electronic devices
By designing a second mounting cavity and an expansion cavity for the circuit board bracket in the electronic device, the problem of poor sound quality caused by the small rear cavity of the speaker is solved, achieving a balance between sound quality improvement and device thinness, while also improving the device's resistance to drops and compression.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-07-31
AI Technical Summary
Electronic devices suffer from poor sound quality due to the small rear cavity of the speaker.
By designing a circuit board bracket in the electronic device, including a second mounting cavity and an expansion cavity, the speaker unit is placed in the second mounting cavity, which is divided into a front cavity and a rear cavity, and the expansion cavity is connected to the rear cavity, thereby increasing the volume of the rear cavity and improving the sound quality.
Without affecting the internal layout of the device, the volume of the rear cavity has been increased, improving the sound quality and reducing the possibility of circuit board damage during drops or external pressure, thus extending the device's lifespan.
Smart Images
Figure CN224583206U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology
[0002] In related technologies, with the rapid development of the electronic equipment industry, electronic devices are constantly evolving towards lighter and thinner designs. This is due to users' ever-increasing demands for performance in electronic devices, such as... Figure 1 As shown, a speaker unit 16' and a circuit board 13' are arranged side by side on one side of the frame 11' of the electronic device 1'. A circuit board bracket 14' is arranged on the side of the speaker unit 16' and the circuit board 13' near the battery cover 12'. The circuit board bracket 14' and the frame 11' surround the speaker unit 16', thus forming a front cavity and a rear cavity. As the size of the circuit board 13' increases, the rear cavity of the speaker becomes smaller and smaller, affecting the sound quality of the electronic device 1'. Utility Model Content
[0003] The purpose of this application is to provide an electronic device that can solve the technical problem of poor sound quality caused by the small rear cavity of the speaker in electronic devices.
[0004] This application provides an electronic device, including:
[0005] Frame;
[0006] A battery cover is disposed on one side of the frame, and a first mounting cavity is formed between the frame and the battery cover;
[0007] The circuit board is disposed in the first mounting cavity, the circuit board is fixed to the frame, and the circuit board is located on the side of the frame facing the battery cover.
[0008] A circuit board support is disposed in a first mounting cavity, at least a portion of which is located between the circuit board and the battery cover. The circuit board support includes a second mounting cavity and an expansion cavity, which are connected to each other. At least a portion of the expansion cavity is located between the circuit board and the battery cover.
[0009] The speaker unit is disposed in the second mounting cavity and is fixed to the circuit board bracket. The speaker unit divides the second mounting cavity into a front cavity and a rear cavity, and the rear cavity is connected to the expansion cavity.
[0010] In this embodiment of the application, the electronic device includes a frame, a battery cover, and a circuit board. The battery cover is disposed on one side of the frame and is connected to the frame, forming a first mounting cavity. The circuit board is disposed in the first mounting cavity and is fixed to the side of the frame facing the battery cover.
[0011] The electronic device also includes a circuit board support and a speaker unit. The circuit board support is disposed in a first mounting cavity, with at least a portion of the circuit board support located between the circuit board and the battery cover, thereby supporting and protecting the circuit board. The circuit board support includes a second mounting cavity and an expansion cavity. The speaker unit is disposed in the second mounting cavity, and the second mounting cavity separates a front cavity and a rear cavity. The expansion cavity and the rear cavity are connected, thereby expanding the rear cavity, increasing the volume of the rear cavity, and improving the sound quality of the electronic device.
[0012] Furthermore, by reusing the circuit board bracket, the bracket can both support and protect the circuit board and expand the rear cavity. This increases the volume of the rear cavity without affecting the internal layout of the electronic device, balancing the device's slimness with its sound quality. Additionally, at least part of the expanded cavity is located between the circuit board and the battery cover. Because this expanded cavity provides some deformation capacity to the circuit board bracket, increasing the buffer space between the circuit board and the battery cover, the deformation of the battery cover is absorbed by the circuit board bracket in the event of a drop or external pressure, reducing the likelihood of the circuit board being crushed and extending the lifespan of the electronic device. Attached Figure Description
[0013] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0014] Figure 1 A cross-sectional view of an electronic device in the related art is shown;
[0015] Figure 2 A cross-sectional view of an electronic device provided in one embodiment of this application is shown;
[0016] Figure 3 A cross-sectional view of a circuit board support and a speaker unit in an electronic device according to an embodiment of this application is shown;
[0017] Figure 4 An exploded view of a circuit board support and a speaker unit in an electronic device according to an embodiment of this application is shown;
[0018] Figure 5 One of the schematic diagrams of a circuit board bracket in an electronic device according to an embodiment of this application is shown;
[0019] Figure 6 This is a second schematic diagram of a circuit board bracket in an electronic device according to an embodiment of this application;
[0020] Figure 7 This illustration shows a schematic diagram of a first housing in an electronic device according to an embodiment of the present application;
[0021] Figure 8 A schematic diagram of a second housing in an electronic device provided in one embodiment of this application is shown.
[0022] Figure 1 Figure label:
[0023] 1' Electronic device, 11' Frame, 12' Battery cover, 13' Circuit board, 14' Circuit board bracket, 16' Speaker unit;
[0024] Figures 2 to 8 Figure label:
[0025] 1 Electronic device, 11 Frame, 111 First mounting cavity, 12 Battery cover, 13 Circuit board, 131 Board body, 132 Electronic components, 14 Circuit board bracket, 141 Second mounting cavity, 142 Front cavity, 143 Rear cavity, 144 Expansion cavity, 145 First housing, 146 First main body, 147 First sheet structure, 148 Second housing, 149 Second main body, 150 Second sheet structure, 151 Support, 152 Support rib, 153 Support step, 154 First reinforcing rib, 155 Second reinforcing rib, 16 Speaker unit, 17 Display screen, 171 First sound outlet. Detailed Implementation
[0026] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] The following is combined Figures 2 to 8 An electronic device 1 according to an embodiment of this application is described.
[0031] like Figure 2 and Figure 3 As shown, this application embodiment provides an electronic device 1, including: a frame 11; a battery cover 12 disposed on one side of the frame 11, forming a first mounting cavity 111 between the frame 11 and the battery cover 12; a circuit board 13 disposed within the first mounting cavity 111, the circuit board 13 being fixed to the frame 11 and located on the side of the frame 11 facing the battery cover 12; a circuit board support 14 disposed within the first mounting cavity 111, at least a portion of the circuit board support 14 being located between the circuit board 13 and the battery cover 12, the circuit board support 14 including a second mounting cavity 141 and an expansion cavity 144, the second mounting cavity 141 and the expansion cavity 144 being connected, at least a portion of the expansion cavity 144 being located between the circuit board 13 and the battery cover 12; and a speaker unit 16 disposed within the second mounting cavity 141, the speaker unit 16 being fixed to the circuit board support 14, the speaker unit dividing the second mounting cavity 141 into a front cavity 142 and a rear cavity 143, the rear cavity 143 being connected to the expansion cavity 144.
[0032] In this embodiment of the application, the electronic device 1 includes a frame 11, a battery cover 12 and a circuit board 13. The battery cover 12 is disposed on one side of the frame 11 and is connected to the frame 11, forming a first mounting cavity 111. The circuit board 13 is disposed in the first mounting cavity 111 and is fixed to the side of the frame 11 facing the battery cover 12.
[0033] The electronic device 1 also includes a circuit board support 14 and a speaker unit 16. The circuit board support 14 is disposed in a first mounting cavity 111. At least a portion of the circuit board support 14 is located between the circuit board 13 and the battery cover 12, thereby supporting and protecting the circuit board 13. The circuit board support 14 includes a second mounting cavity 141 and an expansion cavity 144. The speaker unit 16 is disposed in the second mounting cavity 141, and the second mounting cavity 141 separates a front cavity 142 and a rear cavity 143. The expansion cavity 144 is connected to the rear cavity 143, thereby expanding the rear cavity 143, increasing the volume of the rear cavity 143, and improving the sound quality of the electronic device 1.
[0034] Furthermore, by reusing the circuit board support 14, the circuit board support 14 can both support and protect the circuit board 13, and also expand the capacity of the rear cavity 143. This increases the volume of the rear cavity 143 without affecting the internal layout of the electronic device 1, thus balancing the thinness and lightness of the electronic device 1 with its sound quality. Additionally, at least a portion of the expansion cavity 144 is located between the circuit board 13 and the battery cover 12. Since the expansion cavity 144 can provide a certain amount of deformation for the circuit board support, increasing the buffer space between the circuit board 13 and the battery cover 12, in the event of a drop or external pressure on the electronic device 1, the deformation of the battery cover 12 will be absorbed by the circuit board support 14, reducing the likelihood of the circuit board 13 being compressed and extending the service life of the electronic device 1.
[0035] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in one possible implementation, the circuit board bracket 14 further includes: a first housing 145; a second housing 148 connected to the first housing 145, wherein the first housing 145 and the second housing 148 are fastened together to form a second mounting cavity 141 and an expansion cavity 144, and the speaker unit 16 is located between the first housing 145 and the second housing 148; wherein the first housing 145 is located between the second housing 148 and the battery cover 12.
[0036] Specifically, the circuit board support 14 also includes a first housing 145 and a second housing 148, which are connected to each other. The first housing 145 and the second housing 148 are fastened together to form a second mounting cavity 141 and an expansion cavity 144. By setting the circuit board support 14 as a split structure, it is easier to design the second mounting cavity 141 and the expansion cavity 144, easier to manufacture the circuit board support 14, and reduce the processing difficulty of the circuit board support 14.
[0037] Furthermore, the speaker unit 16 is located between the first housing 145 and the second housing 148, which makes it easier to install the speaker unit 16 and the circuit board bracket 14.
[0038] The first housing 145 is located between the second housing 148 and the battery cover 12. That is, the two are arranged in an OZ pattern along the direction from the circuit board 13 to the battery cover 12, so that the first housing 145 and the second housing 148 are both roughly sheet-like, which reduces the processing difficulty of the first housing 145 and the second housing 148 and reduces the production cost.
[0039] like Figure 2 , Figure 3 , Figure 7 and Figure 8 As shown, in one possible implementation, the first housing 145 includes a first body 146 and a first sheet structure 147, the first body 146 and the first sheet structure 147 are connected, and the first body 146 is located at the edge of the first sheet structure 147; the second housing 148 includes a second body 149 and a second sheet structure 150, the second body 149 and the second sheet structure 150 are connected, and the second body 149 is located at the edge of the second sheet structure 150; wherein, the first sheet structure 147 and the second sheet structure 150 form part of the cavity wall of the expansion cavity 144.
[0040] Specifically, the first housing 145 includes a first main body 146 and a first sheet structure 147 connected together. The first main body 146 is located at the edge of the first sheet structure 147, that is, the first sheet structure 147 is located in the middle of the first housing 145. The second housing 148 includes a second main body 149 and a second sheet structure 150 connected together. The second main body 149 is located at the edge of the second sheet structure 150, that is, the second sheet structure 150 is located in the middle of the second housing 148. The first sheet structure 147 and the second sheet structure 150 form part of the cavity wall of the expansion cavity 144. The sheet structure is relatively thin. Therefore, the first sheet structure 147 and the second sheet structure 150 can effectively increase the volume of the expansion cavity 144 and improve the sound quality of the electronic device 1.
[0041] Optionally, the first sheet structure 147 is made of metal, and similarly, the second sheet structure 150 is made of metal. The first sheet structure 147 and the second sheet structure 150 can have high strength with a small thickness, thereby balancing the support capacity of the circuit board bracket 14 and the volume of the expansion cavity 144.
[0042] The first sheet structure 147 can be made of copper, copper alloy, aluminum, aluminum alloy, iron, or steel. The second sheet structure 150 can be made of copper, copper alloy, aluminum, aluminum alloy, iron, or steel.
[0043] Optionally, the first body 146 may be made of plastic material, and the second body 149 may be made of plastic material.
[0044] In the electronic device 1 provided in this application embodiment, the circuit board support 14 is set to a hollow shape, thereby increasing the capacity of the rear cavity 143 of the speaker. The circuit board support 14 covers the speaker unit and maximizes the rear cavity 143 within a limited space. A steel sheet is made on the top and bottom of the circuit board support 14 to improve audio performance.
[0045] The circuit board support 14 is hollow inside, forming a first mounting cavity 111 and an expansion cavity 144. It makes full use of the thickness space of the electronic device 1. A first sheet structure 147 is provided on the side of the circuit board support 14 facing the circuit board 13, and a second sheet structure 150 is provided on the side facing the battery cover 12, thereby maximizing the space of the expansion cavity 144.
[0046] The first sheet structure 147 can be a sheet structure, and the second sheet structure 150 can be a sheet structure. For example, both the first sheet structure 147 and the second sheet structure 150 are steel sheets.
[0047] like Figure 2 and Figure 3 As shown, in one possible implementation, the first sheet structure 147 is inserted into the first body 146; the second sheet structure 150 is inserted into the second body 149; wherein the first body 146 and the second body 149 are connected.
[0048] Specifically, the first sheet structure 147 is inserted into the first body 146, thereby increasing the connection strength between the first sheet structure 147 and the first body 146. It can be produced by insert injection molding, which improves the strength of the first shell 145 while reducing the production difficulty of the first shell 145. Similarly, the second sheet structure 150 is inserted into the second body 149, thereby increasing the connection strength between the second sheet structure 150 and the second body 149. It can be produced by insert injection molding, which improves the strength of the second shell 148 while reducing the production difficulty of the second shell 148.
[0049] Furthermore, the first body 146 and the second body 149 located at the edge are connected to provide more space for the second mounting cavity 141 and the expansion cavity 144. The first body 146 and the second body 149 can be connected by welding, thereby improving the strength and sealing of the circuit board bracket 14.
[0050] The first body 146 and the second body 149 can be connected by ultrasonic welding, laser welding, hot plate welding, friction welding or vibration welding.
[0051] like Figure 2 and Figure 3 As shown, in one possible implementation, the circuit board support 14 further includes a support portion 151, which is located in the expansion cavity 144. The support portion 151 extends along the direction OZ from the circuit board 13 to the battery cover 12, and the two ends of the support portion 151 are respectively connected to the first housing 145 and the second housing 148.
[0052] Specifically, the circuit board support 14 also includes a support portion 151 disposed in the expansion cavity 144. Along the direction OZ from the circuit board 13 to the battery cover 12, the support portion 151 is supported in the expansion cavity 144. That is, one side of the support portion 151 is connected to the first housing 145, and the other side of the support portion 151 is connected to the second housing 148, thereby supporting the expansion cavity 144 in the direction OZ from the circuit board 13 to the battery cover 12, improving the support capacity of the circuit board support 14, and improving the strength of the circuit board support 14 and its protection capability for the circuit board 13.
[0053] The support portion 151 can be located in the middle region of the expansion cavity 144 or at the edge of the expansion cavity 144.
[0054] like Figure 2 , Figure 3 , Figure 7 and Figure 8 As shown, in one possible implementation, the support portion 151 includes a support rib 152 and a support step 153. The support rib 152 is connected to the first housing 145, and the support step 153 is connected to the second housing 148. The support step 153 and the support rib 152 are distributed along the direction from the circuit board 13 to the battery cover 12. One end of the support rib 152 facing the support step 153 and the other end of the support step 153 facing the support rib 152 are connected.
[0055] Specifically, the support portion 151 includes a support rib 152 and a support step 153. The support rib 152 is connected to the first housing 145, and the support step 153 is connected to the second housing 148. The support step 153 and the support rib 152 are distributed along the direction from the circuit board 13 to the battery cover 12. That is, the support portion 151 consists of two parts, which are respectively connected to the first housing 145 and the second housing 148. After the first housing 145 and the second housing 148 are installed, the end of the support rib 152 facing the support step 153 and the end of the support step 153 facing the support rib 152 are connected to each other, thereby supporting the expansion cavity 144 and improving the strength of the circuit board bracket 14.
[0056] Optionally, the support part 151 is made of plastic material and is formed by welding the support rib 152 and the support step 153, thereby reducing the installation difficulty of the support part 151, reducing the production cost, and the welding connection has high reliability, reducing the possibility of the support rib 152 and the support step 153 detaching.
[0057] For example, the support rib 152 is disposed on the side of the first sheet structure 147 facing the second sheet structure 150, and the support step 153 is disposed on the side of the second sheet structure 150 facing the first sheet structure 147. When the first housing 145 and the second housing 148 are fastened together, the support rib 152 and the support step 153 are in contact or abut against each other, and then connected by ultrasonic welding, hot plate welding, friction welding or vibration welding or other methods.
[0058] Furthermore, the welding between the supporting rib 152 and the supporting step 153 can be carried out in the same process as the welding between the first body 146 and the second body 149, thereby reducing processing steps and lowering production costs.
[0059] Among them, the supporting rib 152 can be integrated with the first main body 146, and the supporting step 153 can be integrated with the second main body 149.
[0060] like Figure 2 As shown, in one possible implementation, at least a portion of the first mounting cavity 111 is located on one side of the circuit board 13 along the direction OX perpendicular to the circuit board 13 to the battery cover 12, and the speaker unit is located on one side of the circuit board 13.
[0061] Specifically, along the direction OX perpendicular to the circuit board 13 to the battery cover 12, at least a portion of the first mounting cavity 111 is located on one side of the circuit board 13, and the speaker unit is located on one side of the circuit board 13. Since the first mounting cavity 111 is used to mount the speaker unit 16, and in order to improve the sound quality of the electronic device 1, the speaker unit 16 needs to have a certain volume, and the front cavity 142 also needs to have a certain volume, therefore, placing at least a portion of the first mounting cavity 111 on one side of the circuit board 13 can provide more mounting space for the speaker unit 16, which helps to reduce the thickness of the electronic device 1 while improving the sound quality of the electronic device 1.
[0062] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in one possible implementation, the circuit board support 14 further includes: a first reinforcing rib 154 disposed on the cavity wall of the expansion cavity 144 facing the circuit board 13; and a second reinforcing rib 155 disposed on the cavity wall of the expansion cavity 144 facing the battery cover 12.
[0063] Specifically, the circuit board support 14 also includes a first reinforcing rib 154 disposed on the cavity wall of the expansion cavity 144 facing the circuit board 13, thereby increasing the strength of the circuit board support 14 facing the circuit board 13, increasing the amplitude of the elastic deformation of the circuit board support 14, and improving the protection capability of the circuit board support 14 for the circuit board 13. Similarly, the circuit board support 14 also includes a second reinforcing rib 155 disposed on the cavity wall of the expansion cavity 144 facing the battery cover 12, thereby increasing the strength of the circuit board support 14 facing the battery cover 12, increasing the amplitude of the elastic deformation of the circuit board support 14, and improving the protection capability of the circuit board support 14 for the circuit board 13. Furthermore, increasing the strength of the circuit board support 14 can reduce the possibility of audio resonance.
[0064] For example, a first reinforcing rib 154 is disposed on the first sheet structure 147. The number of first reinforcing ribs 154 can be one, two or more. Two or more first reinforcing ribs 154 can be distributed in different directions, thereby improving the pressure-bearing capacity of the first sheet structure 147 in multiple directions.
[0065] The second reinforcing rib 155 is provided on the second sheet structure 150. The number of the second reinforcing rib 155 can be one, two or more. The two or more second reinforcing ribs 155 can be distributed in different directions, thereby improving the load-bearing capacity of the second sheet structure 150 in multiple directions.
[0066] Furthermore, increasing the strength of the first housing 145 and the second housing 148 can reduce the possibility of audio resonance. The first sheet structure 147 of the circuit board support 14 is designed with crisscrossing first reinforcing ribs 154, and the second sheet structure 150 is designed with crisscrossing second reinforcing ribs 155. Increasing the strength of the first sheet structure 147 and the second sheet structure 150 can reduce problems such as audio resonance. A support portion 151 is provided at a weak point in the middle region of the first sheet structure 147 and the second sheet structure 150 to improve overall strength.
[0067] like Figure 2 and Figure 3 As shown, in one possible implementation, the first reinforcing rib 154 and the second reinforcing rib 155 protrude into the expansion cavity 144.
[0068] Specifically, the first reinforcing rib 154 and the second reinforcing rib 155 protrude into the expansion cavity 144, thereby reducing the space occupied by the circuit board bracket 14 on the thickness of the electronic device 1, which is conducive to the thinning of the electronic device 1.
[0069] like Figure 2 As shown, in one possible implementation, the electronic device 1 further includes a display screen 17 disposed on the side of the frame 11 away from the battery cover 12. The display screen 17 includes a first sound outlet 171, which is connected to the front cavity 142.
[0070] Specifically, the electronic device 1 also includes a display screen 17 disposed on the side of the frame 11 away from the battery cover 12, and the display screen 17 includes a first sound outlet 171, which is connected to the front cavity 142, and sound waves can be transmitted from the front cavity to the outside of the electronic device 1 through the first sound outlet 171.
[0071] In one possible implementation, the circuit board bracket 14 also includes a second sound outlet, which is connected to the front cavity 142.
[0072] like Figure 2 As shown, in one possible implementation, the circuit board 13 includes a board body 131 and electronic components 132 disposed on the surface of the board body 131.
[0073] like Figure 2 As shown, in one possible implementation, a display screen 17 is provided on the side of the frame 11 opposite to the circuit board 13.
[0074] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, in one possible implementation, the circuit board support 14 includes a first housing 145 and a second housing 148. The edges of the first housing 145 and the edges of the second housing 148 are welded together to achieve a seal. The welding type can be ultrasonic welding, laser welding, hot plate welding, friction welding, or vibration welding, etc.
[0075] At least a portion of the expansion cavity 144 is arranged in the thickness space between the battery cover 12 and the circuit board 13. Since the expansion cavity 144 of the rear cavity 143 is designed within the thickness space between the circuit board 13 and the battery cover 12, it is not affected by the stacking of the circuit boards 13, thereby enabling a larger cavity design and improving audio performance. Due to the hollow structure of the circuit board support 14, with only one layer of steel sheet on the upper and lower sides, under conditions such as static pressure and ball drop on the battery cover 12, the deformation of the battery cover 12 transmits the force to the first housing 145, causing the first housing 145 to deform. Since the acoustic cavity area provides a buffer space for the deformation of the steel sheet, the stress on the circuit board 13 is greatly improved, and the reliability of the electronic device 1 can be further improved.
[0076] To create a larger expansion cavity 144, a large area needs to be made of steel sheets to increase the volume of the expansion cavity 144, namely the first sheet structure 147 and the second sheet structure 150. Since large steel sheets are relatively weak, crisscrossing reinforcing ribs are added to the steel sheet area to effectively solve the cavity resonance problem. Simultaneously, a support portion 151 is set at the center inside the expansion cavity 144. The support portion 151 is welded to corresponding areas of the first shell 145 and the second shell 148 via supporting ribs 152 and supporting steps 153 using ultrasonic welding, providing better support and strength for the entire expansion cavity 144. This combination of the two methods effectively solves the problems of abnormal sound cavity performance and false pressure.
[0077] The electronic device 1 provided in this application embodiment fully utilizes the thickness space between the battery cover 12 and the circuit board 13 to achieve a large-volume rear cavity 143 design. Simultaneously, the hollow shape of the circuit board support 14 provides a larger buffer space for the electronic device 1, effectively improving its reliability. Adding crisscrossing reinforcing ribs to the large steel sheet area, along with a support portion 151 inside the expanded cavity 144, provides better support and overall strength, effectively solving the problems of cavity resonance and misalignment when pressed by the electronic device 1.
[0078] Electronic device 1 can be a terminal or other devices besides a terminal. For example, electronic device 1 can be a mobile phone, tablet computer, laptop computer, handheld computer, music playback device, private network communication terminal equipment (such as walkie-talkie), mobile internet device (MID), augmented reality / virtual reality / mixed reality device, robot, drone, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. The embodiments of this application do not specifically limit it.
[0079] In the description of this specification, references to terms such as "an embodiment" or "specific embodiment" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0080] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. An electronic device, characterized in that, include: Frame; A battery cover is disposed on one side of the frame, and a first mounting cavity is formed between the frame and the battery cover; A circuit board is disposed in the first mounting cavity, the circuit board is fixed to the frame, and the circuit board is located on the side of the frame facing the battery cover; A circuit board bracket is disposed within the first mounting cavity, at least a portion of which is located between the circuit board and the battery cover. The circuit board bracket includes a second mounting cavity and an expansion cavity, which are connected. At least a portion of the expansion cavity is located between the circuit board and the battery cover. A speaker unit is disposed in the second mounting cavity. The speaker unit is fixed to the circuit board bracket. The speaker unit divides the second mounting cavity into a front cavity and a rear cavity. The rear cavity is connected to the expansion cavity.
2. The electronic device according to claim 1, characterized in that, The circuit board support also includes: First shell; The second housing is connected to the first housing, and the first housing and the second housing are fastened together to form the second mounting cavity and the expansion cavity, and the speaker unit is located between the first housing and the second housing; The first housing is located between the second housing and the battery cover.
3. The electronic device according to claim 2, characterized in that, The first housing includes a first body and a first sheet structure, the first body and the first sheet structure are connected, and the first body is located at the edge of the first sheet structure; The second housing includes a second body and a second sheet structure, the second body and the second sheet structure are connected, and the second body is located at the edge of the second sheet structure; The first sheet-like structure and the second sheet-like structure form part of the cavity wall of the expansion cavity.
4. The electronic device according to claim 3, characterized in that, The first sheet-like structure is embedded in the first body; The second sheet-like structure is embedded in the second main body; The first body and the second body are connected.
5. The electronic device according to claim 2, characterized in that, The circuit board support also includes: A support portion is located within the expansion cavity and extends along the direction from the circuit board to the battery cover. The two ends of the support portion are respectively connected to the first housing and the second housing.
6. The electronic device according to claim 5, characterized in that, The support portion includes a support rib and a support step. The support rib is connected to the first housing, and the support step is connected to the second housing. The support step and the support rib are distributed along the direction from the circuit board to the battery cover. The end of the support rib facing the support step and the end of the support step facing the support rib are connected.
7. The electronic device according to any one of claims 1 to 6, characterized in that, Along a direction perpendicular to the circuit board to the battery cover, at least a portion of the first mounting cavity is located on one side of the circuit board, and the speaker unit is located on one side of the circuit board.
8. The electronic device according to any one of claims 1 to 6, characterized in that, The circuit board support also includes: The first reinforcing rib is disposed on the cavity wall of the expansion cavity on the side facing the circuit board; The second reinforcing rib is disposed on the cavity wall of the expansion cavity on the side facing the battery cover.
9. The electronic device according to claim 8, characterized in that, The first reinforcing rib and the second reinforcing rib are arranged to protrude into the expansion cavity.
10. The electronic device according to any one of claims 1 to 6, characterized in that, Also includes: A display screen is disposed on the side of the frame away from the battery cover. The display screen includes a first sound outlet, which is connected to the front cavity.