A sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device

Abstract

This utility model relates to a sheet metal stamping heat dissipation type in-vehicle dual-charger wireless charging device, including a shell assembly, a coil assembly, a control motherboard, and a cooling fan. The shell assembly includes a top cover and a sheet metal stamping base, which is made of galvanized steel sheet. The sheet metal stamping base includes a heat dissipation contact surface, a motherboard assembly area, and a fan mounting position. The heat dissipation contact surface has a planar structure, the motherboard assembly area has a mounting boss, and the fan mounting position has a threaded hole. This utility model provides a sheet metal stamping heat dissipation type in-vehicle dual-charger wireless charging device that replaces the die-cast aluminum solution with a sheet metal stamping base, thereby reducing manufacturing costs while improving the base's vibration resistance and deformation resistance, optimizing the uniformity of the heat dissipation path, and enhancing the vehicle's environmental adaptability.

Description

Technical Field

[0001] This utility model relates to the field of new energy vehicle electronic equipment technology, specifically a sheet metal stamping heat dissipation dual-device wireless charging device for in-vehicle environments, which can simultaneously provide wireless charging services for mobile devices such as mobile phones and smartwatches. Background Technology

[0002] With the development of smart cockpit technology, the demand for wireless charging for multiple devices in vehicles is increasing. Currently, mainstream in-vehicle dual-charging wireless charging devices generally use die-cast aluminum alloy as the heat dissipation base. However, this solution has gradually revealed several technical limitations in long-term application. Regarding structural reliability, the non-uniform cooling of molten metal within the mold cavity during die casting may lead to residual stress accumulation inside the base, especially in areas with significant differences in wall thickness (such as the interface between reinforcing ribs and panels). This stress, under the combined effects of vehicle vibration and temperature cycling, may cause microscopic deformation of the base, thus affecting the bonding stability of the heat dissipation interface. In terms of manufacturing costs, the die casting process requires maintaining the metal in a molten state, resulting in relatively high energy consumption and mold maintenance costs. Furthermore, there is room for improvement in the yield rate of thin-walled structures. Regarding thermal management, while aluminum alloy has certain advantages in thermal conductivity, heat accumulation in localized areas is still common in high-power dual-device charging scenarios, often requiring forced cooling by high-speed fans, which may introduce additional noise. Existing technologies attempt to improve heat dissipation by optimizing airflow design or increasing the density of heat dissipation fins, but these have not fundamentally solved the bottlenecks caused by the base material and structure. Therefore, there is an urgent need to explore a new heat dissipation base solution that takes into account structural stability, production economy, and thermal management balance. Utility Model Content

[0003] In view of this, the present invention provides a sheet metal stamping heat dissipation type vehicle dual wireless charging device, which replaces the die-cast aluminum solution with a sheet metal stamping base, thereby reducing manufacturing costs while improving the base's vibration resistance and deformation resistance, optimizing the uniformity of the heat dissipation path, and enhancing the vehicle's environmental adaptability.

[0004] The objective of this utility model is achieved through the following technical solution: A sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device includes a housing assembly, a coil assembly, a control motherboard, and a cooling fan; the housing assembly includes a top cover and a sheet metal stamping base, the sheet metal stamping base being made of galvanized steel sheet; the sheet metal stamping base includes a heat dissipation contact surface, a motherboard assembly area, and a fan mounting position; the heat dissipation contact surface has a planar structure, the motherboard assembly area is provided with a mounting boss, and the fan mounting position is provided with a threaded hole.

[0005] The base structure, formed by stamping galvanized steel sheet, exhibits higher structural stability and deformation resistance under vehicle vibration environments compared to traditional die-cast aluminum bases. The threaded hole design for the fan mounting position ensures a secure installation of the cooling fan and guarantees directional airflow. The galvanized steel sheet material not only possesses excellent stamping adaptability, simplifying the production process, but its inherent corrosion resistance also effectively resists the humid heat and salt spray corrosion of the vehicle environment. The planar heat dissipation contact surface increases the heat conduction area, and combined with forced convection from the fan, significantly improves heat dissipation efficiency. This integrated base design ensures dual-device wireless charging functionality while addressing the core requirements of compact layout, high reliability, and long lifespan in automotive scenarios.

[0006] Preferably, the sheet metal stamping base and the upper cover are connected by a snap-fit ​​assembly, which includes symmetrically arranged elastic hooks and matching slots.

[0007] The symmetrically distributed elastic hooks and slots forming a snap-fit ​​assembly enable tool-free, rapid assembly of the base and top cover, significantly improving production and assembly efficiency. The elastic hooks deform upon locking, forming a tight interlock with the slots through rebound force, effectively resisting multi-directional vibrations and impacts during vehicle operation. Compared to traditional screw fixing methods, this connection structure eliminates the need for threaded hole machining, reducing manufacturing costs and avoiding the risk of component loosening due to stripped threads. The symmetrical layout of the snap-fit ​​assembly ensures uniform stress distribution, preventing shell deformation caused by localized stress concentration and ensuring the sealing integrity of the outer shell assembly under alternating temperature environments. The elastic hook design also facilitates disassembly and maintenance, providing convenience for internal component inspection.

[0008] Preferably, a thermally conductive medium layer is provided between the control motherboard and the heat dissipation contact surface.

[0009] A thermally conductive dielectric layer is an optimization option, not a necessity. This layer fills the microscopic gaps between the coil support and the heat dissipation contact surface, eliminating thermal resistance bottlenecks caused by air gaps and significantly improving interfacial heat conduction efficiency. This layer can be made of flexible thermal pads or phase change materials to adapt to unevenness on the base surface, ensuring uniform heat dissipation across the entire heat dissipation contact surface. The dielectric layer also acts as a mechanical buffer, absorbing micro-vibrations caused by vehicle bumps and protecting the coil assembly solder joints from fatigue damage. Its electrical insulation properties prevent short-circuit risks between the metal base and the coil assembly, enhancing system safety.

[0010] Preferably, the control motherboard is mounted and fixed on the mounting boss, and the control motherboard is equipped with a temperature detection unit.

[0011] The mounting boss provides a raised mounting platform for the control motherboard, increasing the airflow space between the bottom of the motherboard and the base, and assisting in natural convection cooling. Screw fastening ensures the mechanical stability of the motherboard under strong vibration environments and prevents connectors from loosening. A temperature detection unit monitors the temperature rise in critical areas in real time, providing data support for intelligent temperature control strategies. When overheating risk is detected, it can automatically reduce charging power or increase fan speed to avoid thermal damage to electronic components. This design achieves a balance between hardware protection and performance optimization.

[0012] Preferably, the cooling fan is a centrifugal fan, which is fixed to the fan mounting position by screws; the fan mounting position is located on the back side of the heat dissipation contact surface and is directly opposite the heat dissipation air duct formed by the heat dissipation contact surface.

[0013] Centrifugal fans deliver high-pressure airflow within a limited space, and their optimized blade structure enables low-noise operation, meeting the quiet requirements of automotive environments. Screws secure the fan to a dedicated mounting point, ensuring a rigid connection between the fan and the base and preventing vibration resonance. The fan is positioned on the back side of the heat dissipation contact surface and directly opposite the air duct inlet, allowing forced airflow to penetrate the base's heat dissipation area and directly flush the dense heat source area, improving the convective heat transfer coefficient. This layout maximizes the use of the airflow path, avoids ineffective diffusion, and significantly enhances heat dissipation efficiency.

[0014] Preferably, the inner surface of the upper cover is provided with a support column coaxial with the mounting boss, and the support column and the mounting boss together clamp and fix the control motherboard.

[0015] The support column and the mounting boss on the base form a coaxial clamping structure, subjecting the control motherboard to bidirectional clamping force and eliminating vibration and swaying caused by unilateral fixation. This design disperses stress distribution on the motherboard, reducing the risk of solder joint fatigue failure. The height of the support column matches the mounting boss, precisely controlling the motherboard assembly clearance and avoiding excessive pressure on components. The dual-point fixing mode enhances the motherboard's impact resistance, adapting to high-intensity vibrations under off-road conditions.

[0016] Preferably, the edge of the sheet metal stamping base is provided with an anti-deformation flange.

[0017] The vertical flange structure at the base edge significantly enhances the overall bending stiffness by increasing the moment of inertia of the cross section. The flange forms a closed reinforcing frame, suppressing base warping deformation caused by temperature gradients or mechanical loads, and ensuring the stability of the fit between the heat dissipation contact surface and the coil support. The flange structure is integrally formed in the stamping process, without additional processing costs, and also provides a lateral positioning reference for the housing assembly.

[0018] Preferably, the exhaust direction of the cooling fan is towards the back of the heat dissipation contact surface, and the upper cover is provided with a ventilation grille that communicates with the exhaust direction.

[0019] The ventilation grille is precisely aligned with the fan's exhaust direction, forming a low-resistance exhaust channel and avoiding energy loss caused by turbulent airflow. The grille's angle guides hot air away from the charging equipment, preventing hot air from flowing back into the air intake. The grille blade density design balances dust prevention and ventilation efficiency, reducing the risk of foreign objects entering the cavity. This structure optimizes the heat dissipation synergy between the vehicle's air conditioning system and the charging device.

[0020] The advantages of this utility model compared to the prior art are: Enhanced Structural Reliability and Environmental Adaptability: The base structure, formed from galvanized steel sheet by sheet metal stamping, benefits from material homogeneity, reducing internal stress issues caused by variations in wall thickness. The combination of a planar heat dissipation contact surface created by the stamping process and an edge-resistant flange design enhances the overall rigidity of the base under mechanical vibration conditions, reducing the risk of plastic deformation during long-term use. The galvanized surface's resistance to humid air and road salt spray contributes to extending service life in automotive environments. The partitioned base design physically isolates the heat dissipation contact surface, motherboard assembly area, and fan mounting location, helping to control heat flow paths and reduce mechanical interference between modules.

[0021] Optimized thermal management efficiency: The continuous planar structure of the heat dissipation contact surface provides a stable heat conduction interface for the control motherboard. Combined with an optional thermally conductive layer, this can potentially improve interface thermal resistance. The centrifugal fan's layout, facing the back of the heat dissipation contact surface, allows forced airflow to concentrate over the main heat source areas, improving convective heat transfer efficiency. The introduction of thermal insulation structures helps block radial heat conduction to the motherboard area, creating a relatively low-temperature operating environment for electronic components. The matching design of the ventilation grille and fan exhaust direction can potentially reduce energy loss caused by airflow vortices.

[0022] Improved production economics: The simplified process characteristics and increased material utilization of sheet metal stamping contribute to reduced manufacturing costs. Snap-fit ​​components replacing traditional threaded connections may reduce assembly time and avoid the risk of thread failure. The integrated molding design of the base's functional zones helps reduce subsequent machining steps.

[0023] User experience optimization: The coordinated control strategy between the temperature detection unit and the fan can reduce noise levels while maintaining heat dissipation efficiency. The dual independent coil layout supports the charging needs of devices of different sizes. The modular assembly structure facilitates maintenance. These features positively impact user satisfaction in on-board charging scenarios. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a structural diagram of a sheet metal stamping base according to an embodiment of the present invention.

[0026] Figure 2 This is a structural diagram of a sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device according to an embodiment of the present invention.

[0027] Figure 3 This is a perspective view of a sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device according to an embodiment of the present invention.

[0028] Figure 4 This is a structural diagram of a coil assembly according to an embodiment of the present invention.

[0029] Figure 5 This is a structural diagram of the cover of one embodiment of the present utility model.

[0030] Labeling Explanation: 100 Housing Assembly, 101 Top Cover, 102 Sheet Metal Stamping Base, 103 Heat Dissipation Contact Surface, 104 Motherboard Assembly Area, 105 Fan Mounting Position, 106 Mounting Boss, 107 Threaded Hole, 200 Clip Assembly, 201 Elastic Hook, 202 Matching Slot, 300 Coil Assembly, 400 Support Column, 500 Control Motherboard, 600 Cooling Fan, 700 Anti-deformation Flanged Edge, 800 Ventilation Grille. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0033] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of the embodiments of this application, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0035] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0036] This embodiment provides a sheet metal stamping heat dissipation type vehicle dual wireless charging device, including a housing assembly 100, a coil assembly 300, a control motherboard 500, and a cooling fan 600; the housing assembly 100 includes a top cover 101 and a sheet metal stamping base 102, the sheet metal stamping base 102 being made of galvanized steel sheet; the sheet metal stamping base 102 includes a heat dissipation contact surface 103, a motherboard assembly area 104, and a fan fixing position 105; the heat dissipation contact surface 103 is a planar structure, the motherboard assembly area 104 is provided with a mounting boss 106, and the fan fixing position 105 is provided with a threaded hole 107.

[0037] The base structure, formed by stamping galvanized steel sheet, exhibits higher structural stability and deformation resistance under vehicle vibration conditions compared to traditional die-cast aluminum bases. The partitioned design of the base—including the heat dissipation contact surface 103, the motherboard assembly area 104, and the fan mounting position 105—achieves physical isolation of functional modules: the heat dissipation contact surface 103 directly bears the heat from the coil assembly 300, preventing heat conduction to the motherboard area; the mounting boss 106 of the motherboard assembly area 104 provides precise positioning and mechanical support for the control motherboard 500, reducing the risk of solder joint cracking due to vibration; and the threaded hole 107 of the fan mounting position 105 ensures the stable installation of the cooling fan 600 and guarantees directional airflow. The galvanized steel sheet material not only possesses excellent stamping adaptability, simplifying the production process, but its inherent corrosion resistance also effectively resists the humid heat and salt spray corrosion of the vehicle environment. The planar structure of the heat dissipation contact surface 103 increases the heat conduction area, which, combined with forced convection from the fan, significantly improves heat dissipation efficiency. This integrated base design ensures wireless charging for both devices while also meeting the core requirements of automotive scenarios for compact layout, high reliability, and long lifespan.

[0038] In this embodiment, the sheet metal stamping base 102 and the upper cover 101 are connected by a snap-fit ​​assembly 200, which includes symmetrically arranged elastic hooks 201 and matching slots 202.

[0039] The snap-fit ​​assembly 200, composed of symmetrically distributed elastic hooks 201 and slots 202, enables tool-free rapid assembly of the base and top cover 101, significantly improving production assembly efficiency. The elastic hooks 201 deform upon locking, forming a tight interlock with the slots 202 through rebound force, effectively resisting multi-directional vibrations and impacts during vehicle operation. Compared to traditional screw fixing methods, this connection structure eliminates the machining process for the threaded hole 107, reducing manufacturing costs and avoiding the risk of component loosening due to thread stripping. The symmetrical layout of the snap-fit ​​assembly 200 ensures uniform stress distribution, preventing shell deformation caused by localized stress concentration and ensuring the sealing integrity of the outer shell assembly 100 under alternating temperature environments. The design of the elastic hooks 201 also facilitates disassembly and maintenance, providing convenience for internal component inspection.

[0040] In this embodiment, the coil assembly 300 includes two independent electromagnetic induction coils, a magnetic sheet, and a coil bracket; the electromagnetic induction coils and the magnetic sheet are fixed on the coil bracket, and the coil bracket is fixedly installed on the upper surface of the control motherboard 500 by screws or clips.

[0041] The parallel design of two independent electromagnetic induction coils supports the synchronous charging needs of mobile phones, watches, or earphones. The magnetic sheet concentrates the magnetic field line, reducing energy leakage and improving power transmission efficiency. The coil bracket, as an integrated carrier, directly adheres to the heat dissipation contact surface 103 of the base through its bottom plane, creating an efficient heat conduction path so that the Joule heat generated during coil operation can be quickly dissipated to the metal base. The integrated fixation of the coil and magnetic sheet by the bracket prevents positional displacement caused by vibration, ensuring accurate positioning of the charging area. This structure eliminates the additional heat dissipation interface layer in traditional solutions, simplifying the assembly process and reducing contact thermal resistance, which helps maintain the coil's low-temperature operating state.

[0042] In this embodiment, a thermally conductive medium layer is provided between the control motherboard 500 and the heat dissipation contact surface 103.

[0043] This thermally conductive layer fills the microscopic gaps between the bottom of the control motherboard 500 and the heat dissipation contact surface 103 of the base, eliminating the thermal resistance bottleneck caused by air gaps and significantly improving the interface heat conduction efficiency. This layer can be made of flexible thermally conductive pads or phase change materials to adapt to possible unevenness on the base surface, ensuring that heat can be evenly diffused across the entire heat dissipation contact surface 103. This layer also acts as a mechanical buffer, absorbing the micro-vibrations caused by vehicle bumps and protecting the motherboard solder joints from fatigue damage. Its electrical insulation properties also prevent the risk of short circuits between the metal base and the control motherboard 500, enhancing system safety.

[0044] In this embodiment, the control motherboard 500 is mounted and fixed on the mounting boss 106, and the control motherboard 500 is equipped with a temperature detection unit.

[0045] Mounting boss 106 provides a raised mounting platform for the control motherboard 500, increasing the airflow space between the bottom of the motherboard and the base, and assisting in natural convection cooling. Screw fastening ensures the mechanical stability of the motherboard under strong vibration environments and prevents connector loosening. A temperature detection unit monitors the temperature rise of critical areas in real time, providing data support for intelligent temperature control strategies. When overheating risk is detected, it can automatically reduce charging power or increase fan speed to avoid thermal damage to electronic components. This design achieves a balance between hardware protection and performance optimization.

[0046] In this embodiment, the cooling fan 600 is a centrifugal fan, which is fixed to the fan mounting position 105 by screws; the fan mounting position 105 is located on the back side of the heat dissipation contact surface 103 and faces the heat dissipation contact surface 103 to form a heat dissipation airflow.

[0047] The centrifugal fan delivers high-pressure airflow within a limited space, and its optimized blade structure enables low-noise operation, meeting the quiet requirements of automotive environments. Screws secure the fan to a dedicated fan mounting position 105, ensuring a rigid connection between the fan and the base and preventing vibration resonance. The fan is positioned on the back side of the heat dissipation contact surface 103 and directly opposite the air duct inlet, allowing forced airflow to concentrate and penetrate the base's heat dissipation area, directly scouring areas with high heat density and improving the convective heat transfer coefficient. This layout maximizes the use of the airflow path, avoids ineffective diffusion, and significantly enhances heat dissipation efficiency.

[0048] In this embodiment, the inner surface of the upper cover 101 is provided with a support column 400 coaxial with the mounting boss 106, and the support column 400 and the mounting boss 106 together clamp and fix the control motherboard 500.

[0049] The support column 400 and the base mounting boss 106 form a coaxial clamping structure, allowing the control motherboard 500 to withstand bidirectional clamping force and eliminating vibration and swaying caused by unilateral fixation. This design disperses the stress distribution on the motherboard, reducing the risk of solder joint fatigue failure. The height of the support column 400 matches the mounting boss 106, precisely controlling the motherboard assembly clearance and avoiding excessive pressure on components. The dual-point fixing mode enhances the motherboard's impact resistance and adapts to high-intensity vibrations under off-road conditions.

[0050] In this embodiment, the edge of the sheet metal stamping base 102 is provided with an anti-deformation flange 700.

[0051] The vertical flange structure at the base edge significantly enhances the overall bending stiffness by increasing the moment of inertia of the cross section. The flange forms a closed reinforcing frame, suppressing base warping deformation caused by temperature gradients or mechanical loads, and ensuring the stability of the fit between the heat dissipation contact surface 103 and the coil support. The flange structure is integrally formed in the stamping process, without additional processing costs, and at the same time provides a lateral positioning reference for the housing assembly 100.

[0052] In this embodiment, the exhaust direction of the cooling fan 600 is towards the back of the heat dissipation contact surface 103, and the upper cover 101 is provided with a ventilation grille 800 that communicates with the exhaust direction.

[0053] The ventilation grille 800 is precisely aligned with the fan's exhaust direction, forming a low-resistance exhaust channel and avoiding energy loss caused by airflow turbulence. The grille's angle guides hot air away from the charging equipment, preventing hot air from flowing back into the air intake. The grille blade density design balances dust prevention and ventilation efficiency, reducing the risk of foreign objects entering the cavity. This structure optimizes the heat dissipation coordination between the vehicle's air conditioning system and the charging device.

[0054] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sheet metal stamping heat dissipation type vehicle-mounted dual charging wireless charging device, characterized in that, include: Housing assembly (100), coil assembly (300), control board (500) and cooling fan (600); The outer casing assembly (100) includes a top cover (101) and a sheet metal stamping base (102), wherein the sheet metal stamping base (102) is made of galvanized steel plate; The sheet metal stamping base (102) includes a heat dissipation contact surface (103), a motherboard assembly area (104), and a fan fixing position (105). The heat dissipation contact surface (103) is a planar structure, the motherboard assembly area (104) is provided with a mounting boss (106), and the fan fixing position (105) is provided with a threaded hole (107).

2. The sheet metal stamping heat sink type vehicle-mounted dual charging wireless charging device according to claim 1, characterized in that, The sheet metal stamping base (102) and the top cover (101) are connected by a snap-fit ​​assembly (200), which includes symmetrically arranged elastic hooks (201) and matching slots (202).

3. The sheet metal stamping heat sink on-board dual charging wireless charging device of claim 1, wherein, The coil assembly (300) includes two independent electromagnetic induction coils, a magnetic sheet, and a coil support; the electromagnetic induction coils and the magnetic sheet are fixed on the coil support, and the coil support is fixedly installed on the control board (500) so that the heat of the coil assembly (300) can be conducted to the control board (500).

4. The sheet metal stamping heat sink type vehicle-mounted dual charging wireless charging device according to claim 3, characterized in that, A heat-conducting medium layer is provided between the control motherboard (500) and the heat dissipation contact surface (103).

5. The sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device according to claim 1, characterized in that, The control motherboard (500) is mounted and fixed on the mounting boss (106).

6. The sheet metal stamping heat sink on-board dual charging wireless charging device of claim 1, wherein, The control motherboard (500) is equipped with a temperature detection unit.

7. The sheet metal stamping heat sink on-board dual charging wireless charging device of claim 1, wherein, The cooling fan (600) is a centrifugal fan and is fixed to the fan mounting position (105) by screws. The fan mounting position (105) is located on the back side of the heat dissipation contact surface (103) and faces the heat dissipation contact surface (103) to form a heat dissipation airflow.

8. The sheet metal stamping heat dissipation type vehicle-mounted dual wireless charging device according to claim 1, characterized in that, The inner surface of the upper cover (101) is provided with a support column (400) coaxial with the mounting boss (106), and the support column (400) and the mounting boss (106) together clamp and fix the control motherboard (500).

9. The sheet metal stamping heat sink on-board dual charging wireless charging device of claim 1, wherein, The edge of the sheet metal stamping base (102) is provided with an anti-deformation flange (700).

10. The sheet metal stamping heat sink on-board dual charging wireless charging device of claim 1, wherein, The exhaust direction of the cooling fan (600) is toward the back of the heat dissipation contact surface (103), and the upper cover (101) is provided with a ventilation grille (800) that communicates with the exhaust direction.

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