Photoelectric devices

Abstract

This utility model provides an optoelectronic device comprising: a first optical switch including a first optical input channel and a plurality of first optical output channels and configured to route an optical signal to a selected first optical output channel; a plurality of optical components having corresponding optical input channels connected to corresponding first optical output channels among the plurality of first optical output channels; a first optical combiner configured to combine optical signals from the plurality of optical components and having a combiner optical output channel; a monitoring circuit configured to receive optical signals from the combiner optical output channel and configured to determine the function of the optical signals from the combiner optical output channel; and an optical routing controller configured to change the designation of the selected first optical output channel among the plurality of first optical output channels based on a measurement signal from the monitoring circuit.

Description

Technical Field

[0001] This utility model relates to an optoelectronic device. Background Technology

[0002] In the field of optical communication systems, ensuring the reliability and stability of components such as waveguides, modulators, and photodetectors is crucial. These systems frequently face challenges associated with process variations and component failures, which can impact the performance and yield of optical devices. At the system level, the inability to modify optoelectronic circuits after testing often leads to circuit failures and significant performance degradation, severely limiting system performance and adaptability. Utility Model Content

[0003] In an embodiment of this utility model, the optoelectronic device includes: a first optical switch, including a first optical input channel and a plurality of first optical output channels, and the first optical switch is configured to route an optical signal received through the first optical input channel to a selected first optical output channel, the selected first optical output channel being one of the plurality of first optical output channels; a plurality of optical components, each having a corresponding optical input channel connected to a corresponding one of the plurality of first optical output channels, and having a corresponding optical component output channel; a first optical combiner, configured to combine optical signals from each of the plurality of optical component output channels and having a combiner optical output channel; a monitoring circuit, configured to receive optical signals from the combiner optical output channel and configured to determine the function of the optical signals from the combiner optical output channel; and an optical routing controller, configured to change the designation of the selected first optical output channel among the plurality of first optical output channels based on a measurement signal from the monitoring circuit. Attached Figure Description

[0004] The various aspects of this disclosure can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, for clarity of discussion, the dimensions of the various features may be arbitrarily increased or decreased.

[0005] Figure 1A This is a vertical cross-sectional view of an optoelectronic device including a bonding assembly according to an embodiment of the present disclosure;

[0006] Figure 1B This is a vertical cross-sectional view of an optoelectronic device according to an embodiment of the present disclosure, wherein optical devices and semiconductor devices are provided in a hybrid die;

[0007] Figures 2A to 2D During the manufacturing process, corresponding to Figure 1A A continuous vertical cross-section of region M in the diagram;

[0008] Figure 3A top view of an exemplary architecture that is part of an optical signal distributor or optical switch;

[0009] Figure 4 This is a schematic diagram of a first exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0010] Figure 5A This is a schematic diagram of the first architecture of a second exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0011] Figure 5B This is a schematic diagram of a second architecture of a second exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0012] Figure 5C This is a schematic diagram of a beam splitter that can be used in various embodiments of this disclosure;

[0013] Figure 6A This is a schematic diagram of the first architecture of a third exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0014] Figure 6B This is a schematic diagram of a second architecture of a third exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0015] Figure 7 This is a schematic diagram of a fourth exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0016] Figure 8A This is a schematic diagram of the first architecture of a fifth exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0017] Figure 8B This is a schematic diagram of the second architecture of a fifth exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0018] Figure 9A This is a schematic diagram of the first architecture of a sixth exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0019] Figure 9B This is a schematic diagram of the second architecture of a sixth exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0020] Figure 10 This is a schematic diagram of a seventh exemplary optoelectronic circuit according to an embodiment of the present disclosure;

[0021] Figure 11 This is a flowchart illustrating the steps of forming an optoelectronic device according to an embodiment of the present disclosure;

[0022] Figure 12 This is a flowchart illustrating the steps of operating the optoelectronic device according to an embodiment of the present disclosure. Detailed Implementation

[0023] The following disclosure provides numerous different embodiments or examples for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature above or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features such that the first and second features are not in direct contact. Additionally, reference numerals and / or letters may be repeated in the various examples of this disclosure. Such repetition is for simplicity and clarity and does not in itself define a relationship between the various embodiments and / or configurations discussed.

[0024] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “over” are used herein to describe the relationship between one element or feature and another element or feature as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to cover different orientations of a device or operation in use. Devices may be oriented in other ways (rotated 90 degrees or otherwise) and the spatial relative descriptors used herein may be interpreted accordingly. Unless otherwise expressly stated, elements having the same reference numerals refer to the same elements and are assumed to have the same material composition and the same range of thicknesses. As used herein, an element or system “configured to” function or operate or “configured to” provide or perform a function or operation means an element or system equipped with hardware and suitable software to provide the functions or operations described in this disclosure, and unless any details of such hardware or such software are explicitly described herein, they are as known in the art.

[0025] In semiconductor manufacturing, particularly in the fabrication of optical components such as waveguides and metal layers, the primary focus is on providing signal coupling between these components and the metal layers. However, practical challenges in the manufacturing process can introduce process errors, leading to broken wires or suboptimal component characteristics, thus impacting overall yield and reliability. Furthermore, related component designs often fail to consider broader system-level integration, resulting in inefficient and uncoordinated final optoelectronic devices. At the system level, the inability to modify after testing often leads to circuit failures and significant waste of device area, potentially limiting system performance and adaptability.

[0026] The embodiments of this disclosure enhance the stability and reliability of optoelectronic devices through a novel redundancy architecture. Redundant components are integrated into photonic or electronic integrated dies, thereby maximizing functional efficiency while minimizing device footprint and power consumption. Each multiplier is designed as part of a redundant system and configured to switch to a backup component in real time in the event of a failure. Therefore, the multiplier reduces device downtime and improves device availability. Switching to the backup component can be achieved via an electrically adjustable output selector in an optical switch. The electrically adjustable output selector may include a Mach-Zehnder interferometer (MZI), a phase shifter, or a metal heater capable of effectively performing the switching operation. Embodiments of this disclosure can be used to increase throughput without compromising the stability of components in the optoelectronic device. The redundancy architecture of this disclosure allows for independent verification of the functionality of individual optical or optoelectronic components during testing.

[0027] This disclosure provides a novel redundancy architecture that ensures high component stability during system mass production. The redundancy architecture improves system reliability and stability by providing continuous operation of the optoelectronic device even in the event of a primary component failure. In other words, the redundancy architecture provides fault-tolerant, stable, and continuous device operation for the optoelectronic device.

[0028] The redundant architecture of this disclosure improves production output and allows for real-time repair of optoelectronic circuits during testing and field faults. Specifically, the redundant structure provides fault tolerance during manufacturing, preventing serious failures caused by process errors, thereby improving process yield and throughput. Furthermore, when a field failure occurs, the redundant structure can quickly switch to a backup component to rapidly repair the fault, reducing production downtime and thus improving production efficiency. This architecture involves adding a redundant structure that can activate a backup component with the same functionality when the primary component fails, thereby improving system reliability and stability. The deactivation of the failed primary component and the activation of the backup component can be performed during testing or in the field using an optical routing controller, the operation of which will be described in detail below. Various aspects of embodiments of this disclosure are now described with reference to the accompanying drawings.

[0029] refer to Figure 1AThis illustration shows an exemplary bonding assembly including a photonic integrated die 100 and an electronic integrated die 200. As used herein, a "photonic integrated die" refers to a die comprising multiple photonic components and circuitry. Photonic components typically include waveguides, optical switches, modulators, optical combiners, and photodetectors used to manipulate, control, and detect optical signals. The photonic integrated die 100 provides high-density integrated photonic functionality, offering a compact, efficient, and scalable solution for optical communication and signal processing systems. The photonic integrated die 100 is designed to seamlessly connect with the electronic components and circuitry within the electronic integrated die 200 to facilitate hybrid integration with electronic integrated circuits for enhanced functionality and performance.

[0030] As used herein, "electronic integrated die" refers to a die comprising a semiconductor substrate in which various electronic components and circuits are integrated. Electronic components typically include transistors, diodes, resistors, capacitors, and integrated circuits for processing electrical signals. Electronic integrated die 200 provides high-density integrated electronic functionality, offering a compact, efficient, and scalable solution for electronic processing and signal management. Electronic integrated die 200 is designed to seamlessly connect with photonic components and circuits in photonic integrated die 100, thereby allowing the formation of optoelectronic devices that enhance overall system performance and functionality.

[0031] The photonic integrated die 100 includes a photonic die substrate 9, optical devices 40, and various waveguides 20 for guiding the propagation path of photons. The photonic die substrate 9 may include a semiconductor substrate, such as a silicon substrate. The various waveguides 20 are configured to transmit optical signals through them and can therefore be used as optical channels. A first subset of the optical channels serves as the optical input channel of the corresponding optical device 40. A second subset of the optical channels serves as the optical output channel of the corresponding optical device 40. An optical channel can be the optical output channel of the first optical device 40 and can be the optical input channel of the second optical device 40. In other words, some optical channels connecting two optical devices 40 serve as both optical input and optical output channels, while others serve only as optical input channels or only as optical output channels. Therefore, the first subset and the second subset are not mutually exclusive. The photonic integrated die 100 may also include a photonic die metal interconnect structure 180 embedded within a photonic die dielectric material layer 160. The photonic die bonding pad 198 can be embedded in the farthest dielectric layer within the photonic die dielectric layer 160.

[0032] Optical device 40 can be any type of optical device known in the art and can include one or more of silicon photonic devices, optical switches, optical amplifiers, optical filters, optical modulators, and photodetectors 550. Photodetectors 550, as a subset of optical device 40, can be formed on photonic die substrate 9. Other optical devices 40 can be formed or placed within photonic die dielectric layer 160. In some embodiments, a first subset of photonic die metal interconnect structure 180 can be formed as a component of optical device 40, and a second subset of photonic die metal interconnect structure 180 can be used to provide metal wiring for optical device 40. An optical path can be provided between a subset of waveguide 20 and the optical input node of photodetector 550. A subset of photonic die metal interconnect structure 180 can include metal via structures contacting the electrical output node of photodetector 550. Photonic die bonding pad 198 can be configured as metal-to-metal bonding, controlled collapse chip connection (C4) bonding, or microbump bonding (also referred to as C2 bonding).

[0033] Electronic integrated die 200 includes a semiconductor die, which includes a semiconductor substrate 201 and a semiconductor device 240 located on the semiconductor substrate 201. Semiconductor device 240 includes optoelectronic devices such as photodetectors and complementary metal-oxide-semiconductor (CMOS) devices such as field-effect transistors. The CMOS device may include control circuitry for controlling the operation of optical device 40. Electronic integrated die 200 may also include electronic die metal interconnect structures 280 embedded within an electronic die dielectric layer 260. Electronic die bonding pads 298 may be formed within the furthest dielectric layer within the electronic die dielectric layer 260. Electronic die bonding pads 298 may be configured for metal-to-metal bonding, controlled collapse chip connection (C4) bonding, or microbump bonding (also known as C2 bonding).

[0034] Generally, an optical path is provided between the waveguide 20 and the photodetector 550 in the photonic integrated die 100. An electrical signal path, i.e., an electrical conduction path, for transmitting data signals is provided between the output electrical node of the photodetector 550 in the photonic integrated die 100 and the input node of the control circuitry within the electronic integrated die 200. An electrical signal path, i.e., an electrical conduction path, for transmitting control signals is provided between the control circuitry within the electronic integrated die 200 and a subset of the optical devices 40 within the photonic integrated die 100. Control signals can be transmitted across the photonic integrated die 100 and the electronic integrated die 200 via electrical conduction paths comprising corresponding bonding pairs of photonic die bonding pads 198 and electronic die bonding pads 298. While various embodiments can be described such that the electronic die bonding pad 298 is bonded to the photonic die bonding pad 198 via metal-to-metal to provide an electrical conduction path extending across the photonic integrated die 100 and the electronic integrated die 200, other embodiments are explicitly contemplated herein, wherein the conductive path includes a bonding structure comprising solder balls.

[0035] Optionally, at least one additional die 300 may be attached to the electronic integrated die 200. The at least one additional die 300, if present, may include a semiconductor die comprising at least one field-effect transistor. The at least one additional die 300 may include a logic die, a memory die, a passive component die, or any other type of semiconductor die. The at least one additional die 300 may include additional bonding pads 398 that are bonded to a subset of the electronic die bonding pads 298 in the electronic integrated die 200.

[0036] Figure 1B This is a vertical cross-sectional view of an optoelectronic device according to an embodiment of the present disclosure, wherein an optical device 40 and a semiconductor device 240 are provided in a hybrid die 400. The hybrid die 400 can be configured to utilize the semiconductor device 240 formed on a photonic die substrate 9. Figure 1A The photonic integrated die 100 shown is derived from this. The photonic die metal interconnect structure 180 provides electrical connection between the optical device 40 and the semiconductor device 240. In embodiments using the hybrid die 400, the hybrid die 400 may have a reference... Figure 1A The function of the combination of the photonic integrated die 100 and the electronic integrated die 200 described.

[0037] Figures 2A to 2D During the manufacturing process, corresponding to Figure 1A A continuous vertical cross-section of region M in the diagram.

[0038] refer to Figure 2AA photodetector 550 may be formed on the photonic die substrate 9. The photodetector 550 is a subset of the optical devices 40 formed on or above the photonic die substrate 9. A photonic die dielectric layer 160 may be formed above the photonic die substrate 9 and the photodetector 550. The photonic die dielectric layer 160 comprises a dielectric material, such as silicon oxide. The thickness of the photonic die dielectric layer 160 may range from 0.5 micrometers to 10 micrometers, for example, from 1 micrometer to 5 micrometers, but smaller and larger thicknesses may also be used.

[0039] Waveguide material layer 20L can be deposited over photonic grain dielectric material layer 160 as a blanket material layer with uniform thickness. Waveguide material layer 20L comprises a material with a higher refractive index than that of photonic grain dielectric material layer 160. For example, in embodiments where photonic grain dielectric material layer 160 comprises silicon oxide, waveguide material layer 20L may comprise silicon or silicon nitride. The thickness of waveguide material layer 20L can range from 100 nm to 500 nm, but smaller and larger thicknesses can also be used.

[0040] The photoresist layer 27 can be applied over the waveguide material layer 20L and can be photolithographically patterned into the pattern of the subsequently formed optical signal distributor. The pattern of the optical signal distributor will then be described in detail.

[0041] refer to Figure 2B The pattern in the photoresist layer 27 can be transferred to the waveguide material layer 20L by performing an anisotropic etching process. The photoresist layer 27 can be used as an etching mask layer, and the waveguide material layer 20L can be patterned into various waveguides 20, which include various optical channels and components of various optical devices 40 (including optical switches, various optical components, and optical combiners). The photoresist layer 27 can then be removed, for example, by ashing. The width of each segment of each waveguide 20 can be uniformly large and can be in the range of 100 nm to 500 nm, but smaller and larger widths can also be used.

[0042] refer to Figure 2C An additional photonic die dielectric layer 160 and optical device 40 can then be formed. The optical device 40 may include any optical components known in the art. The photonic die metal interconnect structure 180 and the photonic die bonding pad 198 may be formed within the additional photonic die dielectric layer 160 and may be electrically connected to the electrical nodes of the optical device 40.

[0043] refer to Figure 2DAn electronic integrated die 200 can be provided. The electronic integrated die 200 can be any type of semiconductor die, such as a system-on-a-chip (SoIC) die, a central processing unit, a graphics processing unit, a memory die, etc. The electronic integrated die 200 may include a semiconductor device 240 formed on the top surface of the semiconductor substrate 201. The semiconductor device 240 may include field-effect transistors 210. An electronic die dielectric layer 260 is formed above the semiconductor device 240. A combination of the semiconductor device 240 and a subset of the electronic die metal interconnect structure 280 includes control circuitry configured to generate control signals for the optical device 40 within the photonic integrated die 100. Each field-effect transistor 210 may include a corresponding gate 205, a corresponding gate dielectric, a corresponding source region 202, and a corresponding drain region 208. Generally, the electronic integrated die 200 includes a semiconductor substrate 201, a control circuit including a semiconductor device (e.g., a field-effect transistor 210), an electronic die metal interconnect structure 280, and an electronic die bonding pad 298 formed in the electronic die dielectric material layer 260.

[0044] The electronic die 200 can be directly attached to the photonic die 100 by bonding the electronic die pad 298 to the photonic die pad 198 via metal-to-metal bonding, or the electronic die 200 can be indirectly attached to the photonic die 100 via an array of solder material portions (e.g., solder balls).

[0045] Figure 3 This is a top view of an exemplary architecture that is part of an optical signal splitter or optical switch. Generally, there is one common port and multiple optical ports (such as optical port 1, optical port 2, ..., and optical port 8). In embodiments where the common port is used as an optical input channel and in embodiments where the multiple optical ports are used as multiple optical output channels, such an optical device can be used as an optical switch. In embodiments where the multiple optical ports are used as optical input ports and the common port is used as an optical output port, such an optical device can be used as an optical combiner. In embodiments where optical device 40 is an optical switch, an electrically adjustable output selector (not specifically shown) can be incorporated into such optical device 40. The electrically adjustable output selector can be selected from a Mach-Zehnder interferometer, an electrically adjustable phase shifter, and a metal heater. Generally, the total number of optical ports within the multiple optical ports can range from 2 to 128, but larger numbers can also be used. While this disclosure has been described using an embodiment with a total number of 8 optical ports within the multiple optical ports, embodiments in which the total number of optical ports (excluding the common port) is greater than 1 rather than 8 are explicitly contemplated. Furthermore, it should be understood that... Figure 3 The architecture shown is merely exemplary, and any shape suitable as a waveguide can be used as a component of the optical device 40.

[0046] refer to Figure 4 The diagram illustrates a first exemplary optoelectronic circuit representing an optoelectronic device of the present disclosure. According to various embodiments disclosed herein, the first exemplary optoelectronic circuit includes a combination of a first optical switch 420 and a first optical combiner 470, which addresses the yield issues of native components during manufacturing and improves the reliability and stability of the optoelectronic device. The optoelectronic device can be dynamically configured to provide system flexibility and scalability. This optoelectronic device includes a redundant architecture to improve fault tolerance and reliability.

[0047] The first exemplary optoelectronic circuit includes a first optical switch 420, which can be an N-port switch, i.e., an optical switch with N optical output ports. N is a positive integer greater than 1, i.e., an integer such as 2, 3, 4, 5, 6, 7, 8, etc. The first optical switch 420 includes a first optical input channel 410 and N first optical output channels 430.

[0048] The first optical switch 420 controls the switching of channels. An optical switch is a device that selectively routes optical signals from one channel to another. Optical switches alter the architecture of optical networks and allow for dynamic reconfiguration of signal paths without converting optical signals to electrical signals and vice versa. In an embodiment, the first optical switch 420 includes an electrically adjustable output selector, which includes a Mach-Zehnder interferometer, and the Mach-Zehnder interferometer includes an electrically adjustable phase shifter.

[0049] Generally, Mach-Zehnder interferometers (MZIs), phase shifters, and metal heaters are interconnected and can be used to provide functional optical switches. A Mach-Zehnder interferometer is a photonic device used to modulate and switch optical signals. The two arms of a Mach-Zehnder interferometer separate and then recombine light rays, producing an interference pattern. By adjusting the relative phase of the light in the two arms, the output intensity can be controlled, effectively modulating the signal. A phase shifter is a component that changes the phase of an optical signal. In an MZI, a phase shifter is used to control the phase difference between the two arms of the interferometer. This phase control is crucial for achieving the desired interference pattern and for modulating or switching optical signals. A metal heater can be used as a mechanism to induce a phase shift in an optical waveguide. Applying current through the metal heater generates heat, thereby changing the refractive index of the waveguide material (usually through a thermo-optical effect). This change in refractive index alters the phase of the optical signal passing through the waveguide.

[0050] The first exemplary optoelectronic circuit also includes N optical components 450, also referred to as N main components. The N optical components 450 may be optical components with the same design, or may be optical components configured to provide the same or similar functions. Generally, the N optical components 450 may be multiple instances of any optical component known in the art, or may be optical components of similar design with different design parameters (e.g., dimensions). Each of the N optical components 450 may be configured to provide the key functions of the disclosed optoelectronic circuit. Each optical input node of the N optical components 450 may be optically coupled to a corresponding one of the N first optical output channels 430. Each output node of the N optical components 450 includes an optical component output channel 460. N optical component output channels 460 may be provided.

[0051] Exemplary optical devices that can be used as the N optical components 450 of this disclosure include, but are not limited to, optical switches, Mach-Zehnder interferometers (MZIs), phase shifters, optical combiners, beam splitters, modulators, attenuators, filters, and wavelength division multiplexers. In embodiments where an optical switch is used as one of the N optical components 450, it should be understood that the optical switch within one of the N optical components 450 provides a master switching function, and multiple instances of the first optical switch 420 can be used to provide multiple source signals as multiple optical inputs to each of the N optical components 450 (i.e., the master optical switch). Generally, the N optical components 450 perform primary optical signal processing functions, and the first optical switch 420 provides the function of directing the input signal to one of the N first optical output channels 430. Similarly, for any function provided by the optical components 450 of this disclosure, the first optical switch 420 provides the function of directing the input signal to one of the N first optical output channels 430.

[0052] Each of the N optical components 450 is configured to perform basic functions of an optoelectronic circuit. For example, an optical switch can selectively route optical signals between different paths, while an MZI can be used for signal modulation or switching by utilizing interference effects. A phase shifter can adjust the phase of an optical signal to achieve a desired interference pattern or to synchronize signals within a circuit. An optical combiner combines multiple optical signals into a single output channel, optimizing the use of the optical infrastructure. On the other hand, a beam splitter splits a single optical signal into multiple paths, enabling parallel processing or distribution of the signal. A modulator can change the intensity, phase, or polarization of an optical signal to encode information, while an attenuator controls the power level of the signal. Filters can selectively transmit or block specific wavelengths, aiding in signal processing and management. Wavelength division multiplexers combine or separate signals of different wavelengths, increasing the data carrying capacity of the optical network. Each of these optical devices can be customized according to specific design parameters to meet the requirements of the optoelectronic circuit, ensuring optimal performance and functionality.

[0053] During operation, the first optical switch 420 can utilize a Mach-Zehnder interferometer (MZI), a phase shifter, and / or a metal heater to manage switching and direct light energy to the selected optical component 450. By default, without any bias, the primary optical component 450 (e.g., the default optical component 450) is selected from N optical components 450. The N optical components 450 provide a redundancy feature of this disclosure.

[0054] Using the same component parameters (e.g., pattern dimensions) for N optical components 450 increases throughput during manufacturing. Using different component parameters for N optical components 450 facilitates the testing and identification of optimal device parameters. If the function of the optical component 450 depends primarily on process throughput and local defects, the same component parameters can be used for all N optical components. If the function of the optical component 450 depends primarily on the device design, different component parameters can be used for all N optical components.

[0055] In a non-limiting example, optical component 450 may include a transmitter, such as a modulator. High stability and reliability are critical for the transmitter. To improve throughput and reduce the risk of component failure, redundancy techniques utilizing N transmitter instances can be used. For example, compared to optical components without redundancy, optical component 450 employing redundancy exhibits higher throughput and more efficient area utilization, minimizing processing problems and enhancing overall availability. By implementing a redundancy architecture that incorporates N optical components 450, the system performance and reliability of the optoelectronic circuitry can be enhanced. The redundancy architecture of this disclosure not only prevents component failure but also improves throughput and system stability, thereby enhancing the overall robustness of the optoelectronic device.

[0056] The first exemplary optoelectronic circuit also includes a first optical combiner 470. An optical combiner is a device that combines multiple optical signals into a single output channel. Therefore, the first optical combiner 470 combines the optical outputs from N optical component output channels 460 and provides the combined optical output through a combiner optical output channel 490. In other words, the first optical combiner 470 integrates the optical signals from N optical component output channels 460 and facilitates efficient transmission of the combined optical signals on a single optical fiber or waveguide serving as the combiner optical output channel 490.

[0057] The first optical combiner 470 is designed to combine signals with minimal insertion loss, thereby preserving the power of the combined signal for further transmission and processing. In wavelength division multiplexing (WDM) systems, the first optical combiner 470 combines signals of different wavelengths into a single fiber, thereby optimizing bandwidth utilization and increasing network capacity. Furthermore, the first optical combiner 470 effectively handles interference between combined signals using techniques such as directional couplers, multi-mode interference (MMI) couplers, or other structures to ensure constructive signal integration.

[0058] Depending on the specific application requirements, various types of optical combiners can be used. These include directional couplers, which use evanescent coupling to combine signals from two waveguides into one; MMI couplers, which utilize the self-imaging principle of multimode waveguides to combine multiple signals; star couplers, particularly suitable for passive optical networks (PONs), used to combine signals from multiple input fibers into a single output fiber; and WDM multiplexers, which use wavelength-selective components (such as diffraction gratings or thin-film filters) to combine signals of different wavelengths. Each of these combiners can be customized to specific design parameters to meet the requirements of optoelectronic circuits, ensuring optimal performance and functionality.

[0059] Integrating the first optical combiner 470 into the optoelectronic circuitry allows for the dynamic combining of optical signals from N optical components 450, thereby enhancing system flexibility and scalability. By combining multiple optical signals into a single output, the first optical combiner 470 optimizes the use of optical infrastructure and improves the network's data carrying capacity. This integration is particularly advantageous for applications such as optical communication networks, laser systems, and photonic integrated circuits (PICs), where efficient management and routing of optical signals are crucial for optimizing system performance.

[0060] Therefore, the first optical combiner 470 primarily adjusts and integrates optical energy through optical components 450. Phase issues based on system application or component characteristics are also considered; optional phase shifters can be added to adjust the phase and ensure maximum energy output.

[0061] Generally, the first optical switch 420 includes a first optical input channel 410 and a plurality of first optical output channels 430. The first optical switch 420 is configured to route an optical signal received through the first optical input channel 410 to a selected first optical output channel 430, which is one of N first optical output channels 430. According to aspects of this disclosure, an optical routing controller 800 can be used to perform the determination of the selected first optical output channel 430 among the N first optical output channels 430; the optical routing controller 800 is a subset of the aforementioned semiconductor device 240. The optical routing controller 800 is configured to change the designation of the selected first optical output channel 430 among the plurality of first optical output channels 430 (i.e., the N first optical output channels 430) based on measurement signals from a monitoring circuit, as will be described subsequently with reference to specific embodiments.

[0062] refer to Figure 5A This illustrates a first architecture of a second exemplary optoelectronic circuit according to an embodiment of the present disclosure. The first architecture of the second exemplary optoelectronic circuit can be derived by setting the value of the integer N to 2. Figure 4 The first exemplary optoelectronic circuit shown is derived from this.

[0063] refer to Figure 5B and Figure 5C The second exemplary optoelectronic circuit's second architecture can be achieved by incorporating a monitoring circuit 500 that monitors the light output from the optical component 450. Figure 5A The first architecture of the second exemplary optoelectronic circuit shown is derived. A beam splitter 620, i.e., a power divider, may be incorporated into each optical component 450. Specifically, the terminal (i.e., output terminal) of each optical component 450 may include a beam splitter 620, which provides a through port 46T and a drop port 46D as two optical output ports. The primary portion of the optical output from the device portion of the optical component 450 is directed to the through port 46T, and a secondary portion of the optical output from the device portion of the optical component 450 is directed to the drop port 46D. In an illustrative example, approximately 80% to 99% of the light energy (i.e., signal strength) from the device portion of the optical component 450 may be directed to the through port 46T, and approximately 1% to 20% of the light energy from the device portion of the optical component 450 may be directed to the drop port 46D.

[0064] The optical output from the download port 46D of optical component 450 can be directed to the additional optical combiner 470' and subsequently to the monitoring circuit 500. In embodiments where the monitoring circuit 500 detects no optical signal from the additional optical combiner 470', the information is transmitted to the optical routing controller 800 in the form of an electrical signal. The optical routing controller 800 then determines that the currently selected optical component 450 (which includes the only optical path activated between the first optical switch 420 and the additional optical combiner 470' at detection time) has failed to correctly transmit and / or process the optical input signal provided by the first optical switch 420. At this point, the optical routing controller 800 can deactivate the previously selected first optical output channel 430, activate the newly selected first optical output channel 430, and transmit the optical signal to another optical component 450 via the first optical switch 420.

[0065] The combination of monitoring circuit 500 and optical route controller 800 constitutes a feedback system. Monitoring circuit 500 may include at least one reference... Figures 1A to 2D The photodetector 550 is described. An embedded beam splitter 620 integrated into the output node of each optical component 450 can be used as a switching element without requiring 100% switching efficiency, thus allowing a small portion of the optical output energy to be transferred to the feedback system. The combination of redundant architecture and the feedback system facilitates automatic switching. The feedback system uses at least one download port 46D of the photodetector 550 and the beam splitter 620.

[0066] refer to Figure 6A and Figure 6B The first and second architectures of the third exemplary optoelectronic circuit are shown respectively. Figure 6A The first architecture of the third exemplary optoelectronic circuit can be derived from a specific embodiment using monitoring circuit 500 and by optionally attaching the light monitoring unit 700 to the combiner light output channel 490. Figure 5B The second architecture of the second exemplary optoelectronic circuit is derived. The light output from the light monitoring unit 700 is referred to herein as the monitoring light output. Generally, the light monitoring unit 700 may include any light monitoring device and / or any light encryption device known in the art. For example, the light monitoring unit 700 (if present) may include a wavelength meter, a spectrum analyzer, a power meter, or alternative optical components configured to analyze the wavelength accuracy, phase shift, power level, and / or spectral characteristics of the light signal. In addition, the light monitoring unit 700 may include encryption devices to ensure the secure transmission of the light signal.

[0067] Figure 6A The first architecture of the third exemplary structure shown uses two optical components 450. Figure 6BThe second architecture of the third exemplary structure shown uses N optical components 450, where N can be any integer greater than 1. Each monitoring circuit 500 includes multiple series connections of a corresponding monitoring circuit optical channel 530 and a corresponding photodetector 550, the corresponding photodetector 550 being configured to generate a corresponding electrical signal (i.e., electrical output) upon detecting an optical signal thereon. Each monitoring circuit optical channel 530 can be the optical output channel of a second optical switch 520, and is therefore also referred to as a second optical output channel. Figure 6A The first architecture of the third exemplary structure shown uses two series connections of the corresponding monitoring circuit optical channel 530 and the corresponding photodetector 550, and Figure 6B The second architecture of the third exemplary structure shown uses M series connections of the corresponding monitoring circuit optical channels 530 and the corresponding photodetectors 550. M can be any integer greater than 1. The series connections of the corresponding monitoring circuit optical channels 530 and the corresponding photodetectors 550 provide 2x or Mx redundancy to prevent failure of the monitoring circuit optical channels 530 and to prevent failure of the photodetectors 550 for any reason (e.g., due to process yield issues, reliability issues, device degradation, or usage conditions).

[0068] In one embodiment, each monitoring circuit 500 includes a second optical switch 520, and the second optical switch 520 is configured to route an optical signal from the combiner optical output channel 490 to a selected second optical output channel, which is one of the monitoring circuit optical channels 530. In another embodiment, an optical routing controller 800 is configured to change the designation of the selected second optical output channel in the monitoring circuit optical channel 530 based on measurement signals from the monitoring circuit 500.

[0069] Generally, the monitoring circuit 500 can be configured to receive optical signals from the combiner optical output channel 490 and can be configured to determine the function of the optical signals from the combiner optical output channel 490. The measure of the function of the optical signals from the combiner optical output channel 490 can be the generation of an electrical output (e.g., photovoltaic current) of a sufficiently high intensity, i.e., an electrical output above a threshold. The monitoring circuit 500 includes at least one photodetector 550, which is configured to generate at least one electrical signal as a measurement signal for the monitoring circuit 500 based on the optical signals from the combiner optical output channel 490.

[0070] The optical routing controller 800 can be configured to change the designation of a selected first optical output channel 430 and / or change the designation of a selected second optical output channel among the optical output channels 530 of the monitoring circuit based on the magnitude of the electrical signal generated by the monitoring circuit 500. Generally, failure to generate electrical output from the selected photodetector 550 pointed to by the output of the second optical switch 520 may be due to a fault in the selected photodetector 550 or a fault in the selected optical component 450 pointed to by the output of the first optical switch 420. In an embodiment, the optical routing controller 800 may first change the designation of the selected first optical output channel 430 to test whether enabling an alternative first optical output channel 430 (and an alternative optical component 450) resolves the detected lack of sufficient electrical output from the selected photodetector 550, and then change the designation of the selected second optical output channel 530 only if enabling the alternative optical component 450 fails to restore electrical output from the selected photodetector 550. In an alternative embodiment, the optical routing controller 800 may first change the designation of the selected second optical output channel 530 to test whether enabling the alternative second optical output channel 530 (and the alternative photodetector 550) causes the newly selected photodetector 550 to generate sufficient electrical output, and then only change the designation of the selected first optical output channel 430 if enabling the alternative photodetector 550 fails to cause the newly selected photodetector 550 to generate sufficient electrical output.

[0071] In one embodiment, a first optical switch 420, a plurality of optical components 450, a first optical combiner 470, an additional optical combiner 470', a second optical switch 520, and at least one photodetector 550 may be located in a photonic integrated die 100, and an optical routing controller 800 may be located in an electronic integrated die 200. In this embodiment, the photonic integrated die 100 and the electronic integrated die 200 are directly coupled to each other or coupled to each other through at least one intermediate chip, such that at least one optical path is provided between the first optical combiner 470 and at least one photonic integrated die 100. In this embodiment, at least one electrically conductive path extends from the output node of the optical routing controller 800 to the control node of the first optical switch 420, and each of the at least one electrically conductive path includes a corresponding photonic die bonding pad 198 and a corresponding electronic die bonding pad 298.

[0072] Alternatively, the first optical switch 420, a plurality of optical components 450, the first optical combiner 470, the additional optical combiner 470', the second optical switch 520, at least one photodetector 550, and the optical routing controller 800 may be located in the hybrid die 400.

[0073] In one embodiment, the first optical switch 420 includes an electrically adjustable output selector, which includes a Mach-Zehnder interferometer that includes an electrically adjustable phase shifter, and the optical routing controller 800 is configured to generate an electrical control signal applied to the electrically adjustable output selector. In another embodiment, the second optical switch 520 includes an additional electrically adjustable output selector, which includes a Mach-Zehnder interferometer that includes an electrically adjustable phase shifter, and the optical routing controller 800 is configured to generate an electrical control signal applied to the additional electrically adjustable output selector.

[0074] refer to Figure 7 This illustrates a fourth exemplary optoelectronic circuit according to an embodiment of the present disclosure, which can be used to obtain light from the combiner optical output channel 490 by connecting a photodetector 550. Figure 4 and Figure 5A The first and second exemplary optoelectronic circuits are derived from this. In this embodiment, the photodetector 550 can be used as shown in the reference. Figure 6A and Figure 6B The described monitoring circuit 500 functions as follows: The electrical output from the photodetector 550 can be a measurement signal, which is the electrical input signal of the optical routing controller 800 that generates the electrical output signal for the first optical switch 420.

[0075] In one embodiment, tuning the wavelength of photons propagating through the combiner optical output channel 490 facilitates the conversion of optical energy in the beam passing through the combiner optical output channel 490 into electrical energy in the electrical output of the photodetector 550. In another embodiment, a metal heater may be disposed on the waveguide 20, which serves as the combiner optical output channel 490, to adjust the wavelength of the photons therein. To ensure the reliability of the photodetector 550 during mass production, the photodetector 550 in the fourth exemplary optoelectronic circuit may employ a redundant architecture, which stabilizes the conversion of optical energy to electrical energy, thereby enhancing the stability of the receiving system.

[0076] refer to Figure 8A and Figure 8B The first and second architectures of a fifth exemplary optoelectronic circuit according to embodiments of the present disclosure are shown respectively. The fifth exemplary optoelectronic circuit implements the redundant architecture of the present disclosure for the photodetector 550 in the fourth exemplary optoelectronic circuit. Figure 8A The first architecture corresponds to an embodiment in which two optical components 450 and two photodetectors 550 are used. Figure 8B The second architecture corresponds to an embodiment that uses N optical components and M photodetectors 550, where N is a first integer greater than 1 and M is a second integer greater than 1. The photodetectors 550 in the fourth exemplary optoelectronic circuit can be referenced... Figure 6AThe described monitoring circuit 500 is used instead to provide the first architecture of the fifth exemplary structure. The second architecture of the fifth exemplary structure can be derived from the first architecture of the fifth exemplary structure by using N times redundancy of optical component 450 and M times redundancy by using the series connection of the corresponding monitoring circuit optical channel 530 and the corresponding photodetector 550.

[0077] Generally speaking, use Figure 8A and Figure 8B The monitoring circuit 500 shown enhances the stability and efficiency of the optoelectronic device of this disclosure by employing a redundant architecture within the monitoring circuit 500. In other words, double or M-fold redundancy in the photodetector 550 ensures that the optoelectronic device can be repaired at the testing step during manufacturing and / or during field operation. The redundant architecture ensures stable operation of the optical component 450 and ensures stable and efficient photoelectric conversion of the photodetector 550. Accordingly, the reliability and fault tolerance of the optoelectronic device are improved, the failure rate is reduced, and the stable and efficient operation of the system including the optoelectronic device is ensured.

[0078] refer to Figure 9A and Figure 9B The first and second architectures of a sixth exemplary optoelectronic circuit according to embodiments of the present disclosure are shown respectively. Figure 9A The first architecture of the sixth exemplary structure can be achieved by using a monitoring circuit 500 with M times redundancy instead of the twice redundancy in the photodetector 550. Figure 6A The first architecture of the third exemplary structure shown is derived. A first subset of the optical component output channels 460 may be a through port 46T, while a second subset of the optical component output channels 460 may be a download port 46D. Figure 9B The second architecture of the sixth exemplary structure can be derived from using N optical components 450 (to provide N times redundancy instead of twice the redundancy in the optical components 450). Figure 9A The first architecture of the sixth exemplary structure shown is derived.

[0079] Generally, integrating multiple redundant units in an optoelectronic device can enhance system reliability and fault tolerance. Optical feedback functionality can detect component accuracy in real time, and can be manually adjusted to ensure component stability and reduce failure rates. Download port 46D provides real-time confirmation of the stability and accuracy of the optical signal, allowing for timely detection and resolution of problems. Furthermore, redundant components (e.g., optical components 450) are added before the photoelectric detector 550 performs photoelectric conversion to ensure stable and efficient conversion. Accordingly, embodiments of this disclosure provide stable and efficient operation of the entire system, reducing failure rates and improving system reliability. Additionally, the redundant architecture of this disclosure reduces the impact of a single component failure on the entire system. When one unit fails, other redundant units can take over its operation and maintain system operation, thereby improving system availability.

[0080] refer to Figure 10 The seventh exemplary optoelectronic circuit according to embodiments of this disclosure can be used to split light from optical components by employing a beam splitter 620. Figure 9B The second embodiment of the sixth exemplary optoelectronic circuit shown derives that the beam splitter 620 splits the optical signal from the auxiliary optical combiner 470' into a first optical output that passes through a through-channel 63T and is subsequently transmitted to the second optical switch 520, and a second optical output that passes through a download channel 63D and is guided to the optical monitoring unit 700. The optical monitoring unit 700 can be any of the functions described above. In other words, the input channel of the optical monitoring unit 700 can be the download channel 63D of the beam splitter 620 connected to the output port of the auxiliary optical combiner 470'.

[0081] The various embodiments of this disclosure provide a redundant architecture that not only mitigates the risk of component failure but also enhances the overall system's fault tolerance, ensuring continuous operation even under component stress or failure. This approach reduces production downtime and system-level area waste typically associated with the prior art, thereby improving the economic efficiency and environmental sustainability of the manufacturing process. Furthermore, the integration of system-level feedback mechanisms allows for continuous tuning and optimization, thereby improving the accuracy and reliability of signal transmission within the system. Therefore, the disclosed embodiments provide a robust solution that improves the yield and reliability of semiconductor devices, overcoming the limitations and challenges previously encountered in conventional manufacturing practices.

[0082] refer to Figure 11 The flowchart shows the sequence of steps in manufacturing an optoelectronic device.

[0083] Refer to steps 1110 and Figures 2A to 2C and Figures 4 to 10The system provides a photonic integrated chip 100, which includes a first optical switch 420. The first optical switch 420 includes a first optical input channel 410 and a plurality of first optical output channels 430. The first optical switch 420 is configured to route an optical signal received through the first optical input channel 410 to a selected first optical output channel 430, which is one of the plurality of first optical output channels 430. The photonic integrated chip 100 also includes a plurality of optical components 450, a first optical combiner 470, and at least one photodetector 550. The plurality of optical components 450 are connected to a corresponding one of the plurality of first optical output channels 430 and have a corresponding optical component output channel. The first optical combiner 470 is configured to combine optical signals from each optical component output channel and has a combiner optical output channel 490. The at least one photodetector 550 is configured to determine the function of the optical signal from the combiner optical output channel 490.

[0084] Refer to steps 1120 and Figure 2D and Figures 4 to 10 An electronic integrated die 200 is provided, which includes an optical routing controller 800 configured to generate a specified electrical signal for changing a selected first optical output channel 430 based on the output from the at least one photodetector 550.

[0085] Refer to step 1130 and Figure 1A , Figure 2D and Figures 4 to 10 The photonic integrated die 100 and the electronic integrated die 200 can be bonded together to form an optical path between the photonic integrated die 100 and the optical signal in at least one photodetector 550.

[0086] In one embodiment, the bonding of the photonic integrated die 100 and the electronic integrated die 200 forms an electrical conduction path between the optical routing controller 800 and the first optical switch 420. In another embodiment, the first optical switch 420 includes an electrically adjustable output selector, which includes a Mach-Zehnder interferometer, which includes an electrically adjustable phase shifter; and the electrical conduction path between the optical routing controller 800 and the first optical switch 420 is configured to transmit an electrical control signal generated by the optical routing controller 800 to the electrically adjustable output selector.

[0087] In an embodiment, the at least one photodetector 550 includes a plurality of photodetectors 550 located in the photonic integrated die 100; the bonding assembly of the photonic integrated die 100 and the electronic integrated die 200 includes a monitoring circuit 500, the monitoring circuit 500 including a corresponding monitoring circuit optical channel 530 and a plurality of series connections of the corresponding photodetectors 550 among the plurality of photodetectors 550; and each monitoring circuit optical channel 530 extends through a portion of the photonic integrated die 100 and through a portion of the electronic integrated die 200.

[0088] In one embodiment, the monitoring circuit 500 includes a second optical switch 520 located in the photonic integrated die 100; the second optical switch 520 is configured to route an optical signal from a combiner optical output channel 490 to a selected second optical output channel, which is one of a plurality of monitoring circuit optical channels 530; and the optical routing controller 800 is configured to change the designation of the selected second optical output channel among the plurality of monitoring circuit optical channels 530 based on electrical output signals from a plurality of photodetectors 550.

[0089] refer to Figure 12 The flowchart illustrates the sequence of steps for operating the apparatus of this disclosure.

[0090] Refer to steps 1210 and Figures 1A to 10 The present invention provides an optoelectronic device comprising: a first optical switch 420 including a first optical input channel 410 and a plurality of first optical output channels 430, and the first optical switch 420 being configured to route an optical signal received through the first optical input channel 410 to a selected first optical output channel 430, the selected first optical output channel 430 being one of the plurality of first optical output channels 430; a plurality of optical components 450 connected to a corresponding one of the plurality of first optical output channels 430 and having a corresponding optical component output channel; a first optical combiner 470 configured to combine optical signals from each of the plurality of optical component output channels and having a combiner optical output channel 490; a monitoring circuit 500 configured to receive optical signals from the combiner optical output channel 490 and configured to determine the function of the optical signals from the combiner optical output channel 490; and an optical routing controller 800 configured to change the designation of the selected first optical output channel 430 based on a measurement signal from the monitoring circuit 500.

[0091] Refer to steps 1220 and Figures 4 to 10 When the monitoring circuit 500 detects a missing function in the optical signal from the combiner optical output channel 490, it can change the designation of the selected first optical output channel 430 among multiple first optical output channels 430.

[0092] In one embodiment, the designation of the selected first optical output channel 430 is altered by transmitting an electrical control signal from the optical routing controller 800 to the first optical switch 420 (through an electrical conduction path including the photonic die bonding pad 198 of the photonic integrated die 100 and the electronic die bonding pad 298 of the electronic integrated die 200). In another embodiment, the first optical switch 420 includes an electrically adjustable output selector, which includes a Mach-Zehnder interferometer, and the Mach-Zehnder interferometer includes an electrically adjustable phase shifter; the electrical conduction signal is generated by the optical routing controller 800 and received by the electrically adjustable output selector.

[0093] In one embodiment, the monitoring circuit 500 includes a second optical switch 520 and multiple series connections of corresponding monitoring circuit optical channels 530 and corresponding photodetectors 550; the second optical switch 520 is configured to route an optical signal from a combiner optical output channel 490 to a selected second optical output channel, which is one of the multiple monitoring circuit optical channels 530; the monitoring circuit 500 is configured to monitor an electrical output signal from the photodetector 550. In another embodiment, the method further includes changing the designation of the selected second optical output channel among the multiple monitoring circuit optical channels 530 based on the electrical output signal from the photodetector 550 during testing of the optoelectronic device or during real-time operation of the optoelectronic device.

[0094] Common Reference Figures 1A to 10 According to various embodiments of the present disclosure, an optoelectronic device is provided, comprising: a first optical switch 420 including a first optical input channel 410 and a plurality of first optical output channels 430, wherein the first optical switch 420 is configured to route an optical signal received through the first optical input channel 410 to a selected first optical output channel 430, the selected first optical output channel 430 being one of the plurality of first optical output channels 430; and a plurality of optical components 450 having a corresponding optical input channel connected to a corresponding one of the plurality of first optical output channels 430, and having a corresponding optical input channel. Optical component output channel 460; a first optical combiner 470 configured to combine optical signals from each of the plurality of optical component output channels 460 and having a combiner optical output channel 490; a monitoring circuit 500 configured to receive optical signals from the combiner optical output channel 490 and configured to determine the function of the optical signals from the combiner optical output channel 490; and an optical routing controller 800 configured to change the designation of a selected first optical output channel 430 among the plurality of first optical output channels 430 based on a measurement signal from the monitoring circuit 500.

[0095] In one embodiment, the monitoring circuit 500 includes at least one photodetector 550, which is configured to generate an electrical signal as a measurement signal based on the optical signal from the combiner optical output channel 490. In another embodiment, the optical routing controller 800 is configured to change the designation of the selected first optical output channel 430 based on the magnitude of the electrical signal generated by the monitoring circuit 500.

[0096] In one embodiment, a first optical switch 420, a plurality of optical components 450, a first optical combiner 470, and the at least one photodetector 550 are located in a photonic integrated die 100; and an optical routing controller 800 is located in an electronic integrated die 200. In another embodiment, the photonic integrated die 100 and the electronic integrated die 200 are directly bonded to each other or bonded to each other through at least one intermediate die, such that at least one optical path is provided between the first optical combiner 470 and the at least one photonic integrated die 100. In another embodiment, at least one electrically conductive path extends from the output node of the optical routing controller 800 to the control node of the first optical switch 420; and each of the at least one electrically conductive path includes a corresponding photonic die bonding pad 198 and a corresponding electronic die bonding pad 298.

[0097] In one embodiment, the monitoring circuit 500 includes multiple series connections of corresponding monitoring circuit optical channels 530 and corresponding photodetectors 550, each photodetector 550 being configured to generate a corresponding electrical signal upon detecting an optical signal thereon. In another embodiment, the monitoring circuit 500 includes a second optical switch 520 configured to route an optical signal from a combiner optical output channel 490 to a selected second optical output channel, which is one of the multiple monitoring circuit optical output channels 530. In yet another embodiment, an optical routing controller 800 is configured to change the designation of the selected second optical output channel among the multiple monitoring circuit optical channels 530 based on measurement signals from the monitoring circuit 500.

[0098] In one embodiment, the first optical switch 420 includes an electrically adjustable output selector, which includes a Mach-Zehnder interferometer, which includes an electrically adjustable phase shifter; the optical routing controller 800 is configured to generate an electrical control signal applied to the electrically adjustable output selector.

[0099] The features of several embodiments have been summarized above to enable those skilled in the art to better understand aspects of this disclosure. Each embodiment described using the term "comprising" also inherently discloses other embodiments, wherein the term "comprising" is replaced with "substantially consists of" or "consisting of," unless otherwise explicitly disclosed herein. Whenever two or more elements are listed as alternatives in the same or different paragraphs, a Markush group comprising the list of two or more elements is also implicitly disclosed. Whenever the auxiliary verb "may" is used in this disclosure to describe the formation or processing step of an element, it is also expressly contemplated that embodiments of not performing such an element or such processing step are possible, provided that the resulting apparatus or device may yield equivalent results. Therefore, whenever omitting such an element or the formation of such a process can provide the same or equivalent results, the auxiliary verb "may" applied to the formation or processing step of an element should also be interpreted as "may" or "may or may not." Equivalent results include slightly superior results and slightly inferior results. Those skilled in the art will understand that they can readily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that they can make various changes, substitutions, and alterations without departing from the spirit and scope of this disclosure.

Claims

1. An optoelectronic device, characterized by include: A first optical switch includes a first optical input channel and a plurality of first optical output channels, and the first optical switch is configured to route an optical signal received through the first optical input channel to a selected first optical output channel, wherein the selected first optical output channel is one of the plurality of first optical output channels; Multiple optical components have a corresponding optical input channel connected to one of the multiple first optical output channels, and a corresponding optical component output channel; The first optical combiner is configured to combine optical signals from each of the output channels of the plurality of optical components and has a combiner optical output channel; A monitoring circuit is configured to receive an optical signal from the optical output channel of the combiner and to determine the function of the optical signal from the optical output channel of the combiner. as well as An optical routing controller is configured to change the designation of the selected first optical output channel among the plurality of first optical output channels based on measurement signals from the monitoring circuit.

2. The photovoltaic device of claim 1, wherein, The monitoring circuit includes at least one photodetector configured to generate an electrical signal as the measurement signal based on the optical signal from the optical output channel of the combiner.

3. The photovoltaic device of claim 2, wherein, The optical routing controller is configured to change the designation of the selected first optical output channel based on the magnitude of the electrical signal generated by the monitoring circuit.

4. The photoelectric device according to claim 2, characterized in that: The first optical switch, the plurality of optical components, the first optical combiner, and the at least one photodetector are located in a photonic integrated die; and The optical routing controller is located in the electronic integrated chip.

5. The photovoltaic device of claim 4, wherein, The photonic integrated die and the electronic integrated die are directly bonded to each other or bonded to each other through at least one intermediate die.

6. The photoelectric device according to claim 5, characterized in that: At least one electrical conduction path extends from the output node of the optical routing controller to the control node of the first optical switch; and Each of the at least one electrically conductive path includes a corresponding photonic die bonding pad and a corresponding electronic die bonding pad.

7. The photovoltaic device of claim 1, wherein The monitoring circuit includes multiple series connections of a corresponding monitoring circuit optical channel and a corresponding photodetector, wherein the corresponding photodetector is configured to generate a corresponding electrical signal when it detects an optical signal thereon.

8. The photoelectric device according to claim 7, characterized in that: The monitoring circuit includes a second optical switch; and The second optical switch is configured to route the optical signal from the combiner optical output channel to a selected second optical output channel, which is one of the plurality of monitoring circuit optical channels.

9. The photovoltaic device of claim 8, wherein, The optical routing controller is configured to change the designation of the selected second optical output channel among a plurality of optical channels of the monitoring circuit based on the measurement signal from the monitoring circuit.

10. The photoelectric device according to claim 1, characterized in that: The first optical switch includes an electrically adjustable output selector, the electrically adjustable output selector includes a Mach-Zehnder interferometer, and the Mach-Zehnder interferometer includes an electrically adjustable phase shifter; and The optical routing controller is configured to generate an electrical control signal applied to the electrically adjustable output selector.

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