conducting structures form a heat-conducting channel, which can conduct the heat generated on the back of the device to be charged and the heat generated by the wireless charging module to the heat dissipation device. Simultaneously, heat-generating components such as the circuit board can also conduct their heat to the lower cover, which is directly or indirectly attached to them. Ultimately, the heat accumulates in the heat dissipation device and the lower cover area. When the cooling fan operates, it can create forced convection of air around the heat dissipation device and the lower cover to dissipate heat from these components, thus simultaneously addressing the heat dissipation issues of multiple heat sources, including the back of the charging device, the wireless charging module, and the circuit board. Therefore, this utility model, through a highly efficient and compact heat dissipation system formed by multiple components, can fully utilize the heat dissipation principle of air convection, optimize the heat dissipation path, ensure that the wireless charging device maintains good heat dissipation performance under various operating conditions, and improve the reliability and service life of the device.

[0016] As a preferred embodiment, the heat dissipation device and the lower cover are separate structures. The heat dissipation device includes a heat dissipation body and heat sinks. The heat dissipation body is connected to the first heat-conducting structure, and the heat sinks are spaced apart on the heat dissipation body.

[0017] In the above technical solution, the separate structure design of the heat dissipation device and the lower cover allows the heat dissipation device to be flexibly adjusted according to actual heat dissipation needs without being limited by the structure of the lower cover. The heat dissipation fins distributed on the heat dissipation body can significantly increase the heat dissipation area of ​​the heat dissipation device, allowing heat to quickly diffuse within the heat dissipation fins and be transferred to the surrounding environment of the heat dissipation device.

[0018] As a preferred embodiment, the cooling fan is a centrifugal fan, which is arranged side by side with the heat sink in the horizontal direction. The side air inlet or side air outlet of the centrifugal fan is correspondingly arranged with the heat sink, so that the heat sink and the surrounding area of ​​the lower cover form a first heat dissipation air duct.

[0019] In the above technical solution, the side air inlet or outlet of the centrifugal fan corresponds to the heat sink, which can ensure that the airflow can flow directly through the gap between each heat sink and the area where the lower cover is located. The airflow forms a first heat dissipation channel in the area around the two, avoiding the detour and obstruction of air flow and improving heat dissipation efficiency.

[0020] As a preferred embodiment, the heat dissipation device and the lower cover are an integral structure, and the heat dissipation device includes heat dissipation columns and / or heat dissipation fins spaced apart on the lower cover.

[0021] In the above technical solution, the integrated design of the heat dissipation device and the lower cover reduces the number of connecting parts, making the entire device more compact and facilitating optimized space design. The heat dissipation pillars distributed on the lower cover provide a vertical heat conduction path, while the heat sink increases the horizontal heat dissipation area. The combined design of the heat dissipation pillars and heat sink further optimizes the heat dissipation effect, making it particularly suitable for high-power charging or scenarios with high heat generation.

[0022] As a preferred embodiment, the cooling fan is an axial fan, which is located below the heat dissipation column and / or the heat sink, and the top air inlet or top air outlet of the axial fan is correspondingly arranged with the heat dissipation column and / or the heat sink, so that the area around the heat dissipation column and / or the heat sink and the lower cover forms a second heat dissipation air duct.

[0023] In the above technical solution, the airflow direction of the axial fan is consistent with the arrangement direction of the heat sink, allowing air to flow smoothly through the gaps between the heat sinks. The airflow generated by the axial fan can directly impact the heat sink, carrying away heat. The formation of the second heat dissipation airflow channel ensures that the air around the heat sink / heat sink and the lower cover remains in a state of constant flow, forming a highly efficient heat dissipation cycle and further optimizing the heat dissipation performance of the entire wireless charging device.

[0024] As a preferred embodiment, the in-vehicle wireless charging device further includes a thermally conductive gel disposed between the heat dissipation device and the first thermally conductive structure, so that the heat dissipation device is connected to the first thermally conductive structure.

[0025] In the above technical solution, by incorporating thermally conductive gel, heat can be transferred more quickly and evenly between the heat dissipation device and the first thermally conductive structure, thereby improving the heat transfer efficiency of the entire heat dissipation system. Furthermore, the thermally conductive gel can form a good bond between the heat dissipation device and the first thermally conductive structure, thus preventing component loosening due to vibration or thermal expansion.

[0026] As a preferred embodiment, the in-vehicle wireless charging device further includes a thermally conductive gel disposed between the circuit board and the lower cover to connect the circuit board and the lower cover together.

[0027] In the above technical solution, by incorporating thermally conductive gel, heat can be transferred more quickly and evenly between the circuit board and the bottom cover, thereby improving the heat transfer efficiency of the entire heat dissipation system. Furthermore, the thermally conductive gel can form a good adhesive effect between the circuit board and the bottom cover, thus preventing components from loosening due to vibration or thermal expansion.

[0028] As a preferred embodiment, the circuit board is fixedly mounted below the bracket, and the high-heat-generating components of the circuit board are positioned facing the lower cover.

[0029] In the above technical solution, the bracket provides stable mechanical support for the circuit board, allowing it to maintain an appropriate distance from the wireless charging module while still connecting to the vehicle's power system and other electronic devices. Positioning the high-heat-generating components on the circuit board towards the lower cover fully utilizes the metal material of the lower cover as an auxiliary heat dissipation component, rapidly transferring heat to the entire surface of the lower cover, where it is then dissipated through a heat dissipation device and cooling fan, thus improving heat transfer efficiency.

[0030] As a preferred embodiment, the first heat-conducting structure includes a support portion and a connecting portion connected to each other, the second heat-conducting structure is disposed above the support portion, the wireless charging module is disposed between the support portion and the second heat-conducting structure, and the heat dissipation device is connected to the connecting portion.

[0031] In the above technical solution, by rationally designing the layout and connection relationship between the second heat-conducting structure, the support part, the connecting part and the heat dissipation device, an efficient heat dissipation path is formed to ensure that the heat generated by each heat-generating component can be quickly conducted and dissipated.

[0032] As a preferred embodiment, the number of both the support portion and the second heat-conducting structure is greater than or equal to two, and the support portions are connected to each other through the connecting portion.

[0033] In the above technical solution, by setting wireless charging modules between two or more support parts and the second heat conduction structure, two or more independent charging areas can be formed, thus realizing a dual charging area or multi-charging area solution.

[0034] In summary, the in-vehicle wireless charging device provided by this utility model has at least the following technical advantages compared to the prior art:

[0035] 1) This utility model adopts a heat dissipation system composed of a heat dissipation device and a heat dissipation fan. The heat generated on the back of the mobile phone is conducted to the heat dissipation device through the first heat conduction structure and the second heat conduction structure. The heat generated by the wireless charging module is conducted to the heat dissipation device through the first heat conduction structure. The heat generated by the circuit board and other heat-generating components is conducted to the bottom cover. Finally, the forced air convection generated by a single heat dissipation fan achieves the heat dissipation effect of both the heat dissipation device and the bottom cover at the same time. Thus, it can simultaneously solve the heat dissipation problem of multiple heat sources such as the back of the mobile phone, the charging coil and the circuit board of the wireless charging device.

[0036] 2) This utility model adopts a single heat dissipation system solution. Compared with multiple independent heat dissipation systems, it can reduce the number of heat dissipation components such as heat dissipation devices and cooling fans, reduce hardware costs, reduce vibration sources, and reduce noise generated during operation, which helps to improve the NVH (noise, vibration, and harshness) performance of the vehicle. Furthermore, by covering multiple heat sources with a single heat dissipation system, it can avoid the large space occupied by multiple independent heat dissipation systems, making the overall layout of the wireless charger more compact and reasonable. Attached Figure Description

[0037] Figure 1 This is a first exploded view of the vehicle-mounted wireless charging device of this utility model;

[0038] Figure 2 This is a second exploded view of the vehicle-mounted wireless charging device of this utility model;

[0039] Figure 3 This is a first structural schematic diagram of the heat dissipation device of this utility model;

[0040] Figure 4 This is a second structural schematic diagram of the lower cover and heat dissipation device of this utility model;

[0041] The meanings of the reference numerals in the attached figures are as follows:

[0042] 1. Bracket; 2. First heat-conducting structure; 21. Support part; 22. Connecting part; 3. Second heat-conducting structure; 4. Lower cover; 5. Circuit board; 6. Heat dissipation device; 61. Heat dissipation body; 62. Heat sink; 63. Heat dissipation column; 7. Cooling fan; 8. Thermal conductive gel; 9. Wireless charging module. Detailed Implementation

[0043] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0044] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0046] See Figure 1 and Figure 2 As shown, in the technical solution of this utility model, the vehicle-mounted wireless charging device includes a bracket 1. A first heat-conducting structure 2 and a second heat-conducting structure 3 are mounted on the bracket 1 and are in close contact with each other. The second heat-conducting structure 3 is positioned above the first heat-conducting structure 2, and a wireless charging module 9 is positioned between the first heat-conducting structure 2 and the second heat-conducting structure 3. The area above the second heat-conducting structure 3 is used to place the device to be charged. The first heat-conducting structure 2 supports the second heat-conducting structure 3, thereby supporting the device to be charged on the second heat-conducting structure 3. Furthermore, the first heat-conducting structure 2 can accommodate the wireless charging module 9, thus eliminating the need for additional support or accommodating structures and optimizing the spatial structure design of the charging device.

[0047] It is worth mentioning that the wireless charging module 9 includes a charging coil module, a magnetic structure, etc.

[0048] The in-vehicle wireless charging device also includes a lower cover 4, which is detachably mounted below the bracket 1. A circuit board 5 is located between the lower cover 4 and the bracket 1. The circuit board 5 serves as the core control unit of the in-vehicle wireless charging device, responsible not only for power management, wireless charging control, and heat dissipation control, but also for communication, interaction, and safety protection. Through the intelligent control of the circuit board 5, the entire wireless charging device can operate efficiently, stably, and safely in the complex and ever-changing in-vehicle environment, providing users with a high-quality wireless charging experience.

[0049] The in-vehicle wireless charging device also includes a heat dissipation device 6 and a cooling fan 7, which are arranged adjacent to each other. The heat dissipation device 6 is connected to the first heat-conducting structure 2, and the circuit board 5 is attached to the lower cover 4. The first heat-conducting structure 2 and the second heat-conducting structure 3 are used to conduct heat generated on the back of the device to be charged to the heat dissipation device 6. The first heat-conducting structure 2 is used to conduct heat generated by the wireless charging module 9 to the heat dissipation device 6. Heat-generating components such as the circuit board 5 directly conduct heat to the lower cover 4, which is directly or indirectly attached to it. Specifically, when the cooling fan 7 is working, it can create forced convection of air around the heat dissipation device 6 and the lower cover 4 to dissipate heat from both, thus simultaneously addressing the heat dissipation issues of multiple heat sources, including the back of the charging device, the wireless charging module 9, and the circuit board 5.

[0050] Based on this, the vehicle-mounted wireless charging device of this utility model forms an efficient and compact heat dissipation system through the heat dissipation device 6, the heat dissipation fan 7, and the fitting design of the circuit board 5 and the lower cover 4. It can make full use of the heat dissipation principle of air convection, optimize the heat dissipation path, ensure that the wireless charging device can maintain good heat dissipation performance under various working conditions, improve the reliability and service life of the device, and provide users with a high-quality wireless charging experience.

[0051] Furthermore, since the vehicle-mounted wireless charging device of this utility model adopts a single heat dissipation system solution, compared with the use of multiple independent heat dissipation systems, it can reduce the number of heat dissipation components such as heat dissipation device 6 and cooling fan 7, reduce hardware costs, reduce vibration sources, reduce noise generated during operation, and help improve the NVH (noise, vibration and harshness) performance of the vehicle.

[0052] It is worth mentioning that the devices to be charged described in this utility model include, but are not limited to, mobile phones.

[0053] In a preferred embodiment, the circuit board 5 is fixedly mounted below the bracket 1, with the high-heat-generating components of the circuit board 5 facing the lower cover 4. Specifically, fixing the circuit board 5 below the bracket 1 allows it to maintain an appropriate distance from the wireless charging module 9 while facilitating connection to the vehicle's power system and other electronic devices. The bracket 1 provides stable mechanical support for the circuit board 5, ensuring its stable operation under vibration and impact during vehicle operation. Positioning the high-heat-generating components of the circuit board 5 towards the lower cover 4 fully utilizes the metal material of the lower cover 4 as an auxiliary heat dissipation component. This allows the lower cover 4 to not only provide protection but also rapidly conduct heat to its entire surface through direct contact or adjacent placement with the high-heat-generating components, which is then dissipated through the heat dissipation device 6 and the cooling fan 7, improving heat transfer efficiency.

[0054] Preferably, the high-heat-generating components on the circuit board 5 include power amplifiers, DC-DC converters, etc.

[0055] It is worth mentioning that the high-heat-generating components of the circuit board 5 are positioned towards the lower cover 4, including a solution where the high-heat-generating components and the lower cover 4 are attached together, and a solution where the high-heat-generating components and the lower cover 4 are positioned adjacent to each other.

[0056] Example 1

[0057] In a preferred embodiment of the present invention, a structural design scheme for the heat dissipation device 6 and the cooling fan 7 is provided.

[0058] See Figure 1 and Figure 3 As shown, in this embodiment, the heat dissipation device 6 and the lower cover 4 are separate structures. The heat dissipation device 6 includes a heat dissipation body 61 and heat sinks 62. The heat dissipation body 61 is connected to the first heat-conducting structure 2, and the heat sinks 62 are spaced apart on the heat dissipation body 61. Specifically, the separate structure of the heat dissipation device 6 and the lower cover 4 allows the heat dissipation device 6 to be designed and optimized independently, focusing on its heat dissipation function, while the lower cover 4 mainly serves to protect and support the circuit board 5 and conduct heat. Thus, the above-mentioned separate structure design allows the heat dissipation device 6 to be flexibly adjusted according to actual heat dissipation needs without being limited by the structure of the lower cover 4. More specifically, the heat dissipation body 61 is distributed with a large number of thin heat sinks 62, which can significantly increase the heat dissipation area of ​​the heat dissipation device 6, allowing heat to quickly diffuse in the heat sinks 62 and be transferred to the surrounding environment of the heat dissipation device 6, thus achieving better cooperation with the cooling fan 7.

[0059] See Figure 1 and Figure 3 As shown, in a preferred embodiment, the cooling fan 7 is a centrifugal fan, which is arranged side-by-side with the heat sink 62 in the horizontal direction. The side air inlet or outlet of the centrifugal fan corresponds to the heat sink 62, so that the area around the heat sink 62 and the lower cover 4 forms a first heat dissipation airflow channel. Specifically, the side air inlet or outlet of the centrifugal fan corresponds to the heat sink 62, ensuring that the airflow can flow directly through the gaps between the heat sinks 62 and the area where the lower cover 4 is located. The airflow forms a first heat dissipation airflow channel in the area around them. The above design avoids the detour and obstruction of airflow, improves heat dissipation efficiency, and prevents heat from accumulating inside the device.

[0060] It is worth mentioning that when the side of the centrifugal fan is set as the air inlet, its air outlet is set on the bottom or top side of the centrifugal fan. Through the rotation of the impeller, air is drawn in from the side and discharged from the bottom or top. When the side of the centrifugal fan is set as the air outlet, its air inlet is set on the bottom or top side of the centrifugal fan. Through the rotation of the impeller, air is drawn in from the bottom or top and discharged from the side.

[0061] Example 2

[0062] In another preferred embodiment of this utility model, another structural design scheme for the heat dissipation device 6 and the cooling fan 7 is provided.

[0063] See Figure 2 and Figure 4 As shown, in this embodiment, the heat dissipation device 6 and the lower cover 4 are an integrated structure. The heat dissipation device 6 includes heat dissipation pillars 63 or heat dissipation fins 62, or both, spaced apart on the lower cover 4. Specifically, the integrated design of the heat dissipation device 6 and the lower cover 4 reduces the number of connecting parts, making the entire device more compact and optimizing space design. Furthermore, since the heat dissipation device 6 and the lower cover 4 are directly integrated, heat can be conducted from the circuit board 5 to the heat dissipation device 6, further improving the heat dissipation efficiency of the circuit board 5. More specifically, when the heat dissipation device 6 includes both heat dissipation pillars 63 and heat dissipation fins 62, the heat dissipation pillars 63 provide a vertical heat conduction path, while the heat dissipation fins 62 increase the horizontal heat dissipation area. This combined design further optimizes the heat dissipation effect and is particularly suitable for high-power charging or scenarios with large heat generation.

[0064] See Figure 2 and Figure 4 As shown, in a preferred embodiment, the cooling fan 7 is an axial fan, which is located below the heat dissipation column 63 and / or the heat sink 62. The top air inlet or top air outlet of the axial fan is correspondingly arranged with the heat dissipation column 63 and / or the heat sink 62. This arrangement makes the airflow direction of the axial fan consistent with the arrangement direction of the heat sink 62, and the air can flow smoothly through the gaps between the heat sinks 62. The airflow generated by the axial fan can directly impact the heat sink 62, carry away heat, and further optimize the heat dissipation effect.

[0065] Specifically, the top air inlet or outlet of the axial fan is positioned corresponding to the heat dissipation column 63 / heat sink 62, allowing air to enter from below the heat dissipation column 63 / heat sink 62, flow through the gaps in the heat sink 62, carry away heat, and then exit from above. This process forms a dedicated heat dissipation airflow channel, namely the second heat dissipation airflow channel. More specifically, the formation of the second heat dissipation airflow channel ensures that the air around the heat dissipation column 63 / heat sink 62 and the lower cover 4 remains in a state of constant flow, forming a highly efficient heat dissipation cycle and further optimizing the heat dissipation performance of the entire wireless charging device.

[0066] Example 3

[0067] In another preferred embodiment of this utility model, a thermally conductive connection scheme between various components is provided.

[0068] See Figure 1 As shown, in an optional embodiment, the vehicle-mounted wireless charging device further includes a thermally conductive gel 8, which is disposed between the heat dissipation device 6 and the first thermally conductive structure 2, thereby connecting the heat dissipation device 6 and the first thermally conductive structure 2 together. On one hand, the thermally conductive gel 8 has good thermal conductivity, effectively filling the tiny gaps and uneven surfaces between the heat dissipation device 6 and the first thermally conductive structure 2, allowing heat to be transferred more quickly and evenly between them, thus improving the heat transfer efficiency of the entire heat dissipation system. On the other hand, the thermally conductive gel 8 has a certain degree of viscosity and flexibility, forming a good bond between the heat dissipation device 6 and the first thermally conductive structure 2, thereby preventing component loosening and poor contact due to factors such as vibration or thermal expansion, and improving the connection reliability and stability of the entire device.

[0069] In another optional embodiment, the in-vehicle wireless charging device further includes a thermally conductive gel 8, which is disposed between the circuit board 5 and the lower cover 4 to connect the circuit board 5 and the lower cover 4 together. Similarly, utilizing the good thermal conductivity of the thermally conductive gel 8, heat can be transferred more quickly and evenly between the circuit board 5 and the lower cover 4, thereby improving the heat transfer efficiency of the entire heat dissipation system. Furthermore, utilizing the adhesion and flexibility of the thermally conductive gel 8, a good adhesive effect can be formed between the circuit board 5 and the lower cover 4, thereby preventing the circuit board 5 from becoming loose due to factors such as vibration or thermal expansion.

[0070] Example 4

[0071] In another preferred embodiment of this utility model, a specific structural design scheme for the first heat-conducting structure 2 and the second heat-conducting structure 3 is provided.

[0072] See Figure 1 and Figure 2As shown, in this embodiment, the first heat-conducting structure 2 includes a support portion 21 and a connecting portion 22 connected to each other. The second heat-conducting structure 3 is located above the support portion 21, and a wireless charging module 9 is provided between the support portion 21 and the second heat-conducting structure 3. The heat dissipation device 6 is connected to the connecting portion 22. The support portion 21 serves to support and accommodate the wireless charging module 9 and indirectly support the device to be charged above the second heat-conducting structure 3. The connecting portion 22 conducts heat, transferring the heat generated by the charging device and the wireless charging module 9 during operation to the heat dissipation device 6. Therefore, by rationally designing the layout and connection relationship between the second heat-conducting structure 3, the support portion 21, the connecting portion 22, and the heat dissipation device 6, an efficient heat dissipation path is formed, ensuring that the heat generated by each heat-generating component can be quickly conducted and dissipated. This also improves the heat dissipation efficiency and reliability of the entire device, providing users with a safer and more reliable wireless charging experience.

[0073] See Figure 1 and Figure 2 As shown, in a preferred embodiment, the number of support portions 21 and second heat-conducting structures 3 is greater than or equal to two, and the support portions 21 are connected by connecting portions 22. Specifically, by setting wireless charging modules 9 between two or more support portions 21 and second heat-conducting structures 3, two or more independent charging areas can be formed, thus realizing a dual-charging-area or multi-charging-area scheme. More specifically, the connection of two or more support portions 21 through connecting portions 22 forms a stable basic frame, providing reliable mechanical support for the entire wireless charging device, and also serving as a key heat conduction path.

[0074] Preferably, the number of support parts 21 and second heat-conducting structures 3 is set to two, and the number of wireless charging modules 9 is also set to two, thereby realizing a dual-charging zone scheme.

[0075] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A vehicle-mounted wireless charging device, characterized in that, include: The bracket has a first heat-conducting structure and a second heat-conducting structure that are in close contact with each other. The second heat-conducting structure is located above the first heat-conducting structure, and a wireless charging module is provided between the first heat-conducting structure and the second heat-conducting structure. A lower cover is detachably mounted below the bracket, and a circuit board is provided between the lower cover and the bracket; The heat dissipation device and the cooling fan are arranged adjacently, the heat dissipation device is connected to the first heat conduction structure, and the circuit board is attached to the lower cover; The cooling fan is used to force convection of the air around the heat dissipation device and the lower cover to dissipate heat from the heat dissipation device and the lower cover.

2. The vehicle-mounted wireless charging device according to claim 1, characterized in that, The heat dissipation device and the lower cover are separate structures. The heat dissipation device includes a heat dissipation body and heat dissipation fins. The heat dissipation body is connected to the first heat-conducting structure, and the heat dissipation fins are spaced apart on the heat dissipation body.

3. The in-vehicle wireless charging device according to claim 2, characterized by, The cooling fan is a centrifugal fan, which is arranged side by side with the heat sink in the horizontal direction. The side air inlet or side air outlet of the centrifugal fan is arranged corresponding to the heat sink, so that the heat sink and the surrounding area of ​​the lower cover form a first heat dissipation air duct.

4. The wireless charging device of claim 1, wherein, The heat dissipation device and the lower cover are an integral structure. The heat dissipation device includes heat dissipation columns and / or heat dissipation fins spaced apart on the lower cover.

5. The wireless charging device of claim 4, wherein, The cooling fan is an axial fan, which is located below the heat dissipation column and / or the heat sink. The top air inlet or top air outlet of the axial fan is correspondingly arranged with the heat dissipation column and / or the heat sink, so that the area around the heat dissipation column and / or the heat sink and the lower cover forms a second heat dissipation air duct.

6. The wireless charging device of claim 1, wherein, The vehicle-mounted wireless charging device also includes a thermally conductive gel, which is disposed between the heat dissipation device and the first thermally conductive structure to connect the heat dissipation device and the first thermally conductive structure together.

7. The wireless charging device of claim 1, wherein, The in-vehicle wireless charging device also includes thermal conductive gel, which is disposed between the circuit board and the lower cover to connect the circuit board and the lower cover together.

8. The wireless charging device of claim 1, wherein, The circuit board is fixedly installed below the bracket, and the high-heat-generating components of the circuit board are positioned facing the lower cover.

9. The wireless charging device of claim 1, wherein, The first heat-conducting structure includes a support portion and a connecting portion that are connected to each other. The second heat-conducting structure is disposed above the support portion. The wireless charging module is disposed between the support portion and the second heat-conducting structure. The heat dissipation device is connected to the connecting portion.

10. The wireless charging device of claim 9, wherein, The number of the support portion and the second heat-conducting structure is greater than or equal to two, and the support portions are connected to each other through the connecting portion.

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