Multi-port ultra-thin charger

Abstract

This utility model discloses a multi-port ultra-thin charger, relating to the field of electronic product charging equipment. The multi-port ultra-thin charger includes built-in main components, including a PCB motherboard, a synchronous rectifier circuit board, a Type-C circuit board, a filter module, a planar transformer, and a step-down module. One side of the synchronous rectifier circuit board is soldered to the top surface of the Type-C circuit board. The filter module is soldered between the Type-C circuit board and the PCB motherboard. The planar transformer is soldered between the synchronous rectifier circuit board and the PCB motherboard. The step-down module is soldered to the top of the Type-C circuit board. The advantages of this utility model are: it can fully utilize the internal space of the charger, greatly reducing the size of the charger and making it more portable.

Description

Technical Field

[0001] This utility model relates to the field of electronic product charging equipment, and more specifically, to a multi-port ultra-thin charger. Background Technology

[0002] With the development of consumer electronics, small-sized chargers are the future trend. Currently, common power adapters and chargers only have one circuit board, with all components placed on one circuit board. This layout requires a lot of space, and the size of the casing is correspondingly large.

[0003] Therefore, this utility model provides a multi-port ultra-thin charger that can make full use of the internal space of the charger, greatly reduce the size of the charger, and make the charger more convenient to carry. Utility Model Content

[0004] To overcome the shortcomings of existing technology, this utility model provides a multi-port ultra-thin charger that can make full use of the internal space of the charger, greatly reduce the size of the charger, and make the charger more convenient to carry.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a multi-port ultra-thin charger, the improvement of which is that the multi-port ultra-thin charger includes built-in main components, including a PCB motherboard, a synchronous rectifier circuit board, a TYPE-C circuit board, a filter module, a planar transformer, and a step-down module; one side of the synchronous rectifier circuit board is soldered to the top surface of the TYPE-C circuit board; the filter module is soldered between the TYPE-C circuit board and the PCB motherboard; the planar transformer is soldered between the synchronous rectifier circuit board and the PCB motherboard; and the step-down module is soldered to the top of the TYPE-C circuit board;

[0006] The step-down module is block-shaped, and its height is adapted to the thickness of the planar transformer; the filter module is cylindrical, and its cross-sectional diameter is adapted to the thickness of the planar transformer; the vertical height of the synchronous rectifier circuit board is adapted to the thickness of the planar transformer.

[0007] In the above structure, the step-down module includes a step-down power inductor, which is soldered to the top surface of the TYPE-C circuit board.

[0008] In the above structure, the built-in main components also include a first TYPE-C interface and a second TYPE-C interface; the first TYPE-C interface and the second TYPE-C interface are both fixedly mounted on the top of the TYPE-C circuit board, and the first TYPE-C interface and the second TYPE-C interface are respectively located on both sides of the step-down power inductor.

[0009] In the above structure, the filtering module includes a first electrolytic capacitor and a second electrolytic capacitor; the first electrolytic capacitor is soldered between the PCB motherboard and the TYPE-C circuit board; one end of the second electrolytic capacitor is soldered to the side of the PCB motherboard away from the TYPE-C circuit board.

[0010] In the above structure, a fuse, a common-mode inductor, a bridge rectifier, a packaged GaN IC chip, and a surface-mount differential-mode inductor are soldered to the top of the PCB motherboard; the fuse, common-mode inductor, bridge rectifier, and packaged GaN IC chip are located on one side of the PCB motherboard; the surface-mount differential-mode inductor is located on the other side of the PCB motherboard, and is located between the first electrolytic capacitor and the second electrolytic capacitor.

[0011] In the above structure, the built-in main components also include a first output solid capacitor and a second output solid capacitor. The first output solid capacitor is soldered to the top surface of the TYPE-C circuit board; the second output solid capacitor is soldered to one side of the synchronous rectifier circuit board near the PCB motherboard.

[0012] In the above structure, the built-in main components also include a heat sink, which is attached to the side of the planar transformer away from the PCB motherboard.

[0013] The beneficial effects of this utility model are as follows: This solution can significantly reduce the thickness of the charger design by using a planar transformer. Through a multi-board design consisting of a synchronous rectifier circuit board, a TYPE-C circuit board, and a PCB main board, and by welding the side of the synchronous rectifier circuit board to the top surface of the TYPE-C circuit board, and welding the filter module and the planar transformer between the TYPE-C circuit board and the PCB main board respectively, and ensuring that the height of the step-down module, the cross-sectional diameter of the filter module, and the vertical height of the synchronous rectifier circuit board are all adapted to the thickness of the planar transformer, a compact, three-dimensional, ultra-thin structure is formed. Compared to the traditional layout where all components are vertically soldered onto a single circuit board, this solution can significantly reduce the overall thickness and volume. Therefore, this utility model can fully utilize the internal space of the charger, greatly reducing its size and making it more portable. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of a multi-port ultra-thin charger according to this utility model. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the overall structure of a multi-port ultra-thin charger according to this utility model. Figure 2 . Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0018] Reference Figure 1 and Figure 2 As shown, this utility model discloses a multi-port ultra-thin charger. The multi-port ultra-thin charger includes built-in main components, including a PCB motherboard 1, a synchronous rectifier circuit board 4, a TYPE-C circuit board 3, a filter module 5, a planar transformer 2, and a step-down module 6. One side of the synchronous rectifier circuit board 4 is soldered to the top surface of the TYPE-C circuit board 3. The filter module 5 is soldered between the TYPE-C circuit board 3 and the PCB motherboard 1. The planar transformer 2 is soldered between the synchronous rectifier circuit board 4 and the PCB motherboard 1. The step-down module 6 is soldered to the top of the TYPE-C circuit board 3. The step-down module 6 is block-shaped, and its height is adapted to the thickness of the planar transformer 2. The filter module 5 is cylindrical, and its cross-sectional diameter is adapted to the thickness of the planar transformer 2. The vertical height of the synchronous rectifier circuit board 4 is adapted to the thickness of the planar transformer 2.

[0019] It should be noted that in this embodiment, the PCB motherboard 1, as the core carrier of the charger, is mainly used to provide power and signal transmission channels, ensuring the coordinated operation of various modules to achieve the control and coordination of the overall function of the charger; the synchronous rectifier circuit board 4 is used to convert AC power to DC power, improve power conversion efficiency, reduce heat generation, and improve the overall performance of the charger. Furthermore, the vertical height of the synchronous rectifier circuit board 4 is adapted to the thickness of the planar transformer 2, thus accommodating the overall ultra-thin design of the charger; the TYPE-C circuit board 3 provides the TYPE-C charging interface and is responsible for managing and controlling the power supply and data transmission of the TYPE-C interface; the filtering module 5 reduces power noise. The filter module 5 is cylindrical and horizontally positioned between the TYPE-C circuit board 3 and the PCB motherboard 1. The cross-sectional diameter of the filter module 5 is adapted to the thickness of the planar transformer 2 to accommodate the overall ultra-thin design of the charger. The planar transformer 2 is used to convert high-voltage AC power into low-voltage AC power, and its flat structure design helps to reduce the thickness of the charger and achieve an overall ultra-thin design. The step-down module 6 is a DC-DC converter used to convert higher DC voltage into lower DC voltage, and its height is adapted to the thickness of the planar transformer 2 to accommodate the overall ultra-thin design of the charger. In the specific implementation of this utility model, the multi-port ultra-thin charger can fully compress the thickness of the charger design through the application of the planar transformer 2. Through the multi-board design of synchronous rectifier circuit board 4, TYPE-C circuit board 3, and PCB main board 1, the side of synchronous rectifier circuit board 4 is welded to the top surface of TYPE-C circuit board 3, and the filter module 5 and planar transformer 2 are respectively welded between TYPE-C circuit board 3 and PCB main board 1. The height of step-down module 6, the cross-sectional diameter of filter module 5, and the vertical height of synchronous rectifier circuit board 4 are all adapted to the thickness of planar transformer 2, thereby forming a compact three-dimensional ultra-thin structure. Compared with the traditional layout of vertically welding all components onto a single circuit board, this solution can significantly reduce the overall thickness and volume. Therefore, this utility model can make full use of the internal space of the charger, greatly reduce the size of the charger, and make the charger more convenient to carry.

[0020] Reference Figure 1 and Figure 2 As shown, the step-down module 6 includes a step-down power inductor 601, which is soldered to the top surface of the TYPE-C circuit board 3.

[0021] It should be noted that, in this embodiment, the combined step-down power inductor 601 is used to convert a higher DC voltage into a lower DC voltage to meet the charging requirements of the device.

[0022] Continue to refer to Figure 1 and Figure 2 As shown, the built-in main components also include a first TYPE-C interface 7 and a second TYPE-C interface 8; the first TYPE-C interface 7 and the second TYPE-C interface 8 are both fixedly installed on the top of the TYPE-C circuit board 3, and the first TYPE-C interface 7 and the second TYPE-C interface 8 are respectively located on both sides of the step-down power inductor 601.

[0023] It should be noted that in this embodiment, the first TYPE-C interface 7 and the second TYPE-C interface 8 serve as voltage output interfaces, enabling dual-interface charging of the charger to optimize the user experience.

[0024] Continue to refer to Figure 1 and Figure 2 As shown, the filter module 5 includes a first electrolytic capacitor 501 and a second electrolytic capacitor 502; the first electrolytic capacitor 501 is soldered between the PCB motherboard 1 and the TYPE-C circuit board 3; one end of the second electrolytic capacitor 502 is soldered to the side of the PCB motherboard 1 away from the TYPE-C circuit board 3; the built-in main components also include a first output solid capacitor 9 and a second output solid capacitor 10, the first output solid capacitor 9 is soldered to the top surface of the TYPE-C circuit board 3; the second output solid capacitor 10 is soldered to the side of the synchronous rectifier circuit board 4 close to the PCB motherboard 1.

[0025] It should be noted that, in this embodiment, the first electrolytic capacitor 501, the second electrolytic capacitor 502, the first output solid capacitor 9, and the second output solid capacitor 10 are all used to filter out noise and ripple in the power supply, improve the stability of the output voltage, and protect the device being charged.

[0026] Continue to refer to Figure 1 and Figure 2 As shown, a fuse 12, a common-mode inductor 13, a bridge rectifier 14, a packaged GaNI C chip 16, and a surface-mount differential-mode inductor 11 are soldered to the top of the PCB motherboard 1; the fuse 12, the common-mode inductor 13, the bridge rectifier 14, and the packaged GaNI C chip 16 are located on one side of the PCB motherboard 1; the surface-mount differential-mode inductor 11 is located on the other side of the PCB motherboard 1, and is located between the first electrolytic capacitor 501 and the second electrolytic capacitor 502.

[0027] It should be noted that, in this embodiment, the fuse 12, common mode inductor 13, bridge rectifier 14, encapsulated GaN IC chip 16, and surface mount differential mode inductor 11 are used to cooperate with the power input and output on the PCB motherboard 1 to realize the control and coordination of the overall function of the charger. In addition, the height of the fuse 12, common mode inductor 13, bridge rectifier 14, encapsulated GaN IC chip 16, and surface mount differential mode inductor 11 does not exceed the height of the planar transformer 2, so as to adapt to the ultra-thin design of the charger.

[0028] Continue to refer to Figure 1 and Figure 2 As shown, the built-in main components also include a heat sink 15, which is attached to the side of the planar transformer 2 away from the PCB motherboard 1.

[0029] It should be noted that in this embodiment, the heat sink 15 used to dissipate heat from the planar transformer 2 is much thinner than the thickness of the planar heat sink. When the heat sink 15 is attached to the planar transformer 2, it will not affect the overall ultra-thin design of the charger.

[0030] It should also be noted that the PCB motherboard 1 is designed with an EMC circuit and a first filter circuit; the synchronous rectifier circuit board 4 is designed with a synchronous rectifier circuit, a feedback circuit, and a PWM control circuit; the TYPE-C circuit board 3 is designed with a second filter circuit, a step-down circuit, a first TYPE-C interface 7, and a second TYPE-C interface 8. In the specific implementation of this utility model, when the charger charges the device, the input wide-range AC power (90-264VAC) first undergoes noise suppression and filtering through the EMC circuit and the first filter circuit on the PCB motherboard 1 to ensure stable input power. Then, the power is transferred to the synchronous rectifier circuit board 4, where efficient power conversion and regulation are achieved through the coordinated control of the synchronous rectifier circuit, the feedback circuit, and the PWM control circuit. When the power reaches the TYPE-C circuit board 3, it undergoes filtering and voltage reduction processing through the second filter circuit and the step-down circuit to ensure that the output voltage meets the device requirements. Finally, the finely regulated power is delivered to the connected device through the first and second TYPE-C interfaces 8, achieving a safe and stable charging process.

[0031] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A multi-port ultra-thin charger, characterized in that, The multi-port ultra-thin charger includes built-in main components, including a PCB motherboard, a synchronous rectifier circuit board, a TYPE-C circuit board, a filter module, a planar transformer, and a step-down module. One side of the synchronous rectifier circuit board is soldered to the top surface of the TYPE-C circuit board. The filter module is soldered between the TYPE-C circuit board and the PCB motherboard. The planar transformer is soldered between the synchronous rectifier circuit board and the PCB motherboard. The step-down module is soldered to the top of the TYPE-C circuit board. The step-down module is block-shaped, and its height is adapted to the thickness of the planar transformer; the filter module is cylindrical, and its cross-sectional diameter is adapted to the thickness of the planar transformer; the vertical height of the synchronous rectifier circuit board is adapted to the thickness of the planar transformer.

2. The multi-port ultra-thin charger of claim 1, wherein, The step-down module includes a step-down power inductor, which is soldered to the top surface of a TYPE-C circuit board.

3. The multi-port ultra-thin charger of claim 2, wherein, The built-in main components also include a first TYPE-C interface and a second TYPE-C interface; the first TYPE-C interface and the second TYPE-C interface are both fixedly installed on the top of the TYPE-C circuit board, and the first TYPE-C interface and the second TYPE-C interface are respectively located on both sides of the buck power inductor.

4. The multi-port ultra-thin charger of claim 1, wherein, The filtering module includes a first electrolytic capacitor and a second electrolytic capacitor; the first electrolytic capacitor is soldered between the PCB motherboard and the TYPE-C circuit board; one end of the second electrolytic capacitor is soldered to the side of the PCB motherboard away from the TYPE-C circuit board.

5. The multi-port ultra-thin charger of claim 4, wherein, The PCB motherboard has a fuse, a common-mode inductor, a bridge rectifier, a packaged GaN IC chip, and a surface-mount differential-mode inductor soldered to its top. The fuse, common-mode inductor, bridge rectifier, and packaged GaN IC chip are located on one side of the PCB motherboard. The surface-mount differential-mode inductor is located on the other side of the PCB motherboard, between the first electrolytic capacitor and the second electrolytic capacitor.

6. The multi-port ultra-thin charger of claim 1, wherein, The built-in main components also include a first output solid capacitor and a second output solid capacitor. The first output solid capacitor is soldered to the top surface of the TYPE-C circuit board; the second output solid capacitor is soldered to one side of the synchronous rectifier circuit board near the PCB motherboard.

7. The multi-port ultra-thin charger of claim 1, wherein, The built-in main components also include a heat sink, which is attached to the side of the planar transformer away from the PCB motherboard.

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