Power integrated devices and inverters

Abstract

This application relates to the field of motor controller technology, and more particularly to a power integrated device and an inverter. The power integrated device provided by this application includes: a power module, which includes a first housing and a conversion component disposed within the first housing, the conversion component being used to convert direct current (DC) to alternating current (AC); and a capacitor module, disposed in the same direction as the power module, the capacitor module including a second housing and a DC output busbar assembly, a capacitor core winding, and a DC input copper busbar assembly disposed in the second housing, the DC input copper busbar assembly being connected to the capacitor core winding via the DC output busbar assembly; wherein, the end of the DC output busbar assembly extends a predetermined length towards the power module and is bent, and the end of the DC output busbar assembly is ultrasonically welded to the conversion component, thereby connecting the capacitor module and the power module. The power integrated device provided by this application can save assembly components and simplify the assembly process, thereby reducing assembly costs and improving assembly efficiency.

Description

Technical Field

[0001] This application relates to the field of motor controller technology, and more particularly to a power integrated device and an inverter. Background Technology

[0002] Motor controllers are commonly used in new energy vehicles and play a decisive role in the overall vehicle power performance. A motor controller typically includes an inverter system and control circuitry, used to invert the DC power from the vehicle's main battery into the three-phase AC power required by the vehicle's drive motor. The inverter system, as the core unit, affects the vehicle's reliability and range.

[0003] In related technologies, the inverter system includes a power module and a bus capacitor. The power module and the bus capacitor are respectively equipped with busbar structures, and then the assembly between the power module and the bus capacitor is achieved by bolt connection or laser welding between the busbar structures.

[0004] However, the assembly process between the power module and the bus capacitor is relatively complex, resulting in high assembly costs. Utility Model Content

[0005] This application provides a power integrated device and an inverter to solve the problem that the current assembly process between power modules and bus capacitors is relatively complex, resulting in high assembly costs.

[0006] To achieve the above objectives, the technical solution of this application is as follows:

[0007] On one hand, this application provides a power integrated device, including: a power module, the power module including a first housing and a conversion component disposed in the first housing, the conversion component being used to convert direct current into alternating current; a capacitor module, disposed in the same direction as the power module, the capacitor module including a second housing and a DC output busbar assembly, a capacitor core roll and a DC input copper busbar assembly disposed in the second housing, the DC input copper busbar assembly being connected to the capacitor core roll through the DC output busbar assembly to input direct current to the capacitor core roll; wherein, the end of the DC output busbar assembly extends a predetermined length in the direction toward the power module and is bent, and the end of the DC output busbar assembly is ultrasonically welded to the conversion component to connect the capacitor module and the power module.

[0008] In one possible implementation, the power integrated device provided in this application includes a DC output bus assembly comprising a first bus and a second bus. The first bus is provided with a first DC output terminal, and the second bus is provided with a second DC output terminal. The first DC output terminal and the second DC output terminal are at least partially stacked and are both connected to the conversion component.

[0009] In one possible implementation, the power integrated device provided in this application has a first pin assembly at the end of the first DC output terminal facing the conversion component, and the first pin assembly has a gap; the second DC output terminal at the end facing the conversion component has a second pin assembly at the gap, and both the first pin assembly and the second pin assembly are connected to the conversion component.

[0010] In one possible implementation, the power integrated device provided in this application includes a conversion component comprising an insulating substrate, a chip connected to the insulating substrate, and an AC terminal for connecting to a drive motor to output AC power to the drive motor; wherein the first pin assembly and the second pin assembly are both connected to the insulating substrate.

[0011] In one possible implementation, the power integrated device provided in this application includes a DC input copper busbar assembly comprising a first DC input copper busbar and a second DC input copper busbar. The first DC input copper busbar is connected to a first busbar, and the second DC input copper busbar is connected to a second busbar. The first DC input copper busbar and the second DC input copper busbar are arranged alternately.

[0012] In one possible implementation, the power integrated device provided in this application further includes a first potting layer, a first busbar, a capacitor core roll, and a second busbar arranged sequentially along a first direction; the first busbar is provided with a heat dissipation part, which protrudes from the surface of the first busbar and extends to the surface of the first potting layer.

[0013] In one possible implementation, the power integrated device provided in this application further includes an insulating element and a heat dissipation module, with the insulating element covering at least a portion of the capacitor module; the heat dissipation module includes a cooling component and a first heat dissipation element, and the power module, cooling component, first heat dissipation element and capacitor module are arranged sequentially in the same direction.

[0014] In one possible implementation, the power integrated device provided in this application has a second heat sink on the side of the first housing facing the cooling assembly; the cooling assembly includes a first cooling component and a second cooling component communicating with the first cooling component, wherein the second heat sink is embedded in the first cooling component and the second cooling component is connected to the capacitor module through the first heat sink.

[0015] In one possible implementation, the power integrated device provided in this application has a first connection portion and a second connection portion respectively provided on the side of the heat dissipation module facing the power module and the side facing the bus capacitor; the periphery of the second heat dissipation component has a pair of third connection portions, which are connected to the first connection portions one by one; the periphery of the second housing has at least two fourth connection portions, and each fourth connection portion is located on two intersecting or opposite sides, which are connected to the second connection portions one by one.

[0016] On the other hand, this application provides an inverter that includes the aforementioned power integration device.

[0017] The power integration device and inverter provided in this application include a power module and a capacitor module. The capacitor module includes a second housing and a DC output busbar assembly, a capacitor core winding, and a DC input copper busbar assembly disposed in the second housing. Both the capacitor core winding and the DC input copper busbar assembly are connected to the DC output busbar assembly. The DC input copper busbar assembly is used to connect to an external power source, which provides DC power to the power integration device. The DC power enters the capacitor core winding through the DC input copper busbar assembly, where the capacitor core winding is charged, stores electrical energy, and smooths the voltage. The power module includes a first housing and a conversion assembly disposed in the first housing. By extending and bending the end of the DC output busbar assembly in the direction toward the power module, the end of the DC output busbar assembly contacts the conversion assembly. Then, the DC output busbar assembly and the conversion assembly are connected by ultrasonic welding, thereby connecting the capacitor module and the power module. This enables the DC output busbar assembly to input DC power to the conversion assembly, which then converts the DC power into AC power. After the capacitor module is connected to the power module, the power module is then encapsulated with potting compound. In this way, the capacitor module and the power module are connected by ultrasonic welding between the DC output busbar assembly and the conversion assembly, which can save assembly parts and simplify the assembly process, thereby reducing assembly costs and improving assembly efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the power integrated device provided in the embodiments of this application;

[0020] Figure 2 for Figure 1 Another structural diagram from a different perspective;

[0021] Figure 3 for Figure 1 A structural diagram from another perspective;

[0022] Figure 4 for Figure 1 Exploded view;

[0023] Figure 5 for Figure 4 Schematic diagram of the medium power module;

[0024] Figure 6 A schematic diagram of the capacitor module provided in the embodiments of this application. Figure 1 ;

[0025] Figure 7 for Figure 6 Exploded view of the structure of the DC output busbar assembly;

[0026] Figure 8 for Figure 6 A schematic diagram showing the connection between the DC output busbar assembly and the capacitor core winding;

[0027] Figure 9 A schematic diagram of the capacitor module provided in the embodiments of this application. Figure 2 ;

[0028] Figure 10 This is another connection diagram of the power module and capacitor module provided in an embodiment of this application;

[0029] Figure 11 This is another schematic diagram showing the connection between the power module and the capacitor module provided in an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10-Power integrated devices;

[0032] 100-Power Module;

[0033] 110 - First housing; 111 - Second heat sink; 1111 - Heat sink column; 112 - Third connecting part;

[0034] 120 - Conversion component; 121 - Insulating substrate; 122 - Chip; 123 - AC terminal;

[0035] 200-Capacitor Module;

[0036] 210 - Second housing; 211 - Fourth connecting part;

[0037] 220 - DC output busbar assembly; 221 - First busbar; 2211 - First DC output terminal; 2212 - First pin assembly; 2213 - Heat sink; 2214 - Gap; 222 - Second busbar; 2221 - Second DC output terminal; 2222 - Second pin assembly;

[0038] 230 - Capacitor core roll;

[0039] 240 - DC input copper busbar assembly; 241 - First DC input copper busbar; 242 - Second DC input copper busbar;

[0040] 250 - First potting layer;

[0041] 300 - Insulating parts;

[0042] 400 - Heat dissipation module;

[0043] 410 - Cooling assembly; 411 - First cooling component; 4111 - Seal; 412 - Second cooling component;

[0044] 420 - First heat sink;

[0045] 430 - First connecting part;

[0046] 440 - Second connecting part;

[0047] X - First direction.

[0048] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the preferred embodiments of this application will be described in more detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0050] It should be noted that in the description of the embodiments of this application, the terms "upper", "lower", "inner", "outer" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description, and do not indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application.

[0051] Furthermore, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0053] Motor controllers are commonly used in new energy vehicles and play a decisive role in the overall vehicle power performance. A motor controller typically includes an inverter system and control circuitry, used to invert the DC power from the vehicle's main battery into the three-phase AC power required by the vehicle's drive motor. The inverter system, as the core unit, affects the vehicle's reliability and range.

[0054] In related technologies, inverter systems include power modules and bus capacitors. The power modules and bus capacitors are each equipped with busbar structures, and assembly between the power modules and bus capacitors is achieved through bolt connections or laser welding between the busbar structures. However, the assembly process between the power modules and bus capacitors described above is relatively complex, resulting in high assembly costs.

[0055] In view of this, the power integration device and inverter provided in this application include a power module and a capacitor module. The capacitor module includes a second housing and a DC output busbar assembly, a capacitor core winding, and a DC input copper busbar assembly disposed in the second housing. Both the capacitor core winding and the DC input copper busbar assembly are connected to the DC output busbar assembly. The DC input copper busbar assembly is used to connect to an external power source, which provides DC power to the power integration device. The DC power enters the capacitor core winding through the DC input copper busbar assembly, where the capacitor core winding is charged, stores electrical energy, and smooths the voltage. The power module includes a first housing and a conversion assembly disposed in the first housing. By extending and bending the end of the DC output busbar assembly in the direction toward the power module, the end of the DC output busbar assembly contacts the conversion assembly. Then, the DC output busbar assembly and the conversion assembly are connected by ultrasonic welding, thereby connecting the capacitor module and the power module. This enables the DC output busbar assembly to input DC power to the conversion assembly, which then converts the DC power into AC power. After the capacitor module is connected to the power module, the power module is then encapsulated with potting compound. In this way, the capacitor module and the power module are connected by ultrasonic welding between the DC output busbar assembly and the conversion assembly, which can save assembly parts and simplify the assembly process, thereby reducing assembly costs and improving assembly efficiency.

[0056] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0057] See Figures 1 to 11 This application provides a power integrated device 10, which may include a power module 100 and a capacitor module 200. The power module 100 may include a first housing 110 and a conversion component 120 disposed within the first housing 110, the conversion component 120 being used to convert direct current into alternating current.

[0058] In one embodiment of this application, the conversion component 120 is disposed within the first housing 110. The first housing 110 can effectively prevent electrical leakage and short circuit between the conversion component 120 and the external environment, thereby improving the safety and stability of the device.

[0059] The capacitor module 200 and the power module 100 are arranged in the same direction. The capacitor module 200 includes a second housing 210 and a DC output busbar assembly 220, a capacitor core roll 230, and a DC input copper busbar assembly 240 disposed in the second housing 210. The DC input copper busbar assembly 240 is connected to the capacitor core roll 230 through the DC output busbar assembly 220 to input DC power to the capacitor core roll 230. The end of the DC output busbar assembly 220 extends a predetermined length toward the power module 100 and is bent. The end of the DC output busbar assembly 220 is ultrasonically welded to the conversion assembly 120 to connect the capacitor module 200 and the power module 100.

[0060] It is understood that the capacitor module 200 and the power module 100 can be arranged in the same direction, for example, see [reference needed]. Figure 1 , Figure 10 and Figure 11 The capacitor module 200 and the power module 100 can be arranged vertically or horizontally, and this application does not impose any restrictions on this arrangement. The arrangement of the capacitor module 200 and the power module 100 in the same direction improves the integration and practicality of the device.

[0061] For example, when the capacitor module 200 and the power module 100 are arranged horizontally, the DC output busbar assembly 220 can be led out from the upper or lower part of the capacitor module 200 and bent to the side of the capacitor module 200 to connect with the power module 100.

[0062] By providing a second housing 210, electrical leakage between the DC output busbar assembly 220, capacitor core roll 230, and DC input copper busbar assembly 240 located in the second housing 210 and the external environment can be prevented, thereby improving the safety and stability of the device.

[0063] Specifically, multiple capacitor core rolls 230 can be configured, with each capacitor core roll 230 having two sides connected to the two poles of the DC output busbar assembly 220, and the two poles of the DC input copper busbar assembly 240 correspondingly connected to the two poles of the DC output busbar, so as to realize the electrical connection between the DC input copper busbar assembly 240 and the capacitor core roll 230, thereby ensuring that the DC power output from the external power supply can be stably input into the capacitor core roll 230 for energy storage or filtering.

[0064] It should be noted that, see Figure 6 and Figure 9 The end of the DC output busbar assembly 220 can be bent at 90 degrees relative to the conversion assembly 120, or the bending angle can be greater than 90 degrees, such as 100 degrees or 110 degrees. While ensuring the electrical connection between the end of the DC output busbar assembly 220 and the conversion assembly 120, increasing the bending angle can reduce the assembly difficulty when the capacitor module 200 and the power module 100 are set in the same direction, and avoid interference problems between components in the power integration device 10.

[0065] In related technologies, the capacitor module 200 and the power module 100 are typically manufactured and packaged separately before being assembled, thus increasing the assembly process of the power integrated device 10. In this application, the capacitor module 200 is connected to the power module 100 before the power module 100 is packaged. Specifically, the end of the DC output busbar assembly 220 of the capacitor module 200 is extended by a predetermined length in the direction toward the power module 100 and bent so that the end of the DC output busbar assembly 220 can contact the conversion component 120 of the power module 100. In this way, it is not necessary to install a busbar structure connected to the capacitor module 200 on the power module 100, which can save assembly parts and reduce assembly costs.

[0066] The DC output busbar assembly 220 and the conversion assembly 120 are connected by ultrasonic welding to achieve the connection between the power module 100 and the capacitor module 200. Finally, the power module 100 is potted and encapsulated to form a second potting layer (not shown in the figure), completing the assembly of the power integrated device 10. It should be noted that the power module 100 includes an ultrasonic welding process in the manufacturing process; therefore, the connection between the DC output busbar assembly 220 and the conversion assembly 120 does not introduce additional processing steps. Thus, the power integrated device 10 provided in this application can simplify the assembly process, reduce assembly costs, and improve assembly efficiency.

[0067] Furthermore, the power module 100 and the capacitor module 200 are connected by ultrasonic welding. Compared to bolted connections and laser welding in related technologies, this application reduces stray inductance by using ultrasonic welding. Additionally, the power module 100 is encapsulated with potting compound, further reducing stray inductance while ensuring insulation.

[0068] In practical use, the DC input copper busbar assembly 240 is connected to an external power source, which provides DC power to the power integration device 10. The DC power enters the capacitor core roll 230 through the DC input copper busbar assembly 240, where it is charged, stores electrical energy, and smooths the voltage. Then, the capacitor core roll 230 outputs DC power to the DC output busbar assembly 220, which in turn inputs DC power to the conversion assembly 120. The conversion assembly 120 then converts the DC power into AC power, thus realizing the conversion between DC and AC power through the power integration device 10.

[0069] See Figure 6 and Figure 7 In some embodiments, the DC output bus assembly 220 may include a first bus 221 and a second bus 222. The first bus 221 is provided with a first DC output terminal 2211, and the second bus 222 is provided with a second DC output terminal 2221. The first DC output terminal 2211 and the second DC output terminal 2221 are at least partially stacked and are both connected to the conversion assembly 120.

[0070] In a specific implementation, the first DC output terminal 2211 can be a DC+ terminal, i.e., the positive terminal of DC output, and the second DC output terminal 2221 can be a DC- terminal, i.e., the negative terminal of DC output. The first DC output terminal 2211 and the second DC output terminal 2221 are at least partially stacked, which can form overlapping and opposite commutation circuits, thereby reducing stray inductance, reducing voltage spikes in the power module 100, and helping to reduce conversion losses and improve device performance and reliability.

[0071] The first DC output terminal 2211 can be configured as multiple, and the second DC output terminal 2221 can also be configured as multiple, corresponding to the first DC output terminal 2211 and the second DC output terminal 2221. In specific implementation, each first DC output terminal 2211 can be configured with the same bending angle or with different bending angles, and the bending angle of the second DC output terminal 2221 is matched with the bending angle of the corresponding first DC output terminal 2211.

[0072] See Figure 7In some embodiments, the end of the first DC output terminal 2211 facing the conversion component 120 has a first pin component 2212, and the first pin component 2212 is provided with a gap 2214. The end of the second DC output terminal 2221 facing the conversion component 120 has a second pin component 2222, and the second pin component 2222 is disposed in the gap 2214. Both the first pin component 2212 and the second pin component 2222 are connected to the conversion component 120.

[0073] By providing space for the arrangement of the second pin assembly 2222 through the gap 2214, the spatial layout is optimized, effectively improving the integration and space utilization of the DC output busbar assembly 220.

[0074] Understandably, placing the second pin assembly 2222 within the gap 2214 of the first pin assembly 2212 avoids mutual interference between the first pin assembly 2212 and the second pin assembly 2222, thus achieving a stable connection between the first pin assembly 2212, the second pin assembly 2222, and the conversion assembly 120. This arrangement not only improves the reliability and stability of the circuit but also reduces the risk of circuit failure.

[0075] It should be noted that both the first pin assembly 2212 and the second pin assembly 2222 include multiple pins. The position of the gap 2214 relative to the first pin assembly 2212 can be in the middle of the first pin assembly 2212. The pins of the first pin assembly 2212 are evenly divided into two groups and arranged on both sides of the gap 2214. Of course, the position of the gap 2214 can be set according to the design of the conversion component 120. The purpose is to realize the electrical connection between each pin and the conversion component 120. This application does not impose any restrictions here.

[0076] See Figure 1 , Figure 5 and Figure 7 In some embodiments, the conversion component 120 may include an insulating substrate 121, a chip 122 connected to the insulating substrate 121, and an AC terminal 123. The AC terminal 123 is used to connect to a drive motor to output AC power to the drive motor. The first pin assembly 2212 and the second pin assembly 2222 are both connected to the insulating substrate 121.

[0077] Understandably, the connection between chip 122 and insulating substrate 121 enables signal processing and transmission. Specifically, chip 122 converts the DC power input from the DC output bus assembly 220 into AC power suitable for driving the motor. Through its connection to insulating substrate 121, chip 122 can efficiently receive and process signals from other circuit components, while ensuring the accuracy and stability of the conversion process, thus guaranteeing the quality and stability of the AC power output and improving the operating efficiency and performance of the drive motor.

[0078] The AC terminal 123 can be injection molded to the first housing 110. The AC terminal 123 serves as the connection interface between the conversion component 120 and the drive motor, and is used to output AC power to the drive motor. By setting the AC terminal 123, the conversion component 120 can be flexibly applied to different drive motor systems, enhancing the versatility and adaptability of the power integration device 10.

[0079] The insulating substrate 121 may include a double-sided copper-clad ceramic substrate, which can be fabricated using direct copper bonding (DCB) technology.

[0080] Chip 122 may include a metal-oxide-semiconductor field-effect transistor (MOSFET), an insulated-gate bipolar transistor (IGBT), and a power diode.

[0081] See Figure 7 In some embodiments, the DC input copper bus assembly 240 may include a first DC input copper bus 241 and a second DC input copper bus 242, the first DC input copper bus 241 being connected to a first bus 221, the second DC input copper bus 242 being connected to a second bus 222, and the first DC input copper bus 241 and the second DC input copper bus 242 being alternately arranged.

[0082] The first DC input copper busbar 241 can be a DC+ copper busbar, i.e., a DC input positive copper busbar, and the second DC input copper busbar 242 can be a DC- copper busbar, i.e., a DC input negative copper busbar. In specific implementation, the first DC input copper busbar 241 is connected to the first busbar 221, and the second DC input copper busbar 242 is connected to the second busbar 222 to meet electrical connection requirements.

[0083] It should be noted that the first DC input copper busbar 241 and the second DC input copper busbar 242 are arranged alternately to facilitate corresponding connection with the positive and negative terminals of the external power supply.

[0084] See Figure 6 and Figure 9 In some embodiments, the capacitor module 200 may further include a first potting layer 250, the first potting layer 250, a first busbar 221, a capacitor core roll 230, and a second busbar 222 arranged sequentially along a first direction X. The first busbar 221 is provided with a heat dissipation portion 2213, which protrudes from the surface of the first busbar 221 and extends to the surface of the first potting layer 250.

[0085] The first direction X can be the vertical direction.

[0086] During the production process of capacitor module 200, the capacitor module 200 is encapsulated by setting a first potting layer 250. The first potting layer 250 can effectively fill the gaps 2214 inside capacitor module 200, isolate harmful substances such as moisture and dust in the external environment, protect the inside of capacitor module 200 from corrosion, and thus extend the service life of capacitor module 200.

[0087] Optionally, the first potting layer 250 may include epoxy resin.

[0088] The protruding design of the heat dissipation part 2213 enhances the heat dissipation performance of the capacitor module 200. Specifically, the protrusion of the heat dissipation part 2213 onto the surface of the first potting layer 250 increases the contact area between the first busbar 221 and the air, facilitating rapid heat dissipation. During the operation of the capacitor module 200, the generated heat can be more effectively transferred to the external environment through the heat dissipation part 2213, thereby reducing the operating temperature of the capacitor module 200 and improving its thermal stability and durability.

[0089] See Figure 4 and Figure 6 In some embodiments, the power integration device 10 may further include an insulating element 300 and a heat dissipation module 400, with the insulating element 300 covering at least a portion of the capacitor module 200. The heat dissipation module 400 includes a cooling assembly 410 and a first heat dissipation element 420, and the power module 100, cooling assembly 410, first heat dissipation element 420, and capacitor module 200 are arranged sequentially in the same direction.

[0090] It is understandable that the safety and reliability of the power integrated device 10 can be enhanced by setting the insulating component 300. Specifically, during the operation of the power integrated device 10, there is a high voltage between the positive and negative currents. Therefore, insulating components 300 can be set between the first busbar 221 and the second busbar 222, between the first DC input copper busbar 241 and the second DC input copper busbar 242, and on the outer side of the first busbar 221 and the second busbar 222. The insulating component 300 can effectively isolate direct contact between electrical components, ensure the insulation and creepage requirements of the power integrated device 10, and prevent device failure caused by electrical short circuits or leakage.

[0091] Optionally, the insulating element 300 may include at least one of insulating paper, insulating varnish, and insulating gasket.

[0092] To improve the heat dissipation efficiency of the power integrated device 10, the power integrated device 10 may be equipped with a heat dissipation module 400. The heat dissipation module 400 may include a cooling component 410 and a first heat sink 420. Optionally, the cooling component 410 may be at least one of a water-cooled heat dissipation module 400, a phase-change heat dissipation module 400, and an air-cooled heat dissipation module 400. The first heat sink 420 may be at least one of a heat dissipation pad and a heat pipe.

[0093] For specific implementation details, please refer to [link / reference]. Figure 2 In order to facilitate the highly integrated assembly of the power integration device 10, the bottom of the cooling component 410 can be designed with an arc-shaped envelope structure to avoid interference between modules.

[0094] The sequential arrangement of the cooling assembly 410 and the first heat sink 420 allows heat to be transferred along a clear and efficient path from the power module 100 and the capacitor module 200 to the outside of the power integrated device 10. The first heat sink 420 can absorb the heat dissipated by the heat dissipation section 2213 of the capacitor module 200, and then the cooling assembly 410 absorbs and removes the heat from the power module 100 and the first heat sink 420, thereby achieving heat dissipation for both the capacitor module 200 and the power module 100. The cooling assembly 410 can be connected to an external heat exchange device to exchange heat between the power integrated device 10 and the external heat exchange device.

[0095] Furthermore, the power module 100, cooling component 410, first heat sink 420 and capacitor module 200 are arranged in the same direction in sequence, which helps to achieve the compactness of the power integrated device 10.

[0096] See Figure 4In some embodiments, a second heat sink 111 is provided on the side of the first housing 110 facing the cooling assembly 410. The cooling assembly 410 includes a first cooling component 411 and a second cooling component 412 communicating with the first cooling component 411, wherein the second heat sink 111 is embedded in the first cooling component 411, and the second cooling component 412 is connected to the capacitor module 200 through the first heat sink 420.

[0097] The second heat sink 111 is in contact with the conversion component 120 on the side away from the cooling component 410. The second heat sink 111 can be directly embedded in the first cooling component 411, thereby enhancing the heat conduction efficiency and ensuring that heat can be quickly transferred from the conversion component 120 to the first cooling component 411 through the second heat sink 111 and effectively dissipated to the external environment.

[0098] Optionally, the second heat sink 111 can be a heat sink plate, and the side of the heat sink plate facing the first cooling element 411 can be provided with multiple heat dissipation columns 1111 to further improve the heat dissipation efficiency of the power module 100. The first cooling element 411 can be an open water tank.

[0099] In a specific implementation, a sealing element 4111 can be provided around the first cooling element 411 to achieve a sealed connection between the power module 100 and the heat dissipation module 400, thereby improving the heat absorption effect of the first cooling element 411. The sealing element 4111 can be a sealing ring.

[0100] In addition, the second cooling element 412 can be a water channel connected to an open water tank, and the first heat dissipation element 420 transfers heat to the water channel. The water flowing in the water channel can carry the heat out of the power integration device 10.

[0101] See Figures 1 to 4 In some embodiments, the heat dissipation module 400 has a first connecting portion 430 and a second connecting portion 440 on the side facing the power module 100 and the side facing the capacitor module 200, respectively. The second heat sink 111 has a pair of third connecting portions 112 on its periphery, and the third connecting portions 112 are connected to the first connecting portions 430 one by one. The second housing 210 has at least two fourth connecting portions 211 on its periphery, and each fourth connecting portion 211 is located on two intersecting or opposite sides, and the fourth connecting portions 211 are connected to the second connecting portions 440 one by one.

[0102] On the one hand, by providing a first connecting part 430 on the side of the heat dissipation module 400 facing the first housing 110, and connecting it one-to-one with the paired third connecting parts 112, a firm connection between the heat dissipation module 400 and the first housing 110 is achieved. This not only ensures that heat can be efficiently transferred from the first housing 110 to the heat dissipation module 400, but also enhances the stability and reliability of the connection through the paired arrangement of the third connecting parts 112, avoiding equipment failure caused by loose connections.

[0103] On the other hand, a second connecting portion 440 is provided on the side of the heat dissipation module 400 facing the second housing 210, and is connected one-to-one with at least two fourth connecting portions 211 on the periphery of the second housing 210, thereby improving the connection strength between the heat dissipation module 400 and the second housing 210. Furthermore, each fourth connecting portion 211 can be respectively provided on two intersecting or opposite sides of the second housing 210, thus optimizing the space occupied by the heat dissipation module 400 and the second housing 210, and also enhancing the stability and torsional resistance of the power integrated device 10 through connection on different surfaces.

[0104] Optionally, at least one of snap-fit ​​connection and bolt connection can be used between the first connecting part 430 and the third connecting part 112, and between the second connecting part 440 and the fourth connecting part 211.

[0105] Based on the above embodiments, this application provides an inverter that includes the power integration device 10 provided in any of the above embodiments.

[0106] The power integration device 10 has been described in detail in the above embodiments and will not be repeated here.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power integrated device, characterized in that, include: A power module (100) includes a first housing (110) and a conversion component (120) disposed within the first housing (110), the conversion component (120) being used to convert direct current into alternating current; A capacitor module (200) is arranged in the same direction as the power module (100). The capacitor module (200) includes a second housing (210) and a DC output busbar assembly (220), a capacitor core roll (230), and a DC input copper busbar assembly (240) disposed in the second housing (210). The DC input copper busbar assembly (240) is connected to the capacitor core roll (230) through the DC output busbar assembly (220) to input DC power to the capacitor core roll (230). The DC output busbar assembly (220) has its end extended a predetermined length toward the power module (100) and bent. The end of the DC output busbar assembly (220) is ultrasonically welded to the conversion assembly (120) so that the capacitor module (200) is connected to the power module (100).

2. The power integration device according to claim 1, characterized in that, The DC output busbar assembly (220) includes a first busbar (221) and a second busbar (222). The first busbar (221) is provided with a first DC output terminal (2211), and the second busbar (222) is provided with a second DC output terminal (2221). The first DC output terminal (2211) and the second DC output terminal (2221) are at least partially stacked and are both connected to the conversion assembly (120).

3. The power integration device according to claim 2, characterized in that, The first DC output terminal (2211) has a first pin assembly (2212) at one end facing the conversion component (120), and the first pin assembly (2212) is provided with a gap (2214); The second DC output terminal (2221) has a second pin assembly (2222) at one end facing the conversion component (120). The second pin assembly (2222) is disposed in the gap (2214). Both the first pin assembly (2212) and the second pin assembly (2222) are connected to the conversion component (120).

4. The power integration device according to claim 3, characterized in that, The conversion component (120) includes an insulating substrate (121), a chip (122) connected to the insulating substrate (121), and an AC terminal (123), the AC terminal (123) being used to connect to a drive motor to output AC power to the drive motor; Both the first pin assembly and the second pin assembly are connected to the insulating substrate (121).

5. The power integration device according to claim 2, characterized in that, The DC input copper busbar assembly (240) includes a first DC input copper busbar (241) and a second DC input copper busbar (242). The first DC input copper busbar (241) is connected to the first busbar (221), and the second DC input copper busbar (242) is connected to the second busbar (222). The first DC input copper busbar (241) and the second DC input copper busbar (242) are arranged alternately.

6. The power integration device according to claim 2, characterized in that, The capacitor module (200) further includes a first potting layer (250), and the first potting layer (250), the first busbar (221), the capacitor core roll (230) and the second busbar (222) are arranged sequentially along a first direction (X); The first busbar (221) is provided with a heat dissipation part (2213), which protrudes from the surface of the first busbar (221) and extends to the surface of the first potting layer (250).

7. The power integrated device according to any one of claims 1 to 6, characterized in that, It also includes an insulating element (300) and a heat dissipation module (400), the insulating element (300) covering at least a portion of the capacitor module (200); The heat dissipation module (400) includes a cooling component (410) and a first heat sink (420), and the power module (100), the cooling component (410), the first heat sink (420) and the capacitor module (200) are arranged sequentially in the same direction.

8. The power integration device according to claim 7, characterized in that, The first housing (110) is provided with a second heat sink (111) on the side facing the cooling assembly (410); The cooling assembly (410) includes a first cooling element (411) and a second cooling element (412) communicating with the first cooling element (411), wherein the second heat sink (111) is embedded in the first cooling element (411), and the second cooling element (412) is connected to the capacitor module (200) through the first heat sink (420).

9. The power integrated device according to claim 8, characterized in that, The heat dissipation module (400) is provided with a first connecting part (430) and a second connecting part (440) on the side facing the power module (100) and the side facing the capacitor module (200), respectively. The second heat sink (111) has a pair of third connecting parts (112) on its periphery, and the third connecting parts (112) are connected to the first connecting parts (430) in a one-to-one correspondence. The second housing (210) has at least two fourth connecting portions (211) on its periphery, and each of the fourth connecting portions (211) is located on two intersecting or opposite sides, and the fourth connecting portions (211) are connected to the second connecting portion (440) in a one-to-one correspondence.

10. An inverter, characterized in that, Includes the power integrated device (10) as described in any one of claims 1 to 9.

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