A filter chip and a duplexer

Abstract

This application relates to the field of wireless communication technology, specifically to a filter chip and duplexer, including a substrate, a resonator, and a combined heat dissipation structure. Both the resonator and the combined heat dissipation structure are disposed on the surface of the substrate, with the combined heat dissipation structure adjacent to the resonator. The combined heat dissipation structure includes multiple sub-heat dissipation structures arranged in an array and a heat-conducting structure connecting the multiple sub-heat dissipation structures. This application can improve the heat conduction efficiency inside the chip, enabling rapid heat removal from the chip, thereby improving the reliability and stability of the device under high-power applications.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and more specifically, to a filter chip and a duplexer. Background Technology

[0002] In the field of wireless communication, with the increasing scarcity of spectrum resources and the ever-increasing demands for data transmission rates, filters, as a key component, play a crucial role in ensuring signal quality and reducing interference. This is especially true for high-frequency applications such as bulk acoustic wave (BAW) filters, where their performance directly affects the stability and efficiency of the entire communication system. However, with the increase in operating frequency and power capacity requirements, the heat generated inside the filter chip also increases accordingly, placing higher demands on the filter's heat dissipation capabilities.

[0003] Existing technologies typically incorporate heat dissipation structures within the package structure. These structures are located at the chip package level, far from the core heat source inside the chip. This results in a long heat conduction path, high thermal resistance, and low heat transfer efficiency. Consequently, this approach offers limited improvement in heat dissipation within the chip, especially near the core heat-generating area, and fails to meet the demands of high-power devices for efficient heat dissipation and long-term stable operation. Utility Model Content

[0004] The purpose of this application is to provide a filter chip and a duplexer that can improve the heat conduction efficiency inside the chip, so as to realize the rapid heat dissipation inside the chip, thereby improving the reliability and stability of the device under high power applications.

[0005] The embodiments of this application are implemented as follows:

[0006] In a first aspect, embodiments of this application provide a filter chip, including a substrate, a resonator, and a combined heat dissipation structure; the resonator and the combined heat dissipation structure are both disposed on the surface of the substrate, and the combined heat dissipation structure is disposed adjacent to the resonator; the combined heat dissipation structure includes a plurality of sub-heat dissipation structures arranged in an array and a heat-conducting structure; the sub-heat dissipation structure includes a first heat dissipation structure, a second heat dissipation structure, and a third heat dissipation structure stacked together; the heat-conducting structure connects the first heat dissipation structure of the plurality of sub-heat dissipation structures; and / or, the heat-conducting structure connects the third heat dissipation structure of the plurality of sub-heat dissipation structures.

[0007] As an optional implementation, the resonator includes a bottom electrode, a piezoelectric layer, and a top electrode stacked together; the first heat dissipation structure is disposed in the same layer as the bottom electrode, and the third heat dissipation structure is disposed in the same layer as the top electrode.

[0008] As an optional implementation, the projection of the second heat dissipation structure on the substrate falls into the projection of the first heat dissipation structure on the substrate; and / or, the projection of the second heat dissipation structure on the substrate falls into the projection of the third heat dissipation structure on the substrate.

[0009] As an optional implementation, the heat-conducting structure includes a first metal connecting wire; the first metal connecting wire is laid on the surface of the third heat dissipation structure away from the substrate.

[0010] As an optional implementation, the surface of the first metal connecting wire facing away from the substrate has a plurality of spaced protrusions.

[0011] As an optional implementation, the heat-conducting structure includes a second metal connection portion; the second metal connection portion is disposed in the same layer as the first heat dissipation structure.

[0012] As an optional implementation, a plurality of the sub-heat dissipation structures are arranged around the outer periphery of the resonator, and the heat-conducting structure connects the plurality of sub-heat dissipation structures in series along the circumference of the resonator.

[0013] As an optional implementation, the bottom electrode has the same thickness as the first heat dissipation structure; and / or, the top electrode has the same thickness as the third heat dissipation structure.

[0014] As an optional implementation, there are multiple combined heat dissipation structures; the multiple combined heat dissipation structures are arranged at intervals on the surface of the substrate.

[0015] Secondly, embodiments of this application provide a duplexer, including the aforementioned filter chip and a packaging structure for protecting the filter chip.

[0016] The beneficial effects of the embodiments of this application include:

[0017] The filter chip provided in this application includes a substrate, a resonator, and a combined heat dissipation structure. Both the resonator and the heat dissipation structure are disposed on the surface of the substrate, with the combined heat dissipation structure close to the resonator. The combined heat dissipation structure includes multiple sub-heat dissipation structures arranged in an array and a heat-conducting structure. The heat-conducting structure connects the multiple sub-heat dissipation structures. This improves the heat conduction efficiency inside the chip, enabling rapid heat removal and thus enhancing the reliability and stability of the device in high-power applications.

[0018] The duplexer provided in this application includes a high-efficiency heat dissipation structure inside the filter chip and an external packaging structure, which can significantly improve the overall heat dissipation capacity of the duplexer and ensure its stable operation under high power conditions. The physical protection and environmental isolation functions provided by the packaging structure effectively extend the working life of the duplexer and improve its adaptability to external changes. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is one of the structural schematic diagrams of the filter chip in the embodiments of this application;

[0021] Figure 2 This is a second schematic diagram of the filter chip structure according to an embodiment of this application;

[0022] Figure 3 This is the third schematic diagram of the filter chip structure in the embodiments of this application;

[0023] Figure 4 This is the fourth schematic diagram of the filter chip structure in the embodiments of this application;

[0024] Figure 5 This is the fifth schematic diagram of the filter chip structure in the embodiments of this application;

[0025] Figure 6 This is the sixth schematic diagram of the filter chip structure in the embodiments of this application;

[0026] Figure 7 This is the seventh schematic diagram of the filter chip structure in the embodiments of this application;

[0027] Figure 8 This is the eighth schematic diagram of the filter chip structure in the embodiments of this application;

[0028] Figure 9 This is the ninth schematic diagram of the filter chip structure in the embodiments of this application.

[0029] Icons: 100-Substrate; 101-Resonator; 102-Combined heat dissipation structure; 103-Sub-heat dissipation structure; 104-Heat conduction structure; 105-First heat dissipation structure; 106-Second heat dissipation structure; 107-Third heat dissipation structure; 108-First metal connecting line; 109-Bump; 110-Second metal connecting part; 111-Bottom electrode; 112-Top electrode. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In the field of wireless communication, with the increasing scarcity of spectrum resources and the ever-increasing demands for data transmission rates, filters, as a key component, play a crucial role in ensuring signal quality and reducing interference. This is especially true for high-frequency applications such as bulk acoustic wave (BAW) filters, where their performance directly affects the stability and efficiency of the entire communication system. However, with the increase in operating frequency and power capacity requirements, the heat generated inside the filter chip also increases accordingly, placing higher demands on the filter's heat dissipation capabilities.

[0035] Existing technologies typically incorporate heat dissipation structures within the package structure. These structures are located at the chip package level, far from the core heat source inside the chip. This results in a long heat conduction path, high thermal resistance, and low heat transfer efficiency. Consequently, this approach offers limited improvement in heat dissipation within the chip, especially near the core heat-generating area, and fails to meet the demands of high-power devices for efficient heat dissipation and long-term stable operation.

[0036] To address the aforementioned technical problems, embodiments of this application provide a filter chip and a duplexer.

[0037] Reference Figure 1 As shown, the filter chip provided in this embodiment includes a substrate 100, a resonator 101, and a combined heat dissipation structure 102; both the resonator 101 and the combined heat dissipation structure 102 are disposed on the surface of the substrate 100, and the combined heat dissipation structure 102 is adjacent to and close to the resonator 101; see reference. Figure 1 , Figure 6 The combined heat dissipation structure 102 includes multiple arrayed sub-heat dissipation structures 103 and a heat conduction structure 104; see reference. Figure 4 , Figure 5 The sub-heat dissipation structure 103 includes a first heat dissipation structure 105, a second heat dissipation structure 106, and a third heat dissipation structure 107 stacked together; a heat-conducting structure 104 connects the first heat dissipation structure 105 of the multiple sub-heat dissipation structures 103; and / or, the heat-conducting structure 104 connects the third heat dissipation structure 107 of the multiple sub-heat dissipation structures 103. See also... Figure 7 , Figure 8 as well as Figure 9 Example structure.

[0038] It should be noted that the number of resonators 101 on the substrate 100 can be multiple, and those skilled in the art can set them as needed.

[0039] It should be noted that in this embodiment, the combined heat dissipation structure 102 is directly integrated onto the substrate 100, and it is arranged on the same layer as the resonator 101 on the substrate 100. Furthermore, the combined heat dissipation structure 102 is positioned near the resonator 101, which effectively shortens the heat conduction path from the resonator 101 to the combined heat dissipation structure 102, thereby improving heat conduction efficiency. Compared to traditional packaging-level heat dissipation designs, the heat dissipation layout in this embodiment is closer to the heat source, significantly reducing thermal resistance.

[0040] It should be noted that each sub-heat dissipation structure 103 consists of three layers, and the specific selection of each heat dissipation structure can be designed by those skilled in the art as needed. For example, the first heat dissipation structure 105, the second heat dissipation structure 106, and the third heat dissipation structure 107 are all heat dissipation pads. For example, the first heat dissipation structure 105 can be a metal heat-conducting pillar or a heat-conducting film; the second heat dissipation structure 106 can be an intermediate layer with high heat capacity; and the third heat dissipation structure 107 can be a heat-conducting pad connected to the outside.

[0041] It should be noted that the function of the heat-conducting structure 104 is to connect multiple sub-heat dissipation structures 103 laterally to form an integrated heat-conducting network. When the heat-conducting structure 104 is connected to the first heat dissipation structure 105, it helps to quickly extract heat from each sub-structure; when the heat-conducting structure 104 is connected to the third heat dissipation structure 107, it facilitates the diffusion of heat over a larger area, making it easier to transfer to the packaging substrate or external heat dissipation device.

[0042] In this embodiment, both the resonator 101 and the combined heat dissipation structure 102 are disposed on the surface of the substrate 100, and the combined heat dissipation structure 102 is arranged close to the resonator 101 with a small distance between them to improve heat conduction efficiency. The combined heat dissipation structure 102 consists of multiple arrayed sub-heat dissipation structures 103. Each sub-heat dissipation structure 103 includes a first heat dissipation structure 105, a second heat dissipation structure 106, and a third heat dissipation structure 107 stacked together, thus forming a multi-layered heat conduction system with functional layering. Furthermore, a heat conduction structure 104 laterally connects the first or third layers of the multiple sub-heat dissipation structures 103, constructing an effective lateral heat conduction channel to further improve heat diffusion efficiency. This design achieves efficient heat dissipation inside the chip, especially in the core heat-generating area, without increasing the chip area.

[0043] The technical effects that the embodiments of this application can produce are as follows:

[0044] This embodiment of the application effectively shortens the heat conduction path from the core heat source to the heat dissipation structure by setting a combined heat dissipation structure 102 close to the resonator 101 on the surface of the substrate 100, reducing thermal resistance and significantly improving local heat dissipation efficiency. The multiple arrayed sub-heat dissipation structures 103 increase the heat dissipation area and form multiple heat conduction paths, enhancing the overall heat dissipation capacity. The sub-heat dissipation structures 103 adopt a first, second, and third heat dissipation structure 107 stacked in layers, realizing a functional layered design, which respectively undertakes the functions of heat conduction, buffering, and diffusion, improving the thermal management performance of the structure. At the same time, the heat conduction structure 104 laterally connects the first or third layer of multiple sub-heat dissipation structures 103, constructing a lateral heat conduction channel, so that heat can be quickly diffused between different sub-structures, avoiding local overheating. This integrated heat dissipation design can achieve efficient heat dissipation without relying on the packaging layer, and significantly improves the stability and reliability of the filter chip under high power conditions without increasing the chip size.

[0045] As an optional implementation, the resonator 101 includes a bottom electrode 111, a piezoelectric layer, and a top electrode 112 stacked together; see reference. Figure 2 , Figure 3 As shown, the first heat dissipation structure 105 is disposed on the same layer as the bottom electrode 111, as referenced. Figure 5 , Figure 6 As shown, the third heat dissipation structure 107 is disposed on the same layer as the top electrode 112.

[0046] It should be noted that, in the embodiments of this application, the bottom electrode 111 and the top electrode 112 are usually made of metallic materials (such as molybdenum Mo, aluminum Al, etc.) to apply voltage and excite the piezoelectric effect; the piezoelectric layer (such as aluminum nitride AlN) generates mechanical deformation under the action of the electric field, thereby realizing longitudinal vibration and high-frequency resonance in the thickness direction.

[0047] It should be noted that the first heat dissipation structure 105 is on the same layer as the bottom electrode 111, meaning that the first heat dissipation structure 105 can be formed in the same process step as the bottom electrode 111, for example, using the same metal material and deposition / etching process. The third heat dissipation structure 107 is on the same layer as the top electrode 112, that is, the third heat dissipation structure 107 can be completed simultaneously during the fabrication of the top electrode 112; this design in the embodiments of this application realizes the integrated manufacturing of heat dissipation structure and functional electrode without adding additional process steps or changing the original device structure.

[0048] The technical effects that the embodiments of this application can produce are as follows:

[0049] First, the embodiments of this application have strong process compatibility, which facilitates integrated manufacturing. The first heat dissipation structure 105 is arranged in the same layer as the bottom electrode 111, and the third heat dissipation structure 107 is arranged in the same layer as the top electrode 112, which allows them to be integrated without changing the original resonator 101 fabrication process, reducing manufacturing complexity and cost; at the same time, it ensures the structural integrity of the device and does not affect the original electrical performance due to the addition of heat dissipation structures.

[0050] Secondly, the embodiments of this application can improve the efficiency of the heat conduction path. The first heat dissipation structure 105 is close to the bottom electrode 111, which is conducive to quickly dissipating heat from the inside of the piezoelectric layer to the substrate 100 direction; the third heat dissipation structure 107 is close to the top electrode 112, which helps to conduct heat upward to the packaging structure or the external environment; thus forming a highly efficient heat conduction mechanism with dual upper and lower paths, significantly improving the overall heat dissipation capacity.

[0051] Third, the structure of the embodiments of this application is compact, which is conducive to chip miniaturization. The first heat dissipation structure 105 is set on the same layer as the bottom electrode 111, and the third heat dissipation structure 107 is set on the same layer as the top electrode 112, which saves chip space and avoids the increase in chip area due to the introduction of heat dissipation structures. Under the trend of high-density integration, this design is particularly suitable for application scenarios with strict size requirements such as 5G radio frequency front-end and millimeter-wave communication.

[0052] Fourth, the embodiments of this application can enhance device reliability. The embodiments of this application have more efficient thermal management capabilities, which helps to reduce operating temperature and slow down material fatigue and aging; and improves the stability and long-term operational reliability of the filter chip under high power and high frequency applications.

[0053] Reference Figure 5 As shown, in one optional implementation, the projection of the second heat dissipation structure 106 on the substrate 100 falls into the projection of the first heat dissipation structure 105 on the substrate 100; and / or, the projection of the second heat dissipation structure 106 on the substrate 100 falls into the projection of the third heat dissipation structure 107 on the substrate 100.

[0054] It should be noted that the projection of the second heat dissipation structure 106 onto the substrate 100 falls within the projection of the first heat dissipation structure 105 onto the substrate 100. This means that when viewed from a direction perpendicular to the substrate 100, the second heat dissipation structure 106 is completely within the coverage area of ​​the first heat dissipation structure 105. Similarly, the projection of the second heat dissipation structure 106 onto the substrate 100 can also fall completely within the projection area of ​​the third heat dissipation structure 107. In other words, the area of ​​the second heat dissipation structure is smaller than that of the first heat dissipation structure 105 and the third heat dissipation structure 107.

[0055] This embodiment of the application ensures that heat can be quickly conducted to the external environment along the shortest path by making the area of ​​the second heat dissipation structure 106 smaller than that of the first heat dissipation structure 105 and the third heat dissipation structure 107. This layout reduces energy loss during heat conduction and improves overall thermal management efficiency.

[0056] Reference Figure 7 As shown, as an optional implementation, the heat-conducting structure 104 includes a first metal connecting line 108; the first metal connecting line 108 is laid on the surface of the third heat dissipation structure 107 on the side away from the substrate 100.

[0057] It should be noted that this embodiment utilizes the excellent thermal conductivity of metallic materials to construct an efficient lateral heat conduction path between multiple sub-heat dissipation structures 103, enabling heat to dissipate rapidly within the chip. In this embodiment, the first metal connection line 108 is laid on the top surface of the third heat dissipation structure 107, realizing an efficient heat conduction channel from the chip's interior to the external environment. This is particularly beneficial for timely heat dissipation from the top area, preventing localized overheating. This embodiment, by laterally connecting multiple sub-heat dissipation structures 103, forms an integrated heat conduction network, enhancing the synergistic effect of the heat dissipation structures, improving the overall thermal uniformity of the chip, and preventing hotspot concentration.

[0058] In this embodiment, a first metal connecting line 108 is provided on the top of the third heat dissipation structure 107 as a heat conduction structure 104. This not only achieves lateral thermal interconnection between multiple sub-heat dissipation structures 103, but also enhances the external heat dissipation capability of the top region of the chip. This design significantly improves the heat conduction efficiency and uniformity inside the filter chip without increasing the chip area, which helps to improve the stability and reliability of the device under high-power operation. It is particularly suitable for high-frequency, high-density integrated RF front-end applications.

[0059] Reference Figure 8 As shown, as an optional implementation, the surface of the first metal connecting line 108 facing away from the substrate 100 is provided with a plurality of spaced protrusions 109.

[0060] This embodiment of the application effectively increases the thermally conductive contact area by setting bumps 109 on the metal connection line, and forms multiple local thermally conductive channels when in contact with external packaging structures (such as cover plates or thermal pads), thereby significantly improving the thermal conduction efficiency between interfaces. At the same time, the spacing between the bumps 109 helps to alleviate stress concentration caused by the difference in the thermal expansion coefficients of materials, improves structural reliability and thermal stability, and further enhances the heat dissipation capacity and long-term operational stability of the filter chip under high-power operating conditions.

[0061] Reference Figure 9 As shown, as an optional implementation, the heat-conducting structure 104 includes a second metal connection portion 110; the second metal connection portion 110 is disposed in the same layer as the first heat dissipation structure 105.

[0062] The thermally conductive structure 104 in this embodiment includes a second metal connection portion 110, which is disposed on the same layer as the first heat dissipation structure 105, and the thermally conductive structure 104 can be fabricated simultaneously with the first heat dissipation structure 105 in the same process steps. This design eliminates the need for additional manufacturing processes for the thermally conductive structure 104, providing good process compatibility. Furthermore, since the second metal connection portion 110 and the first heat dissipation structure 105 are on the same layer, more efficient and direct lateral heat conduction between the sub-heat dissipation structures 103 can be achieved, further improving the overall thermal diffusion efficiency and structural integration within the chip.

[0063] As an optional implementation, multiple sub-heat dissipation structures 103 are arranged around the outer periphery of the resonator 101, and the heat conduction structure 104 connects the multiple sub-heat dissipation structures 103 in series along the circumference of the resonator 101.

[0064] It should be noted that multiple sub-heat dissipation structures 103 are arranged around the periphery of the resonator 101, and these sub-heat dissipation structures 103 are connected in series along the circumference of the resonator 101 through a thermally conductive structure 104. This design enables the heat dissipation structure to form a ring or near-ring thermally conductive network around the heat source (i.e., the resonator 101), thereby more effectively capturing and dissipating the heat generated when the resonator 101 is working; at the same time, the circumferential series layout of the thermally conductive structure 104 realizes thermal connectivity between the multiple sub-heat dissipation structures 103, enhances the heat diffusion capability in the chip plane, improves the overall heat dissipation efficiency and heat distribution uniformity, and helps to extend the service life and stability of the device under high power conditions.

[0065] As an optional implementation, the bottom electrode 111 has the same thickness as the first heat dissipation structure 105; the top electrode 112 has the same thickness as the third heat dissipation structure 107. That is to say, the second heat dissipation structure 106 is located in the same layer as the piezoelectric layer and has the same thickness.

[0066] The embodiments of this application are beneficial to improving the compatibility and integration efficiency of the manufacturing process; at the same time, since the heat dissipation structure and the functional layer have the same thickness, it is beneficial to maintain the high consistency of the chip surface, reduce stress concentration and thermal resistance changes caused by thickness differences, thereby improving the overall heat conduction uniformity, structural stability and manufacturing yield of the device.

[0067] Reference Figure 1 As shown, as an optional implementation, there are multiple combined heat dissipation structures 102; the multiple combined heat dissipation structures 102 are arranged at intervals on the surface of the substrate. For example, there are four combined heat dissipation structures 102, and the four combined heat dissipation structures 102 are respectively disposed at the four corners.

[0068] This application provides a duplexer, including the above-described filter chip and a packaging structure for protecting the filter chip.

[0069] It should be noted that the embodiments of this application, by combining the efficient heat dissipation structure inside the filter chip with the external packaging structure, can significantly improve the overall heat dissipation capacity of the duplexer, ensuring its stable operation under high power conditions. The physical protection and environmental isolation functions provided by the packaging structure effectively extend the working life of the duplexer and improve its adaptability to external changes.

[0070] Furthermore, this application also provides an electronic device that includes the aforementioned filter chip. It is worth noting that the electronic device referred to herein encompasses not only intermediate products such as RF front-ends and filtering amplification modules, but also terminal products such as mobile phones, Wi-Fi devices, and drones. By integrating this innovatively designed filter chip, these electronic devices can achieve more efficient heat dissipation management while maintaining a compact form factor, improving overall performance and reliability, and meeting the demands of modern wireless communication for high-frequency, high-power processing capabilities.

[0071] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A filter chip, characterized by It includes a substrate (100), a resonator (101), and a combined heat dissipation structure (102); the resonator (101) and the combined heat dissipation structure (102) are both disposed on the surface of the substrate (100), and the combined heat dissipation structure (102) is adjacent to the resonator (101); the combined heat dissipation structure (102) includes a plurality of sub-heat dissipation structures (103) arranged in an array and a heat conduction structure (104); the heat conduction structure (104) connects the plurality of the sub-heat dissipation structures (103).

2. The filter chip of claim 1, wherein, The sub-heat dissipation structure (103) includes a first heat dissipation structure (105), a second heat dissipation structure (106), and a third heat dissipation structure (107) stacked together; the heat conduction structure (104) connects the first heat dissipation structure (105) of the multiple sub-heat dissipation structures (103); and / or, the heat conduction structure (104) connects the third heat dissipation structure (107) of the multiple sub-heat dissipation structures (103).

3. The filter chip of claim 2, wherein, The resonator (101) includes a bottom electrode (111), a piezoelectric layer and a top electrode (112) stacked together; the first heat dissipation structure (105) is disposed on the same layer as the bottom electrode (111) and the third heat dissipation structure (107) is disposed on the same layer as the top electrode (112).

4. The filter chip of claim 2, wherein, The projection of the second heat dissipation structure (106) on the substrate (100) falls into the projection of the first heat dissipation structure (105) on the substrate (100); and / or, the projection of the second heat dissipation structure (106) on the substrate (100) falls into the projection of the third heat dissipation structure (107) on the substrate (100).

5. The filter chip according to any one of claims 2-4, characterized in that, The heat-conducting structure (104) includes a first metal connecting line (108); the first metal connecting line (108) is laid on the surface of the third heat dissipation structure (107) on the side away from the substrate (100).

6. The filter chip of claim 5, wherein, The first metal connecting line (108) has a plurality of spaced protrusions (109) on the side of the first metal connecting line (108) away from the substrate (100).

7. The filter chip according to any one of claims 2-4, characterized in that, The heat-conducting structure (104) includes a second metal connection (110); the second metal connection (110) is disposed in the same layer as the first heat dissipation structure (105).

8. The filter chip according to any one of claims 2-4, characterized in that, Multiple sub-heat dissipation structures (103) are arranged around the outer periphery of the resonator (101), and the heat conduction structure (104) connects the multiple sub-heat dissipation structures (103) in series along the circumference of the resonator (101).

9. The filter chip of claim 3, wherein, The bottom electrode (111) has the same thickness as the first heat dissipation structure (105); and / or, the top electrode (112) has the same thickness as the third heat dissipation structure (107).

10. A diplexer, characterized by It includes the filter chip according to any one of claims 1-9 and the packaging structure for protecting the filter chip.

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