A power conversion device and energy storage system

Abstract

This application discloses a power conversion device and an energy storage system. The power conversion device includes a chassis, a PCB assembly, and a power conversion component. The chassis includes a main body and a cover plate, which together form a loading cavity. The PCB assembly is disposed within the loading cavity and has multiple PCB modules. The surfaces of each PCB module are coplanar and arranged sequentially along a first direction, dividing the loading cavity into a first air duct cavity and a second air duct cavity. The first and second air duct cavities are arranged in layers along a second direction. The power conversion component is disposed within the second air duct cavity. The cover plate and the surfaces of each PCB module enclose the first air duct cavity. This power conversion device not only meets the heat dissipation requirements of the electrical components within the chassis but also allows for easy disassembly and maintenance of the PCB modules by simply opening the cover plate, greatly improving the convenience of disassembly and maintenance of the electrical components within the chassis.

Description

Technical Field

[0001] This application relates to the field of power equipment technology, and more specifically, to a power conversion device and energy storage system. Background Technology

[0002] To meet the heat dissipation requirements of electrical components within the power conversion device chassis, an airflow structure is often designed inside the chassis to achieve air cooling. In related technologies, the airflow structure within the chassis often employs airflow partitions to divide the loading cavities into the required airflow configurations, with the electrical components installed within their respective airflow channels. While this structure satisfies the heat dissipation requirements, it makes the disassembly and maintenance of the electrical components within the chassis very inconvenient.

[0003] In summary, improving the ease of disassembly and maintenance of electrical components inside the chassis of power conversion devices has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, this application provides a power conversion device and an energy storage system to improve the ease of disassembly and maintenance of electrical components inside the power conversion device's chassis.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A power conversion device, comprising:

[0007] The chassis includes a main body and a cover plate. One side of the main body is open, and the cover plate closes to the opening and encloses the main body to form a loading cavity.

[0008] A PCB assembly is disposed in the loading cavity. The PCB assembly includes multiple PCB modules. The boards of each PCB module are coplanar and arranged sequentially along a first direction, and the loading cavity is divided into a first air duct cavity and a second air duct cavity. The first air duct cavity and the second air duct cavity are arranged in layers along a second direction.

[0009] A power conversion component is disposed within the second air duct cavity;

[0010] Wherein, the first direction is parallel to the cover plate, the second direction is perpendicular to the cover plate, and the cover plate and the board surface of each PCB module enclose the first air duct cavity.

[0011] In some embodiments of this application, the cover plate includes a plurality of sub-cover plates, which are sequentially assembled along the first direction;

[0012] The projection of the sub-cover plate toward the PCB assembly corresponds to the surface of the PCB module.

[0013] In some embodiments of this application, the projection of the sub-cover plate toward the PCB assembly corresponds one-to-one with the board surface of the PCB module;

[0014] Alternatively, the projection of at least one of the sub-covers toward the PCB assembly covers the board surface of multiple PCB modules;

[0015] Alternatively, at least one of the PCB modules may have a board face corresponding to a plurality of the sub-covers.

[0016] In some embodiments of this application, one side wall of the main housing in the first direction is a chassis panel, and the chassis panel is provided with DC wiring terminals;

[0017] The power conversion component includes a DC module, which is arranged close to the chassis panel.

[0018] In some embodiments of this application, the DC terminal is arranged close to the PCB assembly, and the DC module includes a DC main body and a fuse part, with the fuse part disposed on the side of the DC main body facing the PCB assembly.

[0019] In some embodiments of this application, the DC terminal is arranged close to the bottom wall of the main enclosure.

[0020] In some embodiments of this application, the power conversion component further includes an AC module, which is arranged close to the chassis panel and located on two opposite sides of the DC module in the third direction;

[0021] The third direction is parallel to the cover plate and perpendicular to the first direction.

[0022] In some embodiments of this application, the power conversion component further includes an IGBT module and a filter module. The filter module and the DC module are arranged along a first direction, and the filter module is located on the side away from the chassis panel. The IGBT module and the DC module are arranged along a second direction and are located close to the filter module.

[0023] In some embodiments of this application, an external connector is provided on the chassis panel, and the IGBT module is connected to the external connector via a flexible hose.

[0024] In some embodiments of this application, an air inlet and an air outlet are provided on the side wall of the main housing, and the air inlet and the air outlet are respectively provided on two opposite side walls of the main housing in a first direction.

[0025] To improve the ease of disassembly and maintenance of electrical components within the chassis of a power conversion device, the power conversion device provided in this application includes a chassis, a PCB assembly, and a power conversion component. The chassis includes a main body and a cover plate. One side of the main body is open, and the cover plate closes to the opening, forming a loading cavity with the main body. The PCB assembly is disposed within the loading cavity and includes multiple PCB modules. The surfaces of each PCB module are coplanar and arranged sequentially along a first direction, dividing the loading cavity into a first air duct cavity and a second air duct cavity. The first and second air duct cavities are arranged in layers along a second direction. The power conversion component is disposed within the second air duct cavity. The first direction is parallel to the cover plate, and the second direction is perpendicular to the cover plate. The cover plate and the surfaces of each PCB module enclose the first air duct cavity. In practical applications, this power conversion device utilizes the fact that the surfaces of each PCB module are coplanar and arranged sequentially along a first direction, dividing the loading cavity into a first air duct cavity and a second air duct cavity. The power conversion component is located within the second air duct cavity, which meets the heat dissipation requirements of the relevant electrical components within the chassis. Simultaneously, since the cover plate and the surfaces of each PCB module enclose the first air duct cavity, meaning the PCB module is located closer to the cover plate than the power conversion component, disassembly and maintenance can be performed simply by opening the cover plate, greatly improving the convenience of disassembly and maintenance of the electrical components within the power conversion device's chassis. Furthermore, since the first and second air duct cavities are separated by the surfaces of each PCB module, no additional air duct partitions are required, saving materials and reducing the structural cost of the chassis. Additionally, the assembly process between the air duct partitions and the chassis is eliminated, thus improving assembly efficiency.

[0026] On the other hand, embodiments of this application also provide an energy storage system, including the power conversion device described in any of the above solutions. Since the aforementioned power conversion device has the above-mentioned technical effects, the energy storage system having this power conversion device should also have corresponding technical effects, which will not be elaborated further here.

[0027] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the internal loading cavity of the power conversion device provided in the embodiments of this application;

[0030] Figure 2 (A schematic diagram of the structure of the chassis cover provided in the embodiments of this application, which is designed as multiple sub-covers assembled along a first direction).

[0031] Figure 3 for Figure 1 A schematic diagram of the structure shown below after removing the chassis;

[0032] Figure 4 Another schematic diagram of the loading cavity inside the chassis of the power conversion device provided in the embodiments of this application;

[0033] Figure 5 for Figure 4 A schematic diagram of the structure shown below after removing the chassis.

[0034] in, Figures 1-5 middle:

[0035] 1-Chassis;

[0036] 10 - Loading cavity;

[0037] 101 - First air duct cavity;

[0038] 102 - Second air duct cavity;

[0039] 11-Main box;

[0040] 110 - Chassis front panel;

[0041] 111 - Bottom wall of the box;

[0042] 112 - Box sidewall;

[0043] 12-Cover plate;

[0044] 121-Sub-cover plate;

[0045] 2-PCB assembly;

[0046] 20- PCB module;

[0047] 3-Power conversion components;

[0048] 31-DC module;

[0049] 311-DC main body;

[0050] 312 - Fuse section;

[0051] 32-Communication Module;

[0052] 33-IGBT module;

[0053] 34-Filtering module;

[0054] 4-DC terminal block. Detailed Implementation

[0055] The core of this application is to provide a power conversion device and energy storage system to improve the ease of disassembly and maintenance of electrical components inside the power conversion device's chassis.

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0057] To meet the heat dissipation requirements of electrical components within the power conversion device chassis, an airflow structure is often designed inside the chassis to achieve air cooling. In related technologies, the airflow structure within the chassis often employs airflow partitions to divide the loading cavities into the required airflow configurations, with the electrical components installed within their respective airflow channels. While this structure satisfies the heat dissipation requirements, it makes the disassembly and maintenance of the electrical components within the chassis very inconvenient.

[0058] Based on this, one aspect of the embodiments of this application provides a power conversion device to improve the ease of disassembly, assembly, and maintenance of electrical components inside the chassis of the power conversion device.

[0059] Specifically, refer to Figure 1As shown, the power conversion device includes a chassis 1, a PCB assembly 2, and a power conversion component 3. The chassis 1 includes a main body 11 and a cover plate 12. One side of the main body 11 is open, and the cover plate 12 closes to the opening, forming a loading cavity 10 with the main body 11. The loading cavity 10 is mainly used to load the relevant electrical components (such as the PCB assembly 2 and the power conversion component 3) used to achieve the power conversion function. The PCB assembly 2 is disposed within the loading cavity 10 and includes multiple PCB modules 20. PCB (Printed Circuit Board) The PCB module 20, also known as the circuit board module, specifically includes a board body and electrical components disposed on the board body. The boards of each PCB module 20 are coplanar and arranged sequentially along a first direction, dividing the loading cavity 10 into a first air duct cavity 101 and a second air duct cavity 102. The first air duct cavity 101 and the second air duct cavity 102 are arranged in layers along a second direction. The edges of the boards of the PCB module 20 may be, but are not limited to, connected to the inner wall of the chassis 1 by corner brackets. The power conversion component 3 is disposed in the second air duct cavity 102. The power conversion component 3 is mainly used to realize power conversion, and it may specifically include a DC module 31, an AC module 32, an IGBT module 33, and a filter module 34, etc.

[0060] In addition, in this embodiment, the first direction is parallel to the cover plate 12. For example, the first direction can be the length direction of the main housing 11 or the width direction of the main housing 11. The second direction is perpendicular to the cover plate 12, that is, the second direction can be the thickness direction of the main housing 11. The cover plate 12 and the board surface of each PCB module 20 enclose the first air duct cavity 101, that is, the cover plate 12 is arranged closer to the power conversion component 3.

[0061] In practical applications, this power conversion device, with its coplanar PCB modules 20 arranged sequentially along a first direction, divides the loading cavity 10 into a first air duct cavity 101 and a second air duct cavity 102. The power conversion component 3 is located within the second air duct cavity 102, which meets the heat dissipation requirements of the relevant electrical components within the chassis 1. Simultaneously, since the cover plate 12 and the PCB modules 20 enclose each other to form the first air duct cavity 101, meaning the PCB modules 20 are located closer to the cover plate 12 than the power conversion component 3, when disassembly and maintenance are required, opening the cover plate 12 allows for easy disassembly and maintenance of the PCB modules 20, significantly improving power conversion efficiency. The ease of disassembly and maintenance of electrical components inside the chassis 1 of the power conversion device is enhanced. For example, by removing the cover plate 12, the PCB module 20 can be disassembled, tested, and maintained. Since the PCB module 20 is easy to disassemble and maintain, the disassembly, testing, and maintenance of related electrical components (i.e., power conversion components 3) located in the second air duct cavity 102 will also be more convenient. In addition, since the first air duct cavity 101 and the second air duct cavity 102 are separated by the board surfaces of each PCB module 20, there is no need to design additional air duct partitions, which saves materials and helps to reduce the structural cost of the chassis 1. Furthermore, the assembly process between the air duct partition and the chassis 1 is eliminated, which also helps to improve assembly efficiency.

[0062] In this arrangement, the surfaces of each PCB module 20 are coplanar and arranged sequentially along a first direction. Specifically, the surfaces of each PCB module 20 can be parallel to the cover plate 12 and coplanar, or they can be arranged at a certain angle to the cover plate 12. The specific configuration can be selected according to the installation requirements. By designing the PCB modules 20 in the above-mentioned sequential arrangement along the first direction, the partition surfaces formed by the PCB modules 20 are made more regular, and the installation, maintenance, and layout of the PCB modules 20 are also more convenient.

[0063] In a further implementation plan, refer to Figure 2 Combination Figure 3 As shown, the aforementioned cover plate 12 may specifically include multiple sub-cover plates 121, which are sequentially assembled along the first direction; wherein the projection of the sub-cover plate 121 toward the PCB assembly 2 corresponds to the board surface of the PCB module 20. This design facilitates the individual disassembly, testing, and maintenance of PCB modules 20 at different locations. For example, when a certain PCB module 20 needs to be disassembled, tested, or maintained, only the sub-cover plate 121 corresponding to that PCB module 20 needs to be removed, without disassembling the entire cover plate 12, making the operation more convenient.

[0064] Specifically, the projection of the sub-cover plate 121 toward the PCB assembly 2 corresponds to the board surface of the PCB module 20. This can be a one-to-one correspondence between the projection of the sub-cover plate 121 toward the PCB assembly 2 and the board surface of the PCB module 20; alternatively, the projection of at least one sub-cover plate 121 toward the PCB assembly 2 can cover the board surfaces of multiple (i.e., two or more) PCB modules 20; or at least one board surface of the PCB module 20 can correspond to multiple (i.e., two or more) sub-cover plates 121. In practical applications, specific configurations can be made according to actual needs. For example, when the board surface size of a single PCB module 20 is large, the board surface of that PCB module 20 can correspond to multiple sub-cover plates 121. Conversely, when the board surface sizes of multiple PCB modules 20 are small and arranged adjacent to each other, the projection of one sub-cover plate 121 toward the PCB assembly 2 can be designed to cover the board surfaces of multiple PCB modules 20.

[0065] In some other specific implementation schemes, refer to Figure 1 and Figure 2 As shown, one side wall of the main housing 11 in the first direction is the chassis panel 110, and the chassis panel 110 is provided with DC terminals 4; the power conversion component 3 may specifically include a DC module 31, which is arranged close to the chassis panel 110 to facilitate the electrical connection between the DC module 31 and the DC terminals 4.

[0066] It should be noted that the position of the DC terminal 4 on the chassis panel 110 can be selected according to the specific structural form of the DC module 31.

[0067] For example, refer to Figure 1 The DC terminal block 4 is designed to be positioned close to the PCB assembly 2. The DC module 31 includes a DC main body 311 and a fuse part 312. The fuse part 312 is located on the side of the DC main body 311 facing the PCB assembly 2. Alternatively, the DC main body 311 and the fuse part 312 are arranged sequentially along a second direction, which is perpendicular to the cover plate 12, or the direction of the bottom wall 111 of the main housing 11 facing the PCB assembly 2. This structural design allows the fuse part 312 to be positioned at a height closer to the DC terminal block 4 on the chassis panel 110, facilitating wiring and shortening the DC path. Furthermore, the fuse part 312's orientation towards the PCB assembly 2 makes fuse replacement easier. The DC main body 311 and the fuse part 312 can be designed as an integrated structure or as separate components; the design choice depends on the specific application requirements and is not limited here.

[0068] Another example, see reference. Figure 4 Combination Figure 5 As shown, the DC terminal 4 can also be designed to be arranged close to the bottom wall 111 of the main enclosure 11. In this case, the height of the DC module 31 in the main enclosure 11 and the height of the DC terminal 4 on the chassis panel 110 are designed to match each other, so as to facilitate wiring.

[0069] In some other specific implementation schemes, refer to Figure 1 and Figure 3 The aforementioned power conversion component 3 may further include an AC module 32, which may be specifically designed to be arranged close to the chassis panel 110 and located on two opposite sides of the DC module 31 in the third direction; wherein, the third direction is parallel to the cover plate 12 and perpendicular to the first direction. By designing this structure, it is convenient to cascade and install multiple power conversion components 3. For example, a single power conversion component 3 can be cascaded with other power conversion components 3 on both opposite sides of the third direction through the DC module 31.

[0070] In some specific implementation plans, refer to Figure 1 and Figure 3 The power conversion component 3 described above may further include an IGBT module 33 and a filter module 34. The IGBT (Insulated Gate Bipolar Transistor) in the IGBT module 33 is a composite fully controllable power semiconductor device that combines the high input impedance of a MOSFET (Insulated Gate Field Effect Transistor) with the low on-state voltage drop of a BJT (Bipolar Junction Transistor). The filter module 34 and the DC module 31 are arranged along a first direction and located on the side away from the chassis panel 110; the IGBT module 33 and the DC module 31 are arranged along a second direction and located close to the filter module 34; as mentioned above, the second direction is perpendicular to the cover plate 12. By arranging the IGBT module 33 and the filter module 34 in the second air duct cavity 102 as described above, the layout of electrical components is compact and reasonable. Specifically, the IGBT module 33 is more convenient to connect with the electrolytic capacitor in the filter module 34. For example, the IGBT module 33 and the electrolytic capacitor in the filter module 34 are at approximately the same height, which shortens the path between them, reduces the inductance, and helps to ensure the electrical performance of the power conversion component 3.

[0071] In some other specific implementations, the chassis panel 110 may also be provided with an external connector, and the IGBT module 33 may be connected to the external connector via a flexible hose, but is not limited to that provided.

[0072] It should be noted that in the power conversion device, the filter module 34 is a core component for ensuring power quality. Its main functions are to suppress electromagnetic interference (EMI), eliminate harmonic pollution, smooth voltage / current waveforms, and ensure stable system operation. Specifically, it may have the following functions and operating principles:

[0073] 1) Electromagnetic interference (EMI) suppression:

[0074] Principle: High-frequency noise is blocked from being transmitted to the power grid or equipment through a double π-type filter network or low-pass filter composed of inductors (L) and capacitors (C). For example, input filter circuits can suppress surge currents during power switching and prevent high-frequency noise interference.

[0075] Typical structure: common-mode inductor + safety capacitor (such as X / Y capacitor) + differential-mode inductor, effectively filtering out common-mode / differential-mode interference.

[0076] 2) Harmonic mitigation:

[0077] Application scenarios: 5th / 7th / 11th / 13th harmonics generated by rectifiers and inverters (such as 6 / 12 pulse rectifier equipment).

[0078] Technical solution:

[0079] Passive filters: LC resonant circuits are designed for specific harmonic frequencies, and are low in cost but lack flexibility.

[0080] Active power filter (APF): It uses IGBT power modules to detect harmonics in real time and inject reverse current, with a filtering efficiency of >95%, and is suitable for scenarios such as frequency converters and new energy grid connection.

[0081] 3) Energy buffering and ripple smoothing:

[0082] Capacitor filters: In DC-DC converters, electrolytic capacitors or film capacitors store energy and absorb ripple. The larger the capacitance, the better the low-frequency filtering effect (the size and cost need to be balanced).

[0083] LCL filters combine the current suppression of inductors with the voltage regulation of capacitors to improve the purity of the output waveform and are commonly found in photovoltaic inverters.

[0084] 4) Topology innovation improves performance:

[0085] Magnetic integrated filtering technology: The energy storage magnetic components (such as transformers) of the power converter are coupled with the filter inductor to form a series resonance through mutual inductance effect, which significantly improves the insertion loss in the target frequency band (such as the switching frequency).

[0086] In some other specific implementation schemes, refer to Figure 1As shown, air inlets and outlets can also be provided on the side walls 112 of the main housing 11. The air inlets and outlets are respectively provided on two opposite side walls 112 of the main housing 11 in a first direction, as mentioned above, where the first direction is parallel to the cover plate 12. Although Figure 1 The specific structures of the air inlet and outlet are not shown, but this does not affect the understanding of the technical solution by those skilled in the art. By designing the aforementioned air inlet and outlet, the heat dissipation effect of the first air duct cavity 101 and the second air duct cavity 102 is improved. External airflow can circulate through the relevant components in the first air duct cavity 101, such as the relevant electrical components on the PCB module 20. At the same time, external airflow can also circulate through the power conversion component 3 in the second air duct cavity 102, resulting in better air cooling performance.

[0087] It is worth mentioning that the power conversion device mentioned in this article can specifically refer to an energy storage converter, or other power conversion devices, such as rectifiers and inverters, without further specific limitations.

[0088] On the other hand, embodiments of this application also provide an energy storage system, including the power conversion device described in any of the above solutions. Since the aforementioned power conversion device has the above-mentioned technical effects, the energy storage system having this power conversion device should also have corresponding technical effects, which will not be elaborated further here.

[0089] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.

[0090] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0091] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0092] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0093] It should also be noted that in the description of the embodiments of this application, the terms "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0094] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A power conversion device, characterized by, include: The chassis (1) includes a main body (11) and a cover plate (12). One side of the main body (11) is open, and the cover plate (12) covers the opening and surrounds the main body (11) to form a loading cavity (10). A PCB assembly (2) is disposed in the loading cavity (10). The PCB assembly (2) includes a plurality of PCB modules (20). The surfaces of each PCB module (20) are coplanar and arranged sequentially along a first direction, and the loading cavity (10) is divided into a first air duct cavity (101) and a second air duct cavity (102). The first air duct cavity (101) and the second air duct cavity (102) are arranged in layers along a second direction. The power conversion component (3) is disposed in the second air duct cavity (102); Wherein, the first direction is parallel to the cover plate (12), the second direction is perpendicular to the cover plate (12), and the cover plate (12) and the board surface of each PCB module (20) enclose the first air duct cavity (101).

2. The power conversion device of claim 1, wherein, The cover plate (12) includes a plurality of sub-cover plates (121), which are assembled sequentially along the first direction; The projection of the sub-cover plate (121) toward the PCB assembly (2) corresponds to the board surface of the PCB module (20).

3. The power conversion device of claim 2, wherein, The projection of the sub-cover plate (121) toward the PCB assembly (2) corresponds one-to-one with the board surface of the PCB module (20); Alternatively, the projection of at least one of the sub-covers (121) toward the PCB assembly (2) covers the surface of a plurality of the PCB modules (20); Alternatively, at least one of the PCB modules (20) may have a board face corresponding to a plurality of the sub-covers (121).

4. The power conversion device of claim 1, wherein, The main housing (11) has a chassis panel (110) on one side wall in the first direction, and the chassis panel (110) is provided with DC wiring terminals (4). The power conversion component (3) includes a DC module (31) which is arranged close to the chassis panel (110).

5. The power conversion device of claim 4, wherein, The DC terminal (4) is arranged close to the PCB assembly (2). The DC module (31) includes a DC main body (311) and a fuse part (312). The fuse part (312) is disposed on the side of the DC main body (311) facing the PCB assembly (2).

6. The power conversion device of claim 4, wherein, The DC terminal (4) is arranged near the bottom wall (111) of the main housing (11).

7. The power conversion device of claim 4, wherein, The power conversion component (3) also includes an AC module (32), which is arranged close to the chassis panel (110) and located on two opposite sides of the DC module (31) in the third direction; The third direction is parallel to the cover plate (12) and perpendicular to the first direction.

8. The power conversion device of claim 4, wherein, The power conversion component (3) further includes an IGBT module (33) and a filter module (34). The filter module (34) and the DC module (31) are arranged along a first direction, and the filter module (34) is located on the side away from the chassis panel (110). The IGBT module (33) and the DC module (31) are arranged along a second direction and are located close to the filter module (34).

9. The power conversion device of claim 8, wherein, An external connector is provided on the chassis panel (110), and the IGBT module (33) is connected to the external connector via a flexible hose.

10. The power conversion device of any one of claims 1-9, wherein, The main housing (11) has an air inlet and an air outlet on its side wall (112), and the air inlet and the air outlet are respectively located on two opposite side walls (112) of the main housing (11) in the first direction.

11. An energy storage system characterized by, Includes the power conversion device as described in any one of claims 1-10.

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