Support for facilitating charging of electronic devices
By designing cable routing channels extending in opposite directions and vertically positioned placement slots on the bracket, the problem of aligning connection cables when charging electronic devices is solved. Furthermore, the heat dissipation structure optimizes the heat dissipation effect of the device, thereby improving the user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN DEONE INNOVATION TECH CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-31
AI Technical Summary
In existing stand designs, it is difficult to align the connecting cable with the interface when charging electronic devices, which leads to inconvenience in use, and the heat dissipation of electronic devices is poor after long-term use.
Design a bracket for easy charging of electronic devices. The cable routing groove extends in the opposite direction to the first direction, so that the connecting wires can be connected first and then embedded in the placement groove. The vertical placement groove and cable routing groove reduce space occupation. At the same time, heat dissipation vents and flow cavities are provided on the bottom wall of the placement groove to ensure heat dissipation.
It achieves convenient connection and optimized heat dissipation during the charging process of electronic devices, thus improving the user experience.
Smart Images
Figure CN224582916U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of bracket technology, specifically to a bracket that facilitates charging of electronic devices. Background Technology
[0002] When users use electronic devices for extended periods, they often place them on a stand to reduce the time spent holding them, as holding them for too long can lead to a poor user experience.
[0003] Because electronic devices are used for extended periods, they often run out of power and have to be shut down, affecting users' ability to use them for longer periods. Therefore, a cable management channel is installed at the bottom of the stand, connecting to a placement slot for the electronic device. This allows the device to be used and charged simultaneously while in the placement slot, preventing interruptions due to low battery.
[0004] Before charging an electronic device, the connecting cable needs to be threaded through the cable tray of the holder so that it connects to the first interface on the bottom of the electronic device. Therefore, when placing the electronic device, it is necessary to align the connecting cable and the first interface. Since the connecting part of the cable is located on the bottom wall of the placement tray, the electronic device will obstruct the view of the connecting cable when it is embedded in the placement tray, making it difficult to align and connect the electronic device and the connecting cable. Utility Model Content
[0005] The purpose of this utility model is to address the defects and deficiencies of the existing technology by providing a bracket that facilitates the charging of electronic devices. By setting the cable routing groove to extend in the opposite direction of the first direction, the cable routing groove penetrates the side of the main body in the opposite direction of the first direction, allowing the electronic device to be connected to the connecting wire and then embedded in the placement groove. During the placement process, the connecting wire is embedded in the cable routing groove along the first direction.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a bracket for facilitating the charging of electronic devices, used to place electronic devices, wherein the bottom of the electronic device is provided with a first interface, the bracket includes a main body, the main body has a placement groove for placing the electronic device, the placement groove is provided with a wiring groove, the wiring groove connects the bottom wall of the placement groove to the outside, so that connecting wires pass through the wiring groove and connect to the first interface, the direction in which the electronic device is embedded in the placement groove is a first direction, and the wiring groove extends in the opposite direction of the first direction, so that the wiring groove penetrates the side of the main body in the opposite direction of the first direction.
[0007] Preferably, the main body includes a first side and a second side opposite to each other, the direction from the first side to the second side is a second direction, the third direction is perpendicular to the first direction and perpendicular to the second direction, the placement groove extends along the second direction, and the wiring groove extends along the third direction.
[0008] Preferably, the placement groove extends through the first side and the second side.
[0009] Preferably, the bottom wall of the placement slot is provided with a first heat dissipation vent, the bottom of the electronic device is provided with a heat dissipation window, the first heat dissipation vent is aligned with the heat dissipation window, a flow cavity is provided inside the main body, the first heat dissipation vent is connected to the flow cavity, and the main body is provided with a second heat dissipation vent, the second heat dissipation vent is connected to the flow cavity and the outside.
[0010] Preferably, the second heat dissipation vent is located on one side of the first heat dissipation vent in the first direction.
[0011] Preferably, the first heat dissipation vent is provided with a plurality of grilles.
[0012] Preferably, the flow cavity is provided with a plurality of reinforcing ribs.
[0013] Preferably, the bottom wall of the placement groove is provided with a recessed groove, and the first heat dissipation vent is disposed on the bottom surface of the recessed groove.
[0014] Preferably, the sinking groove is connected to the wiring groove.
[0015] Preferably, the placement slot includes a first support surface, a second support surface, and a bottom wall. The bottom wall connects the first support surface and the second support surface. The second support surface is used to support at least a portion of the back of the electronic device. The second support surface is set at an angle to the first direction.
[0016] After adopting the above technical solution, the beneficial effects of this utility model are as follows: by setting the wiring groove to extend in the opposite direction of the first direction, the wiring groove penetrates the side of the main body in the opposite direction of the first direction, so that the electronic device can first connect the connecting wire and then embed it into the placement groove. During the placement process, the connecting wire is embedded into the wiring groove along the first direction, that is, the connecting wire can pass through the side of the main body in the opposite direction of the first direction, thereby embedding into the wiring groove. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the support structure in an embodiment of this utility model.
[0019] Figure 2 This is a structural schematic diagram of the bracket from another perspective in an embodiment of this utility model.
[0020] Figure 3 yes Figure 1 Cross-sectional view along the AA' direction.
[0021] Figure label:
[0022] 100. Bracket; 10. Main body; 11. First side; 12. Second side; 13. Flow cavity; 131. Reinforcing rib; 14. Second heat dissipation vent; 20. Placement slot; 21. First heat dissipation vent; 22. Grille; 23. Sinking groove; 24. First support surface; 25. Second support surface; 26. Bottom wall; 30. Cable routing groove; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation
[0023] The present invention will be further described in detail below with reference to the accompanying drawings.
[0024] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive element, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.
[0025] like Figure 1-3As shown, this embodiment relates to a stand 100 for facilitating the charging of electronic devices. The stand 100 is used to place electronic devices. The bottom of the electronic device is provided with a first interface for connecting an external cable. The stand 100 includes a main body 10, which has a placement slot 20 for placing the electronic device. The main body 10 also has a cable routing groove 30, which connects the bottom wall 26 of the placement slot 20 to the outside, allowing the cable to pass through the cable routing groove 30 from the outside to reach the placement slot 20. The cable then passes through the cable routing groove 30 to connect to the first interface, thereby facilitating charging or data transmission when the electronic device is embedded in the placement slot 20. The direction in which the electronic device is embedded in the placement slot 20 is designated as the orientation. The wiring groove 30 extends in the opposite direction to the first direction X, allowing the wiring groove 30 to penetrate the side of the main body 10 in the opposite direction to the first direction X. This enables the electronic device to be embedded into the placement slot 20 after the connecting wire is connected. During placement, the connecting wire is embedded into the wiring groove 30 along the first direction X, meaning the connecting wire can pass through the side of the main body 10 in the opposite direction to the first direction X, thus embedding into the wiring groove 30. This design avoids the problem of the electronic device being embedded in the placement slot 20 obstructing the view of the connecting wire, thus preventing difficulties in aligning and connecting the electronic device and the connecting wire.
[0026] like Figure 1-3 As shown, the main body 10 includes a first side 11 and a second side 12 facing each other. The direction from the first side 11 to the second side 12 is designated as the second direction Y. The third direction Z is perpendicular to the first direction X and perpendicular to the second direction Y. The placement groove 20 extends along the second direction Y, and the wiring groove 30 extends along the third direction Z. Compared to the embodiment where the placement groove 20 has a wiring groove 30 on its bottom wall 26, the perpendicular arrangement of the placement groove 20 and the wiring groove 30 prevents the connecting wire from passing through the first side 11 or the second side 12, thereby reducing the space required in the second direction Y during use.
[0027] Specifically, the first direction X is the height direction of the bracket 100, the second direction Y is the length direction of the bracket 100, and the third direction Z is the width direction of the bracket 100.
[0028] like Figure 1 as well as Figure 2 As shown, the placement slot 20 extends through the first side 11 and the second side 12, so that the size of the electronic device placed in the placement slot 20 in the second direction Y can be larger than the size of the bracket 100 in the second direction Y, so as to adapt to the electronic device with a larger size in the second direction Y and increase the adaptability of the bracket 100.
[0029] like Figure 1-3As shown, the bottom wall 26 of the placement slot 20 has a first heat dissipation vent 21. The bottom of the electronic device has a heat dissipation window. When the electronic device is inserted into the placement slot 20, the first heat dissipation vent 21 aligns with the heat dissipation window. A flow cavity 13 is provided inside the main body 10, and the first heat dissipation vent 21 connects to the flow cavity 13. The main body 10 also has a second heat dissipation vent 14, which connects the flow cavity 13 to the outside, thereby sequentially connecting the internal cavity of the electronic device, the heat dissipation window, the first heat dissipation vent 21, the flow cavity 13, the second heat dissipation vent 14, and the outside.
[0030] When the heat dissipation window serves as the air inlet for the electronic device, the airflow passes through the second heat dissipation port 14, the flow cavity 13, and the first heat dissipation port 21 to reach the heat dissipation window, as shown by the dotted line in the figure. This allows the electronic device to draw air from the outside through the airflow channel formed by the main body 10, ensuring adequate air intake and heat dissipation. It also prevents blockage of the heat dissipation window from affecting the heat dissipation effect and thus the user experience.
[0031] When the heat dissipation window is the air outlet of the electronic device, the hot air generated by the electronic device flows through the heat dissipation window, the first heat dissipation vent 21, the flow cavity 13 and the second heat dissipation vent 14 to reach the outside. This allows the electronic device to exhaust the hot air to the outside through the airflow channel formed by the main body 10, ensuring the heat dissipation of the electronic device and thus avoiding heat accumulation and avoiding affecting the user experience.
[0032] like Figure 1-3 As shown, the second heat dissipation vent 14 is located on one side of the first heat dissipation vent 21 in the first direction X. This allows the exhaust airflow to flow from the first heat dissipation vent 21 along the first direction X, and then flow towards the second heat dissipation vent 14; or the intake airflow to flow from the second heat dissipation vent 14 in the direction of airflow entering the flow cavity 13, and then flow in the opposite direction of the first direction X, to reach the first heat dissipation vent 21. Compared to the latter, where the second heat dissipation vent 14 is located on the side of the first heat dissipation vent 21 in the opposite direction of the first direction X, the airflow in the latter requires at least two turns, resulting in greater wind resistance and affecting the heat dissipation effect of the electronic device. The latter's two turns of flow are as follows: flowing along the first direction X, then along the second direction Y or a third direction Z, and then flowing in the opposite direction of the first direction X. By positioning the second heat dissipation vent 14 on one side of the first heat dissipation vent 21 in the first direction X, wind resistance is reduced, ensuring airflow, and thus ensuring the heat dissipation effect of the electronic device.
[0033] In this embodiment, the second heat dissipation vent 14 is located on the side of the main body 10 in the third direction Z, and is located on the side of the first heat dissipation vent 21 in the first direction X, that is, the setting height of the second heat dissipation vent 14 is less than the setting height of the first heat dissipation vent 21. This allows airflow to enter the flow cavity 13 from the second heat dissipation vent 14 on the back side of the main body 10 and flow upward to the first heat dissipation vent 21, or airflow to enter the flow cavity 13 from the first heat dissipation vent 21 on the bottom wall 26 of the placement groove 20 and flow backward to the second heat dissipation vent 14.
[0034] In some embodiments, the second heat dissipation vent 14 is disposed on the first side 11 or the second side 12 of the main body 10 or on the side of the main body 10 opposite to the third direction Z, and the second heat dissipation vent 14 is located on the side of the first heat dissipation vent 21 in the first direction X, that is, the setting height of the second heat dissipation vent 14 is less than the setting height of the first heat dissipation vent 21.
[0035] In other embodiments, the second heat dissipation vent 14 is located on the side opposite to the first heat dissipation vent 21 in the first direction X, that is, the setting height of the second heat dissipation vent 14 is greater than the setting height of the first heat dissipation vent 21. Specifically, the setting height of the second heat dissipation vent 14 is higher than the bottom wall 26 of the placement groove 20, that is, at least one side wall constituting the placement groove 20 is hollowed out and connected to the flow cavity 13, and the second heat dissipation vent 14 is located on the outer side of the main body 10. Compared with the aforementioned embodiments, this embodiment has greater wind resistance, which is not conducive to airflow and heat dissipation of electronic devices.
[0036] Since heat dissipation vents are generally designed to extend along the bottom surface of electronic devices to increase their size and ensure effective heat dissipation, the first heat dissipation vent 21 is also designed to extend along the second direction Y to accommodate the heat dissipation vent. This results in a decrease in the mechanical strength of the bracket 100, specifically a decrease in the mechanical strength of the bottom wall 26 of the placement groove 20, making the bracket 100 more susceptible to damage.
[0037] like Figure 1-3 As shown, the first heat dissipation port 21 in this embodiment is provided with a plurality of grilles 22 to ensure the mechanical strength of the first heat dissipation port 21 and to avoid damage to the bracket 100.
[0038] like Figure 2-3 As shown, the flow cavity 13 is provided with several reinforcing ribs 131. The mechanical strength of the bracket 100 is ensured by the setting of the reinforcing ribs 131, and the bracket 100 is prevented from being damaged.
[0039] In some embodiments, the reinforcing rib 131 is disposed in the airflow portion of the flow cavity 13. The reinforcing rib 131 extends at least partially along the direction from the first heat dissipation port 21 to the second heat dissipation port 14 to ensure airflow and avoid affecting the heat dissipation effect of the electronic device.
[0040] When electronic devices are embedded in the placement slot 20, they are often placed at an angle, resulting in only part of the heat dissipation vent aligning with part of the heat dissipation window, which restricts airflow and affects the heat dissipation effect of the electronic devices.
[0041] like Figure 1 as well as Figure 3 As shown, the bottom wall 26 of the placement slot 20 is provided with a recessed groove 23, and the first heat dissipation vent 21 is disposed on the bottom surface of the recessed groove 23. By setting the recessed groove 23, the first heat dissipation vent 21 is prevented from being in close contact with the bottom surface of the electronic device, so that the electronic device and the first heat dissipation vent 21 are separated by the height of the recessed groove 23. Airflow can pass through the recessed groove 23, ensuring airflow and thus ensuring the heat dissipation effect of the electronic device.
[0042] In some embodiments, the first heat dissipation vent 21 is provided with a grille 22 to ensure the mechanical strength of the bracket 100 at the first heat dissipation vent 21. The heat dissipation window of the electronic device is also provided with a grille 22 to ensure the mechanical strength at the heat dissipation window. When the electronic device is embedded in the placement slot 20, there may be a misalignment of the grilles 22, for example, the grille 22 of the first heat dissipation vent 21 may align with the gap between the two grilles 22 of the heat dissipation window, resulting in increased wind resistance, restricting airflow, and affecting the heat dissipation effect of the electronic device. By providing a recessed groove 23 on the bottom wall 26 of the placement slot 20, and positioning the first heat dissipation vent 21 on the bottom surface of the recessed groove 23, the first heat dissipation vent 21 is prevented from being in direct contact with the bottom surface of the electronic device. This allows the electronic device and the first heat dissipation vent to be separated by the height of the recessed groove 23, enabling airflow to pass through the recessed groove 23, ensuring airflow and thus guaranteeing the heat dissipation effect of the electronic device.
[0043] like Figure 1 as well as Figure 3 As shown, the recessed groove 23 is connected to the wiring groove 30, allowing airflow to flow into or out of the recessed groove 23 through the wiring groove 30. This allows the heat dissipation window to connect with the outside world through the recessed groove 23 and the wiring groove 30, increasing the airflow channel and ensuring the heat dissipation effect of the electronic equipment.
[0044] like Figure 1 as well as Figure 3 As shown, the placement slot 20 includes a first support surface 24, a second support surface 25, and a bottom wall 26. The bottom wall 26 connects the first support surface 24 and the second support surface 25. The second support surface 25 supports at least a portion of the back of the electronic device, the bottom wall 26 supports at least a portion of the bottom surface of the electronic device, and the first support surface 24 supports at least a portion of the bottom or front surface of the electronic device. The second support surface 25 is angled to the first direction X, such that the back of the electronic device rests against the second support surface 25. That is, when the electronic device is embedded in the placement slot 20, it forms an angle with the first direction X, causing the screen of the front of the electronic device to be tilted upwards, facilitating user access to the screen.
[0045] During the use of the bracket 100, since the screen on the front of the electronic device needs to be exposed and for easy viewing by the user, the dimension of the sidewall of the inclined second support surface 25 in the placement groove 20 in the third direction Z is larger than the dimension of the other sidewall in the third direction Z. To reduce the weight in the middle of the bracket 100, a cavity is formed inside this sidewall, which can form part of the flow cavity 13. At the same time, to ensure the mechanical strength of the main body 10, a reinforcing rib 131 is provided in this part of the flow cavity 13, that is, the reinforcing rib 131 is set inside the sidewall forming the placement groove 20 to ensure the mechanical strength of the sidewall.
[0046] like Figure 1 as well as Figure 3 As shown, the placement slot 20 includes a first support surface 24, a second support surface 25, and a bottom wall 26. The bottom wall 26 connects the first support surface 24 and the second support surface 25. The second support surface 25 supports at least a portion of the back of the electronic device, the bottom wall 26 supports at least a portion of the bottom surface of the electronic device, and the first support surface 24 supports at least a portion of the bottom or front surface of the electronic device. The dimension of the first support surface 24 in the first direction X is smaller than the dimension of the second support surface 25 in the first direction X, so as to expose the screen of the front of the electronic device, while ensuring that the first support surface 24 can support and limit the electronic device.
[0047] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.
Claims
1. A stand (100) for facilitating charging of an electronic device, used to place the electronic device, the electronic device having a first interface at its bottom, the stand (100) comprising a main body (10), the main body (10) having a placement groove (20) for placing the electronic device, the main body (10) having a wiring groove (30) connecting the bottom wall (26) of the placement groove (20) to the outside, so that a connecting wire passes through the wiring groove (30) and connects to the first interface, the direction in which the electronic device is embedded in the placement groove (20) is a first direction (X), characterized in that, The wiring groove (30) extends in the opposite direction to the first direction (X) such that the wiring groove (30) penetrates the side of the body (10) in the opposite direction to the first direction (X).
2. The stent (100) of claim 1, wherein, The main body (10) includes a first side (11) and a second side (12) facing each other. The direction from the first side (11) to the second side (12) is the second direction (Y). The third direction (Z) is perpendicular to the first direction (X) and perpendicular to the second direction (Y). The placement groove (20) extends along the second direction (Y), and the wiring groove (30) extends along the third direction (Z).
3. The bracket (100) as described in claim 2, characterized in that, The placement slot (20) extends through the first side (11) and the second side (12).
4. The stent (100) of claim 1, wherein, The bottom wall (26) of the placement slot (20) is provided with a first heat dissipation vent (21), the bottom of the electronic device is provided with a heat dissipation window, the first heat dissipation vent (21) is aligned with the heat dissipation window, the main body (10) is provided with a flow cavity (13), the first heat dissipation vent (21) is connected to the flow cavity (13), the main body (10) is provided with a second heat dissipation vent (14), the second heat dissipation vent (14) is connected to the flow cavity (13) and the outside.
5. The stent (100) of claim 4, wherein, The second heat dissipation vent (14) is located on the side of the first heat dissipation vent (21) in the first direction (X).
6. The stent (100) of claim 4, wherein, The first heat dissipation vent (21) is provided with several grilles (22).
7. The stent (100) of claim 4, wherein, The flow cavity (13) is provided with several reinforcing ribs (131).
8. The stent (100) of claim 4, wherein, The bottom wall (26) of the placement slot (20) is provided with a sinkhole (23), and the first heat dissipation port (21) is located on the bottom surface of the sinkhole (23).
9. The stent (100) of claim 8, wherein, The sinking groove (23) is connected to the wiring groove (30).
10. The stent (100) of claim 1, wherein, The placement slot (20) includes a first support surface (24), a second support surface (25), and a bottom wall (26). The bottom wall (26) connects the first support surface (24) and the second support surface (25). The second support surface (25) is used to support at least a portion of the back of the electronic device. The second support surface (25) is set at an angle to the first direction (X).